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STUDENT HAND BOOKBACHELOR OF TECHNOLOGY

SEMESTER-6th

STUDY SCHEME-2015 onwards

SWAMI VIVEKANAND COLLEGE OF ENGINEERING & TECHNOLOGY, BANUR.

DEPARTMENT OF ELECTRONICS & COMMUNICATION


DEPARTMENT OF CIVIL ENGINEERING


STUDY SCHEME

Designed By:

Department of Electronics & Communication Engineering.



DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGINEERING

Department TeachersS.

No. Name of Teacher Contact no. Email-id

1. Mr. Aseem Sharma 9915271691 [email protected]

2. Mr. Keshav Jha 7837475573 [email protected]

3. Ms.Amarpreet Kaur 9646138327 [email protected]

4. Ms. Avneet Kaur 9417973297 [email protected]

5. Ms. Shivani 8894549535 [email protected]

Subject Teachers 6th SemesterS. No. Name of Subject Subject code Subject Teachers

name1 Operating Systems BTCS-401 Ms. Shivani

2 Microwave & Radar Engineering BTEC-601 Mr. Keshav Jha

3 Wireless Communication System BTEC-602 Mr. Aseem Sharma

4Engineering Economics & Industrial

Management

BTEC-603Ms. Avneet Kaur

5 VLSI- Design BTEC-604 Ms. Avneet

6 Microelectronics BTEC-902 Ms. Avneet

7 Lab VLSI BTEC-605 Ms. Avneet

8 Lab Microwave Engineering BTEC-606 Mr. Keshav Jha



BTCS-401 OPERATING SYSTEM

Internal Marks: 40 L T PExternal Marks: 60 3 1 0Total Marks: 100

PART-A 1. Introduction to Operating system, Role of Operating System as resource manager, function of kernel and shell, operating system structures, views of an operating system.

2. Process management: CPU scheduling, Scheduling Algorithms, PCB, Process synchronization, Deadlocks, Prevention, Detection and Recovery.

3. Memory Management: Overlays, Memory management policies, Fragmentation and its types, Partitioned memory managements, Paging, Segmentation, Need of Virtual memories, Page replacement Algorithms, Concept of Thrashing.

PART-B 4. Device Management: I/O system and secondary storage structure, Device management policies, Role of I/O traffic controller, scheduler.

5. File Management: File System Architecture, Layered Architecture, Physical and Logical File Systems, Protection and Security.

6. Brief study to multiprocessor and distributed operating systems.

7. Case Studies: LINUX / UNIX Operating System and Windows based operating systems.

Suggested Readings/ Books: 1. A Silberschatz and Peter B. Galvin, ―Operating System Concepts" Addison‖ Wesley Publishing Company 2. Dhamdhere, ―Systems Programming & Operating Systems‖ Tata McGraw Hill 3. Gary Nutt, ―Operating Systems Concepts‖, Pearson Education ltd. 3rd edition.4. Operating System by Madnick Donovan 5. Operating System by Stallings

ASSIGNMENT-1



Q1. What is real time system?

Q2. What is a process?

Q3. What is process control block?

Q4. Define CPU scheduling.

Q5. What is preemptive and non preemptive scheduling?

ASSIGNMENT-2

Q1. What are conditions under which a deadlock situation may arise?

Q2. What are the methods for handling deadlocks

Q3. Define deadlock prevention

Q4. Define deadlock avoidance

Q5. Define logical address and physical address.

Q6. Write about the various CPU scheduling algorithms

ASSIGNMENT-3

Q1. What is virtual memory?

Q2. What are the various page replacement algorithms used for page replacement?

Q3. Give the basic concepts about paging.

Q4. Explain about contiguous memory allocation.

Q5. What is a process state and mention the various states of a process?



ASSIGNMENT-4

Q1. Consider the following five processes, with the length of the CPU burst time given in milliseconds.

Process Burst time P1 10 P2 29 P3 3 P4 7 P5 12 Consider the First come First serve (FCFS), Non Preemptive Shortest Job First (SJF), Round Robin (RR) (quantum=10ms) scheduling algorithm Illustrate the scheduling using Gantt chart. Which algorithm will give the minimum average waiting time? Discuss.

Q2. Assume the following processes arrive for execution at the time indicated and also mention with the length of the CPU-burst time given in milliseconds. Job Burst time (ms) Priority Arrival time (ms) P1 6 2 0 P2 2 2 1 P3 3 4 1 P4 1 1 2 P5 2 3 2

Give a Gantt chart illustrating the execution of these processes using FCFS, Round Robin (quantum=1), and Priority (Preemptive and Non preemptive)

ASSIGNMENT-5

Q1. Define swapping.

Q2. What do you mean by best fit?

Q3. What do you mean by first fit?

Q4. What is segmentation?

Q5. What is thrashing?

Q6. Explain concept of Fragmentation?



QUESTION BANK

Q1. What is an operating system?

Q2. What is the kernel?

Q3. What is real time system?

Q4. What is a process?

Q5. What is process control block?

Q6. Define CPU scheduling.

Q7. What is preemptive and non preemptive scheduling?

Q8. What are the various scheduling criteria for CPU scheduling?

Q9. Define throughput?

Q10. What is turnaround time?

Q11. What is critical section problem?

Q12. What is a semaphore?

Q13. Define deadlock

Q14. What are conditions under which a deadlock situation may arise?

Q15. What are the methods for handling deadlocks

Q16. Define deadlock prevention

Q17. Define deadlock avoidance

Q18. Define logical address and physical address.

Q19. Write about the various CPU scheduling algorithms

Q20. What is virtual memory?

Q21. What are the various page replacement algorithms used for page replacement?

Q22. Give the basic concepts about paging.

Q23. Explain about contiguous memory allocation.

Q24. What is a process state and mention the various states of a process?



Q25. Consider the following five processes, with the length of the CPU burst time given in milliseconds.

Process Burst time

P1 10

P2 29

P3 3

P4 7

P5 12

Consider the First come First serve (FCFS), Non Preemptive Shortest Job First (SJF), Round Robin (RR) (quantum=10ms) scheduling algorithm Illustrate the scheduling using Gantt chart. Which algorithm will give the minimum average waiting time? Discuss.

Q26. Assume the following processes arrive for execution at the time indicated and also mention with the length of the CPU-burst time given in milliseconds.

Job Burst time (ms) Priority Arrival time (ms)

P1 6 2 0

P2 2 2 1

P3 3 4 1

P4 1 1 2

P5 2 3 2

Give a Gantt chart illustrating the execution of these processes using FCFS, Round Robin (quantum=1), and Priority (Preemptive and Non preemptive)

Q27. Define swapping.

Q28. What do you mean by best fit?

Q29. What do you mean by first fit?

Q30. What is segmentation?



Q31. What is thrashing?

Q32. Explain concept of Fragmentation



BTEC – 601 Microwave & Radar Engineering


Microwave Tubes: Limitations of conventional tubes, construction, operation and properties of Klystron Amplifier, reflex Klystron, Magnetron, Travelling Wave Tube (TWT), Backward Wave Oscillator (BWO), Crossed field amplifiers.

Microwave Solid State Devices: Limitation of conventional solid state devices at Microwaves, Transistors (Bipolar, FET), Diodes (Tunnel, Varactor, PIN), Transferred Electron Devices (Gunn diode), Avalanche transit time effect (IMPATT, TRAPATT, SBD), Microwave Amplification by Stimulated Emission of Radiation (MASER).

Microwave Components: Analysis of Microwave components using s-parameters, Junctions (E, H, Hybrid), Directional coupler, Bends and Corners, Microwave posts, S.S. tuners, Attenuators, Phase shifter, Ferrite devices (Isolator, Circulator, Gyrator), Cavity resonator, Matched termination.

Microwave Measurements: Power measurements using calorimeters and bolometers, Measurement of Standing Wave Ratio (SWR), Frequency and wavelength, Microwave bridges.

Introduction to Radar Systems: Basic Principle: Block diagram and operation of Radar, Radar range Equation, Pulse Repetition Frequency (PRF) and Range Ambiguities, Applications of Radar.

Doppler Radars: Doppler determination of velocity, Continuous Wave (CW) radar and its limitations, Frequency Modulated Continuous Wave (FMCW) radar, Basic principle and operation of Moving Target Indicator (MTI) radar, Delay line cancellers, Blind speeds and staggered PRFs.

Scanning and Tracking Techniques: Various scanning techniques (Horizontal, vertical, spiral, palmer, raster, nodding), Angle tracking systems (Lobe switching, conical scan, monopulse), Range tracking systems, Doppler (velocity) tracking systems.

Text books: 1. Microwave devices and circuits: Samuel Liao; PHI 2. Microwave devices and Radar Engg: M. Kulkarni; Umesh Publications 3. Introduction to radar systems: Merill I. Skolnik

Reference Books: 1. Foundation of Microwave Engg. : R.E. Collin; McGraw Hill.2. Microwave Engg: K.C Gupta

ASSIGNMENT NO. 1



Q1 What are applications of microwave frequencies?

Q2 Why wave guides are used for higher frequencies?

Q3 Write expression for propagation constant of a rectangular wave guide.

Q4 Write a short note on "slotted section".

Q5 What are Tees? What are different types of Tees?

ASSIGNMENT NO. 2Q1 What is the use of Twists in microwave components?

Q2 Explain the basic concepts of thermionic emission and vacuum tube.

Q3 Explain the effect of transit time on high frequency performance of conventional vacuum

tube.

Q4 What are applications of reflex Klystron?

Q5 Write a short note on "Gunn diode".

ASSIGNMENT NO. 3

Q1 What are different applications of Horn antennas?

Q2 Explain troposphere and its properties.

Q3 Explain the radar range equation.

Q4 Write a short note on "PPI".

Q5 What are different multiple access techniques?

ASSIGNMENT NO. 4

Q1 What is frequency range of X band?

Q2 Define waveguide.

Q3 Draw shape of circular wave guide.

Q4 Define guide wavelength.

Q5 Define E- Bends.

Q6 What is use of Isolator?

Q6 Define vacuum tubes.



ASSIGNMENT NO. 5

Q1 . Draw structure of Horn antenna.

Q2. Define unambiguous range.

Q 3. Expand FMCW.

Q4. Name any most common type of radar display.

Q5. Define Variable attenuator.

QUESTION BANK

Q1. What are applications of microwave frequencies?

Q2. Why wave guides are used for higher frequencies?

Q3. Write expression for propagation constant of a rectangular wave guide.

1. Write a short note on "slotted section".

2. What are Tees? What are different types of Tees?

3. What is the use of Twists in microwave components?

4. Explain the basic concepts of thermionic emission and vacuum tube.

5. Explain the effect of transit time on high frequency performance of conventional vacuum

tube.

6. What are applications of reflex Klystron?

7. Write a short note on "Gunn diode".

8. What are different applications of Horn antennas?

9. Explain troposphere and its properties.

10. Explain the radar range equation.

11. Write a short note on "PPI".

12. What are different multiple access techniques?

13. What is microwave? Classify microwave on the basis of its frequency bands.

14. Explain Microwave circulator with the help of suitable diagram. Also write applications

of microwave circulator.

15. Explain characteristics and working of Multi-cavity magnetron.

16. Draw and explain the block diagram of microwave communication link.



17. Draw and explain block diagram of MTI radar system.

BTEC – 602 Wireless Communication Systems

Internal Marks: 40 L T P



External Marks: 60 3 1 0Total Marks: 100

Introduction: A basic cellular system, performance criteria, operation of cellular systems, planning a cellular system, analog & digital cellular systems. Examples of Wireless Communication Systems: Paging Systems, Cordless Telephone Systems, Cellular Telephone Systems. Blue tooth and Zig Bee.

Elements of Cellular Radio Systems Design: General description of the problem, concept of frequency reuse channels, co-channel interference reduction factor, desired C/I from a normal case in an omni directional antenna system, cell splitting, consideration of the components of cellular systems.

Digital Communication through fading multipath channels: Fading channel and their characteristics- Channel modeling, Digital signaling over a frequency non selective slowly fading channel. Concept of diversity branches and signal paths. Combining methods: Selective diversity combining, Switched combining, maximal ratio combining, Equal gain combining.

Multiple Access Techniques for Wireless Communications: Introduction, Frequency Division Multiple Access (FDMA), Time Division Multiple Access (TDMA), Spread Spectrum Multiple Access, Space Division Multiple Access, Packet Radio Protocols; Pure ALOHA, Slotted ALLOHA.

Wireless Systems & Standards: AMPS and ETACS, United states digital cellular (IS- 54 & IS 136), Global system for Mobile (GSM): Services, Features, System Architecture, and Channel Types, Frame Structure for GSM, Speech Processing in GSM, GPRS/EDGE specifications and features. 3G systems: UMTS & CDMA 2000 standards and specifications. CDMA Digital standard (IS 95): Frequency and Channel specifications, Forward CDMA Channel, Reverse CDMA Channel, Wireless Cable Television.

Future trends: 4G mobile techniques, LTE-Advance systems

Recommended Text Books: 1. T.S.Rappaport, Wireless Communications: Principles and Practice, 2nd Edition, Pearson Education Asia, 2010. 2. William C Y Lee, Mobile Cellular Telecommunications, 2nd Edition, MGH, 2004. 3. Raj Pandya, ―Mobile and Personal Communication systems and services‖, Prentice Hall of

Assignment -1

Q1.What are the basic units of a Cellular system?

Q2.what is meant by handover technique?

Q3.What are the different types of Hand over?



Q4.Define ALOHA

Q5.Explain CDMA2000

Assignment -2

Q1. List the ad hoc routing protocol.

Q2. Explain about wireless ad hoc network.

Q3.With suitable block diagram explain the GSM system?

Q4.Explain the following

a. Doppler shift

b. Doppler spread

c. Coherence time

Q5.Explain fading due to multipath delay spread?

Assignment -3

Q1. Explain fading due to Doppler spread and coherence time?

Q2. What are the basic units of a Cellular system?

Q3. What are the techniques used to expand the capacity of cellular system?

Q4. What is channel assignment? What are the types?

Q5. What do you mean by forward and reverse channel?

Assignment -4

Q1. Define cell splitting.

Q2. Define Grade of service.

Q3. What is cell sectoring?

Q4.What is TDMA?



Q 5.What is CDMA?

Assignment -5

Q1 Compare FDMA, TDMA & CDMA?

Q2. Briefly explain the principle of cellular networks?

Q3. Write short notes on frequency reuse & channel assignment strategies?

Q4. Explain the Multiple Access methods with neat diagrams?

Q5. Explain “repeaters for range extension” and “microcell zone” concept?

QUESTION BANK

Q1. What are the methods to increase the capacity of wireless system, without increasing required spectrum?



Q2. Define capacity of a fading channel?

Q3. What is foot print?

Q4. Define adjacent channel interference

Q5. What is blocked call clear system(BCC)?

Q6. Define large scale propagation model?

Q7. What is a multiple access technique?

Q8. What is flat fading?

Q9. What is sectoring?

Q10. Differentiate flat fading and frequency selective fading.

Q11. What is coherence time and coherence bandwidth?

Q12. Explain in detail the evolution of wireless communication?

Q13. Discuss and explain the multipath propagation.

Q14. Define Grade of service.

Q15 What is cell sectoring?

Q16.What is TDMA?

Q 17.What is CDMA?

Q18.Write is microcell zone concept?

Q19 Compare FDMA, TDMA & CDMA?

Q20. Briefly explain the principle of cellular networks?

Q21. Write short notes on frequency reuse & channel assignment strategies?

Q22. Explain the Multiple Access methods with neat diagrams?

Q23. Explain “repeaters for range extension” and “microcell zone” concept?

BTEC – 603 Engineering Economics & Industrial Management




Cost analysis: Break-even analysis, two and three alternatives, graphical solution. Breakeven charts, effects of changes in fixed and variable costs. Minimum cost analysis, economics order quality. Effect of risk and uncertainty on lot size. Replacement Studies: Reasons for replacement, factors to be considered in replacement Studies, discounted cash flow analysis, economic life of a project, challenger and defender. Economic Analysis Of Investment Alternatives : Basic economy study patterns and their comparison, decision making in selection of alternative by present worth methods, rate of return method, payout period method and uniform annual cost method, economic analysis of new projects, effect of taxation on economic studies. Cost Estimation : Difference between cost estimation and cost accounting, qualifications of an estimator. Estimating procedure, Estimate of material cost and labour cost. Estimation of cost in various manufacturing operations.

Depreciation : Types of depreciation and their Methods.

Concepts of Industrial Management: Concept, Development, application and scope of Industrial Management , Functions of Management, Evolution of Management Thought : Taylor’s Scientific Management, Fayol’s,Principles of Management, Douglas Mc-Gregor’s Theory X and Theory Y, Mayo’s Hawthorne, Experiments, Hertzberg’s Two Factor Theory of Motivation, Maslow’s Hierarchy of Human Needs’

Productivity : Definition, measurement, productivity index, types of production system, Industrial Ownership.

Designing Organizational Structures: Concept, Importance and characteristics of organization, Types of organization - Project, matrix and informal organization. Span of control, Delegation of authority.

Materials Management-Objectives, Inventory - functions, types, associated costs, Inventory Control Systems-Continuous review system-periodical review system. Stores Management and Stores Records. Purchase management, duties of purchase of manager, associated forms.

TEXT BOOKS 1. O.P Khanna, Industrial Engineering. 2. T.N. Bhagooiwal Economics of Labour and Industrial Relations (Sahitya BhawanAg 3. Engineering Economy : Thuesen Prentice Hall



REFERENCES 1. Minappa and Personnel Managements M.S. Saiyada (Tata Mc Graw Hill) 2. C.B. Mamoria Personnel Management (Himalaya publishing house Bombay) 3. Engg. Economics Analysis Bullinger 4. Introduction to Econometrics : Kliwen Prentice Hall.

Assignment 1

Q1.Explain breakeven point?

Q2.Explain reasons for replacement?

Q3.discuss factors for replacement studies?

Q4.Differentiate between capital cost and maintenance cost?

Q5.what is challenger and defender?

Assignment 2

Q1.what are different elements of cost and cost ladder?

Q2.what are labour requirements?Describe a procedure for estimation of material cost.

Q3.what are overhead expenses?

Q4.describe the functions of cost estimation?

Q5 what is depreciation? What is the need for calculation of depreciation?

Assignment 3

Q1.explain various types of depreciation?

Q2.Describe three widely used methods for calculation of depreciation ?

Q3Discuss the concepts, development ,applications and scope of industrial management?

Q4.Explain Moslow hierarchy of human needs?

Q5Describe the functions of managent?

Assignment 4



Q1,Define productivity?

Q2.What are various technical factors affecting productivity?classify these factors?

Q3.What is the importance of productivity?discuss main implication and facts?

Q4.what is the need for productivity measurement?

Q5.Explain total productivity index?

Assignment 5

Q1.explain the advantages of inventory control?

Q2.Explain various models of inventory control?

Q3.what is stores management?explain important stores records?

Q4.what is the role of various costs in inventory control?

Q5.what is human resource planning?

QUESTION BANK



Q1 Need of Minimum cost analysis

Q2. Productivity index

Q3 Duties of purchase manager

Q4. Estimate of material cost

Q5 Discounted cash flow

Q6. Objectives of economic analysis

Q7 Cost estimation vs cost accounting

Q8. Fayol's principles of management

Q9 Continuous review system

Q10. Types of depreciation

Q11 Define break even analysis. Draw a break even chart and explain its components.

Q12 Which are the key factors to considered under replacement studies and Why?

Q13. Highlight merits and demerits of methods of calculating depreciation

Q14. Define cost estimation. Enumerate steps in estimation of material and labour cost.

Q15. Why do purchase management significant for businesses. Highlight its specific objectives too.

Q16 What is industrial management. Discuss Masclow' s hierarchy of human needs theory of management in detail and also highlight its relevance in managerial decision making .

Q17. Why designing of organizational structures is so important in present day business scenario. Enlist key issues in designing organizational structures

Q18. Define production system. Discuss its types with examples in detail.

Q19. Enumerate the inputs required for breakeven analysis

Q20. What is the effect of uncertainty in breakeven analysis?

Q21. Differentiate between challenger and defender in replacement studies

BTEC – 604 VLSI Design

Internal Marks: 40 L T P



External Marks: 60 4 1 0Total Marks: 100

Introduction: Introduction to Computer-aided design tools for digital systems. Hardware description languages, Introduction to VHDL, Data objects, Classes and data types, Operators, Overloading, and Logical operators. Types of delays, Entity and Architecture declaration Introduction to behavioral, dataflow and structural models

VHDL Statements: Assignment statements, Sequential Statements and Process, Conditional Statements, Case Statements, Array and Loops, Resolution Functions, Packages & Libraries, Concurrent Statements.

Applications of VHDL: Combinational Circuit Design such as such as Multiplexers, Encoders, Decoders, Code Converters, Comparators, and Implementation of Boolean functions etc., Sequential Circuit Design such as Shift registers, Counters etc.

Review of MOS Devices: MOS Structure, Enhancement & Depletion Transistor, Threshold Voltage, MOS device design equations MOS Transistor Models. NMOS, PMOS, CMOS.

Basic Electrical Properties and Circuit Concepts: The NMOS Inverter and Transfer Characteristics pull up and pull down ratios of NMOS, alternative forms of pull up the CMOS Inverter and transfer characteristics. CMOS Inverter Delays. Driving large Capacitive loads, Propagation delays and effect of wiring capacitance.

Circuit Characterization and Performance Estimation: Estimation of R, C, L, Switching Characteristics-delay models. Power dissipation. Scaling of MOS circuits. Effect of device scaling on circuit performance.

Recommended Text Books: 1. ―A VHDL Primmer‖: Bhasker; Prentice Hall 1995. 2. Weste and Eshrighian, ―Principle of CMOS VLSI Design‖ Pearson Education, 2001. 3. Pucknell D A and Eshraghian K, ―Basic VLSI Design‖, Prentice Hall India, New Delhi (2003). 4. Fundamentals of Digital Logic with VHDL Design: Brown and Vranesic; TMH(2000) 5. S. M. Kang, Y. Lebiebici, ―CMOS digital integrated circuits analysis & design‖ TMH, 3rd Edition.



ASSIGNMENT 1

Q1. Explain Data objects and library?

Q2. Define operators and logic operators?

Q3. What do you mean by VHDL?

Q4. What do you understand by entity? Explain?

Q5. What is subtyping used for?

ASSIGNMENT 2

Q1. What are types of Delays?

Q2. What are three levels of architecture description?

Q3. Name any two synthesis tools for digital systems?

Q4. Explain basic and extended identifiers?

Q5. Explain entity and architecture declaration?

ASSIGNMENT 3

Q1. What Are advantages of designing?

Q2. Name the different EDA tools for synthesis and simulating digital systems?

Q3. What is operator overloading?

Q4.What are sequential statements?

Q5. What is a process in VHDL ? Explain with example?

ASSIGNMENT 4

Q1.What is resolution Function?

Q2. Explain conditional statement with example?

Q3. Explain the role of attribute in vHDL?

Q4. How is generic statement useful in VHDL code?

Q5. Write short note on sequential statyement?

ASSIGNMENT 5

Q1. What is a combinational circuit?



Q2. Define comparartor?

Q3. Write VHDL code for n-bit NANd gate?

Q4. Write a data flow model for 4 to 16 decoder?

Q5. Design 3:8 decoder?

QUESTION BANK

Q1 Define sensitivity list in a process statement giving example of Half Adder.

Q2 Differentiate between sequential and combinational circuits giving two examples of each.

Q3) List the basic components of a micro computer with the help of a neat sketch.

Q4 Explain the difference between concurrent and sequential programming in VHDL.

Q5 What is Subprogram? Discuss the types of subprograms available in VHDL.

Q6 Give any two points of differences between Signal and Variable class

Q7 Write a VHDL program to implement EX-OR gate using CASE statement

.Q8) What is Package? How it is significant in VHDL?

Q9) Differentiate between PROM and PAL.

Q10 Implement the given function using basic gates and write its VHDL code:

F(A,B,C,D) = m (0,1,2,3,11,12,14,15)

Q11 Write a short note on CPLD. How are they different from FPGA?

Q12. Explain the inertial delay and transport delay in behavioral modeling. Also, give the delay model for each of these

Q13. Design a logic circuit that controls the passage of a signal A according to the following requirements : a) Output X will equal A when control inputs B and C are the same. b) X will remain HIGH when B and C are different. Implement the design using dataflow style of VHDL Modeling

Q14. Write VHDL code for the 3-bit Asynchronous up counter. Use T Flip-Flops in your design

Q15. Design a simple Microcomputer that performs arithmetic and logical operations on bit vectors. Implement using VHDL

Q16 Design a 4 bit Binary to gray code converter. b) Write its Gate level VHDL code using structural style of modeling. 8



Q17Write briefly : a) With a neat block diagram, explain PLA

Q18. Using the example of full adder, Compare and contrast the dataflow, behavioral and structural style of modeling in VHDL..

Q19 Explain VHDL design flow with an example

Q20 What do you mean by package and library?

BTEC-902 MICRO ELECTRONICS




INTRODUCTION: Advantages of IC’s, General classification of IC’s(Linear/Digital IC’s ,Monolithic/ Hybrid IC’s), Basic IC fabrication steps.

CRYSTAL GRTOWTH AND EPITAXY: Starting material for formation of crystal, Horizontal Bridgeman Method, Czochralski growth, Distribution of dopants, Zone refining, Silicon Float Zone process, Si-Wafer preparation, Epitaxial growth, Techniques used for epitaxial growth(LPE,VPE,MBE)

SILICON OXIDATION: Thermal oxidation process (Kinetics of growth , Thin oxide growth), Effect of impurities on the oxidation rate, Preoxidation Cleaning, Various oxidation techniques, Masking properties of SiO2 , IV PHOTOLITHOGRAPHY AND ETCHING, Pattern generation/Mask making, Contact and Proximity printing, Photoresistsl, Photolithography Process(Lift off technology , Fine line photolithography), Wet/Dry etching, Reactive Plasma etching techniques and applications

DIFFUSION AND ION IMPLANTATION: Basic diffusion process(Diffusion equation, Diffusion profiles), Extrinsic diffusion, Lateral Diffusion, Ion Implantation Process (Ion distribution , Ion Stopping), Implant Damage and Annealing process (Furnace and RTA), VI IC PACKAGING, Isolation Techniques, Testing of the Chip, Wire Bonding techniques, Flip Chip technique, Various Packaging methods and Materials, VII FABRICATION OF MONOLITHIC COMPONENTS, Fabrication of Diodes, Resistors, capacitors and inductors, Fabrication of BJT and FET, Fabrication of MOS Devices , CMOS fabrication techniques(nwell and p-well process sequences), Introduction to MEMS.

Recommended Text Books: 1. Fundamental of Semiconductor Fabrication:Gray S.May and Simon M.Sze 2. VLSI Technology : Sze. Reference Books: 1. Microelectronics: Jacob and Millman

ASSIGNMENT 1

Q1. Explain the advantages of IC’s?

Q2. Compare the linear and Digital IC’s?

Q3. Explain the fabrication of IC steps?

Q4. Describe Monolithic IC’s?

Q5. Why Hybrid IC’s preferred?

ASSIGNMENT 2



Q1. What type of material required for the formation of crystal?

Q2. Describe Zone-Refining?

Q3. Explain the difference between Bridgeman and Czochralski Method?

Q4. What you understand by Epitaxial Growth?

Q5. Explain LPE, VPE, MBE?

ASSIGNMENT 3.

Q1. Describe Kinetics of growth?

Q2. Explain Preoxidation Cleaning?

Q3. Describe the masking properties of Sio2?

Q4. Compare Wet and Dry etching?

Q5. Explain Thin oxide growth?

ASSIGNMENT 4

Q1. Explain Reactive plasma techniques with suitable example?

Q2. Describe Photolithography process?

Q3. Discuss pattern generation?

Q4. State diffusion equation and diffusion profile?

Q5. Explain Lift-off technology ?

ASSIGNMENT 5

Q1. Discuss Ion-implanation process?

Q2. Explain Isolation Techniques?

Q3. Describe testing of chip?

Q4. Describe MEMS?

Q5. Explain Extrinsic diffusion process?



QUESTION BANK

Q1. Write down the advantages of IC technology

Q2. Explain Lapping process used in water preparation

Q3 How Chemical Vapor Deposition is done?

Q4. What is DC sputtering? Explain.

Q5. What is the effect of impurities on the oxidation rate?

Q6 How Thermal Runaway can be stopped in IC’s?

Q7 Explain the role of lambda rule.

Q8 Why masking is done in fabrication of CMOS transistor?

Q9 What is the meaning of second Breakdown?

Q10 What do you mean by MEMS?

Q11Explain monolithic and hybrid IC’s classifications with suitable examples

Q12 Explain two types of Impurity Distributions in detail

Q13 . Explain different types of Photolithography.

Q14 What do you mean by zone refining and how we are able to produce a pure structure of an element from an impure element?

Q15. Write down the function of Epitaxy in 1C fabrication. How many types of Epitaxy Growth can be done? Explain

Q16 Derive the equation for finite output resistance of a MOSFET

Q17 Explain the effect of feedback on the amplifier poles.

Q18 What are the properties of negative feedbacks? Explain in detail.

Q19 Draw the ideal structure for the series-series feedback amplifier and explain it.

Q20 Explain the fabrication of CMOS



BTEC-605 (LAB VLSI)


List of Experiments:

Combinational Design Exercises

1. Design of basic Gates: AND, OR, NOT.

2. Design of universal gates

3. Design of 2:1 Mux using other basic gates

4. Design of 2 to 4 Decoder

5. Design of Half-Adder, Full Adder, Half Substractor, Full Substractor

6. Design of 3:8 Decoder

7. Design of 8:3 Priority Encoder

8. Design of 4 Bit Binary to Grey code Converter

9. Design of 4 Bit Binary to BCD Converter using sequential statement

10. Design an 8 Bit parity generator ( with for loop and Generic statements)

11. Design of 2,s Complementary for 8-bit Binary number using Generate statements Sequential Design Exercises

12. Design of all type of Flip-Flops using ( if-then-else) Sequential Constructs

13. Design of 8-Bit Shift Register with shift Right, Rhisft Left, Load and Synchronous reset.

14. Design of Synchronous 8-bit Johnson Counter.

15. Design of Synchronous 8-Bit universal shift register ( parallel-in, parallel-out) with 3- state output

( IC 74299)

16. Design of 4 Bit Binary to BCD Converter using sequential statement.

17. Design counters (MOD 3, MOD 5, MOD 8, MOD 16)

18. Design a decimal up/down counter that counts up from 00 to 99 or down from 99 to 00.

19. Design 3-line to 8-line decoder with address latch



BTEC- 606 (LAB Microwave Engineering)Internal Marks: 30 L T PExternal Marks:20Total Marks: 50 0 0 2

List of Experiments:

1. Study of microwave components and instruments.

2. Measurement of crystal characteristics and proof of the square law characteristics of the diode.

3. Measurement of klystron characteristics.

4. Measurement of VSWR and standing wave ratio.

5. Measurement of Dielectric constants. 6. Measurement of Directivity and coupling coefficient of a directional coupler.

7. Measurement of Q of a cavity.

8. Calibration of the attenuation constant of an attenuator.

9. Determination of the radiation characteristics and gain of an antenna.

10. Determination of the phase-shift of a phase shifter.

11. Determination of the standing wave pattern on a transmission line and finding the length and


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