smartwatch report #15300-131016-pwd product description · disclimer ll company names, prodct...

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.Copyright © 2013, TechIngsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.

© 2013, TechInsights

Survey Teardown

Product DescriptionThe Samsung Galaxy Gear SM-V700 smartwatch features a 1.63-in. AMOLED display with 320 x 320 resolution, 16M colors, and a multitouch capacitive touchscreen. It runs the Android 4.1.2 “Jelly Bean” operating system on a 800 MHz single-core Samsung Exynos 3 processor with 512 MB RAM. Other features include 4 GB of internal memory, two microphones, speaker, and a 1.9 MP BSI CMOS camera with 720p HD video recording capability. Sensors include a 6-axis MEMS gyroscope and accelerometer. Connectivity is provided by Bluetooth 4.0 and NFC. Featured apps include Atooma, which enables the connection of software and hardware sensors on the Galaxy Gear with hardware sensors on other smart devices to create context-specific operating instructions; Banjo, a social discovery app; Evernote, for capturing images, taking notes, and syncing files across devices; and Glympse, a real-time location app. The Samsung Galaxy Gear SM-V700 is powered by a 3.8 V, 315 mAh Li-Polymer battery that supplies a listed 25 hours of use time and 150 hours of standby.

Samsung Galaxy Gear SM-V700SmartwatchReport #15300-131016-PWd

http://www.teardown.com

Survey ReportSamsung Galaxy Gear SM-V700 Report #15300-131016-PWd

Major Components AntennaMajor IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

Product Type SmartwatchBrand SamsungProduct Name & Model # Galaxy Gear SM-V700Official Release Date 9/15/2013Retail Price $359.00Weight (grams) 74.2Product Dimensions (mm) 56.73 x 36.76 x 11.39

Operating System Android 4.1.2 "Jelly Bean"Connectivity Bluetooth 4.0, NFCBattery Life Use Time: 25 hrs.; Standby Time: 150 hrs.Processor 800 MHz Single-Core Exynos 3 (ARM Cortex-A8) w/ 512 MB RAMInterface Multitouch Capacitive TouchscreenStorage Internal: 4 GB; External: N/ASensors 6-Axis MEMS Gyroscope & Accelerometer

Battery 3.8 V, 315 mAh, Li-PolymerDisplay 1.63" AMOLED; 320 x 320 Pixels; 16777216 ColorsCamera 1.9 MP CMOS BSI, Autofocus, 720p HD Video Capability

Key Subsystems

Product Features

Product Description

Product Details



Product Details Major Components Antenna Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Pkg Ref. # PkgQty Brand Name Part Number Pkg Description Form Pin Count Length

(mm)Width(mm)

Height(mm) Die Ref # Die Qty Brand Name Part Number Description Length

(mm)Width(mm) Each Total

1 1 Samsung S6E63J0X03 AMOLED Display Driver Flip Chip, Adhesive 670 21.75 1.06 0.34 1.1 1 Samsung S6E63J0X03 AMOLED Display Driver 21.75 1.06 $1.230 $1.230 2 1 Samsung S5K6A3YX14 1.9 MP BSI CMOS Image Sensor COB 48 5.37 4.20 0.31 2.1 1 Samsung S5K6A3YX14 1.9 MP BSI CMOS Image Sensor 4.39 4.20 $1.430 $1.430

3.1 1 Samsung K9GBG08U0B MLC NAND Flash Memory - 4 GB 10.32 8.09 $3.260 $3.260 3.2 1 Samsung K4P4G324EQ Mobile DDR2-S4 SDRAM Memory - 512 MB 9.05 7.38 $1.700 $1.700 3.3 1 Samsung S4LL125S01 Memory Controller 5.40 1.37 $0.620 $0.620

4 1 Samsung Exynos 3 Single Applications Processor BGA-POP (UF) 1020 12.08 12.01 0.95 4.1 1 Samsung S5PC220A01 Applications Processor 8.97 8.48 $16.450 $16.450 5.1 1 Yamaha ZT6B07 Audio CODEC 4.18 4.18 $1.370 $1.370 5.2 1 Yamaha ZTB103 DSP / Synthesizer ? 3.11 2.78 $0.830 $0.830

6 1 Texas Instruments TPS65631 Dual-Output AMOLED Display Power Supply DFN 10 2.50 2.50 0.75 6.1 1 Texas Instruments TPS65631WA0 Dual-Output AMOLED Display Power Supply 1.91 1.20 $0.190 $0.190 7 1 Samsung S5M8767 Power Management Flip Chip, Solder 144 5.02 5.02 0.77 7.1 1 Samsung S5M8767A01 Power Management 5.02 5.02 $2.250 $2.250 10 1 Maxim MAX17048 Li-ion Battery Fuel Gauge Flip Chip, Solder 8 1.69 0.94 0.56 10.1 1 Maxim BC01Z Li-ion Battery Fuel Gauge 1.69 0.94 $0.200 $0.200 11 1 Maxim MAX14577EEWA Battery Management Flip Chip, Solder 25 2.05 2.05 0.55 11.1 1 Maxim AL25Y Battery Management 2.05 2.05 $0.400 $0.400 12 1 STMicroelectronics STM32F401CB ARM Cortex-M4 32-Bit MCU + FPU Flip Chip, Solder 49 2.98 2.97 0.50 12.1 1 STMicroelectronics R423A ARM Cortex-M4 32-Bit MCU + FPU 2.98 2.97 $0.880 $0.880 13 1 Broadcom BCM20702 Single-Chip Bluetooth 4.0 Flip Chip, Solder 42 3.02 2.51 0.48 13.1 1 Broadcom BCM20702HA Single-Chip Bluetooth 4.0 3.02 2.51 $0.810 $0.810 14 1 Melfas MCS-8000 Capacitive Touchscreen Controller QFN 36 3.99 3.98 0.50 14.1 1 Melfas MCS 81 Capacitive Touchscreen Controller 2.71 2.70 $0.710 $0.710 15 1 Invensense MPU-6500 6-Axis MEMS Gyroscope & Accelerometer QFN 24 2.99 2.99 0.89 15.1 1 Invensense SCORPION-A02 6-Axis MEMS Gyroscope & Accelerometer 2.61 2.21 $1.650 $1.650

Totals 13 2397 16 $33.98

(UF) = Underfilled

5.03 0.881 Yamaha

1.021 Samsung

5 YMU831 Audio Hub / CODEC Amplifier BGA Stacked 2 (UF) 105 5.04

BGA-POP-3 (UF) 216 12.06 11.093 KMNJW0002M Mutichip Memory - 4 GB MLC NAND Flash, 512 MB Mobile DDR2-S4 SDRAM, Memory Controller

Estimated CostsDie InfoPackage Info

Major IC Bill of Materials



Product Details Major Components AntennaMajor IC Bill of Materials Main BoardProduct Label Cost Estimation DiscussionSubsystems

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Exterior Features

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Exterior Features

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Product Details Major Components AntennaMajor IC Bill of Materials Main BoardExterior Features Cost Estimation DiscussionSubsystemsProduct Label



Product Details AntennaMajor IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

View 2View 1

Major Components



Product Details AntennaMajor IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

View 1 View 2

Major Components



Product Details Major Components Major IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

NFCWiFi / Bluetooth

Antenna



Product Details Major Components Major IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

WiFi / Bluetooth

Antenna

NFC



Product Details Major Components AntennaMajor IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation Discussion

Display Camera - FrontTouchscreen

Brand SamsungPart Number LSSP482230ABType Lithium PolymerVoltage 3.80Rating (mAh) 315Size (mm) 29.1 x 21.86 x 4.63Vol. Energy Density (mWh/cc) 406.4Weight (grams) 5.6Wt. Energy Density (mWh/g) 214

Battery Subsystem

Battery

Subsystems




Battery Camera - FrontTouchscreen

1 - Samsung#S6E63J0X03AMOLED Display Driver

Brand SamsungPart Number AMS163AX01Type AMOLEDView Diagonal (inches) 1.6Colors 16777216Rows x Columns (pixels) 320 x 320Backlight NoneDisplay Size (mm) 36.04 x 31.43 x 0.45Weight (grams) 1.1

Display Subsystem

Subsystems

Display




Battery Display Camera - Front

Brand UnknownPart Number 163R1.2Type CapacitiveSize (mm) 40.84 x 34.17 x 2.21 Weight (grams) 5.6

Touchscreen Subsystem

Touchscreen

Subsystems




Battery Display Touchscreen

2 - Samsung#S5K6A3YX141.9 MP BSI CMOS Image Sensor

Brand UnknownPart Number P3905Type CMOSResolution 2 MPOptical Size (inches) 1/5Optical Zoom 1Size (mm) 7.32 x 7.3 x 4.13Weight (grams) 0.4

2 MP Camera Subsystem

Subsystems

Camera - Front



Product Details Major Components AntennaMajor IC Bill of Materials Exterior Features Product Label Cost Estimation DiscussionSubsystems

Side 1 IC Identification Side 2

Grid = 1 cm

Side 1

Main Board




Side 1 Side 2

6 - Texas Instruments#TPS65631Dual-Output AMOLEDDisplay Power Supply

7 - Samsung#S5M8767Power Management

10 - Maxim#MAX17048Li-ion Battery Fuel Gauge

11 - Maxim#MAX14577EEWABattery Management

12 - STMicroelectronics#STM32F401CBARM Cortex-M4 32-Bit MCU + FPU

13 - Broadcom#BCM20702Single-Chip Bluetooth 4.0

14 - Melfas#MCS-8000Capacitive Touchscreen Controller

15 - Invensense#MPU-65006-Axis MEMS Gyroscope & Accelerometer

5 - Yamaha#YMU831Audio Hub / CODEC Amplifier (2-Die Pkg.)

3 - Samsung#KMNJW0002MMutichip Memory - 4 GB MLC NAND Flash, 512 MB Mobile DDR2-S4 SDRAM, Memory Controller(3-Die Pkg.)

Grid = 1 cm

4 - Samsung#Exynos 3 SingleApplications Processor

Main Board

Side 1 IC Identification




Side 1 Side 1 IC Identification

Grid = 1 cm

Side 2

Main Board



COST ESTIMATION PROCESSOverview and Discussion

Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge.

Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources.

Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost.

The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.

We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce.

Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.

Product Details Major Components AntennaMajor IC Bill of Materials Main BoardExterior Features Product Label Subsystems Cost Estimation Discussion


smartwatch report #15300-131016-pwd product description · disclimer ll company names, prodct...

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