som i.mx 8m - solidrun highlighted features • ultra-small footprint som (47x30mm) including three...

29
SOM i.MX 8M User Manual NXP i.MX 8M™ based SOM | Rev. 1.0 EMBEDDED EDGE COMPUTING SolidRun Ltd. 7 Hamada st. | Yokne'am Illit 2069201 | Israel www.solid-run.com

Upload: others

Post on 21-May-2020

5 views

Category:

Documents


0 download

TRANSCRIPT

Page 1: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

SOM i.MX 8M User Manual NXP i.MX 8M™ based SOM | Rev. 1.0

EMBEDDED EDGE COMPUTING

SolidRun Ltd. 7 Hamada st. | Yokne'am Illit 2069201 | Israel www.solid-run.com

Page 2: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

2

Revisions and Notes

Date Owner Revision Notes

Feb. 25th 2018 Noam Wiedenfeld 1.0 Initial release

Disclaimer

No warranty of accuracy is given concerning the contents of the information contained in this

publication. To the extent permitted by law no liability (including liability to any person by reason of

negligence) will be accepted by SolidRun Ltd., its subsidiaries or employees for any direct or indirect

loss or damage caused by omissions from or inaccuracies in this document. SolidRun Ltd. reserves the

right to change details in this publication without prior notice. Product and company names herein

may be the trademarks of their respective owners.

© 2018 SolidRun Ltd. All Rights Reserved.

Please verify that you have the most current version of this document from: www.solid- run.com

Page 3: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

3

Table of Content Introduction ........................................................................................................................................................ 4

Overview ............................................................................................................................................................. 4

Highlighted Features .......................................................................................................................................... 4

Supporting Products ........................................................................................................................................... 5

Description ......................................................................................................................................................... 5

Block Diagram ................................................................................................................................................. 5

Feature Summary ........................................................................................................................................... 6

Core System Components .................................................................................................................................. 7

i.MX8 SoC Family ............................................................................................................................................ 7

Memory .......................................................................................................................................................... 8

10/100/1000 MBPS ETHERNET PHY ............................................................................................................. 10

WI-FI (11AC/B/G/N 2TX2R) TYPE 1216 AND BT 5.0 ...................................................................................... 10

MIPI CSI-2 CAMERA INTERFACE ................................................................................................................... 11

i.MX8 SOM External Interfaces ......................................................................................................................... 12

General ......................................................................................................................................................... 12

Supported Interfaces .................................................................................................................................... 12

Power and Reset ............................................................................................................................................... 23

Reset ............................................................................................................................................................. 23

i. MX8 SOM Integration Manual ........................................................................................................................ 24

Power up sequence ...................................................................................................................................... 24

Booting Options ............................................................................................................................................ 24

I2C Interfaces ................................................................................................................................................ 26

GPIO Interfaces ............................................................................................................................................. 26

i. MX8 SOM Debugging Capability ................................................................................................................. 26

i.MX8 Typical Power Consumption................................................................................................................... 27

i. MX8 SOM Mechanical Description ................................................................................................................. 28

Ordering Information ....................................................................................................................................... 29

Page 4: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

5

Introduction

This User Manual relates to the SolidRun SOM i.MX8M series, which includes:

• Dual core ARM A53 (1.5 GHz) of the i.MX8M SoC.

• Quad lite core ARM A53 (1.5GHz) of the i.MX8M SoC.

• Quad core ARM A53 (1.5GHz) of the i.MX8M SoC.

Overview

The SolidRun’s SOM i.MX8M is a high-performance system on module (SOM) based on the

highly integrated NXP i.MX8M family of products.

Highlighted Features

• Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number).

• NXP i.MX8M SoC (supports dual, quad lite and quad versions)

o Up to quad Cortex A53 and up to 1.5GHz

o Cortex-M4 subsystem processor supports real time tasks.

o Industry-leading audio, voice and video processing for applications

o OpenGL ES 3.1, OpenCL 1.2, OpenGL 3.0, OpenVG and Vulkan standards

• LPDDR4 memory in x32 configurations supports up to 4GB (Quad version)

• Power management devices

• Gigabit Ethernet interface based on Qualcomm Atheros 8031

• Wi-Fi (11ac/b/g/n 2Tx2R) + BT (V4.1 LE) M.2 Type 1216 based on Qualcomm Atheros QCA6174A-5.

• BT V5.0 based on Nordic’s nRF52832.

• PCIe clock generator supporting Gen2.

• 4-Lanes CSI connector for direct connection to a camera.

Page 5: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

6

NOR

eMMC

Supporting Products

The following products are provided from SolidRun both as production level platforms and as

reference examples on how to incorporate the SOM in different levels of integration:

• HummingBoard Pulse– A board computer that incorporates the SOM retains the same

Android and different Linux distributions while adding extra hardware functionalities and

access to the hardware.

• CuBox-Pulse – A minicomputer that is only 2"x2"x2" in size that runs Android and Linux with

different distribution variants, use cases.

Description

Block Diagram

The following figure describes the i.MX8 Blocks Diagram.

10/100/1000 AR8031

GE PHY

RGMII 32 Bits Up to 4GB

USB1 (USB3/ USB2)

USB2 (USB3/ USB2) QSPIA, SS0

4K HDMI Level

adapter SDIO1, 8 Bits

PCIe 2

UART 1 (RX/TX) IMX-8M

I2C1

C

O

N

N

E

C

T

O

R

S

UART 2/3 (RX/TX/CTS/RTS)

ESPI2 SS0

I2C2/ I2C3

SDIO2 (4 BITS/ VSelect)

CSI 1 (2, 4 Lanes)

SAI2/3(TX/RX/TXC/MCLK/TXFS)

SAI1 (Full Bus)

GPIO

Boot Mode, Boot SEL

Reset, Conttrol

QUAD

QUAD Lite

DUAL

PCIe 1 WI-FI AC

EEPROM

UART 4 BT 5.0

CSI 2 (2, 4 Lanes) F

P

C

Cortex M4

3.3V

5V Power

3.3V PMIC

CLK2_O PCIe_CLK2

PCIe_CLK1

PCIe CLK

PCIe_CLK2 Buffer

WI-FI

Page 6: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

7

Feature Summary

Following is the features summary of the SOM. Notice that some of the features are pinout

multiplexed (please refer to the pin mux table below and the NXP i.MX8M data sheets):

• NXP i.MX8M series SoC (Dual/Quad Lite/Quad ARM® Cortex™ A53 Processor, up to 1.5 GHz)

• Cortex-M4 subsystem processor.

• Up to 4GByte LPDDR4 memory

• Eight bits eMMC memory.

• QSPI NOR Flash memory.

• I2C EEPROM.

• HDMI 2.0a, HDMI 1.4 interface

• 4-lanes MIPI-DSI interface

• Two 4 lanes MIPI CSI-2 ()

• 10/100/1000 Mbps Ethernet PHY supporting 1588 standard (PPS output)

• Wi-Fi (11ac/b/g/n 2Tx2R) + BT (V4.1 LE) M.2 Type 1216 based on Qualcomm Atheros QCA6174A-5.

• BT V5.0 based on Nordic’s nRF52832

• Two USB 3.0 Host and OTG

• Two PCIe interfaces (PCIe-1 is available only if Wi-Fi is not in use).

• PCIe clock generator.

• Four bits SD interface

• Single eSPI interface.

• Up to three Synchronous Audio Interfaces.

• Up to three Serial interfaces.

• Required power sources:

o A single 5.0V interface

o 1.8/3.3V to support uSD card optional IO power.

Page 7: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

8

Core System Components

i.MX8 SoC Family

The i.MX8M Dual / 8M QuadLite / 8M Quad processors feature advanced implementation of a quad

Arm® Cortex®-A53 core, which operates at speeds of up to 1.5 GHz. A general- purpose Cortex®-M4

core processor is for low-power processing.

The following figure describes the i.MX8 SoC’s main features (For more details refer to NXP’s

i.MX8 datasheet).

i. MX8 supports three variants; the following table describes the main differences:

Page 8: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

9

LPDDR4

eMMC

Memory

The IMX-8 SOM support varieties of memory interfaces for booting and data storage. The following

figure describes the IMX-8 SOM memory interfaces.

Carrier SOM

LPDDR4

• Up to 4GB memory space (QUAD-Light and Dual up to 3GB).

• 32 Bits data bus.

• Up to 3200 MT/s.

• Supports D1, D2 and D4 die chips (Two CS).

• Support various low power modes, clock and power gated operation.

• Support Self-Refresh mode.

eMMC NAND Flash

• Up to 64GB memory space.

• 8 Bits data bus.

• Support MMC standard, up to version 5.0.

• Up to 1600 Mbps of data transfer for MMC cards using 8 parallel data lines in SDR

mode.

• Up to 3200 Mbps of data transfer for MMC cards using 8 parallel data lines in DDR

mode.

• IMX-8 uSDHC-1.

• Can be used as BOOT NVM *

USB2/3 32 Bits

NOR ESPI2, SS0

IMX-8 QSPAI, SS0

uSD SDIO2, 4 Bits QUAD

QUAD-Light

DUAL

SDIO1, 8 Bits

I2C1 EEPROM

EEPROM I2C2/3

NOR

Page 9: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

10

Quad Serial NOR Flash (SOM)

• Each channel can be configured as 1/2/4-bit operation.

• Support both SDR mode and DDR mode

• No reset

• IMX-8 QSPIA/nSS0.

• Can be used as BOOT NVM *

EEPROM (SOM)

• 1Kb EEPROM

• ON-Semi’s CAT24AA01TDI or compatible

• IMX-6 I2C1

• Address 0X50 (7 bits format)

• Stores SOM’s configurations.

Micro-SD (Carrier)

• Optional on Carrier board

• IMX-8 uSDHC-1.

• Implements 4 data bits.

• Support SD/SDIO standard, up to version 3.0.

• Up to 400 Mbps of data transfer in SDR mode and up to 800 Mbps of data transfer in DDR mode using 4 parallel data lines.

• Can be used as BOOT NVM *

Serial NOR Flash (Carrier)

• Optional on Carrier board

• 1 bits data bus.

• IMX-8 eSPI2/nSS0

• Can be used as BOOT NVM *

*Please Note – All boot configuration signals are available on the SOM

connector.

Page 10: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

11

2

D

C

o

n

n

e

c

t

o

r

10/100/1000 MBPS ETHERNET PHY

The Ethernet PHY is based on the Qualcomm / Atheros AR8031. The following figure describes

the Giga Ethernet interface.

P PS

M

• IMX-8 RGMII interface.

• IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASE-TX, and 10BASE-Te.

• Atheros AR8031 PHY.

• Supports 1588 (PPS signal).

• 25M clock supports Synchronous Ethernet.

WI-FI (11AC/B/G/N 2TX2R) TYPE 1216 AND BT 5.0

The following figure describes the WI-FI and BT support in the IMX-8 SOM.

USB

SW

IMX-8

TX

RGMII REF_CLK

RX GE

AR8031

MDC/MDIO 25

25M

PHY &

MAG

C

o

n

n

e

c

t

o

r

PCIe

CLK Buff.

IMX-8 CLKO2

PCIe-1

UART-4 TX/RX

M.2 1216

11ac/b/g/n

+

BT 4.1 LE

BT 5.0

Page 11: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

12

WI-FI

The WI-FI module is an M.2 1216 standard LGA module. The i.MX8 WI-FI module is Silex’s

WCBN3507A which based on Qualcomm Atheros QCA6174A-5 chip. The WI-FI main features are:

• Operate at ISM frequency Band (2.4/ 5 GHz)

• IEEE Standards Support 802.11ac, 802.11a, 802.11b, 802.11g and 802.11n

• IMX-8 PCIe-1 interface

• Enterprise level security supporting: WPA, WPA2

• Support 2 transmission and 2 receiving, transmission rate can up to 867Mbps(Physical Rate) in downstream and upstream

• USB2 connection is optional from carrier board to support BT over the M.2 module (*).

• Global certification.

BT 5.0

The i.MX8 SOM uses U-BLOX’s NINA-B111 module. The module is based on Nordic’s

nRF52832 BT SoC. The module main features are:

• Bluetooth 5.

• Advanced Serial Port Service.

• GATT server and client.

• Open CPU with Arm® Mbed™ and Nordic SDK.

• External antenna.

• Global certification.

Please Note: (*) the Silex M.2 module doesn’t support BT over UART.

MIPI CSI-2 CAMERA INTERFACE

The i.MX8 SOM supports a 4-Lanes MIPI CSI-2 interface. A 22 pins

FPC connector on the SOM board enables a direct connection to a

Camera supporting the CSI interface.

The connector pin-out is according to Allied Vision, a cameras

manufacturer. The figure to the right describes the interface

signals.

Page 12: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

12

WI-FI

Resistor

Assembly

Option REF_CLK

REF_CLK

PCIe

CLK Buff.

C

o

n

n

e

c

t

o

r

• IMX-8 MIPI CSI channel 2.

• Implements all three CSI-2 MIPI layers.

• Scalable data lane support, 1 to 4 Data Lanes.

• Supports high speed mode (80Mbps - 1.5Gbps) per lane, providing 4K@30fpscapability for the 4 lanes.

• Virtual Channel support.

i. MX8 SOM External Interfaces

General

The SOM incorporates three Hirose DF40 board-to-board headers. The

selection of the Hirose DF40 is due to the following criteria:

• Miniature (0.4m pitch)

• Highly reliable manufacturer

• Availability (worldwide distribution channels)

• Excellent signal integrity (supports 6Gbps)

o Please contact Hirose or SolidRun for reliability and test result data.

• Mating height of between 1.5mm to 4.0mm (1.5mm to 3.0mm if using 70-pin Board- to-Board header). SR-SOM-MX6 headers are fixed, the final mating height is determined by carrier implementation.

Supported Interfaces

PCIe

The i.MX8 SOM supports two PCIe interfaces. The following figure describes the PCIe

interfaces.

IMX-8 PCIe-1

TX_M/P

RX_M/P

PCIe-1 REF_CLK X

PCIe-2

TX_M/P

RX_M/P

PCIe-2 REF_CLK

CLK2

Page 13: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

13

The PCIe main features are:

• On board clock buffer sources all PCIe interfaces, on SOM and on Carrier.

• The IMX-8 CLK2_P/N clock output feeds the PCIe clock buffer.

• PCIe-1 can be used by the WI-FI module on the SOM or other module on the carrier. It is an assembly option.

• 1.5 / 2.5 / 3.0 / 5.0 / 6.0 Gbps Serializer / Deserializer.

• Compliant with PCI Express Base Specification 2.1.

• Supports Spread Spectrum Clocking in Transmitter and Receiver.

• x1 Gen2 lane.

• The PCIe TX signals are DC coupled by capacitors.

• The clock are HSTL compatible, no decoupling capacitors.

USB 3.0

The i.MX8 supports two USB 3.0 interfaces. The following figure describes the USB

interfaces.

C

o

n

n

e

c

RX_P/N t

DP/DN o

r

The USB main features are:

• USB 1 and USB 2 are directly connected to the connectors (No HUB).

• The TX signals are DC coupled by capacitors.

• Complies with USB specification rev 3.0 (xHCI compatible).

• USB dual-role operation and can be configured as host or device.

• Super-speed (5 Gbit/s), high-speed (480 Mbit/s), full-speed (12 Mbit/s), and low speed (1.5 Mbit/s) operations.

• Supports four programmable, bidirectional USB endpoints.

• OTG (on-the-go) 2.0 compliant, which includes both device and host capability. Super-speed operation is not supported when OTG is enabled.

• The USB 3.0 module operates in following modes:

IMX-8

USB1 TX_P/N

RX_P/N

DP/DN

USB1 VBUS

USB1 ID

USB2

TX_P/N

USB2 VBUS

Page 14: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

14

o Host Mode: SS/HS/FS/LS

o Device Mode: SS/HS/FS

o OTG: HS/FS/LS.

• Power control signal are not part of the USB module, any available GPIO can be used.

MIPI CSI

The following figure describes the CSI interface.

CSI_LANE

CSI_LANE

CSI_LANE

CSI_LANE

CSI_CL

• i.MX8 MIPI CSI channel 1.

• Implements all three CSI-2 MIPI layers.

• Scalable data lane support, 1 to 4 Data Lanes.

• Supports high speed mode (80Mbps - 1.5Gbps) per lane, providing 4K@30fpscapability for the 4 lanes.

• Virtual Channel support.

MIPI DSI

The following figure described the DSI interface.

IMX-8

DSI_LANE0

C

o DSI_LANE1 n DSI_LANE2 n

DSI DSI_LANE3

DSI_CLK

e

c

t

o

r

The DSI main features are:

• Implements all three DSI Layers.

• Support for Command and Video Modes.

IMX-8

CSI 1

C

o

n

n

e

c

t

o

r

Page 15: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

15

C

o

n

n

e

c

t

o

r

• Host Version.

• Scalable data lane support, 1 to 4 Data Lanes. (Optional bidirectional support on lane 0).

• Support for all DSI data types and formats.

• Virtual Channel support.

• MIPI Alliance Specification for Display Serial Interface Version 1.1 compliant.

Audio

The i.MX8 SOM supports up to three Audio channels, SAI1, SAI2 and SAI3. The following figure

describes the audio interface.

RXD, TXD, T/RXC, T/RXFS, MCL

RXD, TXD, T/RXC, T/RXFS, MCLK

SPDIF OUT

The Audio main features are:

• SAI1 supports 8TX and 8 RX channels.

• SAI2 and SAI3 supports RX and TX,

• SPDIF Out.

• Transmitter with independent bit clock and frame sync supporting 1 data line.

• Receiver with independent bit clock and frame sync supporting 1 data line.

• Each data line can support a maximum Frame size of 32 words.

For more details check the i.MX8 datasheet and AN.

Please Note: SAI1 signals are used as boot configuration during POR.

IMX-8 SAI1

SAI2

SAI3

SPDIF

Page 16: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

16

HDMI

The i.MX8 supports the HDMI interface including the signal termination. The following figure

describes the HDMI interface.

The HDMI main features are:

• On board pull-up termination to support HDMI levels.

• HDMI HPD support 5V level,

• HDMI DDC doesn’t support PU, need to support on carrier board.

• Up to 4Kp60 video/graphics display over HDMI 2.0a with HDCP 2.2 encryption and audio formats including Dolby Digital, DTS, TrueHD, LPCM.

For more details check the i.MX8 datasheet.

Please Note: to support DPI, the pull-Up termination resistors are not

assembled.

Page 17: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

17

UART

The i.MX8 SOM can support up to 4 UART interfaces. The following figure describes the UART

interfaces.

RX, TX (TerminaL

RX, TX,CTS, RT

RX, T

RX, TX Resistor4 - RX, T

Assembly

Option 2 – CTS, RTS

BT 5

MODULE

The UART interfaces main features are:

• UART 1 supports TX and RX. Can be used as debug terminal.

• UART 2 supports TX, RX, CTS and RTS. When using the RTS and CTS signals UART 4 is not available.

• UART 3 Supports TX, RX, CTS and RTS.

• UART 4 support TX and RX. It has an assembly options:

o On SOM BT module.

o Free UART on carrier board.

• High-speed TIA/EIA-232-F compatible, up to Mbit/s.

• 9-bit or Multidrop mode (RS-485) support (automatic slave address detection).

• 7 or 8 data bits for RS-232 characters, or 9 bit RS-485 format.

• Hardware flow control support for request to send (RTS_B) and clear to send (CTS_B) signals.

• RS-485 driver direction control via CTS_B signal.

• Auto baud rate detection (up to 115.2 Kbit/s).

• DCE/DTE capability.

For more information check the i.MX8 datasheet.

IMX-8 UART 1

UART 3

UART 2

UART 4

C

o

n

n

e

c t

o

r

Page 18: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

18

eSPI

The i.MX8 SOM supports an eSPI interface. The following figure describes the eSPI

interface.

nSS0, MOSI, MISO, CLK

• i.MX8’s eSPI channel 2.

• Single chip select nSS0.

• Master/Slave configurable.

• Polarity and phase of the Chip Select (SS) and SPI Clock (SCLK) are configurable.

Please Note: eSPI channel 1 is not available as default configuration. The

signals supporting channel 1 are available as GPIO.

I2C

i. MX8 supports up to four I2c Interfaces. The following figure describes the I2C interfaces.

EEPROM

PMIC 1K

Camera

FPC

IMX-8 0x50

I2C1

I2C2

I2C3

The I2C main features are:

• I2C-1 is used only on the SOM. It is connected to the SOM EEPROM, PMIC and camera FPC connector.

• I2C-2 and I2C-3 are available on the connector by default.

• I2C-4 is not available as default configuration; it signals are available as GPIO.

• Multimaster operation.

• Software programmability for one of 64 different serial clock frequencies.

IMX-8

eSPI 2

C

o

n

n

e

c

t

o

r

Page 19: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

19

• In Standard mode, I2C supports the data transfer rates up to 100 kbits/s.

• In Fast mode, data transfer rates up to 400 kbits/s can be achieved.

For more details check the i.MX8 datasheet.

uSD

The uSD supports the following features:

• i.MX8 uSDHC-1.

• Implements 4 data bits.

• Support SD/SDIO standard, up to version 3.0.

• Up to 400 Mbps of data transfer in SDR mode and up to 800 Mbps of data transfer in DDR mode using 4 parallel data lines.

• 1.8V or 3.3V support using SD2_VSELECT signal.

Page 20: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

20

Connector’s Signal Description

J5001

PIN PWR Main GPIO PIN PWR Main GPIO

1 3V3 PMIC_ON 2

3 3V3 BOOT_MODE0 4 DSI_DN3

5 3V3 BOOT_MODE1 6 DSI_DP3

7 GND GND

8 GND GND

9

DSI_CKP

10 GND GND

11 DSI_CKN 12 DSI_DN0

13 GND GND 14 DSI_DP0

15 DSI_DN2 16 GND GND

17 DSI_DP2 18 PCIE1_REF_CLKP_CN

19 GND GND

20

PCIE1_REF_CLKN_CN

21

DSI_DN1

22 GND GND

23 DSI_DP1 24 3V3 PCIE_nPME gpio3.IO[5]

25 GND GND 26 3V3 PCIe_nWAKE gpio3.IO[12]

27 3V3 PWM1_OUT 28 3V3 USB1_SS_SEL gpio3.IO[15]

29 3V3 UART3_TXD gpio5.IO[27] 30 GND GND

31 3V3 UART3_RXD gpio5.IO[26] 32

PCIE1_TXP_C

33 GND GND

34

PCIE1_TXN_C

35 36 GND GND

37 3V3 UART3_CTS gpio5.IO[9] 38 PCIE1_RXP_C

39 3V3 UART3_RTS gpio5.IO[10] 40 PCIE1_RXN_C

41 3V3 SAI1_TXD2 (BT_CFG10) gpio4.IO[14] 42 GND GND

43 3V3 DSI_TS_nINT gpio5.IO[7] 44 3V3 UART2_RXD gpio5.IO[24]

45

46 3V3 UART2_TXD gpio5.IO[25]

47 GND GND 48 3V3 UART2_CTS uart4.RX/gpio5.IO[28]

49 50 3V3 UART2_RTS uart4.TX/gpio5.IO[29]

51 SAI1_TXD4 (BT_CFG12) gpio4.IO[16] 52 GND GND

53 WIFI_DP 54 CSI_P1_DN0

55

WIFI_DN

56

CSI_P1_DP0

57 GND GND

58 GND GND

59 CSI_P1_CKP 60 CSI_P1_DP2

61 CSI_P1_CKN 62 CSI_P1_DN2

63 GND GND 64 GND GND

65 CSI_P1_DP3 66 CSI_P1_DP1

67

CSI_P1_DN3

68

CSI_P1_DN1

69 GND GND 70 GND GND

Page 21: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

J7

21

PIN PWR Main GPIO PIN PWR Main GPIO

1

PCIE2_REF_CLKP_CN

2

PCIE2_RXN

3

PCIE2_REF_CLKN_CN

4

PCIE2_RXP

5 GND GND

6 GND GND

7

PCIE2_TXN

8 3V3 SAI3_MCLK gpio5.IO[2]

9

PCIE2_TXP

10 3V3 SAI3_RXC gpio4.IO[29]

11 GND GND

12 3V3 SAI1_TXC gpio4.IO[11]

13 3V3 SAI3_TXFS gpio4.IO[31] 14 3V3 SAI3_TXC gpio5.IO[0]

15 3V3 SAI3_RXFS gpio4.IO[28] 16 3V3 SPDIF_TX gpio5.IO[3]

17 GND GND

18 3V3 IR_CAP gpio1.IO[12]

19

HDMI_TXP2

20 3V3 SAI1_TXD7 (BT_CFG15) gpio4.IO[19]

21

HDMI_TXN2

22 3V3 SAI1_TXD0 (BT_CFG8) gpio4.IO[12]

23 GND GND

24 3V3 SAI1_TXD1 (BT_CFG9) gpio4.IO[13]

25

HDMI_TXP1

26 3V3 SAI3_RXD gpio4.IO[30]

27

HDMI_TXN1

28 3V3 SAI1_TXD3 (BT_CFG11) gpio4.IO[15]

29 GND GND

30 3V3 SAI1_TXFS gpio4.IO[10]

31

HDMI_TXP0

32 3V3 nWDOG gpio1.IO[2]

33

HDMI_TXN0

34

35 GND GND

36 3V3 SAI1_MCLK gpio4.IO[20]

37

HDMI_CLKP

38 3V3 CLKO2 gpio1.IO[15]

39

HDMI_CLKN

40

41 GND GND

42 GND GND

43 3V3 HDMI_CEC

44

Tanya gpio5.IO[21]

45 5V HDMI_DDC_SCL

46

SAI1_RXD7 (BT_CFG7) gpio4.IO[9]

47 5V HDMI_DDC_SDA

48 GND GND

49 5V HDMI_HPD

50 3V3 SAI1_RXD5 (BT_CFG5) gpio4.IO[7]

51 3V3 SAI2_TXC gpio4.IO[25] 52 3V3 UART1_TXD gpio5.IO[23]

53 3V3 SAI2_TXD gpio4.IO[26] 54 3V3 UART1_RXD gpio5.IO[22]

55 3V3 SAI2_TXFS gpio4.IO[24] 56 3V3 USB1_ID

57 3V3 SAI2_RXD gpio4.IO[23] 58 GND GND

59 3V3 SAI2_MCLK gpio4.IO[27] 60

USB2_RXP

61 GND GND

62

USB2_RXN

63 3V3 SAI1_RXD6 (BT_CFG6) gpio4.IO[8] 64 GND GND

65 3V3 SYS_nRST

66

USB2_TXN

67 3V3 SAI1_RXD4 (BT_CFG4) gpio4.IO[6] 68

USB2_TXP

69 3V3 SAI1_RXC gpio4.IO[1] 70 GND GND

71 3V3 SAI1_RXFS gpio4.IO[0] 72 3V3 SAI1_RXD2 (BT_CFG2) gpio4.IO[4]

73 3V3 SD2_VSELECT gpio1.IO[4] 74 3V3 SAI1_RXD3 (BT_CFG3) gpio4.IO[5]

75 GND GND

76 GND GND

77

HDMI_AUXP

78 3V3 SAI1_RXD0 (BT_CFG0) gpio4.IO[2]

79

HDMI_AUXN

80 3V3 SAI1_RXD1 (BT_CFG1) gpio4.IO[3]

Page 22: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

J9

22

PIN PWR Main GPIO PIN PWR Main GPIO

1

MDI_TRXN3

2 GND GND

3

MDI_TRXP3

4

USB1_TXP

5 GND GND

6

USB1_TXN

7

MDI_TRXN2

8 GND GND

9

MDI_TRXP2

10

USB1_RXP

11 GND GND

12

USB1_RXN

13

MDI_TRXN1

14 GND GND

15

MDI_TRXP1

16

USB1_DP

17 GND GND

18

USB1_DN

19

MDI_TRXN0

20 GND GND

21

MDI_TRXP0

22

USB2_DP

23 GND GND

24

USB2_DN

25 3V3 LED_10_100_LED_1000

26 GND GND

27 3V3 LED_ACT

28 3V3 USB_H1_PWR_EN gpio3.IO[4]

29 3V3 PPS

30 3V3 USB_OTG_PWR_EN gpio3.IO[2]

31 3V3 I2C3_SCL gpio5.IO[18] 32 3V3 ECSPI2_SS0 gpio5.IO[13]

33 3V3 I2C3_SDA gpio5.IO[19] 34 3V3 DSI_EN gpio5.IO[6]

35 GND GND

36 GND GND

37 3V3 CSI_nRST gpio1.IO[6] 38 3V3 SD2_CLK gpio2.IO[13]

39 3V3 AUD_nMUTE gpio1.IO[8] 40 3V3 SD2_CMD gpio2.IO[14]

41 3V3 CLKO_25MHz gpio3.IO[11] 42 3V3 SD2_DATA0 gpio2.IO[15]

43 5V USB1_VBUS

44 3V3 SD2_DATA1 gpio2.IO[16]

45 3V3 ECSPI2_MISO gpio5.IO[12] 46 3V3 SD2_DATA2 gpio2.IO[17]

47 3V3 ECSPI2_MOSI gpio5.IO[11] 48 3V3 SD2_DATA3 gpio2.IO[18]

49 3V3 ECSPI2_SCLK gpio5.IO[10] 50 3V3 SD2_nCD gpio2.IO[12]

51 3V3 I2C2_SDA gpio5.IO[17] 52 5V USB2_VBUS

53 3V3 I2C2_SCL gpio5.IO[16] 54 3V3 SAI1_TXD5 (BT_CFG13) gpio4.IO[17]

55 3V3 SWDCLK1

56

57 3V3 CLK_25M

58

59 3V3 SWDIO1

60

61 1.8/3.3V NVCC_SD2

62 3V3 ONOFF

63 3V3 3V3_OUT

64 3V3 SAI1_TXD6 (BT_CFG14) gpio4.IO[18]

65 3V3 3V3_OUT

66

67 3V3 3V3_OUT

68 3V3 PWM2_OUT gpio1.IO[13]

69 3V3 3V3_OUT

70 GND GND

71 5V VIN_5V0

72 GND GND

73 5V VIN_5V0

74 GND GND

75 5V VIN_5V0

76 GND GND

77 5V VIN_5V0

78 GND GND

79 5V VIN_5V0

80 GND GND

Page 23: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

Power and Reset

23

The i.MX8 power is a single 5V source. It uses NXP’s PMIC and discreet power converter to source all

the i.MX8 power rails. The following figure describes the i.MX8 power architecture.

The power architecture main features are:

• Single 5V power source.

• NXP’s PF4210 source most of the IMX-8 power rails.

• Two discrete DC-to-DC converters source the CPU SOC and ARM powers.

• SNVS_3V3 can’t be power by a battery (No separate input).

• 3.3V output up to 2A (Need to calculate system and SOM power).

• Power up sequence is supported by the PMIC configuration.

Reset

The i.MX8 POR signal is activated by the PMIC output. The following figure describes the reset

architecture.

C

O

SYS_RST N N

E

C

T

3V3

VDD_SOC EN

PMIC_ON

PMIC POR

O nWDOG

R

POR

S IMX-8

A reset can be triggered by an external reset signal (Switch) or the internal Watch-Dog. Both signals

are OR to disable the VDD_SOC power source. The power source PG signal enables/disables the PMIC.

3.3V

C 5V DCDC BUCK NVCC_SNVS_3V3

3.38V/4A

O

N

N

E

C

T

O

R

S

SNVS_3V3

0.9V

PG Reset

DCDC BUCK

0.92V/3A EN

PMIC_ON

LDO

0.9V/0.3A

3.3V

PG

DCDC BUCK

0.99V/3A EN

VDDA_1V8

PMIC_ON

Conn.

NVCC_SD2

POR

3A Power

VDDA_1V8 EN Switch

Page 24: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

24

i.MX8 SOM Integration Manual

Power up sequence

The IMX-8 is source by a single 5V input. Al power sequences are supported by the SOM.

When using the SOM 3.3V output there is no need to consider its power sequence. If an external

power source is used, it needs to be power according to the power sequence rules. (See IMX-8

datasheet for details)

Booting Options

Fuses Booting

The IMX-8 can boot from its internal fuses map. Booting from the fuses is enabled when the

BOOT_MODE[1..0] is set to “00”.

Booting From Resistors Settings

The i.MX8 SOM can boot from different NVM according to an external resistors configuration. The

boot from the resistors configuration BOOT_MODE[1..0] is set to “10”.

The available booting NVM are:

• eMMC on uSDH1.

• uSD card on uSDH2.

• QSPI on QSPIA.

Page 25: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

25

The booting signals are SAI1RXD[0..7] and SAI1TXD[0..7]. The following table describes the

booting signals and its status during and after POR.

The following table describes how the booting signals need to be set to support the different

booting options.

Notes:

• NAND booting is not an option on the IMX-8 SOM.

• SPI NOR is an option on the carrier board (Not on the SOM).

• The configuration signals can be used as I/O or Audio interfaces after POR. Make sure that during POR it keep the booting requirements.

Page 26: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

26

I2C Interfaces

The i.MX8 SOM uses I2C1 interface for its internal configurations. The following table describes

the address mapping.

Ref. Chip I2C Port Address A Port Address B Description

U15 PMIC 1 0 0 0 1 0 0 0 RW 08H IMX8 PMIC

U17 EEPROM 1 1 0 1 0 0 0 0 RW 50H EEPROM

GPIO Interfaces

The i.MX8 SOM uses some GPIO signals for it internal controls. The following table

describes the GPIO allocation.

Signal I/O Description Remarks

PCIE1_nCLKREQ gpio5.IO[20] Input from WI-FI module Active Low

WL_REG_ON gpio5.IO[5] Enable the WI-FI RF Active High

WL_nPERST gpio4.IO[21] Reset the WI-FI module Active Low

REF_CLK_32K gpio3.IO[3] 32K clock for the WI-FI module N.I.U.

UBLOX_RSTN gpio5.IO[1] Reset the BT module Active Low

ENET_nRST gpio1.IO[9] Ethernet PHY reset Active Low

ENET_WoL gpio1.IO[10] Ethernet Wake-Up signal Active Low

ENET_nINT gpio1.IO[11] Ethernet interrupt Active Low

PMIC_nINT gpio1.IO[7] PMIC interrup Active Low

i.MX8 SOM Debugging Capability

The IMX-8 SOM supports two main debugging interfaces:

• UART interface

• JTAG interface

The UART interface is a null modem interface that is internally pulled up and support using UART1

TX/RX signals.

he UART interface is optional to use and mentioned here since most of the

Page 27: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

27

software infrastructure used in CuBox-Pulse and HummingBoard Pulse uses those two signals for

debugging.

JTAG interface is on the IMX-8 SOM and is exposed as test pins on component side. Following is a

snapshot of the test points and its connectivity traces:

TP-4 -> JTAG_nTRST. TP-5 -> JTAG_TDI. TP-6 -> JTAG_TMS. TP-7 ->

JTAG_TCK. TP-8 -> JTAG_TDO.

i.MX8 Typical Power Consumption

Setup 5V DC input power

consumption

Notes

Android idle TBD Performance governor, HDMI is on, USB,

eSata, WiFi and Ethernet are off

Android idle with Ethernet TBD Performance governor, HDMI is on, USB,

eSata, WiFi and Ethernet is 1Gbps

(note #1)

Android Nenamark2 benchmark TBD Performance governor, HDMI is on,

usb, sata, wifi and Ethernet are off

Full load - Android Nenamark2 benchmark

+ 4 processors running 100% (dd command

memory to memory)

TBD Performance governor, HDMI is on, USB,

eSata, WiFi and Ethernet is 1Gbps (note

#1). Tj is 55c

Full load - Android Nenamark2 benchmark

+ 4 processors running 100% (dd command

memory to memory)

TBD Performance governor, HDMI is on, usb, sata, wifi and Ethernet is 1Gbps (note #1). Tj is 87c (note #2)

Video 1080p Big Buck Bunny with AC3

audio codec (gstreamer from local SD)

TBD Performance governor, HDMI is on, USB,

eSata, WiFi and Ethernet are off

Linux idle TBD Performance governor, HDMI, USB,

eSata, WiFi and Ethernet are all off.

Linux suspend to memory TBD Note #3

Page 28: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

28

i. MX8 SOM Mechanical Description

The following is a diagram of the TOP VIEW of the i.MX8 SOM.

Note the following details:

- The carrier board must use the same footprint as in the above mechanical footprint. Since this is a TOP VIEW of

the print side of the SOM i.MX8, the diagram above describes the dimensions and placement of the board-to-

board headers, mechanical holes and boundaries of the SOM i.MX8, as-is.

- J5002 is the main board-to-board header (bottom side in the diagram).

- J8004 is the second board-to-board header (upper side in the diagram).

- J5001 is the third board-to-board header (right side in the diagram).

- CuBox-i design does not use the mechanical holes, since the mating strength of two Hirose DF40 pairs and the

internal heat spreader is satisfactory for the design requirements.

- In case 1.5mm mating height was chosen, then the SOM i.MX8 requirement would be that all area beneath

it on the carrier will be all dedicated ONLY for the board- to-board connectivity; no other components are

allowed.

- In case higher mating is chosen, then 1.5mm should be reserved for the SR-SOM- MX6. For instance, if 3.5mm

mating height is chosen, then 1.5mm is dedicated to the SOM i.MX8 print side components and the remaining

2mm for the carrier components underneath the SOM i.MX8.

Refer to SolidRun HummingBoard and CuBox Pulse design and layout, where there are examples

of the main and second 80 pin header board-to- board usage.

Page 29: SOM i.MX 8M - SolidRun Highlighted Features • Ultra-small footprint SOM (47x30mm) including three board-to-board connectors (250 total pins number). • NXP i.MX8M SoC (supports

29

Ordering Information

Please refer to the SolidRun website for more information regarding part numbers and the

procedure for placing an order.

http://www.solid-run.com