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State of the Art, Inc. Semi-Precision Thick Film Chip Resistor MIL-PRF-55342/12 Epoxy Bondable RM0603 Performance Part Number Mechanical M55342K12C100DS -W Packaging: -TR: Tape & Reel -W: Waffle Tray Product Level (/1000 hrs.): M: 1% P: 0.1% R & U: 0.01% S & V: 0.001% T: Space 0.001% Resistance Value and Tolerance: Termination Material: C: Epoxy Bondable Silver U: Epoxy Bondable Platinum Gold G: Epoxy Bondable Gold Ω: kΩ: MΩ: D: 1% E: 1% F: 1% G: 2% H: 2% T: 2% J: 5% K: 5% L: 5% M: 10% N: 10% P: 10% Three numerals and a letter indicating decimal, value range, and tolerance Length (a) Width (b) Thickness (c) Top Termination (d) Bottom Termination (e) Approximate Weight Inches .062(.058 - .070) .032(.027 - .037) .018(.010 - .033) .010(.007 - .017) .014(.010 - .020) 0.00235 g Millimeters 1.57(1.47 - 1.78) 0.81(0.69 - 0.94) 0.46(0.25 - 0.84) 0.25(0.18 - 0.43) 0.36(0.25 - 0.51) State of the Art, Inc. 2470 Fox Hill Road, State College, PA, USA 16803-1797 www.resistor.com Telephone: 814-355-8004 Toll Free: 800-458-3401 Fax: 814-355-2714 Specifications Subject to Change Without Notice All Products Made in the USA Copyright 2015 by State of the Art, Inc. Recommended Minimum Bond Pads (inches) .031 .030 .092 .036 Resistance Range* Tolerances (± %)* TCR (± ppm/°C)* Power Rating Voltage Rating Operating Range Product Levels Temperature Characteristic TCR (ppm/°C) Thermal Shock Power Conditioning Low Temperature Operation Short Time Overload High Temperature Exposure Moisture Resistance Life (Qualification) Life (FR Level) Resistance to Soldering Heat Resistance to Bonding Exposure K ±100 ±0.5% ±0.5% ±0.25% ±0.25% ±0.5% ±0.5% ±0.5% ±2.0% ±0.25% ±0.25% L ±200 ±0.5% ±0.5% ±0.25% ±0.25% ±0.5% ±0.5% ±0.5% ±2.0% ±0.25% ±0.25% M ±300 ±0.5% ±0.5% ±0.5% ±0.5% ±1.0% ±0.5% ±2.0% ±2.0% ±0.25% ±0.25% 1Ω to 22 MΩ 1, 2, 5, 10 100, 200, 300 100 mW 50 V -65 to 150°C M, P, R, S, U, V, T 40 20 0 -20 -40 1 1k 1M Noise Resistance Value (Ω) Noise (dB) Power (W) Power Dissipation Temperature Rise (°C) 125 100 75 50 25 0 0 1.00 1.25 0.25 0.50 0.75 ceramic board 0.5 0.4 0.3 0.2 0.1 0 0 2k 4k 6k 8k 10k Drift (|%∆R|) Hours Life Test Maximum Allowable Drift *see QPL55342 for part number availability a b e d c Size: 12: RM0603 Temperature Characteristic (ppm/°C): K: ±100 L: ±200 M: ±300 Performance Specification MIL-PRF-55342 150 70 -10 100 75 50 25 0 Percent Power Ambient Temperature (°C) Power Derating

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  • State of the Art, Inc.Semi-Precision Thick Film Chip Resistor

    MIL-PRF-55342/12 Epoxy Bondable RM0603Performance

    Part Number

    Mechanical

    M 5 5 3 4 2 K 1 2 C 1 0 0 D S - WPackaging: -TR: Tape & Reel -W: Waffle Tray

    Product Level (/1000 hrs.): M: 1% P: 0.1% R & U: 0.01% S & V: 0.001% T: Space 0.001%

    Resistance Value and Tolerance:

    Termination Material: C: Epoxy Bondable Silver U: Epoxy Bondable Platinum Gold G: Epoxy Bondable Gold

    Ω:kΩ:

    MΩ:

    D: 1%E: 1%F: 1%

    G: 2%H: 2%T: 2%

    J: 5%K: 5%L: 5%

    M: 10%N: 10%P: 10%

    Three numerals and a letter indicatingdecimal, value range, and tolerance

    Length (a)Width (b)Thickness (c)Top Termination (d)Bottom Termination (e)

    Approximate Weight

    Inches.062(.058 - .070).032(.027 - .037).018(.010 - .033).010(.007 - .017).014(.010 - .020)

    0.00235 g

    Millimeters1.57(1.47 - 1.78)0.81(0.69 - 0.94)0.46(0.25 - 0.84)0.25(0.18 - 0.43)0.36(0.25 - 0.51)

    State of the Art, Inc. 2470 Fox Hill Road, State College, PA, USA 16803-1797www.resistor.com Telephone: 814-355-8004 Toll Free: 800-458-3401 Fax: 814-355-2714

    Specifications Subject to Change Without Notice All Products Made in the USA Copyright 2015 by State of the Art, Inc.

    RecommendedMinimum

    Bond Pads(inches)

    .031 .030

    .092

    .036

    Resistance Range*Tolerances (± %)*TCR (± ppm/°C)*Power RatingVoltage RatingOperating RangeProduct Levels

    Temperature CharacteristicTCR (ppm/°C)Thermal ShockPower ConditioningLow Temperature OperationShort Time OverloadHigh Temperature ExposureMoisture ResistanceLife (Qualification)Life (FR Level)Resistance to Soldering HeatResistance to Bonding Exposure

    K±100

    ±0.5%±0.5%±0.25%±0.25%±0.5%±0.5%±0.5%±2.0%±0.25%±0.25%

    L±200

    ±0.5%±0.5%±0.25%±0.25%±0.5%±0.5%±0.5%±2.0%±0.25%±0.25%

    M±300

    ±0.5%±0.5%±0.5%±0.5%±1.0%±0.5%±2.0%±2.0%±0.25%±0.25%

    1Ω to 22 MΩ1, 2, 5, 10

    100, 200, 300100 mW

    50 V-65 to 150°C

    M, P, R, S, U, V, T

    40

    20

    0

    -20

    -401 1k 1M

    Noise

    Resistance Value (Ω)

    Noi

    se (d

    B)

    Power (W)

    Power Dissipation

    Tem

    pera

    ture

    Ris

    e (°

    C) 125

    100

    75

    50

    25

    00 1.00 1.250.25 0.50 0.75

    ceramic board

    0.5

    0.4

    0.3

    0.2

    0.1

    00 2k 4k 6k 8k 10k

    Drif

    t (|%

    ∆R|)

    Hours

    Life TestMaximum Allowable Drift

    *see QPL55342 for part number availability

    ab e

    dc

    Size: 12: RM0603Temperature Characteristic (ppm/°C): K: ±100 L: ±200 M: ±300

    Performance Specification MIL-PRF-55342

    15070-10

    100

    75

    50

    25

    0

    Per

    cent

    Pow

    er

    Ambient Temperature (°C)

    Power Derating