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Surface Mount Tantalum Capacitors

ContentsSurface Mount Tantalum Capacitors

Section 1 – TAJ, TAZ, and TPS Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

TAJ Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

TPS Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9

Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

TAZ Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-15

CWR09 Style (MIL-C-55365/4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-18

CWR11 Style (MIL-C-55365/8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19-21

Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-23

Technical Summary and Application GuidelinesContents/Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24-25

Electrical Characteristics and Explanation of Terms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-29

A.C. Operation, Ripple Voltage and Ripple Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30-32

Reliability and Calculation of Failure Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33-34

Soldering Conditions and Board Attachment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Recommended Soldering Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Mechanical and Thermal Properties/Qualification Approval Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Questions and Answers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39-40

Recommended Technical Publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

AVX offers a broad line of molded solid tantalumcapacitors in a wide range of sizes, styles, and ratings to meet your design needs. This catalogcombines into one source AVX’s SMD tantalumcapacitor information from its worldwide tantalumoperations.

The TAJ series includes EIA standard case sizesand ratings, along with extended range values. Lowprofile packages and MIL-Style CWR11 compo-nents are available as part of the TAJ family.

The TPS Low ESR SMD product line was intro-duced last year and is included in this catalog toprovide a comprehensive listing of our tantalum surface mount lines. TPS has its own catalog whichcovers performance and applications in depth. Thiscatalog may be obtained from your local AVX repre-sentative.

The TAZ Series offers high volume efficiencycomponents in a wide variety of footprints. Five

of those footprints have a nominal height of 0.050inches which make them ideal for low profile appli-cations.

The TAZ series is qualified as the MIL-StyleCWR09, the molded equivalent of the MIL-StyleCWR06. Two new case sizes are added to thisseries, increasing the capacitance/voltage ratingsavailable for both low and high values. Extendedrange values are also available in all series.

AVX offers tantalum applications service for use by our customers, please contact your localrepresentative if you wish to discuss any specialrequirements.

AVX has become a world leader in tantalumcapacitor technology and is continuing to make sig-nificant investments in equipment and research tomaintain that leadership.

Surface Mount Tantalum CapacitorsForeword

1

The AVX series of molded tantalum chips aredesigned for surface mount applications and areequally suitable for hybrid applications. They areavailable tape and reel packaged for high volumeautomatic assembly techniques.

Surface Mount Tantalum CapacitorsSection 1 – TAJ, TAZ, and TPS

Design and Application Features1. Flat top surface for high speed pick-up — compatible with high speed automatic onsertion equipment.2. Regular molded shape — allows accurate transferand placement during onsertion.3. Glue pads on underside of TAJ/TPS ranges permitconsistent, strong bonding to circuit board prior tosoldering.4. Consistent termination dimensions — allows reliable pad design and a consistent “fit” — helps toeliminate “tombstoning” effects and reducesrotational effects.5. Compliant terminations — transfer of thermo-mechanical stresses during operation and mechani-cal stresses during equipment servicing to the component are reduced.

6. Rugged construction helps to prevent damageduring mounting and to ensure compatibility with allsystems for soldering (infra-red, wave solder, reflowsolder, vapor phase) and conductive epoxy resinmounting techniques.

7. Resistant to flux removal solvents includingAqueous systems used with vapor phase soldering.

8. All parts are coded on uppermost surface withvidecon-readable polarity marking, cap value,and voltage.

9. High density packaging on 8 and 12 mm blistertape, available on 7" and 13" reels.

10. Qualified to IECQ, CECC and MIL specifications,TAJ/TPS in compliance with EIA standards.

11. New low profile case sizes including the new “R”case compatible with “0805” footprint. Maximumheight for low profile is 1.2mm (0.047").

Ta

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Carbon

Silver

2

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2

Surface Mount Tantalum CapacitorsTAJ Series — Solid Tantalum Chip Capacitors (EIA Standard)

The TAJ standard series encompasses the four key sizes recognized by majorOEMs throughout the world, together with the high profile E case (7343Hsize).

Available with standard capacitance tolerances of ±10% and ±20%.

Operational temperature -55°C to +85°C at rated voltage and up to +125°Cwith voltage derating in applications utilizing recommended series resistance.

TAJ is available in standard and extended ranges.

Note on sizes: A, B, C, D - EIA standard EIA-535BAACE - Extended range (high profile D case, 7343H EIA-535BAAC)

For CWR11 ratings see pages 19 - 21.

Case Dimensions millimeters (inches)

W1 dimension applies to the termination width for A dimensional area only.

Code EIA W+0.2 (0.008) L± 0.2 (0.008) H+0.2 (0.008) W1±0.2 (0.008) A+ 0.3 (0.012) S Min.Code -0.1 (0.004) - 0.1 (0.004) - 0.2 (0.008)

A 3216 1.6 (0.063) 3.2 (0.126) 1.6 (0.063) 1.2 (0.047) 0.8 (0.031) 1.1 (0.043)

B 3528 2.8 (0.110) 3.5 (0.138) 1.9 (0.075) 2.2 (0.087) 0.8 (0.031) 1.4 (0.055)

C 6032 3.2 (0.126) 6.0 (0.236) 2.6 (0.102) 2.2 (0.087) 1.3 (0.051) 2.9 (0.114)

D 7343 4.3 (0.169) 7.3 (0.287) 2.9 (0.114) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173)

E 7343H 4.3 (0.169) 7.3 (0.287) 4.1 (0.162) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173)

How to Order: TAJ C 106 M 025 R **

Type

Case Code (See table above)

Capacitance CodepF code: 1st two digits represent significant figures, 3rddigit represents multiplier (number of zeros to follow)

ToleranceK=±10%, M=±20%, (J=±5%, consult your AVX representative for details)

Rated DC Voltage

Packaging/Leadframe Finish (Consult page 10 for details)

Additional characters may be added for special requirements

Technical Data: All technical data relate to an ambient temperature of +25°CCapacitance Range: 0.1 µF to 330 µFCapacitance Tolerance: ±20%; ±10%Rated Voltage DC (VR) %+85°C: 4 6.3 10 16 20 25 35 50Category Voltage (VC) +125°C: 2.7 4 7 10 13 17 23 33Surge Voltage (VS) %+85°C: 5.2 8 13 20 26 32 46 65

+125°C: 3.2 5 8 12 16 20 28 40Temperature Range: -55°C to +125°CEnvironmental Classification: 55/125/56 (IEC 68-2)

3

Surface Mount Tantalum CapacitorsTAJ Series — Solid Tantalum Chip Capacitors (EIA Standard)Standard Range (EIA sizes). See below for extended range.

Capacitance Range (letter denotes case code)Capacitance Rated voltage DC (VR) at 85°C

µF Code 4V 6.3V 10V 16V 20V 25V 35V 50V0.1 104 A A0.15 154 A A/B0.22 224 A A/B0.33 334 A B0.47 474 A A/B C0.68 684 A A A/B C1.0 105 A A A B C1.5 155 A A A A/B B/C D2.2 225 A A A/B A/B B B/C D3.3 335 A A A/B A/B B C D4.7 475 A A A/B B B/C C C/D D6.8 685 A A/B A/B B/C B/C C D D

10 106 A A/B B/C B/C C C/D D15 156 B B B/C C C/D D D22 226 B/C C C/D D D E33 336 C C/D D D E47 476 C/D D D68 686 C/D D D E

100 107 D D E150 157 E220 227 E330 337 E E

Capacitance Range (letter denotes case code)Capacitance Rated voltage DC (VR) at 85°C

µF Code 4V 6.3V 10V 16V 20V 25V 35V 50V0.1 1040.15 1540.22 224

0.33 3340.47 4740.68 684

1.0 105 A1.5 155 A C2.2 225 A

3.3 335 B4.7 475 A A B B6.8 685 A B C

10 106 A B E15 156 A A A B B C22 226 A A B B C C

33 336 A/B B B C C D47 476 B B B/C D D E68 686 C B C D E

100 107 B/C C C D E150 157 D D220 227 C/D C/D D E

330 337 E E470 477 D E680 687 D E

1000 108 E

Extended Range/Developmental Range

Ratings outside this matrix may be available upon request.

4

Surface Mount Tantalum CapacitorsTAJ Series — Low Profile Solid Tantalum Chip Capacitors (EIA Standard)

Three additional case sizes are available in the TAJ range offering ultra low profilesolid tantalum chip capacitors. Designed for applications where maximum heightof components above or below board are of prime consideration, this height of1.2mm equates to that of a standard integrated circuit package after mounting.Also available is the ultra compact 0805 equivalent in a fully molded package. TheS&T footprints are identical to the A&B case size parts.

Case Dimensions millimeters (inches—Metric Dimensions Govern)

0805 Equivalent

Low Profile Versions of A & B Case

W1 dimension applies to the termination width for A dimensional area only.Pad Stand-off is 0.1±0.1.

Code EIA W+0.2 (0.008) L±0.2 H max. W1±0.1 A+ 0.3 (0.012) S Min.Code - 0.1 (0.004) (0.008) (0.004) - 0.1 (.004)

R 2012 1.3 (0.05) 2.05 (0.08) 1.2 (0.047) 1.2 (0.047) 0.5 (0.020) 0.85 (0.033)

S 3216L 1.6 (0.06) 3.2 (0.12) 1.2 (0.047) 1.2 (0.047) 0.8 (0.031) 1.1 (0.043)

T 3528L 2.8 (0.11) 3.5 (0.14) 1.2 (0.047) 2.2 (0.087) 0.8 (0.031) 1.4 (0.055)

Capacitance and Voltage Range*/Developmental Range Capacitance Rated voltage DC (VR) at 85°C

µF Code 2V 4V 6.3V 10V 16V 20V0.1 104 R/S0.15 154 R/S0.22 224 R/S

0.33 334 R/S0.47 474 R/S0.68 684 R/S R/S/T

1.0 105 R/S R/S/T S/T1.5 155 R/S R/S S T2.2 225 R/S R/S S T T

3.3 335 R/S R/S S T4.7 475 R R/S S/T T6.8 685 R S/T T

10 106 S T T

Marking: TAJ Series

For TAJ, the positive end of body has videcon readablepolarity bar marking, with the AVX logo “A” as shown in thediagram. Bodies are marked by indelible laser marking ontop surface with capacitance value, voltage and date ofmanufacture. Due to the small size of the A, B, R, S and Tcases, a voltage code is used as shown below:

Voltage Code Rated VoltageA, B, S and T Cases at 85°C

G 4J 6.3A 10C 16D 20E 25V 35T 50

A, B, R, S and T Case:1. Voltage Code

(see table)2. Capacitance in µF3. Date Code

C, D and E Case:1. Capacitance in µF2. Rated Voltage at 85°C3. Date Code

Polarity bar indicates anode (+) termination

*Letter denotes case code.Note: Ratings outside this matrix may be available upon special request.

5

AVX Case Capacitance DCL DF ESRPart No. Size µF (µA) % max. (V)

Max. Max. @ 100 kHz

10 volt @ 85°C (6.3 volt @ 125°C)TAJA155(*)010 A 1.5 0.5 6 10.0TAJA225(*)010 A 2.2 0.5 6 7.0TAJA335(*)010 A 3.3 0.5 6 5.5TAJA475(*)010 A 4.7 0.5 6 5.0TAJB475(*)010 B 4.7 0.5 6 4.0TAJA685(*)010 A 6.8 0.7 6 4.0TAJB685(*)010 B 6.8 0.7 6 3.0TAJA106(*)010 A 10 1.0 6 3.0TAJB106(*)010 B 10 1.0 6 2.5TAJC106(*)010 C 10 1.0 6 2.5TAJB156(*)010 B 15 1.6 6 2.8TAJC156(*)010 C 15 1.5 6 2.0TAJB226(*)010 B 22 2.2 6 2.4TAJC226(*)010 C 22 2.2 6 1.8TAJC336(*)010 C 33 3.3 6 1.6TAJD336(*)010 D 33 3.3 6 1.1TAJC476(*)010 C 47 4.7 6 1.2TAJD476(*)010 D 47 4.7 6 0.9TAJD686(*)010 D 68 6.8 6 0.9TAJD107(*)010 D 100 10.0 6 0.9TAJD157(*)010 D 150 15.0 8 0.9TAJE157(*)010 E 150 15.0 6 0.9TAJE227(*)010 E 220 22.0 8 0.9

16 volt @ 85°C (10 volt @ 125°C)TAJA105(*)016 A 1.0 0.5 4 11.0TAJA155(*)016 A 1.5 0.5 6 8.0TAJA225(*)016 A 2.2 0.5 6 6.5TAJB225(*)016 B 2.2 0.5 6 5.5TAJA335(*)016 A 3.3 0.5 6 5.0TAJB335(*)016 B 3.3 0.5 6 4.5TAJA475(*)016 A 4.7 0.8 6 4.0TAJB475(*)016 B 4.7 0.8 6 3.5TAJB685(*)016 B 6.8 1.1 6 2.5TAJC685(*)016 C 6.8 1.1 6 2.5TAJB106(*)016 B 10 1.6 6 2.8TAJC106(*)016 C 10 1.6 6 2.0TAJB156(*)016 B 15 2.4 6 2.5TAJC156(*)016 C 15 2.4 6 1.8TAJC226(*)016 C 22 3.5 6 1.6TAJD226(*)016 D 22 3.5 6 1.1TAJC336(*)016 C 33 5.3 6 1.5TAJD336(*)016 D 33 5.3 6 0.9TAJD476(*)016 D 47 7.5 6 0.9TAJD686(*)016 D 68 10.8 6 0.9TAJD107(*)016 D 100 16.0 6 0.9TAJE107(*)016 E 100 16.0 6 0.9

Surface Mount Tantalum CapacitorsTAJ Series — Solid Tantalum Chip CapacitorsRatings and Part Number Reference


Max. Max. @ 100 kHz

4 volt @ 85°C (2.5 volt @ 125°C)TAJA475(*)004 A 4.7 0.5 6 7.5TAJA685(*)004 A 6.8 0.5 6 6.5TAJA106(*)004 A 10 0.5 6 6.0TAJA156(*)004 A 15 0.6 6 4.0TAJB156(*)004 B 15 0.6 6 3.0TAJA226(*)004 A 22 0.9 6 3.5TAJB336(*)004 B 33 1.4 6 2.8TAJB476(*)004 B 47 1.9 6 2.4TAJC686(*)004 C 68 2.7 6 1.6TAJC107(*)004 C 100 4.0 6 1.3TAJD227(*)004 D 220 8.8 8 0.9TAJE337(*)004 E 330 13.2 8 0.9

6.3 volt @ 85°C (4 volt @ 125°C)TAJA225(*)006 A 2.2 0.5 6 9.0TAJA335(*)006 A 3.3 0.5 6 7.0TAJA475(*)006 A 4.7 0.5 6 6.0TAJA685(*)006 A 6.8 0.5 6 5.0TAJB685(*)006 B 6.8 0.5 6 4.0TAJA106(*)006 A 10 0.6 6 4.0TAJB106(*)006 B 10 0.6 6 3.0TAJA156(*)006 A 15 1.0 6 3.5TAJB156(*)006 B 15 1.0 6 2.5TAJB226(*)006 B 22 1.4 6 2.5TAJC226(*)006 C 22 1.4 6 2.0TAJB336(*)006 B 33 2.1 6 2.2TAJC336(*)006 C 33 2.1 6 1.8TAJB476(*)006 B 47 3.0 6 2.0TAJC476(*)006 C 47 3.0 6 1.6TAJD476(*)006 D 47 3.0 6 1.1TAJC686(*)006 C 68 4.3 6 1.6TAJD686(*)006 D 68 4.3 6 0.9TAJC107(*)006 C 100 6.3 6 0.9TAJD107(*)006 D 100 6.3 6 0.9TAJD157(*)006 D 150 9.0 6 0.9TAJD227(*)006 D 220 13.2 8 0.9TAJE337(*)006 E 330 19.8 8 0.9

For 10% tolerance, insert ‘K’ in (*) above.For 20% tolerance, insert ‘M’ in (*) above. (K tolerance may be supplied in lieu ofM tolerance.)NOTE: Voltage ratings are minimum values. We reserve the right to supplyhigher voltage ratings in the same case size, to the same reliability standards.

6


Max. Max. @ 100 kHz

35 volt @ 85°C (23 volt @ 125°C)TAJA104(*)035 A 0.1 0.5 4 24.0TAJA154(*)035 A 0.15 0.5 4 21.0TAJA224(*)035 A 0.22 0.5 4 18.0TAJA334(*)035 A 0.33 0.5 4 15.0TAJA474(*)035 A 0.47 0.5 4 12.0TAJB474(*)035 B 0.47 0.5 4 10.0TAJA684(*)035 A 0.68 0.5 4 8.0TAJB684(*)035 B 0.68 0.5 4 8.0TAJA105(*)035 A 1.0 0.5 4 7.5TAJB105(*)035 B 1.0 0.5 4 6.5TAJB155(*)035 B 1.5 0.5 6 5.2TAJC155(*)035 C 1.5 0.5 6 4.5TAJB225(*)035 B 2.2 0.8 6 4.2TAJC225(*)035 C 2.2 0.8 6 3.5TAJB335(*)035 B 3.3 1.2 6 3.5TAJC335(*)035 C 3.3 1.2 6 2.5TAJC475(*)035 C 4.7 1.6 6 2.2TAJD475(*)035 D 4.7 1.6 6 1.5TAJC685(*)035 C 6.8 2.4 6 1.8TAJD685(*)035 D 6.8 2.4 6 1.3TAJD106(*)035 D 10 3.5 6 1.0TAJD156(*)035 D 15 5.3 6 0.9TAJE226(*)035 E 22 7.7 6 0.9

50 volt @ 85°C (33 volt @ 125°C)TAJA104(*)050 A 0.1 0.5 4 22.0TAJA154(*)050 A 0.15 0.5 4 15.0TAJB154(*)050 B 0.15 0.5 4 17.0TAJA224(*)050 A 0.22 0.5 4 18.0TAJB224(*)050 B 0.22 0.5 4 14.0TAJB334(*)050 B 0.33 0.5 4 12.0TAJC474(*)050 C 0.47 0.5 4 8.0TAJC684(*)050 C 0.68 0.5 4 7.0TAJC105(*)050 C 1.0 0.5 4 5.5TAJC155(*)050 C 1.5 0.8 6 5.0TAJD155(*)050 D 1.5 0.8 6 4.0TAJD225(*)050 D 2.2 1.1 6 2.5TAJD335(*)050 D 3.3 1.7 6 2.0TAJD475(*)050 D 4.7 2.4 6 1.4TAJD685(*)050 D 6.8 3.4 6 1.0TAJE106(*)050 E 10 5.0 8 1.0

Surface Mount Tantalum CapacitorsTAJ Series — Solid Tantalum Chip CapacitorsRatings and Part Number Reference (cont’d)


Max. Max. @ 100 kHz

20 volt @ 85°C (13 volt @ 125°C)TAJA684(*)020 A 0.68 0.5 4 12.0TAJA105(*)020 A 1.0 0.5 4 9.0TAJA155(*)020 A 1.5 0.5 6 6.5TAJA225(*)020 A 2.2 0.5 6 5.3TAJB225(*)020 B 2.2 0.5 6 3.5TAJA335(*)020 A 3.3 0.7 6 4.5TAJB335(*)020 B 3.3 0.7 6 3.0TAJA475(*)020 A 4.7 1.0 6 4.0TAJB475(*)020 B 4.7 1.0 6 3.0TAJC475(*)020 C 4.7 1.0 6 2.8TAJB685(*)020 B 6.8 1.4 6 2.5TAJC685(*)020 C 6.8 1.4 6 2.0TAJB106(*)020 B 10 2.0 6 2.1TAJC106(*)020 C 10 2.0 6 1.9TAJC156(*)020 C 15 3.0 6 1.7TAJD156(*)020 D 15 3.0 6 1.1TAJC226(*)020 C 22 4.4 6 1.6TAJD226(*)020 D 22 4.4 6 0.9TAJD336(*)020 D 33 6.6 6 0.9TAJD476(*)020 D 47 9.4 6 0.9TAJE686(*)020 E 68 13.6 6 0.9

25 volt @ 85°C (16 volt @ 125°C)TAJA474(*)025 A 0.47 0.5 4 14.0TAJA684(*)025 A 0.68 0.5 4 10.0TAJA105(*)025 A 1.0 0.5 4 8.0TAJA155(*)025 A 1.5 0.5 6 7.5TAJB155(*)025 B 1.5 0.5 6 5.0TAJB225(*)025 B 2.2 0.6 6 4.5TAJB335(*)025 B 3.3 0.8 6 3.5TAJB475(*)025 B 4.7 1.2 6 2.8TAJC475(*)025 C 4.7 1.2 6 2.4TAJC685(*)025 C 6.8 1.7 6 2.0TAJC106(*)025 C 10 2.5 6 1.8TAJD106(*)025 D 10 2.5 6 1.2TAJD156(*)025 D 15 3.8 6 1.0TAJD226(*)025 D 22 5.5 6 0.9TAJE336(*)025 E 33 8.3 6 0.9

All technical data relates to an ambient temperature of +25°C measured at120 Hz, 0.5V RMS unless otherwise stated.

*Insert J for ± 5% tolerance, K for ± 10% and M for ±20%.

NOTE: Voltage ratings are minimum values. We reserve the right to supplyhigher voltage ratings in the same case size, to the same reliability standards.

For parametric information on development codes,please contact your local AVX sales office.

7


Max. Max. @ 100 kHz

20 voltsTAJR104(*)020 R 0.1 0.5 4 25.0TAJS104(*)020 S 0.1 0.5 4 25.0TAJR154(*)020 R 0.15 0.5 4 25.0TAJS154(*)020 S 0.15 0.5 4 25.0TAJR224(*)020 R 0.22 0.5 4 25.0TAJS224(*)020 S 0.22 0.5 4 25.0TAJR334(*)020 R 0.33 0.5 4 25.0TAJS334(*)020 S 0.33 0.5 4 25.0TAJR474(*)020 R 0.47 0.5 4 25.0TAJS474(*)020 S 0.47 0.5 4 25.0TAJR684(*)020 R 0.68 0.5 4 25.0TAJS684(*)020 S 0.68 0.5 4 15.0TAJT684(*)020 T 0.68 0.5 4 15.0TAJS105(*)020 S 1.0 0.5 4 12.0TAJT105(*)020 T 1.0 0.5 4 9.0TAJT155(*)020 T 1.5 0.5 6 6.5TAJT225(*)020 T 2.2 7.7 6 6.0

Surface Mount Tantalum CapacitorsTAJ Low Profile Series — Solid Tantalum Chip CapacitorsRatings and Part Number Reference (cont’d)


Max. Max. @ 100 kHz

2 voltTAJR475(*)002 R 4.7 0.5 6 20.0TAJR685(*)002 R 6.8 0.5 6 20.0TAJS106(*)002 S 10 0.5 6 20.0

4 volt TAJR225(*)004 R 2.2 0.5 6 25.0TAJS225(*)004 S 2.2 0.5 6 25.0TAJR335(*)004 R 3.3 0.5 6 20.0TAJS335(*)004 S 3.3 0.5 6 18.0TAJR475(*)004 R 4.7 0.5 6 12.0TAJS475(*)004 S 4.7 0.5 6 10.0TAJS685(*)004 S 6.8 0.5 6 8.0TAJT685(*)004 T 6.8 0.5 6 6.0TAJT106(*)004 T 10 0.6 6 5.0

6.3 voltTAJR155(*)006 R 1.5 0.5 6 25.0TAJS155(*)006 S 1.5 0.5 6 25.0TAJR225(*)006 R 2.2 0.5 6 20.0TAJS225(*)006 S 2.2 0.5 6 18.0TAJR335(*)006 R 3.3 0.5 6 12.0TAJS335(*)006 S 3.3 0.5 6 9.0TAJS475(*)006 S 4.7 0.5 6 7.5TAJT475(*)006 T 4.7 0.5 6 6.0TAJT685(*)006 T 6.8 0.5 6 5.0

10 voltsTAJR105(*)010 R 1.0 0.5 4 25.0TAJS105(*)010 S 1.0 0.5 4 25.0TAJR155(*)010 R 1.5 0.5 6 20.0TAJS225(*)010 S 2.2 0.5 6 12.0TAJT335(*)010 T 3.3 0.5 6 6.0TAJS475(*)010 S 4.7 0.5 6 8.0TAJT475(*)010 T 4.7 0.5 6 5.0TAJT106(*)010 T 10 1.0 6 3.0

16 voltsTAJR684(*)016 R 0.68 0.5 4 25.0TAJS684(*)016 S 0.68 0.5 4 25.0TAJR105(*)016 R 1.0 0.5 4 20.0TAJS105(*)016 S 1.0 0.5 4 15.0TAJT105(*)016 T 1.0 0.5 4 5.0TAJS155(*)016 S 1.5 0.5 6 12.0TAJT225(*)016 T 2.2 0.5 6 6.5TAJT335(*)016 T 3.3 0.5 6 5.0

All technical data relates to an ambient temperature of +25°C measured at120 Hz, 0.5V RMS unless otherwise stated.

*Insert J for ± 5% tolerance, K for ± 10% and M for ±20%.

NOTE: Voltage ratings are minimum values. We reserve the right to supplyhigher voltage ratings in the same case size, to the same reliability standards.

For parametric information on development codes,please contact your local AVX sales office.

8

Surface Mount Tantalum CapacitorsTPS Series — Tantalum Low ESR CapacitorsThe TPS (Tantalum for Power Supplies) surface mountproducts have inherently low ESR (equivalent seriesresistance) and is capable of higher ripple current,handling, producing lower ripple voltages, less powerand heat dissipation than standard product for the mostefficient use of circuit power.

TPS has been designed, manufactured, and precondi-tioned for optimum performance in typical power supplyenvironments. By combining the latest improvements intantalum powder technology, improved manufacturingprocesses, and application specific preconditioning tests, AVX is able to provide a technologically superioralternative to standard molded or conformal coatedtantalum capacitors.

Dimensions millimeters (inches)

W1 dimension applies to the termination width for A dimensional area only.Pad Stand-off is 0.1±0.1.

Code EIA L±0.2 (0.008) W+0.2 (0.008) H±0.2 (0.008) W1±0.2 (0.008) A+0.3 (0.012) S Min.Code -0.1 (0.004) -0.2 (0.008) -0.2 (0.008)

C 6032 6.0 (0.236) 3.2 (0.126) 2.6 (0.102) 2.2 (0.087) 1.3 (0.051) 2.9 (0.114)

D 7343 7.3 (0.287) 4.3 (0.169) 2.9 (0.114) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173)

E 7343H 7.3 (0.287) 4.3 (0.169) 4.1 (0.162) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173)

V 7.0 (0.275) 6.0 (0.236) 3.6 (0.140) 3.1 (0.120) 1.4 (0.055) 3.4 (0.133)

How to Order: TPS D 107 M 010 R 0100

Series MaximumESR in Milliohms

Case Size Tape and Reel SizeCapacitance in Picofarads R = 7" (180mm)

S = 13" (330mm)

Voltage

ToleranceK= ±10%, M= ±20%

Technical Data: All technical data relate to an ambienttemperature of +25°C

Capacitance Range: 10 µF to 470 µFCapacitance Tolerance: ±20%; ±10%Rated Voltage DC (VR) %+85°C: 6.3 10 16 20 25 35Category Voltage (VC) %+125°C: 4 7 10 13 17 23Surge Voltage (VS) %+85°C: 8 13 20 26 32 46

%+125°C: 5 8 12 16 20 28Temperature Range: -55°C to +125°CEnvironmental Classification: 55/125/56 (IEC 68-2)

Capacitance, µF 6.3V 10V 16V 20V 25V 35V4.7 C(600mΩ)6.8

10 C(500mΩ)15 C(450mΩ) D(300mΩ)22 C(375mΩ) D(200mΩ) E(300mΩ)33 C(375mΩ) D(200mΩ) E(200mΩ)47 C(350mΩ) D(150mΩ)68 E(150mΩ) V(150mΩ)

100 C(150mΩ) D(100mΩ) E(125mΩ) V(200mΩ)D(80mΩ) D(125mΩ) V(85mΩ)D(65mΩ)

150 D(100mΩ)220 D(100mΩ) E(100mΩ) V(150mΩ)

V(75mΩ)330 E(100mΩ) V(100mΩ)

V(60mΩ)470 V(100mΩ)

V(55mΩ)

TPS Case Size (ESR) Matrix/Developmental Range (Milliohms)

9

Surface Mount Tantalum CapacitorsTPS Series — Tantalum Low ESR Capacitors

AVX Part Case Cap (µF) Rated DCL max DF ESR max 100 kHz RIPPLE CURRENT (mA)Number Size Voltage (µA) (%) (mΩ) 258C 858C 1258C

TPSV477*006R0100 V 470 6.3 28.2 10 100 1581 1414 633TPSV337*010R0100 V 330 10 33.0 10 100 1581 1414 633TPSV227*016R0150 V 220 16 35.2 10 150 1291 1155 517TPSV107*020R0200 V 100 20 20.0 10 200 1118 1000 447TPSV686*025R0150 V 68 25 17.0 10 150 1291 1155 517

Standard ESR Level: Ripple Ratings

For 10% tolerance, insert ‘K’ in (*) above.For 20% tolerance, insert ‘M’ in (*) above.NOTE: Voltage ratings are minimum values. We reserve the right to supply higher voltage ratings in the same case size, to the same reliability standards.

For full details of TPS Series and comprehensive application notes, pleasereference “AVX TPS Catalog” available from your local AVX sales office.

AVX Part Case Cap (µF) Rated DCL max DF ESR max 100 kHz RIPPLE CURRENT (mA)Number Size Voltage (µA) (%) (mΩ) 258C 858C 1258C

TPSV477*006R0055 V 470 6.3 28.2 10 55 2132 1907 853TPSV337*010R0060 V 330 10 33.0 10 60 2041 1826 817TPSV227*016R0075 V 220 16 35.2 10 75 1826 1633 730TPSV107*020R0085 V 100 20 20.0 10 85 1715 1534 686

Level II ESR: Ripple Ratings

(Ripple based on ESR Levels as supplied; allow 25% increase post PCB assembly)

AVX Case Capacitance Rated DCL max DF ESR 100 kHz RIPPLE CURRENT (mA) RatingsPart No. Size (µF) Voltage (µA) (%) max (mΩ)

Max. Max. @ 100 kHz 258C 858C 1258CTPSC475*035R0600 C 4.7 35 1.6 6 600 428 383 171TPSC106*025R0500 C 10 25 2.5 6 500 469 420 188TPSC156*020R0450 C 15 20 3.0 6 450 494 442 198TPSC226*016R0375 C 22 16 3.5 6 375 542 485 217TPSC336*010R0375 C 33 10 3.3 6 375 542 485 217TPSC476*010R0350 C 47 10 4.7 6 350 561 502 224TPSC107*006R0150 C 100 6.3 6.0 6 150 856 766 343TPSD156*035R0300 D 15 35 5.3 6 300 707 632 283TPSD226*025R0200 D 22 25 5.5 6 200 866 775 346TPSD336*020R0200 D 33 20 6.6 6 200 866 775 346TPSD476*016R0150 D 47 16 7.5 6 150 1000 895 400TPSD107*016R0125 D 100 16 16.0 6 125 1095 980 438TPSD107*010R0100 D 100 10 10.0 6 100 1225 1095 490TPSD107*010R0080 D 100 10 10.0 6 80 1369 1225 547TPSD107*010R0065 D 100 10 10.0 6 65 1519 1359 608TPSD157*010R0100 D 150 10 15.0 6 100 1225 1095 490TPSD227*006R0100 D 220 6.3 13.2 8 100 1225 1095 490TPSE226*035R0300 E 22 35 7.7 6 300 742 663 297TPSE336*025R0200 E 33 25 8.3 6 200 908 812 363TPSE686*020R0150 E 68 20 13.6 6 150 1048 938 420TPSE107*016R0125 E 100 16 16.0 6 125 1149 1027 459TPSE227*010R0100 E 220 10 22.0 8 100 1285 1149 514TPSE337*006R0100 E 330 6.3 19.8 8 100 1285 1149 514

Ratings and Part Number Reference

For 10% tolerance, insert ‘K’ in (*) above.For 20% tolerance, insert ‘M’ in (*) above.NOTE: Voltage ratings are minimum values. We reserve the right to supply higher voltage ratings in the same case size, to the same reliability standards.

10

Solid Tantalum Chip TAJ and TPS

Tape and reel packaging for automatic component placement. Millimeters (inches)Please enter required Suffix on order. Bulk product is not available.

TAJ and TPS Taping Suffix Table

Surface Mount Tantalum CapacitorsTape and Reel Packaging

Case Size Tape width P 180mm (7") reel 330mm (13") reelreference mm mm Suffix Qty. Suffix Qty.

A 8 4 R/A 2000 S/B 8000

B 8 4 R/A 2000 S/B 8000

C 12 8 R/A 500 S/B 3000

D 12 8 R/A 500 S/B 2500

E 12 8 R/A 400 S/B 1500

V 12 8 R/A 400 S/B 1500

R 8 4 R/A 2500 S/B 10000

S 8 4 R/A 2500 S/B 10000

T 8 4 R/A 2500 S/B 10000

Code 8mm Tape 12mm Tape

4±0.1 (0.157±0.004) 4±0.1 (0.157±0.004)P* or or

8±0.1 (0.315±0.004) 8±0.1 (0.315±0.004)

G 1.75 min (0.03 min) 1.75 min (0.03 min)

F 3.5±0.05 (0.138±0.002) 5.5±0.05 (0.22±0.002)

E 1.75±0.1 (0.069±0.004) 1.75±0.1 (0.069±0.004)

W 8±0.3 (0.315±0.012) 12±0.3 (0.472±0.012)

P2 2±0.05 (0.079±0.002) 2±0.05 (0.079±0.002)

P0 4±0.1 (0.157±0.004) 4±0.1 (0.157±0.004)

D 1.5±0.1 (0.059±0.004) 1.5±0.1 (0.059±0.004)-0 (-0) -0 (-0)

D1 1.0 min (0.039 min) 1.5 min (0.059 min)

Total Tape Thickness — K max

TAJ/TPSCase sizereference Dims

A 2.3 (0.090)B 2.6 (0.102) C 3.3 (0.130) D 3.6 (0.142) E 4.8 (0.189) R 1.9 (0.075) S 1.9 (0.075)T 1.9 (0.075)

*See taping suffix tables for actual P dimension(component pitch).

NOTE: TPS available as solder termination (R & S) only.R - Solder Termination A - Gold Termination,S - Solder Termination B - Gold Termination

Tape SpecificationTape dimensions comply to EIA RS 481 A

Dimensions A0 and B0 of the pocket and the tape thickness, K,are dependent on the component size.

Tape materials do not affect component solderability duringstorage.

Carrier Tape Thickness <0.4mm

Plastic Tape ReelDimensions

Standard dimensions mmA: 9.5mm (8mm tape)

13.0mm (12mm tape)

Cover Tape DimensionsThickness: 75±25µWidth of tape:5.5mm + 0.2mm (8mm tape)9.5mm + 0.2mm (12mm tape)

.

m

.

m

.

m

..

.

.

13±0.5

2 ± 0.5A ± 1.0

D ±

2.0

70 ±

2.021

± 1

.0

11

Surface Mount Tantalum CapacitorsTAZ Series

Microminiature Surface Mount TechnologySolid Tantalum Chip Capacitors

The TAZ molded surface mount series is designed for use inapplications utilizing either solder, conductive adhesive or thermalcompression bonding techniques. Case sizes (A through H) arecompatible with CWR06 pad layouts and are qualified as theCWR09 style. The two styles are interchangeable per MIL-C-55365/4. Each chip is marked with polarity, capacitance code andrated voltage. There are three termination finishes available: fused solder plated (standard) (“K” per MIL-C-55365), hot solder dipped (“C”) and gold plated (“B”). In addition, the moldingcompound has been selected to meet the flammability requirements of UL94V-O and outgassing requirements of NASASP-R-0022A.


NOTE: For solder coated terminations add 0.38 (0.015) max. to length and height dimensions.

Case Width Length Height Term. Width Term. Length “S” MinCode W±.38 (0.015) L±.38 (0.015) H±.38 (0.015) W1 A+.13 (0.005)

“Regular”

A 1.27 (0.050) 2.54 (0.100) 1.27 (0.050)1.27±0.13 .76 (0.030) .38 (0.015)(.050±.005)

B 1.27 (0.050) 3.81 (0.150) 1.27 (0.050)1.27±0.13 .76 (0.030) 1.65 (0.065)(.050±.005)

D 2.54 (0.100) 3.81 (0.150) 1.27 (0.050) 2.41+0.13/-0.25 .76 (0.030) 1.65 (0.065)(.095+.005/-.010)

E 2.54 (0.100) 5.08 (0.200) 1.27 (0.050) 2.41+0.13/-0.25 .76 (0.030) 2.92 (0.115)(.095+.005/-.010)

F 3.43 (0.135) 5.59 (0.220) 1.78 (0.070) 3.30±0.13 .76 (0.030) 3.43 (0.135)(.130±.005)

G 2.79 (0.110) 6.73 (0.265) 2.79 (0.110) 2.67±0.13 1.27 (0.050) 0.140 (3.56)(.105±.005)

H 3.81 (0.150) 7.24 (0.285) 2.79 (0.110) 3.68+.013/-0.51 1.27 (0.050) 4.06 (0.160)(.145+.005/-.020)

Additional special case sizes are available.Contact AVX for details.

12


The electrical and mechanical parameters shown on the TAZ series are general. Forspecific circuit applications, special screening is available. Please contact AVX ifyou have special electrical or mechanical requirements.

How to Order:(professional grade) TAZ D 335 M 015 C R SZ* 0000*Type

Case Code(See table on page 11)

Capacitance CodepF code: 1st two digits represent significant figures, 3rddigit represents multiplier (number of zeros to follow)

Tolerance(J=±5%, K=±10%, M=±20%)

Rated DC Voltage

Lead Configuration(C = Chip, X = Extended Range)

Packaging(Consult pages 22-23 for details)

Manufacturing Routing and Failure Rate*S = Standard, Z = Not applicable

Termination Finish*0000 = Fuse solder plated, 0800 = Hot solder dipped, 0900 = Gold plated*

*Not applicable to European orders (other endings are assigned by the factory for special customer requirements)

Technical Data: All technical data relate to an ambient temperature of +25°CCapacitance Range: 0.1 µF to 330 µFCapacitance Tolerance: ±20%; ±10%; ±5%Rated Voltage DC (VR) %+85°C: 4 6 10 15 20 25 35 50Category Voltage (VC) %+125°C: 2.7 4 7 10 13 17 23 33Surge Voltage (VS) %+85°C: 5.2 8 13 20 26 32 46 65

%+125°C: 3.2 5 8 12 16 20 28 40Operating Temperature Range: -55°C to +125°C

MarkingThe positive end of body has videcon readable polarity bar mark-ing along with the capacitance code and rated work voltage:

• Polarity Stripe (+)• Capacitance Code• Voltage Rating

Typical Lead FrameMaterial Thicknesses

Lead Frame: Alloy 194Thickness: .005±.0002"

0000 - Fused Solder Plate: (60/40)60-135 microinches nickel300±75 microinches fused solder

0900 - Gold Plated:35-100 microinches nickel50-75 microinches gold

0800 - Hot Solder Dipped: (60/40)50-100 microinches nickelMin. 60 microinches solder

13


Standard Range Series

Capacitance and Voltage Range (letter denotes case code)Capacitance Rated voltage DC (VR) at 85°C

µF Code 4V 6V 10V 15V 20V 25V 35V 50V

0.1 104 A0.15 154 A0.22 224 A B

0.33 334 A B0.47 474 A B0.68 684 A B B D

1.0 105 A B D E1.5 155 A B D E F2.2 225 A B D E F

3.3 335 B D E F G4.7 475 B D E F G H6.8 685 D E F G H

10 106 D E F G15 156 E F G H22 226 F G H

33 336 F G H47 476 G H68 686 G H

100 107 H

Capacitance and Voltage Range (letter denotes case code)Capacitance Rated voltage DC (VR) at 85°C

µF Code 4V 6V 10V 15V 20V 25V 35V0.68 684 A1.0 105 A A B1.5 155 A B

2.2 225 A B D3.3 335 A A B D E4.7 475 A A B D E

6.8 685 A B B/D D E F10 106 B B D E H15 156 B D E F

22 226 D E E F G H33 336 D/E E47 476 F F G H

68 686 F G H100 107 F G H H150 157 G H

220 227 H330 337 H

NOTE: TAZ Standard Range ratings are also available as CWR09 Military parts, see pages 16-18.

Extended Range Series

Not available as CWR09 Military.Contact AVX for electrical limits.

14


Ratings and Part Number Reference (Standard Range and Special Case Sizes Only)AVX Case Capacitance DCL DF ESR

Part No. Size µF (µA) % max. (V)Max. Max. @ 100 kHz

4 volt @ 85°C (2.5 volt @ 125°C)TAZA225(‡)004C* A 2.2 1.0 6 20.0TAZB475(‡)004C* B 4.7 1.0 6 10.0TAZD106(‡)004C* D 10.0 1.0 6 10.0TAZE156(‡)004C* E 15.0 1.0 8 5.0TAZF336(‡)004C* R 33.0 2.0 8 4.0TAZG686(‡)004C* F 68.0 3.0 10 2.0TAZH107(‡)004C* H 100.0 4.0 10 1.0

6 volt @ 85°C (4 volt @ 125°C)TAZA155(‡)006C* A 1.5 1.0 6 12.0TAZB335(‡)006C* B 3.3 1.0 6 12.0TAZD685(‡)006C* D 6.8 1.0 6 12.0TAZE106(‡)006C* E 10.0 1.0 6 6.0TAZF226(‡)006C* F 22.0 2.0 8 4.0TAZG476(‡)006C* G 47.0 3.0 10 2.0TAZH686(‡)006C* H 68.0 4.0 10 2.0

10 volt @ 85°C (6.3 volt @ 125°C)TAZA105(‡)010C* A 1.0 1.0 6 18.0TAZB225(‡)010C* B 2.2 1.0 6 12.0TAZD475(‡)010C* D 4.7 1.0 6 10.0TAZE685(‡)010C* E 6.8 1.0 6 4.0TAZF156(‡)010C* F 15.0 2.0 6 3.0TAZG336(‡)010C* G 33.0 3.0 10 3.0TAZH476(‡)010C* H 47.0 5.0 10 2.0


20 volt @ 85°C (13 volt @ 125°C)TAZA474(‡)020C* A 0.47 1.0 6 20.0TAZB684(‡)020C* B 0.68 1.0 6 15.0TAZB105(‡)020C* B 1.0 1.0 6 15.0TAZD225(‡)020C* D 2.2 1.0 6 10.0TAZE335(‡)020C* E 3.3 1.0 6 8.0TAZF685(‡)020C* F 6.8 2.0 6 5.0TAZG156(‡)020C* G 15.0 3.0 6 3.0TAZH226(‡)020C* H 22.0 4.0 6 2.0


Max. Max. @ 100 kHz

25 volt@ 85°C (16 volt @ 125°C)TAZA334(‡)025C* A 0.33 1.0 6 25.0TAZB684(‡)025C* B 0.68 1.0 6 15.0TAZD155(‡)025C* D 1.5 1.0 6 10.0TAZE225(‡)025C* E 2.2 1.0 6 8.0TAZF475(‡)025C* F 4.7 2.0 6 6.0TAZG685(‡)025C* G 6.8 2.0 6 4.0TAZG106(‡)025C* G 10.0 3.0 6 3.0TAZH156(‡)025C* H 15.0 4.0 6 2.0


50 volt @ 85°C (33 volt @ 125°C)TAZA104(‡)050C* A 0.10 1.0 6 30.0TAZA154(‡)050C* A 0.15 1.0 6 30.0TAZB224(‡)050C* B 0.22 1.0 6 25.0TAZB334(‡)050C* B 0.33 1.0 6 25.0TAZD684(‡)050C* D 0.68 1.0 6 20.0TAZE105(‡)050C* E 1.0 1.0 6 12.0TAZF155(‡)050C* F 1.5 1.0 6 10.0TAZF225(‡)050C* F 2.2 2.0 6 6.0TAZG335(‡)050C* G 3.3 2.0 6 4.0TAZH475(‡)050C* H 4.7 3.0 6 2.0

‡ Insert J for ± 5% tolerance, K for ± 10%, M for ±20%* Insert letter for packing option. See ordering information on pages 22-23.All technical data relates to an ambient temperature of +25°C. Capacitance andDF are measured at 120Hz 0.5V RMS with a maximum DC bias of 2.2 volts.DCL is measured at rated voltage after 5 minutes .

For any special electrical requirements, please contact factory.

The electrical and mechanical parametersshown on the TAZ series are general.For special circuit requirements, applica-tion specific testing is available. Pleasecontact AVX if you have special electricalor mechanical requirements.

DCL, DF and ESR limits are general infor-mation only. Contact AVX if your applica-tion requires lower or tighter limits.

15

Surface Mount Tantalum CapacitorsTAZ Extended Range Series

Ratings and Part Number Reference AVX Case Capacitance DCL DF ESR

Part No. Size µF (µA) % max. (V)Max. Max. @ 100 kHz

4 voltTAZA475(‡)004X* A 4.7 1 6 20TAZB106(‡)004X* B 10 1 6 10TAZD226(‡)004X* D 22 1 8 10TAZE336(‡)004X* E 33 2 8 5TAZF107(‡)004X* F 100 4 10 4TAZG157(‡)004X* G 150 6 10 2

6 voltTAZA335(‡)006X* A 3.3 1 6 18TAZB685(‡)006X* B 6.8 1 6 12TAZD156(‡)006X* D 15 1 6 10TAZE226(‡)006X* E 22 2 6 4TAZF686(‡)006X* F 68 4 8 4TAZG107(‡)006X* G 100 6 10 2TAZH227(‡)006X* H 220 10 10 1

10 voltTAZA225(‡)010X* A 2.2 1 6 20TAZB475(‡)010X* B 4.7 1 6 12TAZD685(‡)010X* D 6.8 1 6 8TAZD106(‡)010X* D 10 1 6 10TAZE156(‡)010X* E 15 2 6 4TAZE226(‡)010X* E 22 3 6 4TAZF476(‡)010X* F 47 4 8 3TAZG686(‡)010X* G 68 6 10 2TAZH107(‡)010X* H 100 10 10 1


Max. Max. @ 100 kHz

15voltTAZA105(‡)015X* A 1 1 6 22TAZB335(‡)015X* B 3.3 1 6 12TAZD475(‡)015X* D 4.7 1 6 10TAZE106(‡)015X* E 10 2 6 6TAZF226(‡)015X* F 22 3 6 5TAZH686(‡)015X* H 68 10 8 2

20 voltTAZA684(‡)020X* A 0.68 1 6 22TAZB225(‡)020X* B 2.2 1 6 12TAZD335(‡)020X* D 3.3 1 6 10TAZE475(‡)020X* E 4.7 1 6 8TAZE685(‡)020X* E 6.8 2 6 8TAZF156(‡)020X* F 15 3 6 4TAZG226(‡)020X* G 22 4 8 3TAZH476(‡)020X* H 47 10 8 2

25 voltTAZB105(‡)025X* B 1 1 6 12TAZD225(‡)025X* D 2.2 1 6 10TAZE335(‡)025X* E 3.3 1 6 8TAZF685(‡)025X* F 6.8 2 6 6TAZH226(‡)025X* H 22 6 8 2

35 voltTAZH106(‡)035X* H 10 4 8 2

‡ Insert J for ± 5% tolerance, K for ± 10%, M for ±20%* Insert letter for packing option. See ordering information on pages 22-23.All technical data relates to an ambient temperature of +25°C. Capacitance andDF are measured at 120Hz 0.5V RMS with a maximum DC bias of 2.2 volts.DCL is measured at rated voltage after 5 minutes .

For any special electrical requirements, please contact factory.

The electrical and mechanical parametersshown on the TAZ series are general.For special circuit requirements, applica-tion specific testing is available. Pleasecontact AVX if you have special electricalor mechanical requirements.

DCL, DF and ESR limits are general infor-mation only. Contact AVX if your applica-tion requires lower or tighter limits.

16

Surface Mount Tantalum CapacitorsCWR09 Style (MIL-C-55365/4)

Marking (military qualified)The “V” following rated voltage is replaced with a “J” for JAN Brand.

Polarity Stripe (+)

Capacitance code

Rated Voltage“J” for “JAN” Brand

How to Order:(MIL-C-55365/4) CWR09 J B 225 J M A \TRStyle

VoltageC=4, D=6, F=10, H=15,J=20, K=25, M=35, N=50

Termination FinishB=Gold Plated, C=Hot Solder Dipped,K=Solder Fused

Capacitance Code

Tolerance(J=±5%, K=±10%, M=±20%)

Failure RateExponential: (M=1%/1000 hours); (P=0.1%/1000 hours);(R=0.01%/1000 hours); (S=0.001%/1000 hours)Weibull: (B=0.1%/1000 hours); (C=0.01%/1000 hours)

Optional Surge CurrentA=10 cycles at 25°CB=10 cycles at -55°C and +85°C

PackagingBulk (Standard if nothing is specified in this position)\TR=7" Tape & Reel\TR13=13" Tape & Reel\W=Waffle Pack

NOTES: CWR09 is fully interchangeable with CWR06.Case sizes correspond to TAZ A through H.Packaging information can be found on pages 22-23.

17


Electrical Ratings for CWR09 CapacitorsCapacitance DC Leakage (max.) Dissipation Factor (max.) Max. ESR

MIL-C-55365/4 Case Rated (nom.) 100 kHzPart Size voltage (µF) +25°C +85°C +125°C +25°C +85/125°C -55°C +25°C

Number (85°C) (µA) (µA) (µA) (%) (%) (%) Style(See Note) (volts) CWR09

(Ohms)

CWR09C*225†@nh A 4 2.2 1.0 10 12 6 8 8 8.0CWR09C*475†@nh B 4 4.7 1.0 10 12 6 8 8 8.0CWR09C*685†@nh C 4 6.8 1.0 10 12 6 8 8 5.5CWR09C*106†@nh D 4 10.0 1.0 10 12 8 8 10 4.0CWR09C*156†@nh E 4 15.0 1.0 10 12 8 10 12 3.5CWR09C*336†@nh F 4 33.0 2.0 20 24 8 10 12 2.2CWR09C*686†@nh G 4 68.0 3.0 30 36 10 12 12 1.1CWR09C*107†@nh H 4 100.0 4.0 40 48 10 12 12 0.9

CWR09D*155†@nh A 6 1.5 1.0 10 12 6 8 8 8.0CWR09D*335†@nh B 6 3.3 1.0 10 12 6 8 8 8.0CWR09D*475†@nh C 6 4.7 1.0 10 12 6 8 8 5.5CWR09D*685†@nh D 6 6.8 1.0 10 12 6 8 8 4.5CWR09D*106†@nh E 6 10.0 1.0 10 12 8 10 12 3.5CWR09D*226†@nh F 6 22.0 2.0 20 24 8 10 12 2.2CWR09D*476†@nh G 6 47.0 3.0 30 36 10 12 12 1.1CWR09D*686†@nh H 6 68.0 4.0 40 48 10 12 12 0.9

CWR09F*105†@nh A 10 1.0 1.0 10 12 6 8 8 10.0CWR09F*225†@nh B 10 2.2 1.0 10 12 6 8 8 8.0CWR09F*335†@nh C 10 3.3 1.0 10 12 6 8 8 5.5CWR09F*475†@nh D 10 4.7 1.0 10 12 6 8 8 4.5CWR09F*685†@nh E 10 6.8 1.0 10 12 6 8 8 3.5CWR09F*156†@nh F 10 15.0 2.0 20 24 8 8 10 2.5CWR09F*336†@nh G 10 33.0 3.0 30 36 10 12 12 1.1CWR09F*476†@nh H 10 47.0 5.0 50 60 10 12 12 0.9

CWR09H*684†@nh A 15 0.68 1.0 10 12 6 8 8 12.0CWR09H*155†@nh B 15 1.5 1.0 10 12 6 8 8 8.0CWR09H*225†@nh C 15 2.2 1.0 10 12 6 8 8 5.5CWR09H*335†@nh D 15 3.3 1.0 10 12 6 8 8 5.0CWR09H*475†@nh E 15 4.7 1.0 10 12 6 8 8 4.0CWR09H*106†@nh F 15 10.0 2.0 20 24 6 8 8 2.5CWR09H*226†@nh G 15 22.0 4.0 40 48 8 8 10 1.1CWR09H*336†@nh H 15 33.0 5.0 50 60 8 8 10 0.9

CWR09J*474†@nh A 20 0.47 1.0 10 12 6 8 8 14.0CWR09J*684†@nh B 20 0.68 1.0 10 12 6 8 8 10.0CWR09J*105†@nh B 20 1.0 1.0 10 12 6 8 8 12.0CWR09J*155†@nh C 20 1.5 1.0 10 12 6 8 8 6.0CWR09J*225†@nh D 20 2.2 1.0 10 12 6 8 8 5.0CWR09J*335†@nh E 20 3.3 1.0 10 12 6 8 8 4.0CWR09J*685†@nh F 20 6.8 2.0 20 24 6 8 8 2.4CWR09J*156†@nh G 20 15.0 3.0 30 36 6 8 8 1.1CWR09J*226†@nh H 20 22.0 4.0 40 48 6 8 8 0.9

Note: To complete the MIL-C-55365/4 Part Number, additional information must be added:

* = Termination Finish † = Tolerance Code: @ = Failure Rate Level: n = Optional Surge Current h = PackagingDesignator: J = ± 5% Exponential: M = 1.0% per 1000 hours A = 10 cycles at 25°C Bulk StandardB = Gold Plated K = ± 10% P = 0.1% per 1000 hours B = 10 cycles at -55°C and +85°C \TR=7" Tape & ReelC = Hot Solder Dipped M = ± 20% R = 0.01% per 1000 hours \TR13=13" Tape & ReelK = Solder Fused S = 0.001% per 1000 hours \W=Waffle Pack

Weibull: B = 0.1% per 1000 hoursC = 0.01% per 1000 hours

Note: The C case size has limited availability. Where possible, the D case size should be substituted.

Contact factory for latest qualification status.

18

Surface Mount Tantalum CapacitorsTAZ Military Series MIL-C-55365 (Rev. C) (CWR09 Style)

Electrical Ratings for CWR09 CapacitorsMIL-C-55365/4 Case Rated Capacitance DC Leakage (max.) Dissipation Factor (max.) Max. ESR

Part Size voltage (nom.) 100 kHzNumber (85°C) (µF) +25°C +85°C +125°C +25°C +85/125°C -55°C +25°C

(See Note) (volts) (µA) (µA) (µA) (%) (%) (%) StyleCWR09(ohms)

CWR09K*334†@nh A 25 0.33 1.0 10 12 6 8 8 15.0CWR09K*684†@nh B 25 0.68 1.0 10 12 6 8 8 7.5CWR09K*105†@nh C 25 1.0 1.0 10 12 6 8 8 6.5CWR09K*155†@nh D 25 1.5 1.0 10 12 6 8 8 6.5CWR09K*225†@nh E 25 2.2 1.0 10 12 6 8 8 3.5CWR09K*475†@nh F 25 4.7 2.0 20 24 6 8 8 2.5CWR09K*685†@nh G 25 6.8 2.0 20 24 6 8 8 1.2CWR09K*106†@nh G 25 10.0 3.0 30 36 6 8 8 1.4CWR09K*156†@nh H 25 15.0 4.0 40 48 6 8 8 1.0

CWR09M*224†@nh A 35 0.22 1.0 10 12 6 8 8 18.0CWR09M*474†@nh B 35 0.47 1.0 10 12 6 8 8 10.0CWR09M*684†@nh C 35 0.68 1.0 10 12 6 8 8 8.0CWR09M*105†@nh D 35 1.0 1.0 10 12 6 8 8 6.5CWR09M*155†@nh E 35 1.5 1.0 10 12 6 8 8 4.5CWR09M*335†@nh F 35 3.3 1.0 10 12 6 8 8 2.5CWR09M*475†@nh G 35 4.7 2.0 20 24 6 8 8 1.5CWR09M*685†@nh H 35 6.8 3.0 30 36 6 8 8 1.3

CWR09N*104†@nh A 50 0.10 1.0 10 12 6 8 8 22.0CWR09N*154†@nh A 50 0.15 1.0 10 12 6 8 8 17.0CWR09N*224†@nh B 50 0.22 1.0 10 12 6 8 8 14.0CWR09N*334†@nh B 50 0.33 1.0 10 12 6 8 8 12.0CWR09N*474†@nh C 50 0.47 1.0 10 12 6 8 8 8.0CWR09N*684†@nh D 50 0.68 1.0 10 12 6 8 8 7.0CWR09N*105†@nh E 50 1.0 1.0 10 12 6 8 8 6.0CWR09N*155†@nh F 50 1.5 1.0 10 12 6 8 8 4.0CWR09N*225†@nh F 50 2.2 2.0 20 24 6 8 8 2.5CWR09N*335†@nh G 50 3.3 2.0 20 24 6 8 8 2.0CWR09N*475†@nh H 50 4.7 3.0 30 36 6 8 8 1.5

Note: To complete the MIL-C-55365/4 Part Number, additional information must be added:

* = Termination Finish † = Tolerance Code: @ = Failure Rate Level: n = Optional Surge Current h = PackagingDesignator: J = ± 5% Exponential: M = 1.0% per 1000 hours A = 10 cycles at 25°C Bulk StandardB = Gold Plated K = ± 10% P = 0.1% per 1000 hours B = 10 cycles at -55°C and +85°C \TR=7" Tape & ReelC = Hot Solder Dipped M = ± 20% R = 0.01% per 1000 hours \TR13=13" Tape & ReelK = Solder Fused S = 0.001% per 1000 hours \W=Waffle Pack


Note: The C case size has limited availability. Where possible, the D case size should be substituted.

Contact factory for latest qualification status.

19


MIL-C-55365/8 Marking (CWR11 style)

Polarity Stripe“J” for JAN Brand

Capacitance code

Rated Voltage(with manufacturer’s ID)

How to Order:(MIL-C-55365/8) CWR11 J B 225 K M A \TRStyleVoltage

C=4, D=6, F=10, H=15,J=20, K=25, M=35, N=50

Termination FinishB=Gold PlatedC=Hot Solder DippedK=Solder Fused

Capacitance CodeTolerance

(J=±5%, K=±10%, M=±20%)Failure Rate

Exponential: (M=1%/1000 hours); (P=0.1%/1000 hours); (R=0.01%/1000 hours); (S=0.001%/1000 hours)Weibull: (B=0.1%/1000 hours); (C=0.01%/1000 hours)

Optional Surge CurrentA=10 cycles at 25°CB=10 cycles at -55°C and +85°C

PackagingBulk (Standard if nothing is specified in this position)\TR=7" Tape & Reel\TR13=13" Tape & Reel\W=Waffle Pack


Case H H2 L P W W2Code (min) ±0.3 (±0.012) ±0.1 (±0.004)

A 1.6±.2 0.7 3.2±.2 0.8 1.6±.2 1.2(0.063 ±.008) (.028) (.126 ±.008) (.031) (.063±.008) (.047)

B 1.9±.2 0.7 3.5±.2 0.8 2.8±.2 2.2(.075±.008) (.028) (.138±.008) (.031) (.110±.008) (.087)

C 2.5±.3 1.0 6.0±.3 1.3 3.2±.3 2.2(.098±.012) (.039) (.236 ±.012) (.051) (.126±.012) (.087)

D 2.8 ±.3 1.0 7.3±.3 1.3 4.3±.3 2.4(.110±.012) (.039) (.287±.012) (.051) (.169±.012) (.094)

MIL-C-55365/8 Case Rated Capacitance DC Leakage (max.) Dissipation Factor (max.) Max.Part Size voltage (nom.) ESR

Number (85°C) (µF) +25°C +85°C +125°C +25°C +85/125°C -55°C 100 kHz(See Note) (volts) (µA) (µA) (µA) (%) (%) (%) (V)

CWR11D*155†@nh A 6 1.5 0.5 5.0 6.0 6 9 9 8.0CWR11D*225†@nh A 6 2.2 0.5 5.0 6.0 6 6 9 8.0CWR11D*335†@nh A 6 3.3 0.5 5.0 6.0 6 9 9 8.0CWR11D*475†@nh B 6 4.7 0.5 5.0 6.0 6 9 9 5.5CWR11D*685†@nh B 6 6.8 0.5 5.0 6.0 6 6 9 4.5CWR11D*106†@nh B 6 10.0 0.6 6.0 7.2 6 9 9 3.5CWR11D*156†@nh C 6 15.0 0.9 9.0 10.8 6 6 9 3.0CWR11D*226†@nh C 6 22.0 1.4 14.0 16.8 6 9 9 2.2CWR11D*476†@nh D 6 47.0 2.8 28.0 33.6 6 6 9 1.1

CWR11F*105†@nh A 10 1.0 0.5 5.0 6.0 4 6 6 10.0CWR11F*155†@nh A 10 1.5 0.5 5.0 6.0 6 6 9 8.0CWR11F*225†@nh A 10 2.2 0.5 5.0 6.0 6 9 9 8.0CWR11F*335†@nh B 10 3.3 0.5 5.0 6.0 6 9 9 5.5CWR11F*475†@nh B 10 4.7 0.5 5.0 6.0 6 9 9 4.5CWR11F*685†@nh B 10 6.8 0.7 7.0 8.4 6 9 9 3.5CWR11F*156†@nh C 10 15.0 1.5 15.0 18.0 6 6 9 2.5CWR11F*336†@nh D 10 33.0 3.3 33.0 39.6 6 6 9 1.1

CWR11H*684†@nh A 15 0.68 0.5 5.0 6.0 4 6 6 12.0CWR11H*105†@nh A 15 1.0 0.5 5.0 6.0 4 6 9 10.0CWR11H*155†@nh A 15 1.5 0.5 5.0 6.0 6 9 9 8.0CWR11H*225†@nh B 15 2.2 0.5 5.0 6.0 6 9 9 5.5CWR11H*335†@nh B 15 3.3 0.5 5.0 6.0 6 8 9 5.0CWR11H*475†@nh B 15 4.7 0.7 7.0 8.4 6 9 9 4.0CWR11H*106†@nh C 15 10.0 1.6 16.0 19.2 6 8 9 2.5CWR11H*226†@nh D 15 22.0 3.3 33.0 39.6 6 8 9 1.1

20


Electrical Ratings for CWR11 Capacitors

Note: To complete the MIL-C-55365/8 Part Number, additional information must be added:* = Termination Finish † = Tolerance Code: @ = Failure Rate Level: n = Optional Surge Current h = PackagingDesignator: J = ± 5% Exponential: M = 1.0% per 1000 hours A = 10 cycles at 25°C Bulk StandardB = Gold Plated K = ± 10% P = 0.1% per 1000 hours B = 10 cycles at -55°C and +85°C \TR=7" Tape & ReelC = Hot Solder Dipped M = ± 20% R = 0.01% per 1000 hours \TR13=13" Tape & ReelK = Solder Fused S = 0.001% per 1000 hours \W=Waffle Pack


Contact factory for latest qualification status. D = 0.001% per 1000 hours

21

MIL-C-55365/8 Case Rated Capacitance DC Leakage (max.) Dissipation Factor (max.) Max.Part Size voltage (nom.) ESR

Number (85°C) (µF) +25°C +85°C +125°C +25°C +85/125°C -55°C 100 kHz(See Note) (volts) (µA) (µA) (µA) (%) (%) (%) (V)

CWR11J*474†@nh A 20 0.47 0.5 5.0 6.0 4 6 6 14.0CWR11J*684†@nh A 20 0.68 0.5 5.0 6.0 4 6 6 12.0CWR11J*105†@nh A 20 1.0 0.5 5.0 6.0 4 6 6 10.0CWR11J*155†@nh B 20 1.5 0.5 5.0 6.0 6 9 9 6.0CWR11J*225†@nh B 20 2.2 0.5 5.0 6.0 6 8 9 5.0CWR11J*335†@nh B 20 3.3 0.7 7.0 8.4 6 9 9 4.0CWR11J*475†@nh C 20 4.7 1.0 10.0 12.0 6 8 9 3.0CWR11J*685†@nh C 20 6.8 1.4 14.0 16.8 6 9 9 2.4CWR11J*156†@nh D 20 15.0 3.0 30.0 36.0 6 8 9 1.1

CWR11K*334†@nh A 25 0.33 0.5 5.0 6.0 4 6 6 15.0CWR11K*474†@nh A 25 0.47 0.5 5.0 6.0 4 6 6 14.0CWR11K*684†@nh B 25 0.68 0.5 5.0 6.0 4 6 6 7.5CWR11K*105†@nh B 25 1.0 0.5 5.0 6.0 4 6 6 6.5CWR11K*155†@nh B 25 1.5 0.5 5.0 6.0 6 8 9 6.5CWR11K*225†@nh C 25 2.2 0.6 6.0 7.2 6 9 9 3.5CWR11K*335†@nh C 25 3.3 0.9 9.0 10.8 6 8 9 3.5CWR11K*475†@nh C 25 4.7 1.2 12.0 14.4 6 9 9 2.5CWR11K*685†@nh D 25 6.8 1.7 17.0 20.4 6 9 9 1.4CWR11K*106†@nh D 25 10.0 2.5 25.0 30.0 6 8 9 1.2

CWR11M*104†@nh A 35 0.10 0.5 5.0 6.0 4 6 6 24.0CWR11M*154†@nh A 35 0.15 0.5 5.0 6.0 4 6 6 21.0CWR11M*224†@nh A 35 0.22 0.5 5.0 6.0 4 6 6 18.0CWR11M*334†@nh A 35 0.33 0.5 5.0 6.0 4 6 6 15.0CWR11M*474†@nh B 35 0.47 0.5 5.0 6.0 4 6 6 10.0CWR11M*684†@nh B 35 0.68 0.5 5.0 6.0 4 6 6 8.0CWR11M*105†@nh B 35 1.0 0.5 5.0 6.0 4 6 6 6.5CWR11M*155†@nh C 35 1.5 0.5 5.0 6.0 6 8 9 4.5CWR11M*225†@nh C 35 2.2 0.8 8.0 9.6 6 8 9 3.5CWR11M*335†@nh C 35 3.3 1.2 12.0 14.4 6 8 9 2.5CWR11M*475†@nh D 35 4.7 1.7 17.0 20.4 6 8 9 1.5

CWR11N*104†@nh A 50 0.10 0.5 5.0 6.0 4 6 6 22.0CWR11N*154†@nh B 50 0.15 0.5 5.0 6.0 4 6 6 17.0CWR11N*224†@nh B 50 0.22 0.5 5.0 6.0 4 6 6 14.0CWR11N*334†@nh B 50 0.33 0.5 5.0 6.0 4 6 6 12.0CWR11N*474†@nh C 50 0.47 0.5 5.0 6.0 4 6 6 8.0CWR11N*684†@nh C 50 0.68 0.5 5.0 6.0 6 6 6 7.0CWR11N*105†@nh C 50 1.0 0.5 5.0 6.0 6 6 6 6.0CWR11N*155†@nh D 50 1.5 0.8 8.0 9.6 6 8 9 4.0CWR11N*225†@nh D 50 2.2 1.1 11.0 13.2 6 8 9 2.5


Electrical Ratings for CWR11 Capacitors

Note: To complete the MIL-C-55365/8 Part Number, additional information must be added:* = Termination Finish † = Tolerance Code: @ = Failure Rate Level: n = Optional Surge Current h = PackagingDesignator: J = ± 5% Exponential: M = 1.0% per 1000 hours A = 10 cycles at 25°C Bulk StandardB = Gold Plated K = ± 10% P = 0.1% per 1000 hours B = 10 cycles at -55°C and +85°C \TR=7" Tape & ReelC = Hot Solder Dipped M = ± 20% R = 0.01% per 1000 hours \TR13=13" Tape & ReelK = Solder Fused S = 0.001% per 1000 hours \W=Waffle Pack


Contact factory for latest qualification status. D = 0.001% per 1000 hours

22


Case Size Tape width P 7" (180mm) reel 13" (330mm) reelreference mm mm Suffix Qty. Suffix Qty.

A 8 4 R 2500 S 9000

B 12 4 R 2500 S 9000

C 12 4 R 2500 S 9000

D 12 4 R 2500 S 8000

E 12 4 R 2500 S 8000

F 12 8 R 1000 S 3000

G 12 8 R 500 S 2500

H 12 8 R 500 S 2500

Code 8mm Tape 12mm Tape4±0.1 (0.157±0.004) 4±0.1 (0.157±0.004)

P* or or8±0.1 (0.315±0.004) 8±0.1 (0.315±0.004)

G 1.75 min (0.03 min) 1.75 min (0.03 min)F 3.5±0.05 (0.138±0.002) 5.5±0.05 (0.22±0.002)E 1.75±0.1 (0.069±0.004) 1.75±0.1 (0.069±0.004)W 8±0.3 (0.315±0.012) 12±0.3 (0.472±0.012)P2 2±0.05 (0.079±0.002) 2±0.05 (0.079±0.002)P0 4±0.1 (0.157±0.004) 4±0.1 (0.157±0.004)D 1.5±0.1 (0.059±0.004) 1.5±0.1 (0.059±0.004)

-0 (-0) -0 (-0)D1 1.0 min (0.039 min) 1.5 min) (0.059 min)

Total Tape Thickness — K max

TAZ

Case size Millimeters (Inches)reference Dims

R 1.9 (0.075)

A 2.0 (0.079)

B 4.0 (0.157)

C 4.0 (0.157)

D 4.0 (0.157)

E 4.0 (0.157)

F 4.0 (0.157)

G 4.0 (0.157)

H 4.0 (0.157) *See taping suffix tables for actual P dimension (component pitch).

Solid Tantalum Chip TAZTape and reel packaging for automatic component placement.Please enter required Suffix on order.Bulk packaging is standard.

TAZ Taping Suffix Table

millimeters (inches)

Tape SpecificationTape dimensions comply to EIA RS 481 A

Dimensions A0 and B0 of the pocket andthe tape thickness, K, are dependent onthe component size.

Tape materials do not affect componentsolderability during storage.

Carrier Tape Thickness <0.4mm

23


Plastic Tape Reel Dimensions

.

m

.

m

.

m

..

.

.

13±0.5

2 ± 0.5A ± 1.0

D ±

2.0

70 ±

2.021

± 1

.0

Waffle Packaging - 2" x 2" hard plastic waffle trays. To orderWaffle packaging use a “W” in part number’s packaging position.

NOTE: Orientation of parts inwaffle packs varies by case size.

MaximumCase size Quantity

Per Waffle

TAZ A 160

TAZ B 112

TAZ C 90

TAZ D 88

TAZ E 60

TAZ F 48

TAZ G 50

TAZ H 28

CWR11 A 96

CWR11 B 72

CWR11 C 54

CWR11 D 28

Standard dimensions mmA: 9.5mm (8mm tape)

13.0mm (12mm tape)

Cover Tape DimensionsThickness: 75±25µWidth of tape:5.5mm + 0.2mm (8mm tape)9.5mm + 0.2mm (12mm tape)

24

Section 1: Electrical Characteristics and Explanation ofTerms.

Section 2: A.C. Operation and Ripple Voltage.Section 3: Reliability and calculation of failure rate.Section 4: Application guidelines for tantalum capacitors.Section 5: Mechanical and thermal properties of leaded

capacitors.Section 6: Qualification approval status.

Introduction

Tantalum capacitors are manufactured from a powder ofpure tantalum metal. The typical particle size is between 2and 10 µm.

4000µFV 10000µFV 20000µFVThe powder is compressed under high pressure around a

Tantalum wire to form a ‘pellet’. The riser wire is the anodeconnection to the capacitor.

This is subsequently vacuum sintered at high temperature(typically 1500 - 2000°C). This helps to drive off any impuri-ties within the powder by migration to the surface.

During sintering the powder becomes a sponge like structure with all the particles interconnected in a huge lattice. This structure is of high mechanical strength anddensity, but is also highly porous giving a large internal surface area.

The larger the surface area the larger the capacitance.Thus high CV (capacitance/voltage product) powders, whichhave a low average particle size, are used for low voltage,high capacitance parts. The figure below shows typical powders. Note the very great difference in particle sizebetween the powder CVs.

By choosing which powder is used to produce eachcapacitance/voltage rating the surface area can be controlled.

The following example uses a 22µF 25V capacitor to illustrate the point.

C = «o«r A

d

where «o is the dielectric constant of free space(8.855 x 10-12 Farads/m)

«r is the relative dielectric constant for Tantalum Pentoxide (27)

d is the dielectric thickness in meters (for a typical25V part)C is the capacitance in Farads

and A is the surface area in meters

Rearranging this equation gives

A = C d«o«r

thus for a 22µF/25V capacitor the surface area is 150 squarecentimeters, or nearly 1⁄2 the size of this page.

The dielectric is then formed over all the tantalum surfacesby the electrochemical process of anodization. The ‘pellet’ isdipped into a very weak solution of phosphoric acid. The dielectric thickness is controlled by the voltage appliedduring the forming process. Initially the power supply is keptin a constant current mode until the correct thickness ofdielectric has been reached (that is the voltage reaches the‘forming voltage’), it then switches to constant voltage modeand the current decays to close to zero.

The chemical equations describing the process are asfollows:

Anode: 2 Ta → 2 Ta5+ + 10 e2 Ta5+ 10 OH-→ Ta2O5 + 5 H2O

Cathode: 10 H2O – 10 e → 5H2 ↑ + 10 OH-

The oxide forms on the surface of the Tantalum but it alsogrows into the metal. For each unit of oxide two thirds growsout and one third grows in. It is for this reason that there is alimit on the maximum voltage rating of Tantalum capacitorswith present technology powders.

The dielectric operates under high electrical stress.Consider a 22µF 25V part:

Formation voltage = Formation Ratio x Working Voltage= 4 x 25= 100 Volts

Technical Summary and Application GuidelinesContents/Introduction

25

Technical Summary and Application GuidelinesIntroduction(cont.)

The pentoxide (Ta2O5) dielectric grows at a rate of 1.7 x 10-9 m/V

Dielectric thickness (d) = 100 x 1.7 x 10-9

= 0.17 µm

Electric Field strength = Working Voltage / d= 147 KV/mm

The next stage is the production of the cathode plate. Thisis achieved by pyrolysis of Manganese Nitrate intoManganese Dioxide.

The ‘pellet’ is dipped into an aqueous solution of Nitrateand then baked in an oven at approximately 250°C to pro-duce to Dioxide coat. The chemical equation is

Mn (NO3)2 → Mn O2 + 2NO2↑

This process is repeated several times through varyingspecific densities of Nitrate to build up a thick coat over allinternal and external surfaces of the ‘pellet’, as shown in thefigure.

The ‘pellet’ is then dipped into graphite and silver to provide a good connection to the Manganese Dioxide cathode plate. Electrical contact is established by depositionof carbon onto the surface of the cathode. The carbon is then coated with a conductive material to facilitate con-nection to the cathode termination. Packaging is carried outto meet individual specifications and customer requirements.This manufacturing technique is adhered to for the wholerange of AVX tantalum capacitors, which can be sub-dividedinto four basic groups:

Chip / Resin dipped / Rectangular boxed / Axial

For further info on production of Tantalum Capacitors seethe technical paper "Basic Tantalum Technology", by JohnGill, available from your local AVX representative.

ManganeseDioxide

Tantalum

DielectricOxide Film

Tantalum

ManganeseDioxide

Oxide FilmDielectric

Tantalum DielectricOxide Film

Tantalum

Dielectric Oxide Film

Anode Manganese Graphite Outer Silver LeadframeDioxide Silver Layer Epoxy

26

1.1 Capacitance1.1.1 Rated Capacitance (CR).This is the nominal rated capacitance. For tantalum capaci-tors it is measured as the capacitance of the equivalentseries circuit at 20°C using a measuring bridge supplied by a120Hz source, free of harmonics with a maximum bias of2.2V d.c.

1.1.2 Capacitance tolerance.This is the permissible variation of the actual value of thecapacitance from the rated value. For additional reading,please consult the AVX technical publication "CapacitanceTolerances for Solid Tantalum Capacitors".

1.1.3 Temperature dependence of capacitance.The capacitance of a tantalum capacitor varies with temper-ature. This variation itself is dependent to a small extent onthe rated voltage and capacitor size.

1.1.4 Frequency dependence of the capacitance. The effective capacitance decreases as frequency increases.Beyond 100KHz the capacitance continues to drop until res-onance is reached (typically between 0.5 - 5MHz dependingon the rating). Beyond the resonant frequency the devicebecomes inductive.

220 µF @ 10 VDC

1.2 Voltage1.2.1 Rated d.c. voltage. (VR)This is the rated d.c. voltage for continuous operation at85°C.

1.2.2 Category voltage (VC)This is the maximum voltage that may be applied continu-ously to a capacitor. It is equal to the rated voltage up to+85°C, beyond which it is subject to a linear derating, to 2/3VR at 125°C.

1.2.3 Surge voltage.(US)This is the highest voltage that may be applied to a capacitorfor short periods of time. The surge voltage may be appliedup to 10 times in an hour for periods of up to 30s at a time.The surge voltage must not be used as a parameter in thedesign of circuits in which, in the normal course of operation,the capacitor is periodically charged and discharged.

1.2.4 Effect of surgesThe solid Tantalum capacitor has a limited ability to with-stand voltage and current surges. This is in common with allother electrolytic capacitors and is due to the fact that theyoperate under very high electrical stress across the dielec-tric. For example a 25 volt capacitor has an Electrical Fieldof 147 KV/mm when operated at rated voltage.

Technical Summary and Application GuidelinesElectrical Characteristics and Explanation of TermsSection 1:Electrical Characteristics and Explanation of Terms

CAPACITANCE VERSUS FREQUENCY

Cap

acit

ance

(µF

)

100 1000 10000 100000 1000000

Frequency (Hz)

250

200

150

100

50

0

TYPICAL CAPACITANCE vs. TEMPERATURE

% C

apac

itan

ce

15

10

5

0

-5

-10

-15

Temperature (°C)

-55 -25 0 25 50 75 100 125

MAXIMUM CATEGORYVOLTAGE vs. TEMPERATURE

% R

ated

Vo

ltag

e

100

90

80

70

60

50

Temperature °C

75 85 95 105 115 125

85°C 125°CRated Surge Category Surge

Voltage Voltage Voltage Voltage(Vdc.) (Vdc.) (Vdc.) (Vdc.)

4 5.2 2.7 3.26.3 8 4 510 13 7.0 816 21 10 1320 26 13 1725 32 17 2035 46 23 3040 52 25 3350 65 33 43

27

Technical Summary and Application GuidelinesElectrical Characteristics and Explanation of Terms

It is important to ensure that the voltage across the terminalsof the capacitor never exceeds the specified surge voltagerating.

Solid tantalum capacitors have a self healing ability of theManganese Dioxide semiconducting layer used as the negative plate, however this is limited in low impedanceapplications.

In the case of low impedance circuits, the capacitor is likelyto be stressed by current surges. Derating the capacitor by50% or more increases the reliability of the component. Seefigure 2 page 33. The “AVX Recommended Derating Table”(page 34) summarizes voltage rating for use on commonvoltage rails, in low impedance applications.

In circuits which undergo rapid charge or discharge a pro-tective resistor of 1V/V is recommended. If this is impossi-ble, a derating factor of up to 70% should be used.

In such situations a higher voltage may be needed than isavailable as a single capacitor. A series combination shouldbe used to increase the working voltage of the equivalentcapacitor: For example two 22µF 25V parts in series isequivalent to a 11µF 50V part. For further details refer toJ.A.Gill’s paper “Investigation into the effects of connectingTantalum capacitors in series”, available from AVX officesworldwide.

NOTE:While testing a circuit (e.g. at ICT or functional) it is likely thatthe capacitors will be subjected to large voltage and currenttransients, which will not be seen in normal use. These con-ditions should be borne in mind when considering thecapacitor’s rated voltage for use. These can be controlled byensuring a correct test resistance is used.

1.2.5 Reverse voltage and Non-Polar operation.The reverse voltage ratings are designed to cover exception-al conditions of small level excursions into incorrect polarity.The values quoted are not intended to cover continuousreverse operation.

The peak reverse voltage applied to the capacitor must notexceed:

10% of the rated d.c. working voltage to a maximum of1.0v at 25°C

3% of the rated d.c. working voltage to a maximum of0.5v at 85°C

1% of the category d.c. working voltage to a maximum of0.1v at 125°C

Non-Polar operation.If higher reverse voltages are unavoidable, then two capaci-tors, each of twice the required capacitance and of equal tolerance and rated voltage, should be connected in a back-to-back configuration, i.e. both anodes or both cathodes joined together. This is necessary in order to avoida reduction in life expectancy.

1.2.6 Superimposed A.C. Voltage (Vr.m.s.) - Ripple Voltage.

This is the maximum r.m.s. alternating voltage; superim-posed on a d.c. voltage, that may be applied to a capacitor.The sum of the d.c. voltage and peak value of the superimposed a.c. voltage must not exceed the categoryvoltage, Uc.

Full details are given in section 2.

1.2.7 Forming voltage.This is the voltage at which the anode oxide is formed. Thethickness of this oxide layer is proportional to the formationvoltage for a tantalum capacitor and is a factor in setting therated voltage.

1.3 Dissipation Factor andTangent of Loss Angle (Tan d)

1.3.1 Dissipation factor (D.F.).Dissipation factor is the measurement of the tangent of theloss angle (tan d) expressed as a percentage. The measure-ment of DF is carried out at +20°C and 120Hz with 2.2V d.c.bias with an a.c. voltage free of harmonics. The value of DFis temperature and frequency dependent.

Note: For surface mounted products the maximum allowedDF values are indicated in the ratings table and it is impor-tant to note that these are the limits met by the componentAFTER soldering onto the substrate.

1.3.2 Tangent of Loss Angle (Tan d).This is a measurement of the energy loss in the capacitor. Itis expressed as Tan d and is the power loss of the capacitordivided by its reactive power at a sinusoidal voltage of spec-ified frequency. Terms also used are power factor, loss factorand dielectric loss. Cos (90 - d) is the true power factor. Themeasurement of Tan d is carried out at +20°C and 120 Hzwith 2.2V d.c. bias with an a.c. voltage free of harmonics.

28

Technical Summary and Application GuidelinesElectrical Characteristics and Explanation of Terms1.3.3 Frequency dependence of Dissipation Factor.

Dissipation Factor increases with frequency as shown in thetypical curves:

1.3.4 Temperature Dependence of Dissipation Factor.Dissipation factor varies with temperature as the typicalcurves show. For maximum limits please refer to ratingstables.

1.4 Impedance, (Z) and Equivalent SeriesResistance (ESR)

1.4.1 Impedance, Z.This is the ratio of voltage to current at a specified frequen-cy. Three factors contribute to the impedance of a tantalumcapacitor; the resistance of the semiconductor layer; thecapacitance value and the inductance of the electrodes andleads.

At high frequencies the inductance of the leads becomes alimiting factor. The temperature and frequency behavior ofthese three factors of impedance determine the behavior ofthe impedance Z. The impedance is measured at 20°C and100kHz.

1.4.2 Equivalent Series Resistance, ESR.Resistance losses occur in all practical forms of capacitors.These are made up from several different mechanisms,including resistance in components and contacts, viscousforces within the dielectric and defects producing bypass

current paths. To express the effect of these losses they areconsidered as the ESR of the capacitor. The ESR is frequen-cy dependent and can be found by using the relationship;

ESR = Tan 2πfC

Where f is the frequency in Hz, and C is the capacitance in farads.

The ESR is measured at 20°C and 100kHz.ESR is one of the contributing factors to impedance, and athigh frequencies (100kHz. and above) it becomes the domi-nant factor. Thus ESR and impedance become almost iden-tical, impedance being only marginally higher.

1.4.3 Frequency dependence of Impedance and ESR.ESR and Impedance both increase with decreasing frequen-cy. At lower frequencies the values diverge as the extracontributions to impedance (due to the reactance of thecapacitor) become more significant. Beyond 1 MHz. (andbeyond the resonant point of the capacitor) impedanceagain increases due to the inductance of the capacitor.

DF vs. FREQUENCY(TPSE107M016R0100)

DF

(%

)

100 1000 10000 100000Frequency (Hz)

500

450

400

350

300

250

200

150

100

50

0

DF VERSUS TEMPERATURE

DF

(%

)

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

Temperature (°C)

-55 -40 -20 0 20 40 60 80 100 125

ESR VERSUS FREQUENCY(TPSE107M016R0100)

ES

R (

Oh

ms)

1

0.1

0.01100 1000 10000 100000 1000000

Frequency (Hz)

IMPEDANCE VERSUS FREQUENCY(TPSE107M016R0100)

10

1

0.1

0.01

Imp

edan

ce (

Oh

ms)

Frequency (Hz)

100 1000 10000 100000 1000000

29

1.4.4 Temperature Dependence of the Impedanceand ESR.

At 100kHz, impedance and ESR behave identically anddecrease with increasing temperature as the typical curvesshow.

1.5 D.C. Leakage Current (IL)

1.5.1 Leakage current, ILThe leakage current is dependent on the voltage applied, theelapsed time since the voltage was applied and the compo-nent temperature. It is measured at +20°C with the ratedvoltage applied. A protective resistance of 1000V is con-nected in series with the capacitor in the measuring circuit.Three to five minutes after application of the rated voltagethe leakage current must not exceed the maximum valuesindicated in the ratings tables. These tables are based on0.01CV or 0.5µA, whichever is greater.

Reforming of tantalum capacitors is unnecessary even afterprolonged periods without the application of voltage.

1.5.2 Temperature dependence of the leakage current.The leakage current increases with higher temperatures, typ-ical values are shown in the graph. For operation between85°C and 125°C, the maximum working voltage must bederated and can be found from the following formula.

Umax = x1- (T - 85)c x VRvolts, where T is the required125

operating temperature.

1.5.3 Voltage dependence of the leakage current.The leakage current drops rapidly below the value corre-sponding to the rated voltage UR when reduced voltagesare applied. The effect of voltage derating on the leakagecurrent is shown in the graph. This will also give a signifi-cant increase in the reliability for any application. SeeSection 3.1 for details.

For additional information on Leakage Current, please con-sult the AVX technical publication. "Analysis of SolidTantalum Capacitor Leakage Current" by R. W. Franklin.

1.5.4 Ripple current.

The maximum ripple current allowed can be calculated fromthe power dissipation limits for a given temperature riseabove ambient temperature. Please refer to Section 2 fordetails.

Technical Summary and Application GuidelinesElectrical Characteristics and Explanation of Terms

ESR VERSUS TEMPERATURE

ES

R (

Oh

ms)

1

0.1

0.01

Temperature (°C)

-55 -40 -20 0 20 40 60 80 100 125

1

0.1

0.010 20 40 60 80 100

Rated Voltage (UR) %

Leakage Currentratio I/IVR

LEAKAGE CURRENT VERSUS RATED VOLTAGE

TypicalRange

TAJD33M6.3

TAJD47M10

TAJD33M16

TAJC6.8M20

10

8

6

4

2

0

-2

-4

-6

-8

-10

Leak

age

Cur

rent

(µA

)

-20 0 20 40 60 80 100

Applied Voltage (Volts)

LEAKAGE CURRENT VERSUS BIAS VOLTAGE

-55 -40 -20 0 20 40 60 80 100 +125

10

1

0.1

Temperature (°C)

Leakage currentratio I/IR20

30

In an a.c. application heat is generated within the capacitorby both the a.c. component of the signal (which will dependupon the signal form, amplitude and frequency), and by thed.c. leakage. For practical purposes the second factor isinsignificant. The actual power dissipated in the capacitor iscalculated using the formula:

P = I2 R

and rearranged to I = P⁄R.....(Eq. 1)

and substituting P = E2 R

Z2

where I=rms ripple current, amperesR=equivalent series resistance, ohmsE=rms ripple voltage, voltsP=power dissipated, wattsZ=impedance, ohms, at frequency under

considerationMaximum a.c. ripple voltage (Emax).

From the previous equation:

E max = Z P max

R .....(Eq. 2)

Where Pmax is the maximum permissible power dissipatedas listed for the product under consideration (see tables).However care must be taken to ensure that:1. The d.c. working voltage of the capacitor must not be

exceeded by the sum of the positive peak of the applieda.c. voltage and the d.c. bias voltage.

2. The sum of the applied d.c. bias voltage and the negativepeak of the a.c. voltage must not allow a voltage reversalin excess of the “Reverse Voltage”.

Historical ripple calculations.Previous ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10°C rise of the capacitors body temperature fromroom temperature, usually in free air. These values areshown in Table I. Equation 1 then allows the maximum ripplecurrent to be established, and equation 2 the maximum rip-ple voltage. But as has been shown in the AVX article onthermal management by I. Salisbury, the thermal conductivi-ty of a Tantalum chip capacitor varies considerably depend-ing upon how it is mounted.

Technical Summary and Application GuidelinesA.C. Operation, Ripple Voltage and Ripple Current

Section 2:A.C. Operation, Ripple Voltage and Ripple Current

2.1 Ripple Ratings (a.c.)

Î

Table I: Power Dissipation Ratings (In Free Air)

TAJ/TPS/CWR11TAJ/TPS/CWR11 TAZ/CWR09 TAZ/CWR09

Series Molded Chip Series Molded Chip Series Molded Chip

Case Max. powersize dissipation (W)A 0.075B 0.085C 0.110D 0.150E 0.165V 0.250M 0.090N 0.130R 0.055S 0.065T 0.080

Case Max. powersize dissipation (W)A 0.050B 0.070C 0.075D 0.080E 0.090F 0.100G 0.125H 0.150

Temperaturederating factors

Temp. °C Factor+25 1.0+55 0.90+85 0.80+125 0.16

Î

31

A piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor. The temperature rise seen on the body forthe capacitor was then measured using an infra-red probe.This ensured that there was no heat loss through any ther-mocouple attached to the capacitor’s surface.

Results for the C, D and E case sizes

Several capacitors were tested and the combined results areshown here. All these capacitors were measured on FR4board, with no other heatsinking. The ripple was supplied atvarious frequencies from 1KHz to 1MHz.

As can be seen in the figure above, the average Pmax valuefor the C case capacitors was 0.11 Watts. This is the sameas that quoted in Table I.

The D case capacitors gave an average Pmax value 0.125Watts. This is lower than the value quoted in the table by0.025 Watts.

The E case capacitors gave an average Pmax of 0.200 Wattswhich was much higher than the 0.165 Watts from table 1.

If a typical capacitor’s ESR with frequency is considered,e.g. figure below, it can be seen that there is variation. Thusfor a set ripple current, the amount of power to be dissipatedby the capacitor will vary with frequency. This is clearlyshown in figure in top of next column, which shows that theunits surface temperature rises less for a given value of rip-ple current at 1MHz than at 100KHz.

The graph below shows a typical ESR variation with frequency.

Typical ripple current versus temp rise for 100KHz and 1MHzsine wave inputs.

If I2R is then plotted it can be seen that the two lines are infact coincident, as shown in figure below.

ExampleA Tantalum capacitor is being used in a filtering application,where it will be required to handle a 2 Amp peak-to-peak,200KHz square wave current.

A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency. The equation which relates is

ISquare = Ipksin (2πƒ) + Ipk sin (6πƒ) +

Ipk sin (10πƒ) + Ipk sin (14πƒ) +...

3 5 7

Thus the spectral components are

Let us assume the capacitor is a TAJD68M6.3. Typical ESRmeasurements would yield

Thus the total power dissipation would be 0.069 Watts. Fromthe D case results shown in figure top of previous column, itcan be seen that this power would cause the capacitors sur-face temperature to rise by about 5°C. For additional infor-mation, please refer to the AVX technical publication “RippleRating of Tantalum Chip Capacitors” by R.W. Franklin.

Technical Summary and Application GuidelinesA.C. Operation, Ripple Voltage and Ripple Current

100

90

8070

6050

4030

201000 0.1 0.2 0.3 0.4 0.5

Power (Watts)

Tem

per

atur

e ri

se (

oC

)

C case

D case

E case

ESR VERSUS FREQUENCY(TPSE107M016R0100)

ES

R (

Oh

ms)

1

0.1

0.01100 1000 10000 100000 1000000

Frequency (Hz)

70

60

50

40

30

20

10

00.00 0.20 0.40 0.60 0.80 1.00 1.20

RMS current (Amps)

Tem

per

atur

e ri

se (°

C)

100KHz

1 MHz

70.00

60.00

50.00

40.00

30.00

20.00

10.00

0.00

0.00 0.05 0.450.10 0.15 0.20 0.25 0.30 0.35 0.40 0.50FR

Tem

per

atur

e R

ise

(°C

)100KHz

1 MHz

Frequency Peak-to-peak current RMS current(Amps) (Amps)

200 KHz 2.000 0.707600 KHz 0.667 0.2361 MHz 0.400 0.141

1.4 MHz 0.286 0.101

Frequency Typical ESR Power (Watts)(Ohms) Irms2 x ESR

200 KHz 0.120 0.060600 KHz 0.115 0.0061 MHz 0.090 0.002

1.4 MHz 0.100 0.001

32

Technical Summary and Application GuidelinesA.C. Operation, Ripple Voltage and Ripple Current2.2. Thermal Management.The heat generated inside a tantalum capacitor in a.c. operation comes from the power dissipation due to ripplecurrent. It is equal to I2R, where I is the rms value of the current at a given frequency, and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent. The heat will be transferred from the outer surfaceby conduction. How efficiently it is transferred from this pointis dependent on the thermal management of the board.

The power dissipation ratings given in section 2.1 are basedon free-air calculations. These ratings can be approached ifefficient heat sinking and/or forced cooling is used.

In practice, in a high density assembly with no specificthermal management, the power dissipation required to givea 10°C rise above ambient may be up to a factor of 10 less.In these cases, the actual capacitor temperature should beestablished (either by thermocouple probe or infra-red scanner)and if it is seen to be above this limit it may be necessary tospecify a lower ESR part or a higher voltage rating.

Please contact application engineering for details or contactthe AVX technical publication entitled “Thermal Managementof Surface Mounted Tantalum Capacitors” by Ian Salisbury.

LEAD FRAME

SOLDER

ENCAPSULANT

COPPER

PRINTED CIRCUIT BOARD

TANTALUMANODE

121 C\WATT

73 C\WATT

236 C\WATT

X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY

XX

X

TEMPERATURE DEG C

THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY

140

120

100

80

60

40

20

00 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4

POWER IN UNIT CASE, DC WATTS

= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR

Thermal Dissipation from the Mounted Chip

Thermal Impedance Graph with ripple current

33

Section 3:Reliability and Calculation of Failure Rate

3.1 Steady-State

Technical Summary and Application GuidelinesReliability and Calculation of Failure Rate

Tantalum Dielectric has essentially no wear out mechanismand in certain circumstances is capable of limited self healing, random failures can occur in operation. The failurerate of Tantalum capacitors will decrease with time and notincrease as with other electrolytic capacitors and other electronic components.

Figure 1: Tantalum reliability curve.

The useful life reliability of the Tantalum capacitor is affectedby three factors. The equation from which the failure rate canbe calculated is:

F = FU x FT x FR x FB

where FU is a correction factor due to operating voltage/voltage deratingFT is a correction factor due to operating

temperatureFR is a correction factor due to circuit series

resistanceFB is the basic failure rate level. For standard

Tantalum product this is 1%/1000hours

Base failure rate.Standard tantalum product conforms to Level M reliability(i.e., 1%/1000 hrs.) at rated voltage, rated temperature, and 0.1Ω/volt circuit impedance. This is known as the basefailure rate, F(B), which is used for calculating operating reliability. The effect of varying the operating conditions onfailure rate is discussed in this section.

Operating voltage/voltage derating.If a capacitor with a higher voltage rating than the maximumline voltage is used, then the operating reliability will beimproved. This is known as voltage derating. The graph, figure 2, shows the relationship between voltage derating

(the ratio between applied and rated voltage) and the failurerate. The graph gives the correction factor FU for any operating voltage.

Figure 2: Correction factor to failure rate F for voltage derating of a typical component (60% con. level).

Operating Temperature.If the operating temperature is below the rated temperaturefor the capacitor then the operating reliability will beimproved as shown in figure 3. This graph gives a correctionfactor FT for any temperature of operation.

Figure 3: Correction factor to failure rate F for ambient tem-perature T for typical component (60% con. level).

Circuit Impedance.All solid tantalum capacitors require current limiting resistance to protect the dielectric from surges. A seriesresistor is recommended for this purpose. A lower circuitimpedance may cause an increase in failure rate, especiallyat temperatures higher than 20°C. An inductive low imped-ance circuit may apply voltage surges to the capacitor andsimilarly a non-inductive circuit may apply current surges to

Infinite Useful Life

Useful life reliability can be altered by voltagederating, temperature or series resistance

InfantMortalities

1.0000

0.1000

0.0100

0.0010

0.0001

Cor

rect

ion

Fact

or

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1

Applied Voltage / Rated Voltage

100.0

10.0

0.10

1.0

0.01

Cor

rect

ion

Fact

or

20 30 40 50 60 70 80 90 100 110 120

Temperature

Voltage Correction Factor

Temperature Correction Factor

34

Technical Summary and Application GuidelinesReliability and Calculation of Failure Rate

the capacitor, causing localized overheating and failure. Therecommended impedance is 1 V per volt. Where this is not feasible, equivalent voltage derating should be used (See MIL HANDBOOK 217E). The table below shows thecorrection factor, FR, for increasing series resistance.

Circuit ImpedanceCorrection factor to failure rate F for series resistance R onbasic failure rate FB for a typical component (60% con.level).

Example calculationConsider a 12 volt power line. The designer needs about10µF of capacitance to act as a decoupling capacitor near avideo bandwidth amplifier. Thus the circuit impedance willbe limited only by the output impedance of the boardspower unit and the track resistance. Let us assume it to beabout 2 Ohms minimum, i.e. 0.167 Ohms/Volt. The operat-ing temperature range is -25°C to +85°C. If a 10µF 16 Voltcapacitor was designed in the operating failure rate wouldbe as follows.

a) FT = 0.8 @ 85°Cb) FR = 0.7 @ 0.167 Ohms/Voltc) FU = 0.17 @ applied voltage/rated voltage = 75%

Thus FB = 0.8 x 0.7 x 0.17 x 1 = 0.0952%/1000 Hours

If the capacitor was changed for a 20 volt capacitor, theoperating failure rate will change as shown.

FU = 0.05 @ applied voltage/rated voltage = 60%FB = 0.8 x 0.7 x 0.05 x 1 = 0.028%/1000 Hours

3.2 Dynamic.As stated in section 1.2.4, the solid Tantalum capacitor hasa limited ability to withstand voltage and current surges.Such current surges can cause a capacitor to fail. Theexpected failure rate cannot be calculated by a simple for-mula as in the case of steady-state reliability. The two pa-rameters under the control of the circuit design engineerknown to reduce the incidence of failures are derating andseries resistance.

The table below summarizes the results of trials carried outat AVX with a piece of equipment which has very low seriesresistance and applied no derating. That is the capacitorwas tested at its rated voltage.

Results of production scale derating experiment

As can clearly be seen from the results of this experiment,the more derating applied by the user, the less likely theprobability of a surge failure occurring.

It must be remembered that these results were derived froma highly accelerated surge test machine, and failure rates inthe low ppm are more likely with the end customer.

A commonly held misconception is that the leakage currentof a Tantalum capacitor can predict the number of failureswhich will be seen on a surge screen. This can be disprovedby the results of an experiment carried out at AVX on 47µF10V surface mount capacitors with different leakagecurrents. The results are summarized in the table below.

Leakage current vs number of surge failures

Again, it must be remembered that these results werederived from a highly accelerated surge test machine,and failure rates in the low ppm are more likely with the endcustomer.

AVX recommended derating table

For further details on surge in Tantalum capacitors refer toJ.A. Gill’s paper “Surge in solid Tantalum capacitors”, avail-able from AVX offices worldwide.

An added bonus of increasing the derating applied in a cir-cuit, to improve the ability of the capacitor to withstand

Number tested Number failed surgeStandard leakage range 10,000 25

0.1 µA to 1µAOver Catalog limit 10,000 26

5µA to 50µAClassified Short Circuit 10,000 25

50µA to 500µA

Capacitance and Number of units 50% derating No deratingVoltage tested applied applied

47µF 16V 1,547,587 0.03% 1.1%100µF 10V 632,876 0.01% 0.5%22µF 25V 2,256,258 0.05% 0.3%

Voltage Rail Working Cap Voltage

3.3 6.3

5 10

10 20

12 25

15 35

≥24 Series Combinations (11)

Circuit Resistance ohms/volt FR3.0 0.072.0 0.11.0 0.20.8 0.30.6 0.40.4 0.60.2 0.80.1 1.0

35

Technical Summary and Application GuidelinesReliability and Calculation of Failure Ratesurge conditions, is that the steady-state reliability isimproved by up to an order. Consider the example of a 6.3volt capacitor being used on a 5 volt rail. The steady statereliability of a Tantalum capacitor is affected by threeparameters; temperature, series resistance and voltage de-rating. Assuming 40°C operation and 0.1Ω/volt of seriesresistance, the scaling factors for temperature and seriesresistance will both be 0.05 [see section 3.1]. The deratingfactor will be 0.15. The capacitors reliability will therefore be

Failure rate = FU x FT x FR x 1%/1000 hours= 0.15 x 0.05 x 1 x 1%/1000 hours= 7.5% x 10-3/1000 hours

If a 10 volt capacitor was used instead, the new scaling fac-tor would be 0.017, thus the steady-state reliability would be

Failure rate = FU x FT x FR x 1%/1000 hours= 0.017 x 0.05 x 1 x 1%/1000 hours= 8.5% x 10-4/ 1000 hours

So there is an order improvement in the capacitors steady-state reliability.

Reliability testingAVX performs extensive life testing of all series of tantalumcapacitors.

Two criteria are especially tested:

j 2,000 hour tests as part of our regular Quality AssuranceProgram.

Test conditions:

j 85°C/rated voltage/circuit impedance =3Ω max.

j 125°C/2/3 x rated voltage/circuit impedance =3Ω max.

This data is kept under continuous review.

Section 4:Application Guidelines for Tantalum Capacitors.

Soldering Conditions and BoardAttachment.The soldering temperature and time shouldbe the minimum for a good connection.

A suitable combination for wavesoldering is230 - 250°C for 3 - 5 seconds.

For vapor phase or infra-red reflow solder-ing the profile below shows allowable anddangerous time/temperature combinations.The profile refers to the peak reflow tem-perature and is designed to ensure that thetemperature of the internal construction ofthe capacitor does not exceed 220°C.Preheat conditions vary according to thereflow system used, maximum time andtemperature would be 10 minutes at 150°C.Small parametric shifts may be notedimmediately after reflow, componentsshould be allowed to stabilize at room tem-perature prior to electrical testing.

Both TAJ and TAZ series are designed forreflow and wave soldering operations. Inaddition TAZ is available with gold termina-tions compatible with conductive epoxy orgold wire bonding for hybrid assemblies.

DANGEROUS RANGE

ALLOWABLERANGE WITH CARE

RECOMMENDED RANGE

0 15 30 45 60

TIME IN SECONDS

260

250

240

230

220

210

Tem

per

atur

e (

C)

o

Allowable range of peak temp./time combination for IR reflow

Dangerous Range

Allowable Range with Preheat

Allowable Rangewith Care

270

260

250

240

230

220

210

200

0 2 4 6 8 10 12 Soldering Time (secs.)

Allowable range of peak temp./time combination for wave soldering

Temperature(o C)

36

Technical Summary and Application Guidelines

IR Reflow

Wave Soldering

Vapor Phase

Recommended Soldering Profiles

Recommended soldering profiles for surface mounting of tantalum capacitors is provided in figure below.

After soldering the assembly should preferably be allowed to cool naturally. In the event that assisted cooling is used,the rate of change in temperature should not exceed that used in reflow.

RecommendedRamp RateLess than2°C/sec.

37

Technical Summary and Application GuidelinesMechanical and Thermal Properties/Qualification Approval Status

5.1 Acceleration98.1m/s2 (10g)

5.2 Vibration Severity10 to 2000Hz, 0.75 mm of 98.1m/s2 (10g)

5.3 ShockTrapezoidal Pulse, 98.1m/s for 6ms.

5.4 Adhesion to SubstrateIEC 384-3. minimum of 5N.

5.5 Resistance to Substrate BendingThe component has compliant leads which reduces the risk ofstress on the capacitor due to substrate bending.

5.6 Soldering ConditionsDip soldering is permissible provided the solder bath temper-ature is # 270°C, the solder time , 3 seconds and the circuitboard thickness $ 1.0mm.

5.7 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed. This must beconsidered particularly when it is positioned near componentswhich radiate heat strongly (e.g. valves and power transistors).Furthermore, care must be taken, when bending the wires,that the bending forces do not strain the capacitor housing.

5.8 Installation PositionNo restriction.

5.9 Soldering InstructionsFluxes containing acids must not be used.

5.9.1 Guidelines for Surface Mount Footprints

Component footprint and reflow pad design for AVX capacitors

The component footprint is defined as the maximum boardarea taken up by the terminations. The footprint dimensionsare given by A, B, C and D in the diagram, which correspondsto W1 max., A max., S min. and L max. for the component.The footprint is symmetric about the center lines.The dimensions x, y and z should be kept to a minimum toreduce rotational tendencies whilst allowing for visual inspec-tion of the component and its solder fillet.

Section 5:Mechanical and Thermal Properties of Capacitors

Dimensions PS (Pad Separation) and PW (Pad Width) are cal-culated using dimensions x and z. Dimension y may vary,depending on whether reflow or wave soldering is to be per-formed.For reflow soldering, the dimensions PL (Pad Length), PW(Pad Width), and PSL (Pad Set Length) have been calculated.For wave soldering the pad width (PWw) is reduced to lessthan the termination width to minimize the amount of solderpick up while ensuring that a good joint can be produced.Note: these recommendations (also in compliance with EIA)are guidelines only with care and control, smaller footprintsmay be considered for reflow soldering.Nominal footprint and pad dimensions for each case size aregiven in the following tables:

Note: Wave solder pad lengths refer to parts mounted at right angles to the direction of travelthrough the wave.

*Although these are the recommended pad dimensions for the V case capacitor, they will fiton TAJ/TPS D & E pad dimensions.

Pad Dimensions: inches (mm)Case PSL PL PS PW PWw

TAJ/ A 0.157 (4.0) 0.055 (1.4) 0.047 (1.2) 0.071 (1.8) 0.035 (0.9)TPS B 0.157 (4.0) 0.055 (1.4) 0.047 (1.2) 0.110 (2.8) 0.063 (1.6)

C 0.257 (6.5) 0.079 (2.0) 0.098 (2.5) 0.110 (2.8) 0.063 (1.6)D 0.315 (8.0) 0.079 (2.0) 0.157 (4.0) 0.119 (3.0) 0.068 (1.7)V* 0.325 (8.3) 0.090 (2.3) 0.145 (3.7) 0.245 (6.2) 0.068 (1.7)E 0.315 (8.0) 0.079 (2.0) 0.157 (4.0) 0.119 (3.0) 0.068 (1.7)R 0.100 (2.7) 0.040 (1.0) 0.040 (1.0) 0.060 (1.6) 0.030 (0.8)S 0.160 (4.0) 0.050 (1.4) 0.040 (1.0) 0.070 (1.8) 0.030 (0.8)T 0.160 (4.0) 0.050 (1.4) 0.040 (1.0) 0.110 (2.8) 0.030 (0.8)

Pad Dimensions: inches (mm)Case PSL PL PS PW PWw

TAZ A 0.128 (3.3) 0.054 (1.4) 0.020 (0.5) 0.098 (2.5) 0.039 (1.0)B 0.178 (4.5) 0.054 (1.4) 0.070 (1.8) 0.098 (2.5) 0.039 (1.0)D 0.178 (4.5) 0.054 (1.4) 0.070 (1.8) 0.143 (3.6) 0.085 (2.2)E 0.228 (5.8) 0.054 (1.4) 0.120 (3.0) 0.143 (3.6) 0.085 (2.2)F 0.248 (6.3) 0.054 (1.4) 0.140 (3.6) 0.178 (4.5) 0.119 (3.0)G 0.293 (7.4) 0.074 (1.9) 0.145 (3.7) 0.157 (4.0) 0.095 (2.4)H 0.313 (8.0) 0.074 (1.9) 0.165 (4.2) 0.197 (5.0) 0.135 (3.4)

A

x

Y

D

C Bz

PW

PL PSPSL

Section 7:Qualification Approval Status

Section 6:Epoxy Flammability

DESCRIPTION STYLE SPECIFICATION

Surface mount capacitors TAJ CECC 30801 - 005 Issue 2

CECC 30801 - 011 Issue 1IECQ PQC - 32 GB0003 Issue 1MIL-C-55265/8 (CWR11)

TAZ MIL-C-55365/4 (CWR09)

EPOXY UL RATING OXYGEN INDEX

TAJ Hysol MG 33 UL94 V[ 35%TPS Hysol MG 33 UL94 V[ 35%TAZ Hysol MG 40 UL94 V[ 35%


Section 8:8.1 Qualification testsWhen converting designs from through hole to surfacemount, specifications should be checked to ensurecompatibility with the performance standards of thesurface mount devices. As a guide, test limits for TAJand TAZ series are set out below. TAJ is qualified to IECPQC-32 GB0003 and MIL-C-55365/8 (CWR11). TAZ isqualified to MIL-C-55365/4 (CWR09).8.2 Qualification test limits

8.2.1 Life testCapacitors are subjected to 858C at rated volts, and1258C at 2/3 x rated volts, for 2000 hrs. with 3V circuitimpedance. After 1-2 hours recovery, components mustmeet:

TAJ TAZDCR,610% of DCR,65% of

Initial Value Initial ValueDCL,1.25 x Initial Limit DCL,Initial Limit

DF,Initial Limit DF,Initial

8.2.2 Thermal shock testCapacitors are subjected to 5 cycles of 30 mins. at -558Cfollowed by 30 mins at 1258C. After 1-2 hours recovery,components must meet:


Initial Value Initial ValueDCL,Initial Limit DCL,Initial LimitDF,Initial Limit DF,Initial Limit

8.2.3 Humidity testCapacitors are subjected to damp heat at steady state(DHSS). The conditions are 408C with 95% RH (RelativeHumidity) for 56 days. After 1-2 hours recovery, compo-nents must meet:


Initial Value Initial ValueDCL,Initial Limit DCL,Initial Limit

DF,1.2 x Initial Limit DF,1.2 x Initial Limit

8.2.4 Climatic sequenceCapacitors are subjected to 16 hours at 1258C; acceler-ated DHSS (408C/95% RH/5 x 12 hours cycle; 6 hoursrecovery between cycles). After 1-2 hours recovery,components must meet:


Initial Value Initial ValueDCL,Initial Limit DCL,Initial Limit

DF,1.2 x Initial Limit DF,1.2 x Initial Limit

8.2.5 Surge testingCapacitors are subjected to 1000 cycles of 1.3 x ratedvoltage for 30 seconds followed by a 30-second dis-charge period.


Initial Value Initial ValueDCL,Initial Limit DCL,Initial LimitDF,Initial Limit DF,Initial Limit

8.2.6 Temperature stabilityCapacitors are subjected to the following sequence.Electrical requirements are tabulated below.

STEP 1 (2562)8CMeet initial limits for CAP, DCL, and DF

STEP 2 (-5563)8CTAJ TAZ

DCR,68% of DCR,610% ofInitial Value Initial Value

DF,9% DF,8% for VR^20vDF,12% for VR,20v

STEP 3 (2562)8CTAJ TAZ


DCL,Initial Limit DCL,Initial LimitDF,Initial Limit DF,Initial Limit


DCR,+8% of DCR,610% ofInitial Value Initial Value

DCL,0.1 CVR DCL,10 x Initial Limitor 1 µA*

DF,7.2% DF,8% for VR $15vDF,12% for VR ,15v

*Whichever is greater


DCR,+12% of DCR,615% ofInitial Value Initial Value

DCL,0.125 CVC DCL,12 x Initial Limitor 1 µA*DF,9% DF,8% for VR $20v

DF,12% for VR ,20v*Whichever is greater



DCL,Initial Limit DCL,Initial LimitDF,Initial Limit DF,Initial Limit

38

39

Technical Summary and Application GuidelinesQuestions and AnswersSome commonly asked questions regarding TantalumCapacitors:

Question: If I use several tantalum capacitors in serial/ parallel combinations, how can I ensure equal currentand voltage sharing?

Answer:Connecting two or more capacitors in series andparallel combinations allows almost any value andrating to be constructed for use in an application. For exam-ple, a capacitance of more that 60µF is required in a circuitfor stable operation. The working voltage rail is 24 Volts dcwith a superimposed ripple of 1.5 Volts at 120 Hz.

The maximum voltage seen by the capacitor is Vdc +Vac=25.5V

Applying the 50% derate rule tells us that a 50Vcapacitor is required.

Connecting two 25V rated capacitors in series will givethe required capacitance voltage rating, but the effectivecapacitance will be halved,

so for greater than 60µF, four such series combinations arerequired, as shown.

In order to ensure reliable operation, the capacitors should beconnected as shown below to allow current sharing of the acnoise and ripple signals. This prevents any one capacitorheating more than its neighbors and thus being the weak linkin the chain.

The two resistors are used to ensure that the leakage currentsof the capacitors does not affect the circuit reliability,by ensuring that all the capacitors have half the working volt-age across them.

Question: What are the advantages of tantalum over othercapacitor technologies?

Answer:1. Tantalums have high volumetric efficiency.

2. Electrical performance over temperature is very stable.

3. They have a wide operating temperature range - 55degrees C to +125 degrees C.

4. They have better frequency characteristics than alu-minum electrolytics.

5. No wear out mechanism. Because of their construction,solid tantalum capacitors do not degrade in performanceor reliability over time.

Question: How does TPS differ from your standard product?

Answer: TPS has been designed from the initial anode pro-duction stages for power supply applications. Special manu-facturing processes provide the most robust capacitor dielec-tric by maximizing the volumetric efficiency of the package.After manufacturing, parts are conditioned by being subjectedto elevated temperature overvoltage burn in applied for a min-imum of two hours. Parts are monitored on a 100% basis fortheir direct current leakage (DCL) performance at elevatedtemperatures. Parts are then subjected to a low impedancecurrent surge This current surge is performed on a 100%basis and each capacitor individually monitored. At this stage,the capacitor undergoes 100% test for capacitance, DissipationFactor, DCL, and 100 KHz ESR to TPS requirements.

Question: If the part is rated as a 25 volt part and you havecurrent surged it, why can’t I use it at 25 volts in a low imped-ance circuit?

Answer: The high volumetric efficiency obtained using tanta-lum technology is accomplished by using an extremely thinfilm of tantalum pentoxide as the dielectric. Even an applica-tion of the relatively low voltage of 25 volts will produce alarge field strength as seen by the dielectric. As a result ofthis, derating has a significant impact on reliability asdescribed under the reliability section. The following exampleuses a 22 microfarad capacitor rated at 25 volts to illustratethe point. The equation for determining the amount of surfacearea for a capacitor is as follows:

33µF

25V

33µF

25V

16.5µF

50V

66µF

50V33µF

25V

+• •

• •• •

• •• •

100K

100K

100K

40

Technical Summary and Application GuidelinesC = ( (E) (E°) (A) ) / d

A = ( (C) (d) ) /( (E°)(E) )

A = ( (22 x 10-6) (170 x 10-9) ) / ( (8.85 x 10-12) (27) )

A = 0.015 square meters (150 square centimeters)

Where C = Capacitance in farads

A = Dielectric (Electrode) Surface Area (m2)

d = Dielectric thickness (Space between dielectric) (m)

E = Dielectric constant (27 for tantalum)

E° = Dielectric Constant relative to a vacuum (8.855 x 10-

12 Farads x m-1)

To compute the field voltage potential felt by the dielectric weuse the following logic.

Dielectric formation potential = Formation Ratio xWorking Voltage

= 4 x 25

Formation Potential = 100 volts

Dielectric (Ta2O5) Thickness (d) is 1.7 x 10-9 Meters Per Volt

d = 0.17 µ meters

Electric Field Strength = Working Voltage / d

= (25 / 0.17 µ meters)

= 147 Kilovolts permillimeter

= 147 Megavoltsper meter

No matter how pure the raw tantalum powder or the precisionof processing, there will always be impurity sites in the dielec-tric. We attempt to stress these sites in the factory with over-voltage surges, and elevated temperature burn in so that com-ponents will fail in the factory and not in your product.Unfortunately, within this large area of tantalum pentoxide,impurity sites will exist in all capacitors. To minimize the possi-bility of providing enough activation energy for these impuritysites to turn from an amorphous state to a crystalline state thatwill conduct energy, series resistance and derating is recom-mended. By reducing the electric field within the anode atthese sites, the tantalum capacitor has increased reliability.Tantalums differ from other electrolytics in charge transientsare carried by electronic conduction rather than absorptionof ions.

Question: What negative transients can Solid TantalumCapacitors operate under?

Answer: The reverse voltage ratings are designed to coverexceptional conditions of small level excursions into incorrectpolarity. The values quoted are not intended to cover continu-ous reverse operation. The peak reverse voltage applied tothe capacitor must not exceed:

10% of rated DC working voltage to a maximum of1 volt at 25 degrees C.

3% of rated DC working voltage to a maximum of 0.5 voltat 85 degrees C.

1% of category DC working voltage to a maximum of 0.1volt at 125 C.

Question: I have read that manufacturers recommend aseries resistance of 0.1 ohm per working volt. You suggest weuse 1 ohm per volt in a low impedance circuit. Why?

Answer: We are talking about two very different sets of circuitconditions for those recommendations. The 0.1 ohm per voltrecommendation is for steady state conditions. This level ofresistance is used as a basis for the series resistance variablein a 1% / 1000 hours 60% confidence level reference. This iswhat steady state life tests are based on. The 1 ohm per volt isrecommended for dynamic conditions which include currentin-rush applications such as inputs to power supply circuits. Inmany power supply topologies where the di / dt through thecapacitor(s) is limited, (such as most implementations of buck(current mode), forward converter, and flyback), the require-ment for series resistance is decreased.

Question: How long is the shelf life for a tantalum capacitor?

Answer: Solid tantalum capacitors have no limitation on shelflife. The dielectric is stable and no reformation is required. Theonly factors that affect future performance of the capacitorswould be high humidity conditions and extreme storage tem-peratures. Solderability of solder coated surfaces may beaffected by storage in excess of one year under temperaturesgreater than 40 degrees C or humidities greater than 80% rel-ative humidity. Terminations should be checked for solderabil-ity in the event an oxidation develops on the solder plating.

Question: Do you recommend the use of tantalums on theinput side of DC-DC converters?

Answer: No. Typically the imput side of a converter is fedfrom voltage sources which are not regulated and are of nominally low impedance. Examples would be Nickel-Metal-Hydride batteries, Nickel-Cadmium batteries, etc., whoseinternal resistance is typically in the low milliohm range. (Note: Refer to technical publications #25 and 26 on pg. 40for more details.)

41

Recommended Technical Publications

As the world’s broadest line molded tantalum chip supplier, it is ourmission to provide First In Class Technology, Quality and Service,by establishing progressive design, manufacturing and continuousimprovement programs driving toward a single goal:

Total Customer Satisfaction.

Please contact AVX for application engineering assistance.

NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements,information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any

kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty that anysuch use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all safety measures are

indicated or that other measures may not be required. Specifications are typical and may not apply to all applications.


1 Steve Warden and John Gill, “Application Guidelineson IR Reflow of Surface Mount Solid TantalumCapacitors.”

2 John Gill, “Glossary of Terms used in the TantalumIndustry.”

3 R.W. Franklin, “Over-Heating in Failed TantalumCapacitors,” AVX Ltd.

4 R.W. Franklin, “Upgraded Surge Performance ofTantalum Capacitors,” Electronic Engineering 1985

5 R.W. Franklin, “Screening beats surge threat,”Electronics Manufacture & Test, June 1985

6 AVX Surface Mounting Guide

7 Ian Salisbury, “Thermal Management of SurfaceMounted Tantalum Capacitors,” AVX

8 John Gill, “Investigation into the Effects of ConnectingTantalum Capacitors in Series,” AVX

9 Ian Salisbury, “Analysis of Fusing Technologyfor Tantalum Capacitors,” AVX-Kyocera GroupCompany

10 R.W. Franklin, “Analysis of Solid Tantalum CapacitorLeakage Current,” AVX Ltd.

11. R.W. Franklin, “An Exploration of Leakage Current,”AVX, Ltd.

12. William A. Millman, “Application Specific SMDTantalum Capacitors,” Technical Operations, AVX Ltd.

13. John Maxwell, “Assembly Induced Defects,”AVX Corporation

14. R.W. Franklin, “Capacitance Tolerances for SolidTantalum Capacitors,” AVX Ltd.

15. Arch G. Martin, “Decoupling Basics,” AVX Corporation

16. R.W. Franklin, “Equivalent Series Resistance ofTantalum Capacitors,” AVX Ltd.

17. John Stroud, “Molded Surface Mount TantalumCapacitors vs Conformally Coated Capacitors,”AVX Corporation, Tantalum Division

18. Chris Reynolds, “Reliability Management of TantalumCapacitors,” AVX Tantalum Corp.

19. R.W. Franklin, “Ripple Rating of Tantalum ChipCapacitors,” AVX Ltd.

20. Chris Reynolds, “Setting Standard Sizes for TantalumChips,” AVX Corporation

21. Kent Wicker and John Maxwell, “Solder PadGeometry Studies for Surface Mount of ChipCapacitors,” AVX Corporation, Corporate ResearchLaboratory

22. R.W. Franklin, “Surge Current Testing of Resin DippedTantalum Capacitors,” AVX Ltd.

23. John Maxwell, “Surface Mount Tantalum CapacitorApplications Information,” AVX Corporation

24. John Maxwell, “Very High Frequency SMPS OutputFilter Capacitor Considerations and MountingLimitations,” AVX Corporation

25. John Gill, “Surge In Solid Tantalum Capacitors,”AVX Ltd.

26. David Mattingly, “Increasing Reliability of SMDTantalum Capacitors in Low Impedance Applications,”AVX Corporation

27. John Gill, “Basic Tantalum Technology,” AVX Ltd.

28. John Gill, “Capacitor Technology Comparison,” AVXLtd.

29. Scott Chiang, “High Performance CPU CapacitorRequirements, How AVX Can Help,” AVX KyoceraTaiwan

Myrtle Beach, SC / Tel: 803-448-9411 / FAX: 803-448-1943Vancouver, WA / Tel: 360-696-2840 / FAX: 360-695-5836

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Biddeford, ME / Tel: 207-282-5111 / FAX: 207-283-1941AVX Limited, Fleet, Hants, England / Tel: (01252) 770000 / FAX: (01252) 770001

AVX S.A., France / Tel: (1) 6918 4600 / FAX: (1) 6928 7387AVXGmbH, Germany / Tel: 08131 9004-0 / FAX: 08131 9004-44AVX s.r.l., Milano, Italy / Tel: 02-665 00116 / FAX: 02-614 2576

AVX/Kyocera (HK) Ltd. / Tel: 852-363-3303 / FAX: 852-765-8185AVX/Kyocera (Singapore) Pte. Ltd. / Tel: (65) 258-2833 / FAX: (65) 258-8221

AVX Israel Ltd. / Tel: 972-957-3873 / FAX: 972-957-3853AVX/Kyocera Corp. / Tel: 75-593-4518 / FAX: 75-501-4936

http://www.avxcorp.com S-1GLO10M897-C

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Need additional information on AVX Products.

Internet – For more information visit us on theworldwide web at http://www.avxcorp.com

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