tas5630dkd2evm user's guide - texas instruments idle noise fft spectrum (btl)..... 12 4.9 fft...

User's GuideSLAU288A–August 2009–Revised May 2010

TAS5630DKD2EVM

This user’s guide describes the operation of the evaluation module for the TAS5630DKD 300W StereoFeedback Analog-Input Digital Amplifier from Texas Instruments. The user’s guide also providesmeasurement data and design information including the schematic, BOM, and PCB layout.

Contents1 Overview ..................................................................................................................... 3

1.1 TAS5630DKD2EVM Features .................................................................................... 31.2 PCB Key Map ...................................................................................................... 4

2 Quick Setup Guide .......................................................................................................... 52.1 Electrostatic Discharge Warning ................................................................................. 52.2 Unpacking the EVM ................................................................................................ 52.3 Power Supply Setup ............................................................................................... 62.4 Applying Input Signal .............................................................................................. 62.5 Speaker Connection ............................................................................................... 6

3 Protection .................................................................................................................... 73.1 Short-Circuit Protection and Fault-Reporting Circuitry ........................................................ 73.2 Fault Reporting ..................................................................................................... 7

4 TAS5630DKD2EVM Performance ........................................................................................ 74.1 THD+N vs Power (BTL – 4 Ω) ................................................................................... 94.2 THD+N vs Power (BTL – 8 Ω) ................................................................................... 94.3 THD+N vs Frequency (BTL –4 Ω) .............................................................................. 104.4 THD+N vs Frequency (BTL –8 Ω) .............................................................................. 104.5 THD+N vs Power (PBTL – 2 Ω) ................................................................................ 114.6 THD+N vs Frequency (PBTL – 2 Ω) ........................................................................... 114.7 FFT Spectrum with –60-dBFS Tone (BTL) .................................................................... 114.8 Idle Noise FFT Spectrum (BTL) ................................................................................ 124.9 FFT Spectrum With –60-dBFS Tone (PBTL) ................................................................. 124.10 Idle Noise FFT Spectrum (PBTL) .............................................................................. 134.11 Channel Separation (BTL ....................................................................................... 134.12 Frequency Response (BTL) ..................................................................................... 144.13 Frequency Response (PBTL) ................................................................................... 144.14 High-Current Protection (BTL) .................................................................................. 154.15 High-Current Protection (PBTL) ................................................................................ 154.16 Pop/Click (BTL) ................................................................................................... 164.17 Pop/Click (PBTL) ................................................................................................. 164.18 Output Stage Efficiency .......................................................................................... 17

5 Related Documentation from Texas Instruments ..................................................................... 175.1 Additional Documentation ....................................................................................... 18

Appendix A Design Documents ............................................................................................... 18

List of Figures

1 Integrated PurePath™ HD Amplifier System............................................................................ 4

2 Physical Structure for the TAS5630PHDEVM (Approximate Layout) ................................................ 5

3 THD+N vs Power (BTL – 4 Ω) ............................................................................................ 9

4 THD+N vs Power (BTL – 8 Ω) ............................................................................................ 9PurePath is a trademark of Texas Instruments.

1SLAU288A–August 2009–Revised May 2010 TAS5630DKD2EVM

Copyright © 2009–2010, Texas Instruments Incorporated

www.ti.com

5 THD+N vs Frequency (BTL – 4 Ω)...................................................................................... 10

6 THD+N vs Frequency (BTL – 8 Ω)...................................................................................... 10

7 THD+N vs Power (PBTL – 2 Ω) ......................................................................................... 11

8 THD+N vs Frequency (PBTL – 2 Ω) .................................................................................... 11

9 FFT Spectrum with –60-dBFS Tone (BTL)............................................................................. 12

10 Idle Noise FFT Spectrum (BTL) ......................................................................................... 12

11 FFT Spectrum with –60-dBFS Tone (PBTL)........................................................................... 13

12 Idle Noise FFT Spectrum (PBTL) ....................................................................................... 13

13 Channel Separation (BTL) ............................................................................................... 14

14 Frequency Response (BTL).............................................................................................. 14

15 Frequency Response (PBTL) ............................................................................................ 15

16 High-Current Protection (BTL) ........................................................................................... 15

17 High-Current Protection (PBTL) ......................................................................................... 16

18 Pop/Click (BTL) ............................................................................................................ 16

19 Pop/Click (PBTL) .......................................................................................................... 17

20 Output Stage Efficiency................................................................................................... 17

List of Tables

1 TAS5630DKD2EVM Specification ........................................................................................ 3

2 Recommended Supply Voltages .......................................................................................... 6

3 TAS5630 Warning/Error Signal Decoding ............................................................................... 7

4 General Test Conditions ................................................................................................... 7

5 Electrical Data ............................................................................................................... 8

6 Audio Performance ......................................................................................................... 8

7 Thermal Specification ...................................................................................................... 8

8 Physical Specifications ..................................................................................................... 8

9 Related Documentation from Texas Instruments ..................................................................... 18

2 TAS5630DKD2EVM SLAU288A–August 2009–Revised May 2010


www.ti.com Overview

1 Overview

The TAS5630DKD2EVM PurePath™ HD customer evaluation module demonstrates the integrated circuitTAS5630DKD from Texas Instruments (TI).

The TAS5630DKD is a high-performance, integrated Stereo Feedback Analog-Input Digital AmplifierPower Stage designed to drive 4Ω speakers at up to 300W per channel. This amplifier requires only asimple passive demodulation filter to deliver high-quality, high-efficiency audio amplification.

This EVM is configured with 2 BTL channels and the possibility to apply either a single ended or adifferential analog input signal.

The OPA1632 is a High Performance Fully Differential Audio Op Amp designed to allow operation withsingle ended or differential input signals to the EVM.

This EVM is a complete stereo analog input 2 × 300 W power amplifier ready for evaluation and greatmusic.

Table 1. TAS5630DKD2EVM Specification

Key Parameters

Output stage supply voltage 25 V – 50 V

Number of channels 2 × BTL, 1 x PBTL

Load impedance 4–8 ΩOutput power, 4 Ω, 10% THD 310 W

Output powerr, 8 Ω, 10% THD 175 W

Dynamic Range >100 dB(A)

SE to Differential Amplifier OPA1632D

Output stage TAS5630DKD

Other features +15 V on-board switcher from PVDD supply

This document covers EVM specifications, audio performance and power efficiency measurementsgraphs, and design documentation that includes schematics, parts list, layout, and mechanical design.

1.1 TAS5630DKD2EVM Features• Stereo PurePath™ HD evaluation module.• Self-contained protection system (short circuit and thermal).



+12 V Fan OutControl

2 x Analog Input 2 ChannelSpeaker Output

TAS5630DKD2EVM

MODULE

Power Supply

Overview www.ti.com

• Standard 1VRMS single ended line input or differential input.• Double-sided, plated-through PCB layout.

Figure 1. Integrated PurePath™ HD Amplifier System

1.2 PCB Key Map

Physical structure for the TAS5630DKD2EVM is illustrated in Figure 2.



RESET(SW11)

+15V(J17)

+50V(J15)

LEFTSPEAKEROUTPUT

(J11)

RIGHTSPEAKEROUTPUT

(J13)

DIFF INPUT(J24)

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www.ti.com Quick Setup Guide

Figure 2. Physical Structure for the TAS5630PHDEVM (Approximate Layout)

2 Quick Setup Guide

This chapter describes the TAS5630DKD2EVM board in regards to power supply and system interfaces.The chapter provides information regarding handling and unpacking, absolute operating conditions, and adescription of the factory default switch and jumper configuration.

This section provides a step-by-step guide to configuring the TAS5630DKD2EVM for device evaluation

2.1 Electrostatic Discharge Warning

Many of the components on the TAS5630DKD2EVM are susceptible to damage by electrostatic discharge(ESD). Customers are advised to observe proper ESD handling precautions when unpacking and handlingthe EVM, including the use of a grounded wrist strap at an approved ESD workstation.

CAUTION

Failure to observe ESD handling procedures may result in damage to EVMcomponents.

2.2 Unpacking the EVM

On opening the TAS5630DKD2EVM package, ensure that the following items are included:

• 1 pc. TAS5630DKD2EVM board using one TAS5630DKD.



+1

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+12V FANOUT

CONTROL(J22)

JUMPER1 JUMPER2

If a single ended input signal is applied please insert jumpers in theheader J24 and J25

Quick Setup Guide www.ti.com

• 1 pc. PurePath CD-ROM.

If any of the items are missing, contact the Texas Instruments Product Information Center nearest you toinquire about a replacement.

2.3 Power Supply Setup

To power up the EVM, one power supply are needed. An onboard switched voltage regulator is supplyingsystem power, logic and gate-drive. Power supply is connected to the EVM using connector J15.

NOTE: While powering up set switch SW11 to the RESET position.

Table 2. Recommended Supply Voltages

Description Voltage Limitations Current Requirement Cable

Output stage power supply 25 – 50 V 16 A J15 (marked +50V)

CAUTION

Applying voltages above the limitations given in may cause permanent damageto your hardware

NOTE: The length of power supply cable must be minimized. Increasing length of PSU cable isequal to increasing the distortion for the amplifier at high output levels and low frequencies.

2.4 Applying Input Signal

It is possible to apply either a single ended input signal to J20 and J21 or a differential input signal to J24and J25.

NOTE: If a single ended input signal is applied insert jumpers in the header J24 and J25.

2.5 Speaker Connection

CAUTION

Both positive and negative speaker outputs are floating and may not beconnected to ground (e.g., through an oscilloscope).



www.ti.com Protection

3 Protection

This section describes the short-circuit protection and fault-reporting circuitry of the TAS5630 device.

3.1 Short-Circuit Protection and Fault-Reporting Circuitry

The TAS5630 is a self-protecting device that provides fault reporting (including high-temperatureprotection and short-circuit protection). The TAS5630 is configured in back-end auto-recovery mode, andtherefore; resets automatically after all errors (M1, M2, and M3 is set low); see the data sheet (SLES220)for further explanation. This mean that the device restart itself after an error occasion and report throughthe SD error signal.

3.2 Fault Reporting

The OTW and SD outputs from TAS5630 indicate fault conditions. See the TAS5630 data manual for adescription of these pins.

Table 3. TAS5630 Warning/Error Signal Decoding

SD OTW1 OTW2 Device Condition

0 0 0 High-temperature error and/or high-current error

0 0 1 Undervoltage lockout or high current error. 100°C temperature warning.

0 1 1 Undervoltage lockout or high-current error

1 0 0 125°C temperature warning

1 0 1 100°C temperature warning

1 1 1 Normal operation, no errors/warnings

The shutdown signals together with the temperature warning signal give chip-state information asdescribed in the Table 3. device fault-reporting outputs are open-drain outputs.

4 TAS5630DKD2EVM Performance

Table 4. General Test Conditions

General Test Conditions Notes

Output stage supply voltage: 50 V Laboratory power supply (EA-PS 7065-10A)

Load impedance: 4 and 8 ΩInput signal 1 kHz sine

Measurement filters AES17 and AUX0025

Note: These test conditions are used for all tests, unless otherwise specified.



http://www.ti.com/lit/pdf/SLES220

TAS5630DKD2EVM Performance www.ti.com

Table 5. Electrical Data

Electrical Data Notes/Conditions

Output power, 1% THD+N, 4 Ω: 250 W 1 kHz, TA = 25°C



Output power, 10% THD+N,8 Ω: 175 W 1 kHz, TA = 25°C

Maximum peak current: >16 A 1-kHz burst, 1 Ω, ROC = 22 kΩOutput stage efficiency: >90% 2 x channels, 4 ΩDamping factor: 27 1 kHz, relative to 4 Ω load

H-Bridge Supply current: 55 mA 1 kHz, input grounded

Idle power consumption: <3 W H-Bridge Supply, input grounded

Table 6. Audio Performance

Audio Performance Notes/Conditions

THD+N, 4 Ω: 1 W <0.05% 1 kHz

THD+N, 4 Ω: 10 W <0.04% 1 kHz

THD+N, 4 Ω: 50 W <0.02% 1 kHz

THD+N, 4 Ω: 100 W <0.03% 1 kHz

THD+N, 4 Ω: 200 W <0.40% 1 kHz

THD+N, 8 Ω: 1 W <0.04% 1 kHz

THD+N, 8 Ω: 10 W <0.03% 1 kHz

THD+N, 8 Ω: 50 W <0.02% 1 kHz

THD+N, 8 Ω: 100 W <0.10% 1 kHz

Dynamic Range: >100 dB Ref: rated power, A-weighted, AES17 filter, 2 ch avg

Noise Voltage: 320 mVrms A-weighted, AES17 filter

Click/Pop, DC step: <30 mV Mute/Unmute, No signal, 4 ΩChannel Separation: >89 dB 1 kHz

Frequency Response: ±0.5 dB 100 W / 8 Ω, unclipped

Table 7. Thermal Specification

Thermal Specification** THEATSINK* Notes/Conditions

Idle, all channels switching 30°C 1 kHz, 15 min, input grounded, TA = 25°C

2 x 31.3 W, 4 Ω (1/8 power) 45°C 1 kHz, 1 hour, TA = 25°C

2 x 250 W, 4 Ω 70°C 1 kHz, 5 min, TA = 25°C

*Measured on surface of heatsink

** During the thermal test the heat sink has been ventilated with a fan (NMB-MAT Type: 2410ML-04W-B50) connected to J22.

Table 8. Physical Specifications

Physical Specifications Notes/Conditions

PCB dimensions: 94 × 140 × 55 Width × Length × Height (mm)

Total weight: 400 gr Components + PCB + Heatsink + Mechanics

Note: All electrical and audio specifications are typical values.



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www.ti.com TAS5630DKD2EVM Performance

4.1 THD+N vs Power (BTL – 4 Ω)

Figure 3. THD+N vs Power (BTL – 4 Ω)

4.2 THD+N vs Power (BTL – 8 Ω)

Figure 4. THD+N vs Power (BTL – 8 Ω)



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4.3 THD+N vs Frequency (BTL –4 Ω)

Figure 5. THD+N vs Frequency (BTL – 4 Ω)

4.4 THD+N vs Frequency (BTL –8 Ω)

Figure 6. THD+N vs Frequency (BTL – 8 Ω)



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4.5 THD+N vs Power (PBTL – 2 Ω)

Figure 7. THD+N vs Power (PBTL – 2 Ω)

4.6 THD+N vs Frequency (PBTL – 2 Ω)

Figure 8. THD+N vs Frequency (PBTL – 2 Ω)

4.7 FFT Spectrum with –60-dBFS Tone (BTL)

Reference voltage is 28.3 V. FFT size 16k.



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Figure 9. FFT Spectrum with –60-dBFS Tone (BTL)

4.8 Idle Noise FFT Spectrum (BTL)

Input grounded – Reference voltage is 28.3 V. FFT size 16k.

Spurious tone at 52 kHz has it’s origin from the TL2575 switching voltage regulator.

Figure 10. Idle Noise FFT Spectrum (BTL)

4.9 FFT Spectrum With –60-dBFS Tone (PBTL)

Reference voltage is 28.3 V. FFT size 16k.



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Figure 11. FFT Spectrum with –60-dBFS Tone (PBTL)

4.10 Idle Noise FFT Spectrum (PBTL)

Input grounded – Reference voltage is 28.3 V. FFT size 16k.

Spurious tone at 52 kHz has it’s origin from the TL2575 switching voltage regulator.

Figure 12. Idle Noise FFT Spectrum (PBTL)

4.11 Channel Separation (BTL

Channel 1 input signal is set corresponding to 100W / 8 ΩChannel 2 input is grounded. Reference voltage 28.3 Vrms.



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Figure 13. Channel Separation (BTL)

4.12 Frequency Response (BTL)

Measurement bandwidth filter 80 kHz.

Figure 14. Frequency Response (BTL)

4.13 Frequency Response (PBTL)

Measurement bandwidth filter 80 kHz.



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Figure 15. Frequency Response (PBTL)

4.14 High-Current Protection (BTL)

Input 1-kHz bursted signal, load 1 Ω.

Figure 16. High-Current Protection (BTL)

4.15 High-Current Protection (PBTL)

Input 1-kHz bursted signal, load 1 Ω.



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Figure 17. High-Current Protection (PBTL)

4.16 Pop/Click (BTL)

No input signal applied. The measurement results are presented in frequency domain.

Figure 18. Pop/Click (BTL)

4.17 Pop/Click (PBTL)

No input signal applied. The measurement results are presented in frequency domain.



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www.ti.com Related Documentation from Texas Instruments

Figure 19. Pop/Click (PBTL)

4.18 Output Stage Efficiency

Efficiency is tested with 2 BTL channels loaded 8 Ω.

Figure 20. Output Stage Efficiency

5 Related Documentation from Texas Instruments

Table 9 contains a list of data manuals that have detailed descriptions of the integrated circuits used in thedesign of the TAS5630DKD2EVM. The data manuals can be obtained at the URL http://www.ti.com.



http://www.ti.com

Appendix A www.ti.com

Table 9. Related Documentation from TexasInstruments

Part Number Literature Number

TAS5630 SLES220

OPA1632D SBOS286

LM317M SLVS297

TL2575HV-15I SLVS638

5.1 Additional Documentation1. System Design Considerations for True Digital Audio Power Amplifiers application report (SLAA117)2. Digital Audio Measurements application report (SLAA114)3. PSRR for PurePath Digital™ Audio Amplifiers application report (SLEA049)4. Power Rating in Audio Amplifiers application report (SLEA047)5. PurePath Digital™ AM Interference Avoidance application report (SLEA040)6. Click and Pop Measurements Technique application report (SLEA044)7. Power Supply Recommendations for DVD-Receivers application report (SLEA027)8. Implementation of Power Supply Volume Control application report (SLEA038)

Appendix A Design Documents

This appendix comprises design documents pertaining to the TAS5162DDV6EVM evaluation module. Thedocuments are presented in the following order.

• Schematic (4 pages)• Parts List (1 pages)• PCB Specification (1 page)• PCB Layers (6 pages)• Heat-Sink Drawing (1 page)

18 Design Documents SLAU288A–August 2009–Revised May 2010


http://www.ti.com/lit/pdf/SLES220

http://www.ti.com/lit/pdf/SBOS286

http://www.ti.com/lit/pdf/SLVS297

http://www.ti.com/lit/pdf/SLVS638

http://www.ti.com/lit/pdf/SLAA117

http://www.ti.com/lit/pdf/SLAA114

http://www.ti.com/lit/pdf/SLEA049






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ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED

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AUDIO/IMAGING GROUP

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Disclaimer

A846-SCH-001.DSN

TAS5615/30DKD2EVM

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TAS5630DKD2EVM

Page1/4: Front Page and Schematic Disclaimer2/4: TAS5630 Amplifier

Design Name:

Version:Date:Design Engineer:

Audio Configuration:

Interfaces:

File Name: A846-SCH-001.DSN3.0019.May 2009Jonas L. Holm ([email protected])

PurePath HD Digital Amplifier Design1 x TAS5630DKD

Setup:

Type: Mass Market EVM

4 Ohm (BTL) Speaker Loads

TI

Copyright 2008 Texas Instruments, Inc - All rights reserved - The TI and PurePath Digital logos are trademarks of Texas Instruments.

Performance: 2 x 300 W / 4 Ohm (BTL) 10% THD+N> 102 dB Dynamic Range

4/4: Mechanics

J20-J21: RCA Connector for Analog Input

J15: Banana binding post for H-Bridge SupplyJ11, J13: Banana binding posts for speaker connection.

+50 V H-Bridge Supply Voltage

3/4: Input Stage

SCHEMATIC DISCLAIMERThe schematic information and materials ("Materials") provided here are provided by Texas Instruments Incorporated ("TI") as a service to its customers and/or suppliers, and may be used for informational purposes only, and only subject to the following terms. By downloading or viewing these Materials, you are signifying your assent to these terms.

1.) These evaluation schematics are intended for use for ENGINEERING DEVELOPMENT AND EVALUATIONPURPOSES ONLY and are not considered by Texas Instruments to be fit as a basis for establishing productionproducts or systems. This information may be incomplete in several respects, including but not limited to informationrelating to required design, marketing, and/or manufacturing-related protective considerations and product safety measures typically found in the end-product incorporating the goods.

2.) Accordingly, neither TI nor its suppliers warrant the accuracy or completeness of the information, text, graphics, links or other items contained within the Materials. TI may make changes to the Materials, or to the products described therein, at any time without notice. TI makes no commitment to update the Materials.

3.) TI assumes no liability for applications assistance, customer product design, software performance, or services that may be described or referenced in the Materials. The user assumes all responsibility and liability for proper and safe design and handling of goods. Accordingly, the user indemnifies TI from all claims arising from its use of the Materials.

4.) TI currently deals with various customers for products, and therefore our arrangement with the user will not be exclusive. TI makes no representations regarding the commercial availability of non-TI components that may be referenced in the Materials.

5.) No license is granted under any patent right or other intellectual property right of TI covering or relating to anycombination, machine, or process in which such TI products or services might be or are used. Except as expressly provided herein, TI and its suppliers do not grant any express or implied right to you under any patents, copyrights, trademarks, or trade secret information. 6.) Performance tests and ratings, to the extent referenced in the Materials, are measured using specific computersystems and/or components and reflect the approximate performance of TI products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing.

7.) Resale of TI's products or services with statements different from or beyond the parameters stated by TI for that product or service in official TI data books or data sheets voids all express and any implied warranties for the associated TI product or service, and is an unfair and deceptive business practice, and TI is not responsible for any such use.

8.) The Materials are copyrighted and any unauthorized use may violate copyright, trademark, and other laws. Youmay only download one copy for your internal use only, unless you are specifically licensed to do otherwise by TI inwriting. This is a license, not a transfer of title, and is subject to the following restrictions: You may not: (a) modify the Materials (including any associated warranties, conditions, limitations or notices) or use them for any commercialpurpose, or any public display, performance, sale or rental; (b) decompile, reverse engineer, or disassemble softwareMaterials except and only to the extent permitted by applicable law; (c) remove any copyright or other proprietary notices from the Materials; (d) transfer the Materials to another person. You agree to prevent any unauthorized copying of the Materials. TI may terminate this license at any time if you are in breach of the terms of this Agreement. Upon termination, you will immediately destroy the Materials.

9.) THE MATERIALS ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED WARRANTY OF ANY KIND INCLUDING WARRANTIES OF MERCHANTABILITY, NONINFRINGEMENT OF INTELLECTUAL PROPERTY, OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT SHALL TI OR ITS SUPPLIERS BE LIABLE FOR ANY DAMAGESWHATSOEVER (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESSINTERRUPTION, LOSS OF INFORMATION) ARISING OUT OF THE USE OF OR INABILITY TO USE THE MATERIALS, EVEN IF TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

NOTE1

Not Used

SCHEMATIC DISCLAIMERThe schematic information and materials ("Materials") provided here are provided by Texas Instruments Incorporated ("TI") as a service to its customers and/or suppliers, and may be used for informational purposes only, and only subject to the following terms. By downloading or viewing these Materials, you are signifying your assent to these terms.

1.) These evaluation schematics are intended for use for ENGINEERING DEVELOPMENT AND EVALUATIONPURPOSES ONLY and are not considered by Texas Instruments to be fit as a basis for establishing productionproducts or systems. This information may be incomplete in several respects, including but not limited to informationrelating to required design, marketing, and/or manufacturing-related protective considerations and product safety measures typically found in the end-product incorporating the goods.

2.) Accordingly, neither TI nor its suppliers warrant the accuracy or completeness of the information, text, graphics, links or other items contained within the Materials. TI may make changes to the Materials, or to the products described therein, at any time without notice. TI makes no commitment to update the Materials.

3.) TI assumes no liability for applications assistance, customer product design, software performance, or services that may be described or referenced in the Materials. The user assumes all responsibility and liability for proper and safe design and handling of goods. Accordingly, the user indemnifies TI from all claims arising from its use of the Materials.

4.) TI currently deals with various customers for products, and therefore our arrangement with the user will not be exclusive. TI makes no representations regarding the commercial availability of non-TI components that may be referenced in the Materials.

5.) No license is granted under any patent right or other intellectual property right of TI covering or relating to anycombination, machine, or process in which such TI products or services might be or are used. Except as expressly provided herein, TI and its suppliers do not grant any express or implied right to you under any patents, copyrights, trademarks, or trade secret information. 6.) Performance tests and ratings, to the extent referenced in the Materials, are measured using specific computersystems and/or components and reflect the approximate performance of TI products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing.

7.) Resale of TI's products or services with statements different from or beyond the parameters stated by TI for that product or service in official TI data books or data sheets voids all express and any implied warranties for the associated TI product or service, and is an unfair and deceptive business practice, and TI is not responsible for any such use.

8.) The Materials are copyrighted and any unauthorized use may violate copyright, trademark, and other laws. Youmay only download one copy for your internal use only, unless you are specifically licensed to do otherwise by TI inwriting. This is a license, not a transfer of title, and is subject to the following restrictions: You may not: (a) modify the Materials (including any associated warranties, conditions, limitations or notices) or use them for any commercialpurpose, or any public display, performance, sale or rental; (b) decompile, reverse engineer, or disassemble softwareMaterials except and only to the extent permitted by applicable law; (c) remove any copyright or other proprietary notices from the Materials; (d) transfer the Materials to another person. You agree to prevent any unauthorized copying of the Materials. TI may terminate this license at any time if you are in breach of the terms of this Agreement. Upon termination, you will immediately destroy the Materials.

9.) THE MATERIALS ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED WARRANTY OF ANY KIND INCLUDING WARRANTIES OF MERCHANTABILITY, NONINFRINGEMENT OF INTELLECTUAL PROPERTY, OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT SHALL TI OR ITS SUPPLIERS BE LIABLE FOR ANY DAMAGESWHATSOEVER (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESSINTERRUPTION, LOSS OF INFORMATION) ARISING OUT OF THE USE OF OR INABILITY TO USE THE MATERIALS, EVEN IF TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

NOTE1

Not Used

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

/SD

OSC_IOM

READY

/OTW

OSC_IOP

L_IN_N

L_IN_P

R_IN_N

R_IN_P

/RESET

/SD

/OTW

READY

GND

GND

GND

GNDGND

GND GND

GND

GND

GNDGND

VREG

GND

VREG

GND

GND

GND

GND

GND

GND

+12V

+12V PVDD PVDD

GND

PVDD

PVDD

GND

GND

VREG

GND

PVDD

GND

GND

GND

GND

VREG

VREG GND

Rev:

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Project:

File Name:

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AUDIO/IMAGING GROUP

A3

3.00

Jonas L. Holm

Main Schematic

A846-SCH-001.DSN

TAS5615/30DKD2EVM



Rev:

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Project:

File Name:

Date:

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AUDIO/IMAGING GROUP

A3

3.00

Jonas L. Holm

Main Schematic

A846-SCH-001.DSN

TAS5615/30DKD2EVM



Rev:

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Project:

File Name:

Date:

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AUDIO/IMAGING GROUP

A3

3.00

Jonas L. Holm

Main Schematic

A846-SCH-001.DSN

TAS5615/30DKD2EVM



LEFT

4 OHM BTLSPEAKEROUTPUT

RIGHT

4 OHM BTLSPEAKEROUTPUT

High Powersupply

50V

GND

OptionalSync signal

R29

1.5R

R29

1.5R1 2

C3133nFC3133nF

21

C17

10uF

C17

10uF

1 2

SW1

Switch

SW1

Switch

1

3

6

45

2

R51

100R

R51

100R

12

R19

100R

R19

100R

12

C13

100nF

C13

100nF

21

C431nFC431nF

21

C52680nF

C52680nF

21

C482.2uFC482.2uF

21

C322.2uFC322.2uF

21

J11

Red and black banana socket

J11


1

2

R59

100R

R59

100R

12

J13


J13


1

2

C20

330pF

C20

330pF

2 1

C72100pF

C72100pF

21

L117uHL117uH

1 2

R31

1.5R

R31

1.5R1 2

R40

100R

R40

100R

12

C4610nFC46

10nF

21

C25

33nF

C25

33nF

21

R18

100R

R18

100R

12

C22100nFC22100nF

21

C302.2uF

C302.2uF

21

C331000uF

C331000uF

12

C57

47uF

C57

47uF

12

R15

10k

R15

10k12

J15


J15


1

2

C59100pF

C59100pF

21

C15

10uF

C15

10uF

1 2

C4510nFC45

10nF

21

C351000uFC351000uF

12

R333.3RR33

3.3R

12C40

1nFC401nF

21

C37680nF

C37680nF

21

R14

Not Used

R14

Not Used12

C361000uF

C361000uF

12

R3947kR3947k

12

C282.2uF

C282.2uF

21

R353.3RR35

3.3R

12

C4410nFC44

10nF

21

C38680nFC38680nF

21

C39680nFC39680nF

21

C19100nFC19100nF

21

L147uHL147uH

1 2

J19

Header

J19

Header

12

C262.2uFC262.2uF

21

C21100nFC21100nF

21

C29 33nFC29 33nF2 1

C4710nFC47

10nF

21

C14

10uF

C14

10uF

1 2

C23100nFC23100nF

21

R17

100R

R17

100R12

C411nFC411nF

21

C1810uFC1810uF

12

C421nFC421nF

21

U11

TAS5630DKD

U11

TAS5630DKD

PSU_REF1

VDD2

OC_ADJ3

/RESET4

C_STARTUP5

INPUT_A6

INPUT_B7

VI_CM8

GND9

AGND10

VREG11

INPUT_C12

INPUT_D13

FREQ_ADJ14

OSC_IO+15

OSC_IO-16

/OTW18 OUT_D 27

OUT_D 28

GND_D 29

GND_C 30

OUT_C 31

PVDD_C 32

BST_C 33

BST_B 34

PVDD_B 35

OUT_B 36

GND_B 37

GND_A 38

OUT_A 39

OUT_A 40

/SD17

GVDD_AB 44

BST_A 43

PVDD_A 42

PVDD_A 41

M120

M221

M322 GVDD_CD 23

BST_D 24

PVDD_D 25

READY19 PVDD_D 26

C49

10nF

C49

10nF

21

R363.3RR36

3.3R

12

C27 33nFC27 33nF2 1

C60100pF

C60100pF

21

C58100pF

C58100pF

21

SW2

Switch

SW2

Switch

1

3

6

45

2

C73100pFC73100pF

21

L137uHL137uH

1 2

C16

10uF

C16

10uF

1 2

R11

100R

R11

100R

12

R37

3.3R

R37

3.3R

1 2

C24100nF

C24100nF

21

L127uHL127uH

1 2

C341000uFC341000uF

12

R52

100R

R52

100R

12

R12

24k

R12

24k

12

R22

100R

R22

100R

12

C12

1nF

C12

1nF

2 1

C11

4.7nF

C11

4.7nF

2 1

R343.3RR34

3.3R

12

R16

100R

R16

100R12

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

/OTW

/RESET

R_IN_N

R_IN_P

/SD

READY

L_IN_N

L_IN_P

+15V

GND

GND

GND GND

GND

GND GND

+12V

GND

GND

GND GND

+12V

+15V

GND GND

+12V

GND GND

GND GND

GND

+12V

GND

GND

GND

+12V

GND

GND

+15VPVDD

GND

Rev:

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Project:

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Engineer:

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AUDIO/IMAGING GROUP

A3

3.00

Jonas L. Holm

Input Stage

A846-SCH-001.DSN

TAS5615/30DKD2EVM



Rev:

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Project:

File Name:

Date:

Engineer:

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AUDIO/IMAGING GROUP

A3

3.00

Jonas L. Holm

Input Stage

A846-SCH-001.DSN

TAS5615/30DKD2EVM



Rev:

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Project:

File Name:

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AUDIO/IMAGING GROUP

A3

3.00

Jonas L. Holm

Input Stage

A846-SCH-001.DSN

TAS5615/30DKD2EVM



+12VFAN

2 speed FAN Control& Temp Indicator

125 degCChip temp

RE

AD

Y

Shut

dow

n

RES

ET

ON/OFF ControlSTATUS MONITOR12V lin regulator

Optional

LEFT Input

RIGHT Input

Single ended or ballanced input1st order high pass at 1.6Hz& 2nd order active low pass at 80kHz

Jumper J24 & J25 pin 1-2For single ended input

For ballanced input use J24 & J25

+15V Switcher

R434.7kR434.7k

12

D14RedD14

Red

C76470pFC76470pF

21

J22

Header

J22

Header

12

Q162N7002Q162N70021

32

R702.2kR702.2k

1 2

U12 LM317U12 LM317

IN3 OUT 2

AD

J1

OUT 4

R712.2kR712.2k

1 2

C62100nFC62100nF

21

R66 10.0kR66 10.0k1 2

C671nFC671nF

21

C75470pFC75470pF

21

R53

0R

R53

0R

12

V-

V+

V_OCM

EN

U16OPA1632

V-

V+

V_OCM

EN

U16OPA1632

1

2

3

4

5

67

8

C85330uF63V

C85330uF63V

12

R464.7kR464.7k

12

R47560RR47560R

12

C7010uFC7010uF

12

J20

Phono socket

J20

Phono socket

234

1

R54

0R

R54

0R

12

D16Red

D16Red

C56100nFC56100nF

21

C54100nFC54100nF

21

D11GreenD11Green

C7110uFC7110uF

12

R73100kR73100k

12

U17TL2575HV-15IU17TL2575HV-15I

OUTPUT 2VIN1

GN

D3

FB 4

ON

/OFF

5

GN

D-P

AD

6

C5510uF

C5510uF

12

C84

100nF

C84

100nF

21

C5310uF

C5310uF

12

R692.2kR692.2k

1 2

Q142N7002Q142N70021

32

R42560RR42560R

12

R642.2kR642.2k

1 2R652.2kR652.2k

1 2

C6410uF

C6410uF

12

R7510RR7510R

12

R481.2kR481.2k

12

R632.2kR632.2k

1 2

C77 150pFC77 150pF

21

C82 150pFC82 150pF

21

J21

Phono socket

J21

Phono socket

234

1

R501.8k

R501.8k

12

C681nFC681nF

21

R55

0R

R55

0R

12

C6610uFC6610uF

12

C79

100nF

C79

100nF

21C6910uFC6910uF

12

R672.2kR672.2k

1 2

R56

0R

R56

0R

12

R612.2kR612.2k

1 2

R74100kR74100k

12

R72 10.0kR72 10.0k1 2

Q112N7002Q112N70021

32

C6310uFC6310uF

12

C86470uF16V

C86470uF16V

12

R58

0R

R58

0R

12

C61470uF

C61470uF

12

D13Red

D13Red

R68 10.0kR68 10.0k

1 2

J24Shunt Header

J24Shunt Header

1

2

3

R414.7k

R414.7k

12

C65100nFC65100nF

21

C502.2uF100V

C502.2uF100V

21

R57

0R

R57

0R

12

L151mHL151mH

1 2

C78 150pFC78 150pF21

V-

V+

V_OCM

EN

U15OPA1632

V-

V+

V_OCM

EN

U15OPA1632

1

2

3

4

5

67

8

J25Shunt Header

J25Shunt Header

1

2

3

R454.7kR454.7k

12

D1830BQ060D1830BQ060

Q132N7002Q132N70021

32

SW11

Switch

SW11

Switch

1

3

6

45

2

R62 10.0kR62 10.0k

1 2

U13

LM317

U13

LM317

IN3 OUT 2

AD

J1

OUT 4

C83 150pFC83 150pF21

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

GND

Rev:

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AUDIO/IMAGING GROUP

A4

3.00

Jonas L. Holm

Mechanics

A846-SCH-001.DSN

TAS5615/30DKD2EVM



Rev:

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File Name:

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AUDIO/IMAGING GROUP

A4

3.00

Jonas L. Holm

Mechanics

A846-SCH-001.DSN

TAS5615/30DKD2EVM



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AUDIO/IMAGING GROUP

A4

3.00

Jonas L. Holm

Mechanics

A846-SCH-001.DSN

TAS5615/30DKD2EVM



MECHANICS

JUMPER2

Black

JUMPER2

Black

WASHER20

Not Used

WASHER20

Not Used

SCREW14

M3x6

SCREW14

M3x6

STANDOFF14

M3x16

STANDOFF14

M3x16

F11

Not Used

F11

Not Used

1 1

WASHER12

M3

WASHER12

M3

WASHER16

M3

WASHER16

M3

PCB

PCB11

A846-PCB-001_3.00

PCB

PCB11

A846-PCB-001_3.00

MH13

Mounting Hole

MH13

Mounting Hole

1MH16

Mounting Hole

MH16

Mounting Hole

1WASHER14

M3

WASHER14

M3

MH15

Mounting Hole

MH15

Mounting Hole

1

STANDOFF13

M3x16

STANDOFF13

M3x16

MH14

Mounting Hole

MH14

Mounting Hole

1

WASHER15

M3

WASHER15

M3

WASHER13

M3

WASHER13

M3

SCREW16

M3x6

SCREW16

M3x6

SCREW13

M3x6

SCREW13

M3x6

F14

Not Used

F14

Not Used

1 1

MH11

Mounting Hole

MH11

Mounting Hole

1

STANDOFF12

M3x16

STANDOFF12

M3x16

HEAT SINK

HEATSINK11

TIC-HSINK-061_2.00HEAT SINK

HEATSINK11

TIC-HSINK-061_2.00

SCREW12

M3x6

SCREW12

M3x6

WASHER21

Not Used

WASHER21

Not Used

F13

Not Used

F13

Not Used

1 1 JUMPER1

Black

JUMPER1

Black

SCREW15

M3x6

SCREW15

M3x6

MH12

Mounting Hole

MH12

Mounting Hole

1

WASHER11

M3

WASHER11

M3

SCREW11

M3x6

SCREW11

M3x6

STANDOFF11

M3x16

STANDOFF11

M3x16

F12

Not Used

F12

Not Used

1 1

TAS5630DKD2EVM Parts List (3.00).xls

TIQty Part Reference Description Manufacture First Mfr P/N6 R53 R54 R55 R56 R57 R58 0R / 5% / 0603 Thick Film Resistor Yageo RC0603JR-070RL10 R51 R52 R59 100R / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-07100RL1 R15 10k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-0710KL4 R62 R66 R68 R72 10.0k / 100mW / 1% / 0603 Thick Film Resistor Yageo RC0603FR-0710KL2 R73 R74 100k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-07100KL1 R75 10R / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-0710RL1 R48 1.2k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-071K2L

2 R29 R31 1.5R / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-071R5L1 R50 1.8k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-071K8L

8R61 R63 R64 R65 R67 R69 R70 R71 2.2k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-072K2L

1 R12 24k / 100mW / 1% / 0603 Thick Film Resistor Yageo RC0603FR-0724KL

5 R33 R34 R35 R36 R37 3.3R / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-073R3L4 R41 R43 R45 R46 4.7k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-074K7L1 R39 47k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-0747KL2 R42 R47 560R / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-07560RL

5 C44 C45 C46 C47 C49 Ceramic 10nF / 100V / 20% X7R 0805 Capacitor BC Components 0805B103M101NT4 C40 C41 C42 C43 Ceramic 1nF / 100V / 10% NP0 1206 Capacitor BC Components 1206N102K101NT

6 C26 C28 C30 C32 C48 C50Ceramic 2.2uF / 100V / 20% X7R 1210 Capacitor Murata GRM32ER72A225KA35L

1 C12 Ceramic 1nF / 50V / 10% NP0 0805 Capacitor BC Components 0805N102K500NT

12C13 C19 C21 C22 C23 C24 C54 C56 C62 C65 C79 C84 Ceramic 100nF / 16V / 20% X7R 0603 Capacitor Vishay VJ0603Y104MXJ

4 C25 C27 C29 C31 Ceramic 33nF / 25V / 20% X7R 0603 Capacitor BC Components 0603B333M250NT

1 C11 Ceramic 4.7nF / 50V / 20% X7R 0603 Capacitor BC Components 0603B472M500NT

5 C58 C59 C60 C72 C73 Ceramic 100pF / 50V / 10% NP0 0603 Capacitor BC Components 0603N101K500NT2 C67 C68 Ceramic 1nF / 50V / 10% NP0 0603 Capacitor BC Components 0603N102K500NT

4 C77 C78 C82 C83 Ceramic 150pF / 50V / 10% NP0 0603 Capacitor BC Components 0603N151K500NT

1 C20 Ceramic 330pF / 50V / 10% NP0 0603 Capacitor BC Components 0603N331K500NT

2 C75 C76 Ceramic 470pF / 50V / 10% NP0 0603 Capacitor BC Components 0603N471K500NT

4 C37 C38 C39 C52Metal Film 680nF / 250V / 20% Polypropylene 15mm (W:8mm L:18mm) Capacitor Wima MKP 4 0.68uF/20%/250Vdc PCM15

13C14 C15 C16 C17 C18 C53 C55 C63 C64 C66 C69 C70 C71

Electrolytic 10uF / 16V / 20% Aluminium 2mm ø5mm M Series - General Purpose Capacitor Panasonic ECA1CM100

4 C33 C34 C35 C36

Electrolytic 1000uF / 63V / 20% Aluminium 7.5mm ø16mm FC Series - Low Impedance Capacitor Panasonic EEUFC1J102

1 C85Electrolytic 330uF / 63V / 20% Aluminium 5mm ø10mm FC Series - Low Impedance Capacitor Panasonic EEUFC1J331L

1 C57Electrolytic 47uF / 63V / 20% Aluminium 5mm ø10mm Capacitor BC Components 2222 136 68479

1 C86Electrolytic 470uF / 16V / 20% Aluminium 3.5mm ø8mm Low ESR Capacitor Rubycon 16ZL470M8x16

1 C61Electrolytic 470uF / 25V / 20% Aluminium 3.5mm ø8mm FC Series - Low Impedance Capacitor Panasonic EEUFC1E471L

1 L151mH / 0.55A 20% (1.68R) Ferrite Inductor (12.8x12.8x8.0) Epcos B82477G4105M000

4 L11 L12 L13 L14 7uH / 5A (30mR) Low THD+N Ferrite Inductor Fe-Tronic TIC-INDC-026 (1.00)1 D18 3A / 60V Schottky 30BQ060 Diode (SMC) Int. Rectifier 30BQ060PBF3 D13 D14 D16 Light Emitting Red Red LED (0603) Toshiba TLSU10081 D11 Light Emitting Green Green LED (0603) Toshiba TLGU10084 Q11 Q13 Q14 Q16 0.115A / 60V N-ch Power 2N7002 Mosfet (SOT- Fairchild 2N7002

1 U11TAS5630DKD / Stereo Analog Audio PWM Power Output Stage (PSOP3-44) Texas Instruments TAS5630DKD

2 U15 U16OPA1632 / High-Performance, Fully-Differential Audio Opamp (SO8) Texas Instruments OPA1632D

2 U12 U13LM317 / 0.5A Positive Adjustable Regulator (DCY) Texas Instruments LM317MDCY

1 U17TL2575HV-15I / 15V/1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORS (KTT5) Texas Instruments TL2575HV-15IKTTR

6SCREW11 SCREW12 SCREW13 SCREW14 SCREW15 SCREW16 M3x6 Pan Head, Pozidriv, A2 Screw Bossard BN 81882 M3x6

6

WASHER11 WASHER12 WASHER13 WASHER14 WASHER15 WASHER16 M3 Stainless Steel Spring Washer Bossard BN 760 M3

1 of 2 5.Aug. 2009 / JSV

TAS5630DKD2EVM Parts List (3.00).xls

TI4

STANDOFF11 STANDOFF12 STANDOFF13 STANDOFF14 M3x16 nickel plated brass Stand-off Bossard BN 3320 M3x16

2 J19 J222 pins / 1 row / 2.54mm Pitch Vertical Male Friction lock Pin header Header Molex 22-27-2021

2 JUMPER1 JUMPER22 pins / 1 row / 2.54mm Pitch Horizontal Female Black Shunt Black Molex 15-29-1024

2 J20 J21 Horizontal Female w. Switch Coax Phono socket Chunfeng RJ843-4W

3 J11 J13 J152 pins / Vertical Female Banana Red and black banana socket Cliff TPP-3CT

2 J24 J253 pins / 1 row / 2.54mm Pitch Vertical Male Shunt Header Shunt Header Samtec TSW-107-07-T-T

3 SW1 SW2 SW11 Switch DPDT PCB Mount Switch NKK-Nikkai G-22-AP

1 PCB11A846-PCB-001_3.00 / TAS5630DKD2EVM Printed Circuit Board (ver. 3.00) Printline A846-PCB-001(3.00)

1 HEATSINK11TIC-HSINK-061_2.00 / Heatsink for 1 DKD44 package, length 78 mm Phonotech TIC-HSINK-061(2.00)

2 of 2 5.Aug. 2009 / JSV

TI A846-PCBSPEC-001(3.00)

Jonas Holm

Page 1 of 1

TAS5630DKD2EVM PCB SPECIFICATION

Version 3.00

BOARD IDENTIFICATION: A846-PCB-001(3.00)

BOARD TYPE: DOUBLE-SIDED PLATED-THROUGH BOARD

LAMINATE TYPE: FR4

LAMINATE THICKNESS: 1.6mm

TOP LAYER COPPER THICKNESS: 70μm (INCL. PLATING EXTERIOR LAYER)

BOTTOM LAYER COPPER THICKNESS: 70μm (INCL. PLATING EXTERIOR LAYER)

COPPER PLATING OF HOLES: >25μm

MINIMUM HOLE DIAMETER 0.3 mm

SILKSCREEN COMPONENT SIDE: WHITE - REMOVE SILKSCREEN FROM SOLDER AREA & PRE-TINNED AREAS

SILKSCREEN SOLDER SIDE: None

SOLDER MASK COMPONENT SIDE: GREEN

SOLDER MASK SOLDER SIDE: GREEN

PROTECTIVE COATING: SOLDER COATING AND CHEMICAL SILVER ON FREE COPPER

ELECTRICAL TEST: PCB MUST BE ELECTRICAL TESTED

MANUFACTURED TO: PERFAG 2E (www.perfag.dk)

APERTURE TABLE: PERFAG 10A (www.perfag.dk)

BOARD SIZE: 95 x 140 mm

Aprox. Number of holes 410

COMMENTS: SEE DRILL INFORMATION FILE (A846-PCB-001(3.00).pdf)

EVALUATION BOARD/KIT IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must haveelectronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be completein terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmentalmeasures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit doesnot fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYERAND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and allappropriate precautions with regard to electrostatic discharge.

EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANYINDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.

TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.

TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents orservices described herein.

Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/orsafety programs, please contact the TI application engineer or visit www.ti.com/esh.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used.

FCC Warning

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radiofrequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which aredesigned to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments maycause interference with radio communications, in which case the user at his own expense will be required to take whatever measures maybe required to correct this interference.

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the power supply voltage range of 0 V to 50 V.

Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questionsconcerning the input range, please contact a TI field representative prior to connecting the input power.

Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,please contact a TI field representative.

During normal operation, some circuit components may have case temperatures greater than 90°C. The EVM is designed to operateproperly with certain components above 125°C as long as the input and output ranges are maintained. These components include but arenot limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identifiedusing the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2008, Texas Instruments Incorporated

http://www.ti.com/esh

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio

Data Converters dataconverter.ti.com Automotive www.ti.com/automotive

DLP® Products www.dlp.com Communications and www.ti.com/communicationsTelecom

DSP dsp.ti.com Computers and www.ti.com/computersPeripherals

Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps

Interface interface.ti.com Energy www.ti.com/energy

Logic logic.ti.com Industrial www.ti.com/industrial

Power Mgmt power.ti.com Medical www.ti.com/medical

Microcontrollers microcontroller.ti.com Security www.ti.com/security

RFID www.ti-rfid.com Space, Avionics & www.ti.com/space-avionics-defenseDefense

RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video

Wireless www.ti.com/wireless-apps

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2010, Texas Instruments Incorporated

http://amplifier.ti.com

http://www.ti.com/audio

http://dataconverter.ti.com

http://www.ti.com/automotive

http://www.dlp.com

http://www.ti.com/communications

http://dsp.ti.com

http://www.ti.com/computers

http://www.ti.com/clocks

http://www.ti.com/consumer-apps

http://interface.ti.com

http://www.ti.com/energy

http://logic.ti.com

http://www.ti.com/industrial

http://power.ti.com

http://www.ti.com/medical

http://microcontroller.ti.com

http://www.ti.com/security

http://www.ti-rfid.com

http://www.ti.com/space-avionics-defense

http://www.ti.com/lprf

http://www.ti.com/video

http://www.ti.com/wireless-apps