sumit training report

Upload: sumit-narula

Post on 04-Apr-2018

223 views

Category:

Documents


0 download

TRANSCRIPT

  • 7/31/2019 Sumit Training Report

    1/95

    A

    ON

    TRAINING AT

    SUBMITTED TO: SUBMITTED BY:

    ER. AJAY PAL SINGH SUMIT NARULA

    GEC 114404

  • 7/31/2019 Sumit Training Report

    2/95

    There is always a sense of gratitude, which is expressed to others for

    the helpful and needy service towards all this, which have been

    helpful to me in getting this task of project successfully

    accomplished.

    First of all I would express my sincere gratitude to Electronics

    and communication Department SLIET who helped me in some or

    other ways.

    I would like to express my sincere gratitude to Er. Ajaypal Singh,

    who rendered me busy possible help and patiently listening my

    problems.

    Furthermore, I would like to express my gratitude and thanks to

    my course counselor Dr.Anupama Marwaha who helped me in some

    or other way.

  • 7/31/2019 Sumit Training Report

    3/95

  • 7/31/2019 Sumit Training Report

    4/95

    INDEX i

    i)ACKNOWLEDGEMENTii)PREFACE

    1.ABOUT THAPAR UNIVERSITY2.MICROCONTROLLERA) INTRODUCTION TO 8051...B) PIN CONFIGURATION..C) 8051 ARCHITECHTURE....................................D)8051 INSTRUCTION SET.....................................................................................E)ABOUT KEIL VISION3 SIMULATOR.......F) PROGRAMS IN KEIL VISION 3 SIMULATOR...............................................

    3.VLSI DESIGNINGG) INTRODUCTION TO VLSI.H)SOFTWARES USED..I) VLSI DESIGNED CIRUITS ON MENTOR GRAPHICSJ) INTRODUCTION OF VHDLK) VHDL PROGRAMS IN MENTOR GRAPHICS MODELSIM

    4.PCB DESIGNINGL) INTRODUCTION TO PRINTED CIRCUIT BOARD.M)PCB DESIGNING RULESN)PCB ETCHING PROCEDUREO) EXERCISE 1P) EXERCISE 2

  • 7/31/2019 Sumit Training Report

    5/95

    Thapar University, formerly Thapar Institute of Engineering and

    Technology, was founded in 1956 by Karam Chand Thapar. Theuniversity is situated in Patiala, Punjab. A Centre of Relevance and

    Excellence (CORE) has been set up at Thapar University by TIFAC

    Mission REACH of Department of Science & Technology, Government

    of India in its first phase of setting up eight CORES at various

    Institutes and Universities spread all over the country.

    Science and Technology Entrepreneurs Park (STEP) has been

    established jointly by Thapar University and DST, Govt. of India.

    Thapar University has grown in size and activities during the last five

    decades of its existence. Thapar University was granted full

    autonomy and the status of a Deemed University in 1985 UGC

    The institute was established in 1956. The institute was

    granted the status of a Deemed University in 1985 by the University

    Grants Commission. The Thapar University is one of three

    organisations located in the 250 acre campus, known as Thapar

    Technology Campus (TTC), in the historic city of Patiala. The

    university has been consistently ranked among the top 20

    Engineering Colleges in India by India Today, Outlook and also among

    the top 20 private engineering colleges in the country by Dataquest

    and HT Mint. The University is also notable for its laurels ininternational forums like NASA Space Settlement Program and

    Society of Automobile Engineers (SAE) Formula Student, Europe. It is

    one of the oldest college which provide engineering degree even

    older than most of the NITs (government funded institutes)

    Thapar Institute of Engineering & Technology (TIET)

    is a major institute in the 250-acre (1.0 km

    2

    ) Thapar TechnologyCampus (TTC) in Patiala. Other than Thapar Institute of

    http://en.wikipedia.org/wiki/Karam_Chand_Thaparhttp://en.wikipedia.org/wiki/Patialahttp://en.wikipedia.org/wiki/Punjab,_Indiahttp://en.wikipedia.org/wiki/Deemed_Universityhttp://en.wikipedia.org/wiki/University_Grants_Commission_%28India%29http://en.wikipedia.org/wiki/University_Grants_Commission_%28India%29http://en.wikipedia.org/wiki/University_Grants_Commission_%28India%29http://en.wikipedia.org/wiki/University_Grants_Commission_%28India%29http://en.wikipedia.org/wiki/Deemed_Universityhttp://en.wikipedia.org/wiki/Punjab,_Indiahttp://en.wikipedia.org/wiki/Patialahttp://en.wikipedia.org/wiki/Karam_Chand_Thapar
  • 7/31/2019 Sumit Training Report

    6/95

    Engineering and Technology, the Thapar Technology campus

    also has Thapar Polytechnic, Thapar Centre for Industrial

    Research and Development. It has been renovated with every

    modern facilities.It provides on-campus residence for all itsstudents with better hostels than other government

    colleges.Chandigarh Campus is opening shortly.

    Biotechnology & Environment Sciences (BTESD)

    Chemical Engineering (CHED)

    Civil Engineering (CED)

    Computer Science & Engineering (CSED)

    Electrical & Instrumentation Engineering (EIED)

    Electronics & Communication Engineering (ECED)

    Mechanical Engineering Department (MED)

    Distance Education (DDE)

    Thapar University was ranked #26 in the Outlook India Top

    Engineering Colleges of 2012[2]

    and #19 in theDataquestIndia's

    Top Engineering Colleges 2011.[3]

    in the limited participation

    CSR-GHRDC Engineering Colleges Survey 2011 it was ranked

    #8.[4]

    In rankings limited to private schools it was ranked #5 in

    the MintTop 50 Private Engineering Colleges of 2009[5]and #3

    in theElectronics for YouTop 50 Private Engineering Colleges of

    2011

    http://en.wikipedia.org/wiki/Outlook_Indiahttp://en.wikipedia.org/wiki/Outlook_Indiahttp://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_OUTLOOK-1http://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_OUTLOOK-1http://en.wikipedia.org/wiki/Dataquesthttp://en.wikipedia.org/wiki/Dataquesthttp://en.wikipedia.org/wiki/Dataquesthttp://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_DQ-2http://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_DQ-2http://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_DQ-2http://en.wikipedia.org/wiki/Competition_Success_Reviewhttp://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_CSR_E-3http://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_CSR_E-3http://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_CSR_E-3http://en.wikipedia.org/wiki/Mint_%28newspaper%29http://en.wikipedia.org/wiki/Mint_%28newspaper%29http://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_MINT_P-4http://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_MINT_P-4http://en.wikipedia.org/wiki/Electronics_for_Youhttp://en.wikipedia.org/wiki/Electronics_for_Youhttp://en.wikipedia.org/wiki/Electronics_for_Youhttp://en.wikipedia.org/wiki/Electronics_for_Youhttp://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_MINT_P-4http://en.wikipedia.org/wiki/Mint_%28newspaper%29http://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_CSR_E-3http://en.wikipedia.org/wiki/Competition_Success_Reviewhttp://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_DQ-2http://en.wikipedia.org/wiki/Dataquesthttp://en.wikipedia.org/wiki/Thapar_University#cite_note-Rankings_OUTLOOK-1http://en.wikipedia.org/wiki/Outlook_India
  • 7/31/2019 Sumit Training Report

    7/95

  • 7/31/2019 Sumit Training Report

    8/95

    The Intel MCS-51 (commonly referred to as 8051) is a Harvard

    architecture, single chip microcontroller (C) series which wasdeveloped by Intel in 1980 for use in embedded systems.

    [1][2] Intel's

    original versions were popular in the 1980s and early 1990s. While

    Intel no longer manufactures the MCS-51, binary compatible

    derivatives remain popular today. In addition to these physical

    devices, several companies also offer MCS-51 derivatives as IP cores

    for use in FPGAs or ASICs designs.

    Intel's original MCS-51 family was developed using NMOStechnology, but later versions, identified by a letter C in their name

    (e.g., 80C51) used CMOS technology and consumed less power than

    their NMOS predecessors. This made them more suitable for battery-

    powered devices.

    IMPORTANT FEATURES AND APPLICATIONS:

    The 8051 architecture provides many functions (CPU, RAM, ROM,I/O, interrupt logic, timer, etc.) in a single package

    8-bit ALU, Accumulator and 8-bit Registers; hence it is an 8-bit

    microcontroller

    8-bit data bus It can access 8 bits of data in one operation

    16-bit address bus It can access 216

    memory locations 64 KB

    (65536 locations) each of RAM and ROM

    On-chip RAM 128 bytes (data memory) On-chip ROM 4 kByte (program memory)

    Four byte bi-directional input/output port

    UART (serial port)

    Two 16-bit Counter/timers

    Two-level interrupt priority

    Power saving mode (on some derivatives)

    http://en.wikipedia.org/wiki/Harvard_architecturehttp://en.wikipedia.org/wiki/Harvard_architecturehttp://en.wikipedia.org/wiki/Microcontrollerhttp://en.wikipedia.org/wiki/Intelhttp://en.wikipedia.org/wiki/Embedded_systemhttp://en.wikipedia.org/wiki/Intel_MCS-51#cite_note-0http://en.wikipedia.org/wiki/Intel_MCS-51#cite_note-0http://en.wikipedia.org/wiki/Binary_compatiblehttp://en.wikipedia.org/wiki/IP_corehttp://en.wikipedia.org/wiki/FPGAshttp://en.wikipedia.org/wiki/ASICshttp://en.wikipedia.org/wiki/NMOS_logichttp://en.wikipedia.org/wiki/CMOShttp://en.wikipedia.org/wiki/Central_processing_unithttp://en.wikipedia.org/wiki/Random_access_memoryhttp://en.wikipedia.org/wiki/Read-only_memoryhttp://en.wikipedia.org/wiki/Input/outputhttp://en.wikipedia.org/wiki/Interrupthttp://en.wikipedia.org/wiki/Timerhttp://en.wikipedia.org/wiki/Integrated_circuit_packaginghttp://en.wikipedia.org/wiki/Arithmetic_logic_unithttp://en.wikipedia.org/wiki/8-bithttp://en.wikipedia.org/wiki/Microcontrollerhttp://en.wikipedia.org/wiki/Data_bushttp://en.wikipedia.org/wiki/Address_bushttp://en.wikipedia.org/wiki/Kilobytehttp://en.wikipedia.org/wiki/Bytehttp://en.wikipedia.org/wiki/Bytehttp://en.wikipedia.org/wiki/Input/outputhttp://en.wikipedia.org/wiki/Serial_porthttp://en.wikipedia.org/wiki/Timerhttp://en.wikipedia.org/wiki/Interrupthttp://en.wikipedia.org/wiki/Power_managementhttp://en.wikipedia.org/wiki/Power_managementhttp://en.wikipedia.org/wiki/Interrupthttp://en.wikipedia.org/wiki/Timerhttp://en.wikipedia.org/wiki/Serial_porthttp://en.wikipedia.org/wiki/Input/outputhttp://en.wikipedia.org/wiki/Bytehttp://en.wikipedia.org/wiki/Bytehttp://en.wikipedia.org/wiki/Kilobytehttp://en.wikipedia.org/wiki/Address_bushttp://en.wikipedia.org/wiki/Data_bushttp://en.wikipedia.org/wiki/Microcontrollerhttp://en.wikipedia.org/wiki/8-bithttp://en.wikipedia.org/wiki/Arithmetic_logic_unithttp://en.wikipedia.org/wiki/Integrated_circuit_packaginghttp://en.wikipedia.org/wiki/Timerhttp://en.wikipedia.org/wiki/Interrupthttp://en.wikipedia.org/wiki/Input/outputhttp://en.wikipedia.org/wiki/Read-only_memoryhttp://en.wikipedia.org/wiki/Random_access_memoryhttp://en.wikipedia.org/wiki/Central_processing_unithttp://en.wikipedia.org/wiki/CMOShttp://en.wikipedia.org/wiki/NMOS_logichttp://en.wikipedia.org/wiki/ASICshttp://en.wikipedia.org/wiki/FPGAshttp://en.wikipedia.org/wiki/IP_corehttp://en.wikipedia.org/wiki/Binary_compatiblehttp://en.wikipedia.org/wiki/Intel_MCS-51#cite_note-0http://en.wikipedia.org/wiki/Intel_MCS-51#cite_note-0http://en.wikipedia.org/wiki/Embedded_systemhttp://en.wikipedia.org/wiki/Intelhttp://en.wikipedia.org/wiki/Microcontrollerhttp://en.wikipedia.org/wiki/Harvard_architecturehttp://en.wikipedia.org/wiki/Harvard_architecture
  • 7/31/2019 Sumit Training Report

    9/95

    Intel fabricated the original 8051 which is known as MCS-51. The

    other two members of the 8051 family are:

    i. 8052 This microcontroller has 256 bytes of RAM and 3 timers.

    In addition to the standard features of 8051, this microcontroller has

    an added 128 bytes of RAM and timer. It has 8K bytes of on chip

    program ROM. The programs written for projects using 8051

    microcontroller can be used to run on the projects using 8052

    microcontroller as 8051 is a subset of 8052.

    ii. 8031 This microcontroller has all the features of 8051 exceptfor it to be ROM-less. An external ROM that can be as large as 64 K

    bytes should be programmed and added to this chip for execution.

    The disadvantage of adding external ROM is that 2 ports (out of the 4

    ports) are used. Hence, only 2 ports are left for I/O operations which

    can also be added externally if required for execution.

  • 7/31/2019 Sumit Training Report

    10/95

    PIN 9: PIN 9 is the reset pin which is used to reset the

    microcontrollers internal registers and ports upon starting up. (Pin

    should be held high for 2 machine cycles.)

    PINS 18 & 19: The 8051 has a built-in oscillator amplifier hence we

    need to only connect a crystal at these pins to provide clock pulses to

    the circuit.

    PIN 40 and 20: Pins 40 and 20 are VCC and ground respectively. The

    8051 chip needs +5V 500mA to function properly, although there are

    lower powered versions like the Atmel 2051 which is a scaled down

    version of the 8051 which runs on +3V.

    PINS 29, 30 & 31: As described in the features of the 8051, this chip

    contains a built-in flash memory. In order to program this we need to

    supply a voltage of +12V at pin 31. If external memory is connected

  • 7/31/2019 Sumit Training Report

    11/95

    then PIN 31, also called EA/VPP, should be connected to ground to

    indicate the presence of external memory. PIN 30 is called ALE

    (address latch enable), which is used when multiple memory chips

    are connected to the controller and only one of them needs to be

    selected.We will deal with this in depth in the later chapters. PIN 29

    is called PSEN. This is "program store enable". In order to use the

    external memory it is required to provide the low voltage (0) on both

    PSEN and EA pins.

    There are 4 8-bit ports: P0, P1, P2 and P3.

    PORT P1 (Pins 1 to 8): The port P1 is a general purpose input/output

    port which can be used for a variety of interfacing tasks. The other

    ports P0, P2 and P3 have dual roles or additional functions associated

    with them based upon the context of their usage.The port 1 output

    buffers can sink/source four TTL inputs. When 1s are written to

    portn1 pins are pulled high by the internal pull-ups and can be used

    as inputs.

    PORT P3 (Pins 10 to 17): PORT P3 acts as a normal IO port, but Port

    P3 has additional functions such as, serial transmit and receive pins,

    2 external interrupt pins, 2 external counter inputs, read and write

    pins for memory access.

    PORT P2 (pins 21 to 28): PORT P2 can also be used as a general

    purpose 8 bit port when no external memory is present, but ifexternal memory access is required then PORT P2 will act as an

    address bus in conjunction with PORT P0 to access external memory.

    PORT P2 acts as A8-A15, as can be seen from fig 1.1

    PORTP0 (pins 32 to 39) PORT P0 can be used as a general purpose 8

    bit port when no external memory is present, but if external memory

    access is required then PORT P0 acts as a multiplexed address and

  • 7/31/2019 Sumit Training Report

    12/95

    data bus that can be used to access external memory in conjunction

    with PORT P2. P0 acts as AD0-AD7, as can be seen from fig 1.1

    PORTP10: asynchronous communication input or Serial synchronous

    communication output.

  • 7/31/2019 Sumit Training Report

    13/95

    : All operations in a microcontroller

    are synchronized by the help of an oscillator clock. The oscillator

    clock generates the clock pulses by which all internal operations are

    synchronized. A resonant network connected through pins XTAL1

    and XTAL2 forms up an oscillator. For this purpose a quartz crystaland capacitors are employed. The crystal run at specified maximum

    and minimum frequencies typically at 1 MHz to 16 MHz. When you

    read the spec a minimum frequencies would imply that some

  • 7/31/2019 Sumit Training Report

    14/95

    internal memories must always operate above a minimum frequency or

    data will be lost.

    The 8051 Microcontroller can be programmed in PL/M, 8051

    Assembly, C and a number of other high-level languages. Many

    compilers even have support for compiling C++ for an 8051.

    Program memory in the 8051 is read-only, while the data memory is

    considered to be read/write accessible. When stored on EEPROM or

    Flash, the program memory can be rewritten when the

    microcontroller is in the special programmer circuit.

    A program counter fetches bytes from locations in memory that are

    addressed by the program counter. Program ROM is at addresses

    0000h until 0FFFh. PC is automatically incremented after every

    instruction byte is fetched. PC does not have an internal address.

    DPTR or data pointer is made up of two 8-bit registers namely DPH

    and DPL needed for filling memory addresses internal and external

    code access. DPTR is specified by each individual byte name, DPH

    and DPL.

  • 7/31/2019 Sumit Training Report

    15/95

    8051 architecture has 34 general purpose or working registers.

    The logical and math operations are being hold by A and B registers.

    The other 32 registers hold the mathematical core operation. Aregister holds addition, subtraction, multiplication and division and

    Boolean bits manipulations. B register works together with A as

    storing data during multiplication and division.

    Flags is the 1-bit registers that stores results of certain program

    instructions. The flag make states that decisions can be made uponthem. Flags are grouped inside program status word (PSW) and the

    power control (PCON) registers. 8051 architecture has four math

    flags function as a responder to the math operations results and

    three general purpose flags for setting or clearing 1 or 0 as the

    programmer desired. General purpose flags are named F0, GF0 and

    GF1 used to record some event. Math flags include

    1.Carry (C)

    2.Auxiliary Carry (AC)

    3.Overflow (OV)

    4.Parity (P)

    Program status word or PSW contains math flags, user program flag

    F0 and register selected bits used to identify the four general-

    purpose register banks that are currently in used. GF0 and GF1 arestored in PCON. See 8051 hardware.

    ROM and RAM have memory for program code bytes for variable

    data that can be altered when you run the program. You can provide

    external memory to internal memory by using suitable circuits.

  • 7/31/2019 Sumit Training Report

    16/95

    Internal RAM:Internal RAM has memory 128-byte. See 8051 hardware for further

    internal RAM design. Internal RAM is organized into three distinct

    areas:1.32 bytes working registers from address 00h to 1Fh

    2.16 bytes bit addressable occupies RAM byte address 20h to

    2Fh, altogether 128 addressable bits

    3.General purpose RAM from 30h to 7Fh

  • 7/31/2019 Sumit Training Report

    17/95

    There is an area inside internal RAM called stack that deals with

    certain op-codes for storing and retrieving data quickly. 8-bit Stack

    Pointer or SP is used by 8051 architecture for holding internal RAM

    address called top of stack. The stack operation stored last byte ofdata in the top of stack. When data send to stack, it will be

    incremented before data is stored. However SP will be decremented

    if data is retrieved from the stack. Operation of the stack is shown in

    8051 hardware.

    Any 8051 architecture that do not use the internal 128-byte RAMaddressees from 00h to 7Fh are being taken care of by Special

    Function register or SFR by using addresses from 80h to FFh. SFRs

    that has asterisk symbol shown are bit addressable that allows

    programming to change that needs to be changed and leave the

    remaining bits unchanged. SFR names and equivalent internal RAM

    addresses are given in 8051 hardware. SFRs are named in certain op-

    codes by their functional names such as A while referenced by other

    op-codes by addresses such as 0E0h.

  • 7/31/2019 Sumit Training Report

    18/95

    Data memory and program code memory both are in different

    physical memory but both have the same addresses. An internalROM occupied addresses from 0000h to 0FFFh. PC addresses

    program codes from 0000h to 0FFFh. Program addresses higher than

    0FFFh that exceed the internal ROM capacity will cause 8051

    architecture to fetch codes bytes from external program memory.

  • 7/31/2019 Sumit Training Report

    19/95

  • 7/31/2019 Sumit Training Report

    20/95

  • 7/31/2019 Sumit Training Report

    21/95

  • 7/31/2019 Sumit Training Report

    22/95

    Keil was founded in 1982 by Gnter und Reinhard Keil, initially as a

    German GbR. In April 1985 the company was converted to Keil

    ElektronikGmbHto market add-on products for the development

    tools provided by many of the silicon vendors. Keil implemented the

    first C compiler designed from the ground-up specifically for

    the 8051 microcontroller.

    Keil provides a broad range of development tools

    like ANSI C compiler, macro assemblers, debuggers and

    simulators, linkers, IDE, library managers,real-time operating

    systems and evaluation boards for 8051, 251, ARM,and XC16x/C16x/ST10 families.

    http://en.wikipedia.org/w/index.php?title=GbR&action=edit&redlink=1http://en.wikipedia.org/wiki/GmbHhttp://en.wikipedia.org/wiki/GmbHhttp://en.wikipedia.org/wiki/Semiconductor_sales_leaders_by_yearhttp://en.wikipedia.org/wiki/C_(programming_language)http://en.wikipedia.org/wiki/Compilerhttp://en.wikipedia.org/wiki/Intel_8051http://en.wikipedia.org/wiki/Microcontrollerhttp://en.wikipedia.org/wiki/ANSIhttp://en.wikipedia.org/wiki/C_(programming_language)http://en.wikipedia.org/wiki/Compilerhttp://en.wikipedia.org/wiki/Assembly_language#Assemblerhttp://en.wikipedia.org/wiki/Debuggershttp://en.wikipedia.org/wiki/Linker_(computing)http://en.wikipedia.org/wiki/Integrated_development_environmenthttp://en.wikipedia.org/wiki/Real-time_operating_systemshttp://en.wikipedia.org/wiki/Real-time_operating_systemshttp://en.wikipedia.org/w/index.php?title=Evaluation_boards&action=edit&redlink=1http://www.intel.com/design/mcs51http://en.wikipedia.org/wiki/ARM_architecturehttp://www.infineon.com/cms/en/product/channel.html?channel=ff80808112ab681d0112ab6b3ae30781http://www.infineon.com/cms/en/product/channel.html?channel=ff80808112ab681d0112ab6b2f42075bhttp://mcu.st.com/mcu/inchtml.php?fdir=pages&fnam=st10http://mcu.st.com/mcu/inchtml.php?fdir=pages&fnam=st10http://www.infineon.com/cms/en/product/channel.html?channel=ff80808112ab681d0112ab6b2f42075bhttp://www.infineon.com/cms/en/product/channel.html?channel=ff80808112ab681d0112ab6b3ae30781http://en.wikipedia.org/wiki/ARM_architecturehttp://www.intel.com/design/mcs51http://en.wikipedia.org/w/index.php?title=Evaluation_boards&action=edit&redlink=1http://en.wikipedia.org/wiki/Real-time_operating_systemshttp://en.wikipedia.org/wiki/Real-time_operating_systemshttp://en.wikipedia.org/wiki/Integrated_development_environmenthttp://en.wikipedia.org/wiki/Linker_(computing)http://en.wikipedia.org/wiki/Debuggershttp://en.wikipedia.org/wiki/Assembly_language#Assemblerhttp://en.wikipedia.org/wiki/Compilerhttp://en.wikipedia.org/wiki/C_(programming_language)http://en.wikipedia.org/wiki/ANSIhttp://en.wikipedia.org/wiki/Microcontrollerhttp://en.wikipedia.org/wiki/Intel_8051http://en.wikipedia.org/wiki/Compilerhttp://en.wikipedia.org/wiki/C_(programming_language)http://en.wikipedia.org/wiki/Semiconductor_sales_leaders_by_yearhttp://en.wikipedia.org/wiki/GmbHhttp://en.wikipedia.org/w/index.php?title=GbR&action=edit&redlink=1
  • 7/31/2019 Sumit Training Report

    23/95

    The A51 Assembler is a macro assembler for the 8051 family of

    microcontrollers. It supports all 8051 derivatives. It translatessymbolic assembly language mnemonics into relocatable object code

    where the utmost speed, small code size, and hardware control are

    critical. The macro facility speeds development and conserves

    maintenance time since common sequences need only be developed

    once. The A51 assembler supports symbolic access to all features of

    the 8051 architecture.

    The A51 assembler translates assembler source files into arelocatable object modules. The DEBUG directive adds full symbolic

    information to the object module and supports debugging with the

    Vision Debugger or an in-circuit emulator. In addition to object files,

    the A51 assembler generates list files which may optionally include

    symbol table and cross reference information.

  • 7/31/2019 Sumit Training Report

    24/95

    When using the Keil tools, the project development cycle is similar to

    any other

    software development project.

    1. Create a project, select the target device from

    the Device Data base, and configure the tool

    settings

    2. Create your source files in C/C++ or

    Assembly

    3. Build your application with the Project

    Manager4. Debug and correct errors in source files, verify

    and optimize your application

    5. Download your code to Flash ROM or SRAM

    and test the linked application.

  • 7/31/2019 Sumit Training Report

    25/95

  • 7/31/2019 Sumit Training Report

    26/95

  • 7/31/2019 Sumit Training Report

    27/95

  • 7/31/2019 Sumit Training Report

    28/95

  • 7/31/2019 Sumit Training Report

    29/95

  • 7/31/2019 Sumit Training Report

    30/95

  • 7/31/2019 Sumit Training Report

    31/95

  • 7/31/2019 Sumit Training Report

    32/95

  • 7/31/2019 Sumit Training Report

    33/95

  • 7/31/2019 Sumit Training Report

    34/95

  • 7/31/2019 Sumit Training Report

    35/95

    Very-large-scale integration (VLSI) is the process of creating integrated

    circuits by combining thousands oftransistors into a single chip. VLSI

    began in the 1970s when

    complexsemiconductor and communication technologies were being

    developed. The microprocessor is a VLSI device.

    Gone are the days when huge computers made of vacuum tubes sat

    humming in entire dedicated rooms and could do about 360

    multiplications of 10 digit numbers in a second. Though they were

    heralded as the fastest computing machines of that time, they surely dont

    stand a chance when compared to the modern day machines. Modern day

    computers are getting smaller, faster, and cheaper and more power

    efficient every progressing second. But what drove this change? The wholedomain of computing ushered into a new dawn of electronic

    miniaturization with the advent of semiconductor transistor by Bardeen

    (1947-48) and then the Bipolar Transistor by Shockley (1949) in the Bell

    Laboratory.

    http://en.wikipedia.org/wiki/Integrated_circuithttp://en.wikipedia.org/wiki/Integrated_circuithttp://en.wikipedia.org/wiki/Transistorshttp://en.wikipedia.org/wiki/Semiconductorhttp://en.wikipedia.org/wiki/Communicationhttp://en.wikipedia.org/wiki/Microprocessorhttp://en.wikipedia.org/wiki/Microprocessorhttp://en.wikipedia.org/wiki/Communicationhttp://en.wikipedia.org/wiki/Semiconductorhttp://en.wikipedia.org/wiki/Transistorshttp://en.wikipedia.org/wiki/Integrated_circuithttp://en.wikipedia.org/wiki/Integrated_circuit
  • 7/31/2019 Sumit Training Report

    36/95

    Complex design challenges characterized by shrinking geometry,functionality within both the hardware and software domains, and

    strict requirements for performance and power efficiency driven by

    the designated application, are changing how systems are being

    designed.

    In the consumer markets, users experience is a key for product

    success. It is determined by the performance of the combined

    hardware and software application. To achieve an optimalarchitecture and allow design scalability, design engineers must

    maintain visibility over the power and performance requirements

    ahead of production when the greatest impact on design

    implementation is still possible.

    Architecture design is the task carried by the system architects and

    SoC designers who need to architect, integrate and optimize complex

    systems meeting power and performance requirements.During the platform definition process, macro-architecture and

    micro-architecture decisions need to be made such as HW/SW

    tradeoffs, processors selection, interconnect and memory

    hierarchies, fabric infrastructures, and caching strategies.

    When designing complex interconnect fabrics (such as storage and

    networking), architecture exploration is usually done ahead of the

    functional design phase by using statistical non-functional modelsand traffic generators that simulate various data distributions and

    loads. Alternately, in SoC and embedded applications, performance

    can be explored along with functional validation and software

    execution. It is critical to be able to balance power and performance

    in conjunction with hardware and software functionality, and then

    trade hardware vs. software implementations in a methodical and

    predictable way.

  • 7/31/2019 Sumit Training Report

    37/95

    FEATURES:

    Set of configurable TLM 2.0-based architecture blocks

    Intuitive graphical platform assembly tool Tracing of data packets, model states and design attributes

    Advanced analysis and visualization

    Hardware / software tradeoff analysis

    Early assessment of timing and power

  • 7/31/2019 Sumit Training Report

    38/95

    MENTOR GRAPHICS IC STATION:

    The Integrated Circuit (IC) tools that operate in the IC Environment

    are collectively called IC Station, The IC Environment is an IC

    development environment you invoke from the

    Design Manager or a shell. The Design Manager is a concurrent

    design environment comprised of both a graphical user interface and

    a set of management facilities that help you to create and manage

    your schematic, PC board, and IC layout designs.

    IC Station tools use the Falcon Framework, which provides the

    Common User Interface (CUI) for all Mentor Graphics tools, supports,multiple editing windows, and manages your layout's database.

    The IC Station tools provide you with the capability to design full

    custom cells and mixed standard cell and block hierarchical layouts.

    You can also use a C program interface; translate a design between

    the IC Environment, GDT, GDSII, and CIF formats; edit polygons; and

    automatically floorplan, place, route, and compact your design.

    Whether you are performing a full custom or automated

    layout, you can use the floorplanner to sketch out your design and

    the compactor to optimize it. Additionally, you can use the IC Station

    tools to verify your layout, compare your layout to a schematic,

    extract parasitics, and backannotate parasitic results to a schematic.

    The schematic capture, digital simulation, and design configuration

    tools, each of which you can independently invoke from the Design

    Manager or a shell, are collectively called Idea Station.

    The Idea Station tools provide you with the capability to describe adesign using the Very High-Speed Integrated Circuit (VHSIC)

    hardware description language,

    perform both schematic capture and digital simulation, configure

    your designs, ANd manage backannotations.

  • 7/31/2019 Sumit Training Report

    39/95

  • 7/31/2019 Sumit Training Report

    40/95

    An inverter circuit outputs a voltage representing the opposite logic-

    level to its input. Inverters can be constructed using asingle NMOS transistor or a single PMOS transistor coupled with

    aresistor. Since this 'resistive-drain' approach uses only a single type

    of transistor, it can be fabricated at low cost. However, because

    current flows through the resistor in one of the two states, the

    resistive-drain configuration is disadvantaged for power

    consumption and processing speed. Alternatively, inverters can be

    constructed using two complementary transistors in

    a CMOSconfiguration. This configuration greatly reduces powerconsumption since one of the transistors is always off in both logic

    states. Processing speed can also be improved due to the relatively

    low resistance compared to the NMOS-only or PMOS-only type

    devices. Inverters can also be constructed with bipolar junction

    transistors (BJT) in either a resistor-transistor logic (RTL) or

    atransistor-transistor logic (TTL) configuration.

    Digital electronics circuits operate at fixed voltage levelscorresponding to a logical 0 or 1 (see binary). An inverter circuit

    serves as the basic logic gate to swap between those two voltage

    levels. Implementation determines the actual voltage, but common

    levels include (0, +5V) for TTL circuits.

    http://en.wikipedia.org/wiki/NMOS_logichttp://en.wikipedia.org/wiki/PMOS_logichttp://en.wikipedia.org/wiki/Resistorhttp://en.wikipedia.org/wiki/CMOShttp://en.wikipedia.org/wiki/Bipolar_junction_transistorhttp://en.wikipedia.org/wiki/Bipolar_junction_transistorhttp://en.wikipedia.org/wiki/Resistor-transistor_logichttp://en.wikipedia.org/wiki/Transistor-transistor_logichttp://en.wikipedia.org/wiki/Digitalhttp://en.wikipedia.org/wiki/Binary_numeral_systemhttp://en.wikipedia.org/wiki/Binary_numeral_systemhttp://en.wikipedia.org/wiki/Digitalhttp://en.wikipedia.org/wiki/Transistor-transistor_logichttp://en.wikipedia.org/wiki/Resistor-transistor_logichttp://en.wikipedia.org/wiki/Bipolar_junction_transistorhttp://en.wikipedia.org/wiki/Bipolar_junction_transistorhttp://en.wikipedia.org/wiki/CMOShttp://en.wikipedia.org/wiki/Resistorhttp://en.wikipedia.org/wiki/PMOS_logichttp://en.wikipedia.org/wiki/NMOS_logic
  • 7/31/2019 Sumit Training Report

    41/95

  • 7/31/2019 Sumit Training Report

    42/95

  • 7/31/2019 Sumit Training Report

    43/95

  • 7/31/2019 Sumit Training Report

    44/95

    :

    Notice how

    transistors Q1 and Q3 resemble the series-connected complementary

    pair from the inverter circuit. Both are controlled by the same inputsignal (input A), the upper transistor turning off and the lower

    transistor turning on when the input is "high" (1), and vice versa.

    Notice also how transistors Q2 andQ4 are similarly controlled by the

    same input signal (input B), and how they will also exhibit the same

    on/off behavior for the same input logic levels. The upper transistors

    of both pairs (Q1 and Q2) have their source and drain terminals

    paralleled, while the lower transistors (Q3 and Q4) are series-

    connected. What this means is that the output will go "high" (1)

    ifeithertop transistor saturates, and will go "low" (0) only

    ifboth lower transistors saturate. The following sequence of

    illustrations shows the behavior of this NAND gate for all four

    possibilities of input logic levels (00, 01, 10, and 11)

  • 7/31/2019 Sumit Training Report

    45/95

    A CMOS NOR gate circuit uses four MOSFETs just like the NAND gate,

    except that its transistors are differently arranged. Instead of two

    paralleled sourcing(upper) transistors connected to Vdd and two

    series-connected sinking (lower) transistors connected to ground,

    the NOR gate uses two series-connected sourcing transistors and two

    parallel-connected sinking transistors like this:

  • 7/31/2019 Sumit Training Report

    46/95

    As with the NAND gate, transistors Q1 and Q3 work as a

    complementary pair, as do transistors Q2 and Q4. Each pair is

    controlled by a single input signal. Ifeitherinput A orinput B are

    "high" (1), at least one of the lower transistors (Q3 or Q4) will be

    saturated, thus making the output "low" (0). Only in the event

    ofboth inputs being "low" (0) will both lower transistors be in cutoffmode and both upper transistors be saturated, the conditions

    necessary for the output to go "high" (1). This behavior, of course,

    defines the NOR logic function.

  • 7/31/2019 Sumit Training Report

    47/95

  • 7/31/2019 Sumit Training Report

    48/95

  • 7/31/2019 Sumit Training Report

    49/95

  • 7/31/2019 Sumit Training Report

    50/95

  • 7/31/2019 Sumit Training Report

    51/95

    The input voltage of the inverter circuit is also the gate-to-source

    voltage of the nMOS transistor (Vi' = VGs), while the output voltage

    of the circuit is equal to the drain-to-source voltage (V", = VDS). Thesource and the substrate terminals of the nMOS transistor, also

    called the driver transistor, are connected to ground potential;

    hence, the source-to substrate voltage is VSB = 0. In this generalized

    representation, the load device is represented as a two-terminal

    circuit element with terminal current IL and terminal voltage VL(IL).

    Oneterminal of the load device is connected to the drain of the n-

    channel MOSFET, while the other terminal is connected to VDD, the

    power supply voltage. We will see shortly that the chaRacteristics of

  • 7/31/2019 Sumit Training Report

    52/95

    the inverter circuit actually depend very strongly upon the type and

    the characteristics of the load device.

  • 7/31/2019 Sumit Training Report

    53/95

  • 7/31/2019 Sumit Training Report

    54/95

  • 7/31/2019 Sumit Training Report

    55/95

    The XOR gate (sometimes EOR gate, or EXOR gate) is a digital logic

    http://en.wikipedia.org/wiki/Logic_gatehttp://en.wikipedia.org/wiki/Logic_gate
  • 7/31/2019 Sumit Training Report

    56/95

    gate that implements an exclusive or; that is, a true output (1) results

    if one, and only one, of the inputs to the gate is true (1). If both

    inputs are false (0) or both are true (1), a false output (0) results. Its

    behavior is summarized in the truth table shown on the right. A wayto remember XOR is "one or the other but not both". It represents

    the inequality function, i.e., the output is HIGH (1) if the inputs are

    not alike otherwise the output is LOW (0).

    TRANSIENT RESPONSE:

    http://en.wikipedia.org/wiki/Logic_gatehttp://en.wikipedia.org/wiki/Exclusive_orhttp://en.wikipedia.org/wiki/Exclusive_orhttp://en.wikipedia.org/wiki/Logic_gate
  • 7/31/2019 Sumit Training Report

    57/95

    Complementary metaloxidesemiconductor (CMOS) ( /sims/) is

    a technology for constructing integrated circuits. CMOS technology is

    used inmicroprocessors, microcontrollers, static RAM, and

    other digital logic circuits. CMOS technology is also used for several

    analog circuits such as image sensors (CMOS sensor), data

    converters, and highly integrated transceivers for many types of

    communication. Frank Wanlass patented CMOS in 1967 (US patent

    3,356,858).CMOS is also sometimes referred to as complementary-symmetry

    metaloxidesemiconductor (or COS-MOS).[1]

    The words

    "complementary-symmetry" refer to the fact that the typical digital

    design style with CMOS uses complementary and symmetrical pairs

    ofp-type and n-type metal oxide semiconductor field effect

    transistors (MOSFETs) for logic functions

    Design Rule Checker (DRC): This is a program that checkseach piece of the layout against the process design rules. This is a

    slow process:

    canonicalize layout into a set of leading and trailing non-overlapping

    mask edges. Some boolean mask operations may be needed.

    determine electrical connectivity and label each edge with the node

    it belongs to. test each edge end point against neighboring edges to

    check for spacing (leading edges) and width (trailing edges)

    violations.

    Layout vs. Schematic (LVS): First a netlist is extracted fromthe layout.

    Use the electrical info generated by the DRC and then recognize

    transistors are juxtapositions of channel with diffusion. Then see if

    extracted netlist is isomorphic to the schematic netlist. This is done

    by a coloring algorithm:

    initialize all nodes to the same color

    http://en.wikipedia.org/wiki/Wikipedia:IPA_for_Englishhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Integrated_circuithttp://en.wikipedia.org/wiki/Microprocessorhttp://en.wikipedia.org/wiki/Microcontrollerhttp://en.wikipedia.org/wiki/Static_Random_Access_Memoryhttp://en.wikipedia.org/wiki/Digital_logichttp://en.wikipedia.org/wiki/Image_sensorhttp://en.wikipedia.org/wiki/CMOS_sensorhttp://en.wikipedia.org/wiki/Data_conversionhttp://en.wikipedia.org/wiki/Data_conversionhttp://en.wikipedia.org/wiki/Transceiverhttp://en.wikipedia.org/wiki/Frank_Wanlasshttp://en.wikisource.org/wiki/United_States_patent_3356858http://en.wikisource.org/wiki/United_States_patent_3356858http://en.wikipedia.org/wiki/CMOS#cite_note-0http://en.wikipedia.org/wiki/CMOS#cite_note-0http://en.wikipedia.org/wiki/CMOS#cite_note-0http://en.wikipedia.org/wiki/P-type_semiconductorhttp://en.wikipedia.org/wiki/N-type_semiconductorhttp://en.wikipedia.org/wiki/Metal_oxide_semiconductor_field_effect_transistorhttp://en.wikipedia.org/wiki/Metal_oxide_semiconductor_field_effect_transistorhttp://en.wikipedia.org/wiki/Metal_oxide_semiconductor_field_effect_transistorhttp://en.wikipedia.org/wiki/Metal_oxide_semiconductor_field_effect_transistorhttp://en.wikipedia.org/wiki/N-type_semiconductorhttp://en.wikipedia.org/wiki/P-type_semiconductorhttp://en.wikipedia.org/wiki/CMOS#cite_note-0http://en.wikisource.org/wiki/United_States_patent_3356858http://en.wikisource.org/wiki/United_States_patent_3356858http://en.wikipedia.org/wiki/Frank_Wanlasshttp://en.wikipedia.org/wiki/Transceiverhttp://en.wikipedia.org/wiki/Data_conversionhttp://en.wikipedia.org/wiki/Data_conversionhttp://en.wikipedia.org/wiki/CMOS_sensorhttp://en.wikipedia.org/wiki/Image_sensorhttp://en.wikipedia.org/wiki/Digital_logichttp://en.wikipedia.org/wiki/Static_Random_Access_Memoryhttp://en.wikipedia.org/wiki/Microcontrollerhttp://en.wikipedia.org/wiki/Microprocessorhttp://en.wikipedia.org/wiki/Integrated_circuithttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English#Keyhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_Englishhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English
  • 7/31/2019 Sumit Training Report

    58/95

    compute a new color for each node as some hashing function

    involving the colors of connected (ie, thru a fet) nodes.

    nodes that have a unique color are isomorphic to similarly colored

    node in other network worry about parallel fets, ambiguous nodes.

    CMOS LAYOUT:

  • 7/31/2019 Sumit Training Report

    59/95

  • 7/31/2019 Sumit Training Report

    60/95

  • 7/31/2019 Sumit Training Report

    61/95

  • 7/31/2019 Sumit Training Report

    62/95

  • 7/31/2019 Sumit Training Report

    63/95

    VHDL is an acronym for VHSlC Hardware Description Language

    (VHSIC is an acronym for Very High Speed Integrated Circuits). It is a

    hardware description language that can be used to model a digital

    system at many levels of abstraction ranging from the algorithmic

    level to the gate level. The complexity of the digital system being

    modeled could vary from that of a simple gate to a complete digital

    electronic system, or anything in between. The digital system can

    also be described hierarchically. Timing can also be explicitlymodeled in the same description.

    The VHDL language can be regarded as an integrated

    amalgamation of the following languages:

    sequential language +

    concurrent language +

    net-list language +

    timing specifications +

    waveform generation language => VHDLTherefore, the language has constructs that enable you to express

    the concurrent or sequential behavior of a digital system with or

    without timing. It also allows you to model the system as an

    interconnection of components. Test waveforms can also be

    generated using the same constructs. All the above constructs may

    be combined to provide a comprehensive description of the system

    in a single model.

    The language not only defines the syntax but also defines very clear

    simulation semantics for each language construct. Therefore, models

    written in this language can be verified using a VHDL simulator. It is a

    strongly typed language and is often verbose to write. It inherits

    many of its features, especially the sequential language part, from

    the Ada programming language. Because VHDL provides an extensive

    range of modeling capabilities, it is often difficult to understand.

  • 7/31/2019 Sumit Training Report

    64/95

    Fortunately, it is possible to quickly assimilate a core subset of the

    language that is both easy and simple to understand without

    learning the more complex features. This subset is usually sufficient

    to model most applications. The complete language, however, hassufficient power to capture the descriptions of the most complex

    chips to a complete electronic system.

    VHDL is used to describe a model for a digital hardware device. This

    model specifies the external view of the device and one or more

    internal views. The internal view of the device specifies the

    functionality or structure, while the external view specifies the

    interface of the device through which it communicates with the

  • 7/31/2019 Sumit Training Report

    65/95

    other models in its environment. Figure I.I shows the hardware

    device and the corresponding software model.

    The device to device model mapping is strictly a one to many.

    That is, a hardware device may have many device models. For

    example, a device modeled at a high leyel of abstraction may not

    have a clock as one of its inputs, since the clock may not have been

    used in the description. Also the data transfer at the interface may

    be treated in terms of say, integer values, instead of logical values. In

    VHDL, each device model is treated as a distinct representation of a

    unique device, called an entityin this text. Figure 1.2 shows the VHDL

    view of a hardware device that has multiple device models, with

    each device model representing one entity. Even though entity Ithrough N represent N different entities from the VHDL point of

    view, in reality they represent the same hardware device.

  • 7/31/2019 Sumit Training Report

    66/95

    MENTOR GRAPHICS MODELSIMMentor Graphics was the first to combine single kernel simulator

    (SKS) technology with a unified debug environment for Verilog,VHDL, and SystemC. The combination of industry-leading, native SKS

    performance with the best integrated debug and analysis

    environment make ModelSim the simulator of choice for both ASIC

    and FPGA designs. The best standards and platform support in the

    industry make it easy to adopt in the majority of process and tool

    flows.

    OVERVIEW: Unified mixed language simulation engine for the fastest regression

    suite throughput

    Native support of Verilog, SystemVerilog for design, VHDL, and

    SystemC for effective verification of the most sophisticated design

    environments

    Fast time-to-debug causality tracing and multi-language debugenvironment

    Advanced code coverage and analysis tools for fast time to coverage

    closure

    BENEFITS AND FEATURES:

    High-performance, high-capacity engine for the fastest regression

    suite throughput

    Native support of Verilog, VHDL, and SystemC for effectiveverification of the most sophisticated design environments

    Fast time-to-debug causality tracing and multi-language debug

    environment

    Advanced code coverage and analysis tools for fast time to coverage

    closure

  • 7/31/2019 Sumit Training Report

    67/95

  • 7/31/2019 Sumit Training Report

    68/95

  • 7/31/2019 Sumit Training Report

    69/95

  • 7/31/2019 Sumit Training Report

    70/95

  • 7/31/2019 Sumit Training Report

    71/95

  • 7/31/2019 Sumit Training Report

    72/95

  • 7/31/2019 Sumit Training Report

    73/95

  • 7/31/2019 Sumit Training Report

    74/95

  • 7/31/2019 Sumit Training Report

    75/95

  • 7/31/2019 Sumit Training Report

    76/95

  • 7/31/2019 Sumit Training Report

    77/95

  • 7/31/2019 Sumit Training Report

    78/95

  • 7/31/2019 Sumit Training Report

    79/95

  • 7/31/2019 Sumit Training Report

    80/95

  • 7/31/2019 Sumit Training Report

    81/95

  • 7/31/2019 Sumit Training Report

    82/95

  • 7/31/2019 Sumit Training Report

    83/95

  • 7/31/2019 Sumit Training Report

    84/95

  • 7/31/2019 Sumit Training Report

    85/95

  • 7/31/2019 Sumit Training Report

    86/95

  • 7/31/2019 Sumit Training Report

    87/95

    A printed circuit board, or PCB, is used to mechanically support and

    electrically connect electroniccomponents using conductive pathways, tracks or signal

    traces etched from copper sheets laminated onto a non-

    conductive substrate. It is also referred to as printed wiring

    board(PWB) or etched wiring board. Printed circuit boards are used

    in virtually all but the simplest commercially produced electronic

    devices.

    A PCB populated with electronic components is called a printedcircuit assembly (PCA), printed circuit board assembly or PCB

    Assembly(PCBA). In informal use the term "PCB" is used both for

    bare and assembled boards, the context clarifying the meaning.

    Alternatives to PCBs include wire wrap and point-to-point

    construction. PCBs must initially be designed and laid out, but

    become cheaper, faster to make, and potentially more reliable

    for high-volume production since production and soldering of PCBscan be automated. Much of the electronics industry's PCB design,

    assembly, and quality control needs are set by standards published

    by the IPC organization.

    http://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Electrical_conductorhttp://en.wikipedia.org/wiki/Industrial_etchinghttp://en.wikipedia.org/wiki/Copperhttp://en.wikipedia.org/wiki/Laminatedhttp://en.wikipedia.org/wiki/Substrate_(electronics)http://en.wikipedia.org/wiki/Wire_wraphttp://en.wikipedia.org/wiki/Point-to-point_constructionhttp://en.wikipedia.org/wiki/Point-to-point_constructionhttp://en.wikipedia.org/wiki/Mass_productionhttp://en.wikipedia.org/wiki/IPC_(electronics)http://en.wikipedia.org/wiki/IPC_(electronics)http://en.wikipedia.org/wiki/Mass_productionhttp://en.wikipedia.org/wiki/Point-to-point_constructionhttp://en.wikipedia.org/wiki/Point-to-point_constructionhttp://en.wikipedia.org/wiki/Wire_wraphttp://en.wikipedia.org/wiki/Substrate_(electronics)http://en.wikipedia.org/wiki/Laminatedhttp://en.wikipedia.org/wiki/Copperhttp://en.wikipedia.org/wiki/Industrial_etchinghttp://en.wikipedia.org/wiki/Electrical_conductorhttp://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Electronic_component
  • 7/31/2019 Sumit Training Report

    88/95

    In the PCB design of electronics circuit, it is important that one plan

    and has a checklist of the do's and don'ts before proceeding to dothe printed circuit board layout. The understanding of the circuit is

    critical to the design, for example one needs to understand the

    maximum current and voltage that are carried by each conductor in

    order to determine the track width of the conductor and the type of

    PCB that will be used.

    The voltage difference between each track will determine the

    clearance between each conductor. If the clearance is not enough,chances are that the electrical potential between each track will

    cause spark over and short circuit the PCB. This will cause functional

    failure to the product and the safety of the users that are using the

    product will be compromised. It is therefore critical for one to

    understand some of this basics requirements before one proceed to

    design the PCB.

    Tracks should not be located on the areas that can caused them to

    be peeled off easily. One of the restricted area is holes on the PCB

    which are used to mount screws or PCB spacers. These holes are

    usually used to secure the PCB to a casing or to secure it in a fixed

    place.

    The edges of the PCB should not have any tracks as these areas are

    usually used to transport the PCB from one process to another

    process by using a conveyor belt. These edges are places where the

    possibility of scratches and cracking of the PCB happens. The

    recommended areas that should not have any track is as shown in

    the diagram below assuming a hole diameter of 4 mm which is usedto mount a PCB spacer.

  • 7/31/2019 Sumit Training Report

    89/95

    The PCB conductor thickness and width will determine the current

    carrying capacity of the track. The IPC standard for the conductor

    thickness and width of the common 1 oz/square-feet PCB is as shown

    below. However, it is always advisable to use a bigger value due to

    the tolerance and variation of the PCB processes. If higher current

    carrying capacity is required, a 2 oz/square-feet or 3 oz/square-feet

    type of PCB is preferred. Many electronics hobbyist prefer to solder a

    thick cooper conductor on the PCB track to increase the current

    carrying capacity of the track.

  • 7/31/2019 Sumit Training Report

    90/95

    Many safety standards call for a minimum of 8mm clearance

    between 240V mains and other isolated signal tracks. These

    safetystandards are to ensure that the users that are using the

    products will be protected from any electrical hazards.

    For non main voltages, IPC recommend the electrical clearancebetween adjacent tracks. It is important to know the maximum

    difference in voltage that are applied on the adjacent tracks of a PCB.

    The electrical clearance specs of IPC standard is as shown below for

    various condition of the PCB. Coating the PCB will help to reduce the

    requirements of the track clearance. However, the quality of the

    coating as well as the material used are critical to ensure that these

    requirements are met. Again, it is always advisable to increase the

    clearance to cater for the variations of the PCB processes.

  • 7/31/2019 Sumit Training Report

    91/95

    PCB etching in 5 steps presented on instructables.com. A simple 5-

    step process to etch your own printed circuit boards at home. Youll

    need the following ingredients:

    laser printer/photocopier & transparencies

    copper board

    scrubbing pads

    iron

    rubber gloves

    Ferric Chloride or Ammonium Persulphate

    drill and drill bits

    1. PCB Design and print:

    Design your PCB. I use anything from Adobe Illustrator to Cadsoft

    Eagle.

    Once you think everything is perfect, print it on a piece of paper and

    test it by placing your components over it. You have to flip

    horizontal your final design so that the transfer from the

    transparency to the copper board restores the intended design

    Then print it on a transparency. It has to be a laser printer or a

    photocopier because we want toner on the transparency. If you can,

    ask the guy at the print shop to make it as dark as possible (more

    toner). Ive noticed that Ive had the best results at the worst printshops in town.

    2. Transfer the toner:

    Now you want to transfer the toner(mostly made of molten plastic)

    onto the copper board. Set the iron to silk (youll have to

    experiement with the temperatureit took me quite a while to

    consistently get good results).

    http://www.printedcircuitsboards.com/software/67/10-pcb-design-layout-software.htmlhttp://www.printedcircuitsboards.com/software/67/10-pcb-design-layout-software.htmlhttp://www.printedcircuitsboards.com/diy-pcb/53/pcb-toner-transfer-and-photo-laser-paper.htmlhttp://www.printedcircuitsboards.com/diy-pcb/53/pcb-toner-transfer-and-photo-laser-paper.htmlhttp://www.printedcircuitsboards.com/diy-pcb/53/pcb-toner-transfer-and-photo-laser-paper.htmlhttp://www.printedcircuitsboards.com/software/67/10-pcb-design-layout-software.html
  • 7/31/2019 Sumit Training Report

    92/95

    Clean and rinse the board with the scrubbing pads and soap. Dry it

    up. Place the transparency on the copper board, place a piece of

    paper on top if it all and start ironing! Depending on the size of your

    circuit, it takes about 2-3 minutes for the copper board to get hot

    enough so the toner sticks to it. When you think youre good,

    immerse the copper board (with the transparency stuck to it) in cold

    water. Then you should be able to peel off the transparency while

    the toner remains on the copper board.

    If the toner did not transfer completely, you didnt iron long enough

    and/or didnt set the temperature high enough. If the toner

    transfered but is smudged on the copper board, the temperaturewas too high and/or you ironed for too long. You can use a Sharpie

    or any other permanent marker to fix parts of the circuit that did not

    transfer properly.

    3. PCB Etch:

    Youre almost done.Put the gloves on, pour some etchant in a

    plastic or glass container and immerse the board. At roomtemperature, it can take up to half an hour. Mixing the solution as

    its etching can speed up the process. Another good way to

    dramatically decrease the etching time is to warm up the solution.

    Now I strongly discourage you to get creative with the microwave or

    your precious pots and pans. You can however dip the container in

    warm water poured from the tap. When it looks good, clean the

    board in running water.

    4. Clean the PCB Board:

    Use the scrubbing pads to remove the toner from the board.

    You can reuse the etching solution, so just pour it back in the original

    container. Do not pour it down the drain! It will corrode your copper

    pipes Over time, the etching process will take longer and longer.

    When the solution becomes unusable, contact the waste

    management organisation in your community to know where todispose of the chemical.

    http://www.printedcircuitsboards.com/tag/pcb-etchinghttp://www.printedcircuitsboards.com/tag/pcb-etchinghttp://www.printedcircuitsboards.com/tag/pcb-etching
  • 7/31/2019 Sumit Training Report

    93/95

    5. PCB Drill:

    For those of you who do not use surface mount components, youll

    need to drill holes in your circuit board. I use a Dremel (you can find

    generic versions for less than 40$). Youll need tiny drill bits (#66-

    #60). Most places youll go to will rip you off with those tiny precise

    bits (10-15$ each). However, some places like Lee Valley sells them

    for ~$0.50 each.

  • 7/31/2019 Sumit Training Report

    94/95

    LAYOUT FOR EXERCISE 1:

  • 7/31/2019 Sumit Training Report

    95/95

    LAYOUT FOR EXERCISE 2: