standard operating manualmfz140.ust.hk/eq_manual/cee 100cb operation manual.pdf · su8, no lol2000...

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST

Version 1.1 of 18

Standard Operating Manual

CEE 100CB Spin Coater /Hotplate


Version 1.1 of 18

Contents

1. Picture and Location

2. Process Capabilities

2.1 Cleanliness Standard

2.2 Substrate Size

2.3 Hotplate Temperature

2.4 Spin Speed

3. Contact List and How to Become a Qualified User

3.1 Emergency Response and Communications

3.2 Training to Become a Qualified User

4. Operating Procedures

4.1 System Description

4.2 Safety Warnings

4.3 Operation Precautions and Rules

4.4 Initial Status Checks

4.5 Initial System Checks

5. Hotplate

5.1 Hotplate Programming

5.2 Hotplate Operation Procedure

6. Spinner

6.1 Spinner Programming

6.2 Spinner Program Running

6.2.1 Chuck Replacement

6.2.2 Resist Coating Procedure

6.3 Clean up

7. Check out

8. Reference

8.1 Hotplate Programming Flowchart

8.2 Spin Coater Programming Flowchart


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CEE 100CB Spin Coater /Hotplate

1. Picture and Location

Fig. 1 CEE Model 100CB Spin Coater/Hotplate

This tool is located at NFF Phase II Cleanroom Class 100.

2. Process Capabilities

2.1 Cleanliness Standard: Clean/Semi-Clean equipment

2.2 Substrate Size: 0.5 to 6”

2.3 Hotplate Temperature: up to 200C with 1.0C resolution

2.4 Spin Speed: Maximum speed 4000rpm (+/- 5rpm) with an

acceleration of 30000rpm/s

3. Contact List and How to Become a Qualified User

3.1 Emergency Response and Communications

Security Control Center: 2358-8999 (24hr) & 2358-6565 (24hr)

Safety Officer: Mr. Wing Leong CHUNG 2358-7211 & 64406238

Deputy Safety Officer: Mr. Man Wai LEE 2358-7900 & 9621-7708

NFF Senior Technician: Mr. Henry YEUNG 2358-7896

NFF Technician: Mr. Charles TANG 23587896


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3.2 Training to Become a Qualified User

Please follow the procedure below to become a CEE 100CB Spin Coater /Hotplate

qualified user.

1. Read through the on-line equipment operating manual of the equipment;

http://www.nff.ust.hk/equipment-and-process/equipment-operation-manual.ht

ml

2. Attend the equipment hand-on operation training either by peer or NFF staff.

3. If training is provided by NFF staff, user must log in NFF equipment

reservation system, and register these trainings.

4. Send an e-mail to Mr. Henry YEUNG requesting CEE 100CB Spin Coater

/Hotplate qualified exam.

5. Pass the examination for the equipment operation and security.

4. Operating Procedures

4.1 System Description

The CEE Model 100CB Hotplate/Spinner is combined hotplate and spinner

controlled by a single microprocessor. The battery-backed memory stores up to

ten user programs containing preset values for bake temperature, bake time, and

bake method while the machine is operating in the hotplate mode. The spinner

mode of operation also contains ten user programs with ten individual steps for

setting spin speed, acceleration and time which allows for very precise spinning.

The Model 100CB Hotplate/Spinner supports three bake methods: proximity,

soft-contact, and hard-contact These bake methods provide maximum control of

substrate warm up, solvent drying, and resin curing characteristics.

System operation for both the hotplate and spinner sections is accomplished


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through one keyboard. This is made possible by multi-tasking the operating

system of each section. The microprocessor is switched between hotplate control

and spinner control by simply pressing the “OPT.”

4.2 Safety Warnings

1. Follow NFF Health and Safety Manual.

2. Avoid direct contact with the Hot Plate surface. It is extremely HOT!

3. Use Tweezer to load/unload the substrate from the hotplate only. Do not touch

the substrate after the baking process until sufficient time for cooling has elapsed.

4. Wear safety glasses when operating the machine always.

5. Check that the exhaust is functioning.

6. Spin exhaust lid should be closed during spinning.

7. If an error or problem occurs, stop all work immediately. Leave notice that the

machine is not to be used and contact the staff. Do not attempt to fix the problem.

8. Never try to flush the spindle with solvent under any condition.

9. Resists may have irritating effects to eye, skin and mucous membranes! Observe

and obey Material Safety Data Sheet (MSDS) of the corresponding materials

used in the system!

10. According to the general fire emergency procedure of HKUST, please report the

accident to the Security Control Center first. The nature of other emergencies will

determine whether you will call police, staff, or both. If someone is injured, the

9-999 emergency number should be called before calling staff. If there is a facilities

problem, such as a flood or a utility problem that does not present a danger to lab

users but may result in damage to equipment, the staff or FMO need to be called.

The 9-999 emergency should not be called for facility or equipment problem.

Always call 9-999 when a potentially life threatening situation might exist (injury,


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fire, gas leak, etc.)

4.3 Operation Precautions and Rules

1. Do not operate the equipment unless you are properly trained and approved by

NFF staff.

2. Please check the checklist and fill all the details of the log sheet attached.

3. Wipe with a fresh Polyester cleanroom wiper with Acetone or IPA to clean the

rim of resist bottle after each use.

4. Return small resist bottle back to assigned small resist bottle storage cabinet after

each use.

5. Clean the chuck in the wet station after each use. If any user fails to clean the

chuck and system properly, you may ban to use the system in future.

6. Glass disposable pipettes and plastic dropper are supplied for applying resist to

small sample.

7. Do not use either of these chucks for any material smaller than the diameter of

the chuck. This will cause the resist to be sucked into the vacuum port on the

spindle and damage the spinner.

8. When cleaning the spin bowl or spin chuck, always cover the vacuum port. If

material enters the vacuum port, it can damage the vacuum system.

9. Use NFF standard photoresist only, No polyimide, No double side coating, No

SU8, No LOL2000 and No PDMS in this track.

4.4 Initial Status Checks

1. Please check the status of shutdown notice posted in the NFF reservation

website.

2. Please check-in the equipment via card reader.

3. Before operate the machine, please check the checklist and fill all the details of

the log sheet attached.


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4.5 Initial System Checks

1. Turn on the main power in front of the equipment.

2. Check the vacuum.

3. Check the hotplate temperature.

Fig.2 Power button is “ON” position.

5. Hotplate

5.1 Hotplate Programming

The Model 100CB Hotplate section stores ten user programs in battery-backed

memory. Programs contain information such as bake temperature, up to three bake

methods, and bake times. Programs, numbered zero to nine, are individually

modified or reviewed.

1. To begin programming, pressing the “RESET” key and toggling the “OPT” key

until screen appears. Then press the PROG key to enter the program mode. This

figure shows the “Home” position for the hotplate.

Fig.3. Home display for the hotplate.

2. Enter the program number to start your programming. The display reads “PROG

MODE/PROG #? 1,” where “1” represents the most recently used program.

Pressing “ENTER” for program to accept your entry.


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Fig.4. After pressing the “PROG” key, the screen looks like this. It is asking for you

to press a number key or label a new program or call up a stored program.

3. Enter the temperature for program 1. The display presents “PGM 1 TEMP 90”,

where “90” indicates the current temperature setting (“TEMP”) for program

number 1 (“PGM 1”). To alter this value press CLEAR, followed by “1”, “1”,

“0,” then ENTER. This sets the temperature of program number 0 to 110° C.

Fig.5 Enter the temperature for program 1.

4. Press one of the “bake method” button on the far right side of the keypad. This

tells the hotplate program hoe to handle the wafer contact with the hotplate.

There are three possible bake methods. “Proximity,” “Contact, and “Vacuum.”

Select “Vac” bake mode in Fig. 6.

Fig.6. Three bake modes: Proximity, Contact, and Vacuum.

Fig.7. “Vacuum” selection.

5. Input the bake time for this condition. The time is 0 minutes (“0M”) and 10

seconds (“10S”). To program minutes in the bake time to 1, press CLEAR,

followed by “1”, then ENTER. To program seconds in the bake time to 45, press

CLEAR, followed by “45”, then ENTER.

Bake

method


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Fig. 8. Enter the bake time for the “VAC” method.

5.2 Hotplate Operation Procedure

1. Pressing the “Opt” key until the hotplate title display. Press the RUN key.

Fig. 9. “Home display for the hotplate.

Fig.10. wait for input the program number from you.

2. To enter a user program, press the appropriate key “1”, then ENTER.

Fig.11. Select program number 1.

3. Pressing START to initiate the program.

Fig.12. Press Start to begin.

4. The system controller instructs the temperature controller as to the temperature

set point of the current program. This could take up to 20 minutes, depending on

how far the temperature has to change. The readout will announce when the

hotplate has arrived at the programmed set-point temperature.

5. Next, Place the wafer against the two posts on the hotplate when the display

reads “LOAD BAKE CHUCK”. Keep the exhaust lid of the hotplate always

down to capture the evolving vapors.

Fig.13. load wafer on the chuck.


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6. The chuck gas pillow will turn on for the settle time allowed in the configuration

routine. During the settle time, place a substrate on the chuck against the

alignment pins. After settling on the chuck, the substrate bakes according to the

selected program. The hotplate timer will then start counting down time.

Fig.14. Place a substrate on the chuck against the alignment pins.

7. Upon completing the bake cycle, the display reads “UNLOAD BAKE CHUCK.”

And the system will beep loudly! The gas pillow turns on. You can remove your

wafer with a tweezers and disable the beeping by pressing “STOP”. After

unloading, the system reverts back to step 5. This continues until completion of

all substrates. Press the “STOP” key to stop processing in the middle of a bake

cycle. The system halts the bake cycle and goes immediately to the unloading

procedure. To stop processing and exit the run mode, press the “RESET” key.

Fig.15. unload bake wafer and place another wafer on the bake chuck.

6. Spinner

6.1 Spinner Programming

1. Press the “RESET” key to bring the controller to its home point readout.

2. Press the “OPT” button once or twice to access the spinner function.


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Fig.16. Home display for the spinner

3. Press the “PROG” key to enter program mode.

Fig.17. Program display with program number inserted.

4. Enter the program number. The display now reads “PROG MODE/PROG# ? 1”.

This indicates that we are now in program mode. The most recently accessed

program number will appear as a default, in this case program number 1. To edit

program number five; press “5” and then “ENTER”.

5. Enter “0” for dispense (not dispense fluid at this step).

Fig.18. Enter 0 to not dispense fluid at this step

6. Enter the spin speed to spread the resist over the wafer. This display indicates

that we are accessing program number one. The parameter being edited is the

velocity for step number zero and the current value is 1000 rpm.

Fig.18. This display indicate that for spin program one, the velocity is 1000rpm.

7. Enter the acceleration ramp rate. The parameter being edited is the acceleration

(ramp rate) for step number zero. The current value is 1000 rpm/second.

Fig.19. Enter the ramp rate in RPM per second.

8. Enter the spin time. The parameter being edited is the spin duration. This

display shows that step zero for program 1 will last for 10 seconds. To change

this value to 30 seconds, press “30” and “ENTER”.


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Fig.20. Enter the spin time.

9. End program. This process continues with successive step numbers until the end

of step number 9 is reached or until the program is ended. To force the process

program to terminate at the end of a given step, leave the velocity value empty

by pressing “CLEAR” for the next step. This will cause the previous step to be

the last one in the program.

Fig.21. End the program by pressing “ENTER”.

10. No changes are saved until the program is ended and the system reverts back to

the model number display. To exit program mode without saving changes

simply press “RESET”. The display will revert to the model number display but

no changes will be saved.

6.2 Spinner Program Running

6.2.1 CHUCK REPLACEMENT

1. Remove the chuck by unscrewing the vented cap head screw in its center.

Fig.22. Removing the screw with vacuum port to replace the spinner chuck.

2. Carefully lift the chuck from the spindle.


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Fig.23. Note the slot in the silver liner in the black chuck and the post

on the side of the motor shaft. They must match and seat when

attached.

3. Replace the chuck with the proper size. Note the notch in the chuck receiver

cylinder that fits over the motor shaft. It fits over the pin in the shaft to prevent

twisting on the shaft. This must fit correctly to prevent damage when the

attachment screw is tightened.

4. Lightly tighten the chuck screw. Make sure before tightening the screw that

the Chuck fits properly and does not wobble on the shaft.

5. Return the removed chuck to its proper place.

6.2.2 Resist Coating Procedure

1. Press the “Opt” key to select the spinner operation.

2. From the model number display (CEE----100CB Spinner), press the RUN key.

The display reads “RUN PROG#?_” where the flashing cursor indicates that the

system is waiting for input from the operator.

Fig.24. Home display for the spinner.

3. To enter a user program, press the appropriate numerical key “1”, then ENTER

for the system to accept your selection.


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Fig.25. Enter 1 to select program number one.

4. Lift the spinner lid and lower the wafer centering arm. Make sure the alignment

posts are vertical.

5. Load a wafer onto the chuck, gently slide the wafer against the alignment posts,

don’t move the alignment posts.

Fig.25. slide the wafer against the alignment posts.

6. After the wafer is centered, tilt the alignment posts away from the wafer and lift

the alignment arm up until it is in the retracted position. If it falls back down, it

will break your wafer and fling wafer fragments into your face.

7. Close the spinner exhaust lid.

8. Press “Start” that the display will show “READY/ PRESS START”. The wafer

will spin to check centering. It should be obvious if the wafer is not centered. If

there is inadequate vacuum, the wafer chuck will not spin.

Fig.26. Spin the wafer and verify centering

9. At the end of the centering test the display will read as follows: If further


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centering is necessary, adjust the wafer and press the “0” key to retest for

centering.

Fig.27. Retest centering by pressing “0”

10. If the wafer is centered, dispense spin solution, close the lid and press “START”

again. The spin process will continue automatically. The display is constantly

updated throughout all of the steps in a spin program. The wafer will rotate at the

selected spin speed for the selected time.

Fig.28. the real time spin speed and the time remaining for the current spin cycle.

11. Clean the rim of resist bottle with Polyester cleanroom wiper, dip with acetone if

needed.


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Fig.29. Clean the rim of resist bottle with Polyester cleanroom wiper.

12. When finished, the wafer comes to stop. Then the system will beeps and display

the instructions to remove the wafer. To stop the beeping, press “STOP”.

Fig.30. remove the wafer.

13. Carefully lift the lid and remove the wafer. The vacuum is released already. The

spinner is ready for the next sample and the display will show, “Ready-Press

Start”.

6.3 Clean up

After finish your coating process, clean up all the resist of the spin bowl with

proper solvent (acetone) in fume hood.

Fig.31. Remove the resist catch-bowl. It just lifts up. Clean it up in the fume hood

with proper solvent (acetone) for the resist and reinstall it back.

7. Check out

1. Check out the equipment via card reader immediately after each use.

2. Fill in the details, problems or comments in the log sheet.


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8. Reference

8.1 Hotplate Programming Flowchart


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8.2 Spin Coater Programming Flowchart

standard operating manualmfz140.ust.hk/eq_manual/cee 100cb operation manual.pdf · su8, no lol2000...

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