standard operating manualmfz140.ust.hk/eq_manual/ag610_operation manual v1.2.pdfallwin21 ag610 is...

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST

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Standard Operating Manual

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Allwin21 AG610 Rapid Thermal Processing System


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Contents

1. Picture and Location

2. Process Capabilities

2.1 Cleanliness Standard

2.2 Process Temperatures, Time and Process Gases Available

2.3 Wafer Size

3. Contact List and How to Become a Qualified User

3.1 Emergency Responses and Communications

3.2 Training to Become a Qualified User

4. Operating Procedures

4.1 System Description

4.2 Important Cautions

4.3 Power Up Procedure

4.4 Wafer Loading

4.5 Start Annealing

4.6 Cooling and Unloading

4.7 Power down Procedure

https://snf.stanford.edu/SNF/equipment/metalization-sputtering/evaporation/innotec-es26c-e-beam-evaporator/#section-9


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1. Picture and Location

Fig. 1: AG610 is located at NFF Phase II Room 2240

2. Process Capabilities

2.1 Cleanliness Standard

Allwin21 AG610 is “Semi-clean” equipment for rapid thermal annealing.

2.2 Process Temperatures, Time and Process Gases Available

Up to 850℃ without susceptor, up to 1000℃ with susceptor

Process gases available: N2, O2, Ar

Maximum allowable steady time (Suppose temperature ramp up/down rates are not

less than 10℃/s)

10 min (<=550℃), 5min (>550℃ and <=600℃), 2min (>600℃ and <=850℃),

1min (>850℃ and <=1000℃)


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2.3 Wafer Size

The maximum wafer size is 6 inch in diameter, 1mm thick.

3. Contact List and How to Become a User

3.1 Emergency Responses and Communications

Safety Officer: Mr. Wing Leong CHUNG 2358-7211 & 64406238

Deputy Safety Officer: Mr. Man Wai LEE 2358-7900 & 9621-7708

NFF Phase 2 Technicians: Mr. Li Ho ,Mr. Chan Tai Shing, Mr. Chen Yi gong

2358 7896

Security Control Center: 2358-8999 (24hr) & 2358-6565 (24hr)

3.2 Training to Become a Qualified User

Please follow the procedure below to become a qualified user of the AG610.

1. Read all materials on the NFF website concerning the AG610.

2. To register AG610 operation training, logon to NFF Equipment Reservation

System. Go to User Info page. Select Equipment Operation Training. Please

follow the instructions on the web page.


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4. Operating Procedures

4.1 System Description

The AG610 is rapid thermal processing (RTP) system, which uses high intensity

visible radiation to heat single wafer for short process period of time at precisely

controlled temperatures. The system consists of an oven unit and a controller

computer running the Allwin21 controller software. The wafer to be processed is

placed on a quartz tray that slides into a quartz isolation tube in the oven unit. Two

banks of lamps, one above the quartz tube and one below it, provide the source of

energy for heating the wafer.

System Component Locations

Fig. 2: System component locations


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Hazards

The AG610 system presents certain hazards. These fail into the following categories:

- Electrical shock hazards

- Process gas hazards

- Process byproduct hazards

- Oxygen hazards

- Thermal hazards

Emergency Stop Procedure

If an emergency condition is suspected, depress fully the Red Emergency Off (EMO)

Button located on the system as shown in Fig. 2.

4.2 Important Cautions

(1) If an equipment failure while being used, never try to fix the problem by yourself.

Please contact NFF staff.

(2) This is semi-clean equipment. Clean your wafers in Wetstation D before the

process. For small samples, please put them in a clean container for transfer after

cleaning.

(3) Also make sure your wafer container and handling tweezers are clean.

(4) Use tweezers to handle your samples.

(5) Semi-clean does not mean you can put any of semi-clean materials into the

machine. Some of semi-clean materials cannot sustain high temperature and as a

result it would seriously contaminate the chamber. Follow your process flow.

Materials which are not mentioned in the process flow are NOT allowed to put

into the AG610.


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(6) The machine consists of quartz wares which are fragile. Be careful to avoid

breaking them.

(7) Please contact NFF staff for editing a new recipe.

(8) Remember to fill in the Log Sheet.

4.3 Power up Procedure

(1) To turn on the cooling water supply and return, use the suction cup lifter to

securely attach to the cleanroom raised floor panel located near the back side of

the machine. Lift the floor panel. Find there are two water ball valves labeled

“AG610”. Open BOTH of them by turning the handles a quarter of one turn

anticlockwise (See Fig. 3 for the correct opening positions of the handles).

Fig 3: Cooling water supply and return

(2) To select a process gas (N2 or O2 or Ar), again use the suction cup lifter to lift

another raised floor panel next to the panel for the cooling water. Find there are

three gas ball valves labeled as “O2 (AG610)”, “N2 (AG610)” and “Ar (AG610)”

respectively. Turn on a desired gas for the annealing process (Don’t turn on more

than one gas!). For example: see Fig. 4 for N2 as the process gas.


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Fig. 4: Process gas supply panel for AG610 (In this picture, N2 ball valve’s handle

is in open position)

(3) Also turn on the compressed air (CA) supply. The CA supply ball valve is labeled

as “CA (AG610)”. Note that there is noise of CA flowing after turning on the CA.

(4) Switch on the control computer power and its monitor power.

(5) Turn on the wall circuit breaker (labeled “AG 610” as shown in Fig. 5)

Fig. 5: Wall circuit breaker for AG610


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(6) Switch on the circuit breaker CB1 on the rear panel of the machine by pushing the

circuit breaker handle up.

(7) Switch on the Lamp Power on the machine front panel.

(8) Check the temperature displayed on the machine front panel. It should be at room

temperature.

(9) At the rear panel of the machine, visually inspect that the process gas exhaust

connection is in position. Check that there is no restriction to the cabinet exhaust

and there is proper air flow from the exhaust fan. Check also for possible water

leaks at the cooling water inlet and outlet connections.

4.4 Wafer Loading

Warning: The wafer will be VERY HOT after unloading from the heated chamber.

Warning: The quartz tray, thermocouple, susceptor etc. must be allowed to cool

down before they are serviced.

Warning: Change a new pair of Latex gloves if touching of parts (quartz tray,

thermocouple, susceptor etc.) of the chamber is necessary.

(1) Gently push down the handle of the chamber door to unlock the chamber door.

Then gently pull out the chamber door. Beware that a delicate quartz tray is

attached to the chamber door.

(2) Check the quartz tray is clean and level.

(3) Visually check the thermocouple wires to make sure there is no shorting of the

leads. Check also the position of the thermocouple bead (junction end) is slightly

higher than that of the supporting pins of the quartz tray. So that when a wafer (or

susceptor) is placed onto the tray, the bead would be slightly pushed down by the


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wafer (or susceptor) and can be in good contact with the wafer (or susceptor)

backside. Noted that only the bead end should touch the wafer. The wires cannot

touch the wafer.

If need, position again the thermocouple so that the bead can comes in contact

near the middle of the wafer (or susceptor) and the thermocouple wires would not

collide with the quartz chamber during closing the door.

Warning: To keep the susceptor clean, don’t put it on other surface. Put the

unused susceptor into the glass container provided only.

(4) For annealing temperature above 850℃ (note that the maximum annealing

temperature allowed is 1000℃), a susceptor must be used.

(a) If the susceptor is not required, place the wafer directly on the middle of the

tray. If samples are small pieces, put a bare wafer onto the tray first and then

put small pieces onto the bare wafer.

(b) If the susceptor is required, wear a new, clean pair of Latex gloves before

handing the susceptor by hands. The susceptor consists of a base and a cover.

Place the base onto the tray first, then put the wafer onto the base, and finally

put the cover on the top of the base.

(5) Slowly push the chamber door back into the chamber (Look at the quartz tray,

wafer (or susceptor) and thermocouple during door closing to make sure they do

not collide with the chamber or other parts of the machine. If so, stop and contact

NFF staff. Gently push up the handle to lock the chamber door.


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4.5 Start Annealing

(1) In the software main screen, select “Process for engineer”.

(2) Note that users are NOT allowed to create a new recipe. Follow your approved

process flow. Contact NFF staff if a new recipe is needed.

Warning: If an unwanted recipe is accidentally clicked to start, you can abort the

process by clicking on “Exit” on the process running screen.

(3) Highlight the required recipe from the list in the column ”Recipe File”. Click on

“RECIPE EDIT” to enter the recipe edit screen. Check the steady time. Don’t

change any contents of the recipe other than the steady time. And don’t set the

steady time exceeding the maximum allowable steady time as stated in the section

“2.2”. Steady time of recipes with more than one ramp up/ramp down cycle is not

allowed to be changed.

(4) If change of steady time is not needed, go to step (6).

(5) Click on the field of steady time at the second column, a window of number pad is

displayed (If accidentally click on the unwanted field, click on “Esc” in the

displayed window). Input the time required and click on “Enter”. Check again the

input time is correct. Then click on “RECIPE VALIDATE”. Click on “OK” in the

pop up dialog. Click on “Save”.

(6) Click on “Exit” back to the “Process for engineer” screen.

(7) Check the temperature of the machine casing is below 28℃. If not, wait unit it

drops to 28℃ or below.

(8) Check the required recipe is still highlighted in the column ”Recipe File”. To start

the annealing process, click on “START PROCESS”.


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(9) Till the process is finished, a large text “Process Over” will be displayed. Click on

“Exit” back to the “Process for engineer” screen. If another annealing process is

needed on the same wafer, go to Step (2) of ‘Start Annealing’.

4.6 Cooling and Unloading

(1) Wait until the wafer is cooled to 300℃ or below.

(2) Gently unlock the chamber door and pull it out.

Warning: The wafer or/and the susceptor will be VERY HOT after unloading from

the heated chamber.

(3) Remove the wafer.

(4) Go to Step (2) of ‘Wafer Loading’ for another run.

(5) If the susceptor was used, remove it from the quartz tray and put it back into the

glass container provided.

(6) Slowly push the chamber door back into the chamber and lock it.

4.7 Power down Procedure

(1) Check the temperature of the machine casing is below 28℃. If not, wait unit it

drops to 28℃ or below.

(2) Click on “Exit” back to the main screen. Select “EXIT REAL AW-610T

SYSTEM”.

(3) Switch off the Lamp Power.

(4) Switch off the CB1.

(5) Switch off the wall circuit breaker (labeled “AG 610”).

(6) Switch off the control computer power and its monitor power.


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(7) Turn off the CA supply.

(8) Turn off the process gas supply.

(9) Turn off the cooling water supply and return.

Reference: Operation Manual by Allwin21 Corporation

standard operating manualmfz140.ust.hk/eq_manual/ag610_operation manual v1.2.pdfallwin21 ag610 is...

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