slus223c current mode pwm controller (rev. c)

7/28/2019 Slus223c Current Mode PWM Controller (Rev. C)

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F E A T U R E S D E S C R I P T I O N

B L O C K D I A G R A M

11

A/B

Vcc 7 12

5 9GROUND

4 7RT/CT

2 3VFB

1 1COMP

3 5CURRENTSENSE

34 V

2.50 V

OSC

UVLO

S/R5 V

REF

VREFGoodLogic

Internal

BIAS

ErrorAmp

2R

R

1 V CURRENTSENSECOMPARATOR

PWMLATCH

S

R

T

8 14

VREF5 V50 mA

7

VC

106

OUTPUT

85

POWERGROUND

Note 1:

Note 2:

A = DIL8 Pin Number. B = SO14 and CFP14 Pin Number.

Toggle flip flop used only in 1844 and 1845.

U C 1 8 4 2 / 3 / 4 / 5

U C 2 8 4 2 / 3 / 4 / 5

U C 3 8 4 2 / 3 / 4 / 5 S L U S 2 2 3 C A P R I L 1 9 9 7 R E V I S E D J U N E 2 0 0 7

C U R R E N T M O D E P W M C O N T R O L L E R

O p t i m i z e d F o r O f f - l i n e a n d D C - t o - D C T h e U C 1 8 4 2 / 3 / 4 / 5 f a m i l y o f c o n t r o l d e v i c e s p r o v i d e s C o n v e r t e r s t h e n e c e s s a r y f e a t u r e s t o i m p l e m e n t o f f - l i n e o r

d c - t o - d c f i x e d f r e q u e n c y c u r r e n t m o d e c o n t r o l L o w S t a r t - U p C u r r e n t ( < 1 m A ) s c h e m e s w i t h a m i n i m a l e x t e r n a l p a r t s c o u n t .

A u t o m a t i c F e e d F o r w a r d C o m p e n s a t i o n I n t e r n a l l y i m p l e m e n t e d c i r c u i t s i n c l u d e u n d e r - v o l t a g e

P u l s e - b y - P u l s e C u r r e n t L i m i t i n g l o c k o u t f e a t u r i n g s t a r t u p c u r r e n t l e s s t h a n 1 m A , a p r e c i s i o n r e f e r e n c e t r i m m e d f o r a c c u r a c y a t t h e e r r o r E n h a n c e d L o a d R e s p o n s e C h a r a c t e r i s t i c s a m p i n p u t , l o g i c t o i n s u r e l a t c h e d o p e r a t i o n , a P W M U n d e r - V o l t a g e L o c k o u t W i t h H y s t e r e s i s c o m p a r a t o r w h i c h a l s o p r o v i d e s c u r r e n t l i m i t c o n t r o l ,

D o u b l e P u l s e S u p p r e s s i o n a n d a t o t e m p o l e o u t p u t s t a g e d e s i g n e d t o s o u r c e o r s i n k h i g h p e a k c u r r e n t . T h e o u t p u t s t a g e , s u i t a b l e f o r H i g h C u r r e n t T o t e m P o l e O u t p u t d r i v i n g N - C h a n n e l M O S F E T s , i s l o w i n t h e o f f s t a t e . I n t e r n a l l y T r i m m e d B a n d g a p R e f e r e n c e

D i f f e r e n c e s b e t w e e n m e m b e r s o f t h i s f a m i l y a r e t h e 5 0 0 - k H z O p e r a t i o n

u n d e r - v o l t a g e l o c k o u t t h r e s h o l d s a n d m a x i m u m d u t y L o w R O E r r o r A m p c y c l e r a n g e s . T h e U C 1 8 4 2 a n d U C 1 8 4 4 h a v e U V L O t h r e s h o l d s o f 1 6 V O N a n d 1 0 V O F F, i d e a l l y s u i t e d t o o f f - l i n e a p p l i c a t i o n s . T h e c o r r e s p o n d i n g t h r e s h o l d s f o r t h e U C 1 8 4 3 a n d U C 1 8 4 5 a r e 8 . 4 V a n d 7 . 6 V . T h e U C 1 8 4 2 a n d U C 1 8 4 3 c a n o p e r a t e t o d u t y c y c l e s a p p r o a c h i n g 1 0 0 % . A r a n g e o f z e r o t o 5 0 % i s o b t a i n e d b y t h e U C 1 8 4 4 a n d U C 1 8 4 5 b y t h e a d d i t i o n o f a n i n t e r n a l t o g g l e f l i p f l o p w h i c h b l a n k s t h e o u t p u t o f f e v e r y o t h e r c l o c k c y c l e .

P l e a s e b e a w a r e t h a t a n i m p o r t a n t n o t i c e c o n c e r n i n g a v a i l a b i l i t y , s t a n d a r d w a r r a n t y , a n d u s e i n c r i t i c a l a p p l i c a t i o n s o f T e x a s I n s t r u m e n t s s e m i c o n d u c t o r p r o d u c t s a n d d i s c l a i m e r s t h e r e t o a p p e a r s a t t h e e n d o f t h i s d a t a s h e e t .

P R O D U C T I O N D A T A i n f o r m a t i o n i s c u r r e n t a s o f p u b l i c a t i o n d a t e . C o p y r i g h t 1 9 9 7 2 0 0 7 , T e x a s I n s t r u m e n t s I n c o r p o r a t e d P r o d u c t s c o n f o r m t o s p e c i f i c a t i o n s p e r t h e t e r m s o f t h e T e x a s I n s t r u m e n t s s t a n d a r d w a r r a n t y . P r o d u c t i o n p r o c e s s i n g d o e s n o t

n e c e s s a r i l y i n c l u d e t e s t i n g o f a l l p a r a m e t e r s .
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A B S O L U T E M A X I M U M R A T I N G S ( 1 )

C O N N E C T I O N D I A G R A M S

1

2

3

4

8

7

6

5

COMP

VFB

ISENSE

RT/CT

VREF

VCC

OUTPUT

GROUND

DIL-8, SOIC-8N or J PACKAGE, D8 PACKAGE

(TOP VIEW)

NC No internal connection

1

2

3

4

5

6

7

14

13

12

11

10

9

8

COMP

NC

VFB

NC

ISENSE

NC

RT/CT

SOIC-14, CFP-14

D or W PACKAGE

(TOP VIEW)

VREF

NC

VCC

VC

OUTPUT

GROUND

PWR GND

3 2 1 20 19

9 10 11 12 13

4

5

6

7

8

18

17

16

15

14

VCC

VC

NC

OUTPUT

NC

NC

VFB

NC

ISENSE

NC

PLCC-20

Q PACKAGE

(TOP VIEW)

NC

COMP

NC

PWRGND

GROUND

NC

NC

NC

RT/CT

VREF

U C 1 8 4 2 / 3 / 4 / 5

U C 2 8 4 2 / 3 / 4 / 5


U N I T

L o w i m p e d a n c e s o u r c e 3 0 V S u p p l y v o l t a g e

I C C < 3 0 m A S e l f L i m i t i n g

O u t p u t c u r r e n t 1 A

O u t p u t e n e r g y ( c a p a c i t i v e l o a d ) 5 JA n a l o g i n p u t s ( P i n s 2 , 3 ) 0 . 3 V t o 6 . 3 V

E r r o r a m p o u t p u t s i n k c u r r e n t 1 0 m A

TA 2 5 C ( D I L - 8 ) 1 W

P o w e r d i s s i p a t i o n T A 2 5 C ( S O I C - 1 4 ) 7 2 5 m W

TA 2 5 C ( S O I C - 8 ) 6 5 0 m W

S t o r a g e t e m p e r a t u r e r a n g e 6 5 C t o 1 5 0 C

J u n c t i o n t e m p e r a t u r e r a n g e 5 5 C t o 1 5 0 C

L e a d t e m p e r a t u r e ( s o l d e r i n g , 1 0 s e c o n d s ) 3 0 0 C

( 1 ) A l l v o l t a g e s a r e w i t h r e s p e c t t o P i n 5 . A l l c u r r e n t s a r e p o s i t i v e i n t o t h e s p e c i f i e d t e r m i n a l . C o n s u l t P a c k a g i n g S e c t i o n o f D a t a b o o k f o r t h e r m a l l i m i t a t i o n s a n d c o n s i d e r a t i o n s o f p a c k a g e s .

2 S u b m i t D o c u m e n t a t i o n F e e d b a c k
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Temp Stability+V

REF(max)*VREF (min)

TJ(max)* TJ (min) VR E F ( m a x ) a n d V R E F ( m i n ) a r e t h e m a x i m u m a n d m i n i m u m r e f e r e n c e v o l t a g e s m e a s u r e d o v e r

T H E R M A L C H A R A C T E R I S T I C S

D I S S I P A T I O N R A T I N G S

E L E C T R I C A L C H A R A C T E R I S T I C S

U C 1 8 4 2 / 3 / 4 / 5

U C 2 8 4 2 / 3 / 4 / 5


o v e r o p e r a t i n g f r e e - a i r t e m p e r a t u r e r a n g e ( u n l e s s o t h e r w i s e n o t e d )

P A C K A G E J C J A

D I L - 8 J 2 8 ( 1 ) 1 2 5 - 1 6 0

N 2 5 1 1 0 ( 2 )

S O I C - 8 D 8 4 2 8 4 - 1 6 0 ( 2 )

S O I C - 1 4 D 1 4 3 5 5 0 - 1 2 0 ( 2 )

C F P - 1 4 W 5 . 4 9 C / W 1 7 5 . 4 C / W

P L C C - 2 0 Q 3 4 4 3 - 7 5 ( 2 )

( 1 ) J C d a t a v a l u e s s t a t e d w e r e d e r i v e d f r o m M I L - S T D - 1 8 3 5 B . ( 2 ) S p e c i f i e d J A ( j u n c t i o n t o a m b i e n t ) i s f o r d e v i c e s m o u n t e d t o 5 i n

2 F R 4 P C b o a r d w i t h o n e o u n c e c o p p e r w h e r e n o t e d . W h e n r e s i s t a n c e r a n g e i s g i v e n , l o w e r v a l u e s a r e f o r 5 i n 2. T e s t P W B w a s 0 . 0 6 2 i n t h i c k a n d t y p i c a l l y u s e d 0 . 6 3 5 - m m t r a c e w i d t h s f o r p o w e r p a c k a g e s a n d 1 . 3 - m m t r a c e w i d t h s f o r n o n - p o w e r p a c k a g e s w i t h 1 0 0 x 1 0 0 - m i l p r o b e l a n d a r e a a t t h e e n d o f e a c h t r a c e .

TA 2 5 C D E R A T I N G F A C T O R T A 7 0 C TA 8 5 C P O T A 1 2 5 CP A C K A G E P O W E R R A T I N G A B O V E T A 2 5 C P O W E R R A T I N G W E R R A T I N G P O W E R R A T I N G

W 7 0 0 m W 5 . 5 m W / C 4 5 2 m W 3 7 0 m W 1 5 0 m W

U n l e s s o t h e r w i s e s t a t e d , t h e s e s p e c i f i c a t i o n s a p p l y f o r 5 5 C TA 1 2 5 C f o r t h e U C 1 8 4 X ; 4 0 C TA 8 5 C f o r t h e

U C 2 8 4 X ; 0 C TA 7 0 C f o r t h e 3 8 4 X ; V C C = 1 5 V ( 1 ); RT = 1 0 k ; CT = 3 . 3 n F , T A = TJ.

U C 1 8 4 2 / 3 / 4 / 5 U C 3 8 4 2 / 3 / 4 / 5

U C 2 8 4 2 / 3 / 4 / 5 P A R A M E T E R T E S T C O N D I T I O N S U N I T

M I N T Y P M A X M I N T Y P M A X

R E F E R E N C E S E C T I O N

O u t p u t V o l t a g e T J = 2 5 C , I O = 1 m A 4 . 9 5 5 . 0 0 5 . 0 5 4 . 9 0 5 . 0 0 5 . 1 0 V

L i n e R e g u l a t i o n 1 2 VI N 2 5 V 6 2 0 6 2 0 m V

L o a d R e g u l a t i o n 1 I0

2 0 m A 6 2 5 6 2 5

T e m p . S t a b i l i t y S e e ( 2 ) ( 3 ) 0 . 2 0 . 4 0 . 2 0 . 4 m V / C

T o t a l O u t p u t V a r i a t i o n L i n e , l o a d , t e m p a t u r e ( 2 ) 4 . 9 5 . 1 4 . 8 2 5 . 1 8 V

O u t p u t N o i s e V o l t a g e 1 0 H z f 1 0 k H z , T J = 2 5 C( 2 ) 5 0 5 0 V

L o n g T e r m S t a b i l i t y T A = 1 2 5 C , 1 0 0 0 H r s ( 2 ) 5 2 5 5 2 5 m V

O u t p u t S h o r t C i r c u i t 3 0 1 0 0 1 8 0 3 0 1 0 0 1 8 0 m A

O S C I L L A T O R S E C T I O N

I n i t i a l A c c u r a c y T J = 2 5 C( 4 ) 4 7 5 2 5 7 4 7 5 2 5 7 k H z

V o l t a g e S t a b i l i t y 1 2 VC C 2 5 V 0 . 2 % 1 % 0 . 2 % 1 %

T e m p . S t a b i l i t y T M I N TA TM A X( 2 ) 5 % 5 %

A m p l i t u d e V P I N 4 p e a k - t o - p e a k ( 2 ) 1 . 7 1 . 7 V

( 1 ) A d j u s t V C C a b o v e t h e s t a r t t h r e s h o l d b e f o r e s e t t i n g a t 1 5 V .

( 2 ) T h e s e p a r a m e t e r s , a l t h o u g h s p e c i f i e d , a r e n o t 1 0 0 % t e s t e d i n p r o d u c t i o n . ( 3 ) T e m p e r a t u r e s t a b i l i t y , s o m e t i m e s r e f e r r e d t o a s a v e r a g e t e m p e r a t u r e c o e f f i c i e n t , i s d e s c r i b e d b y t h e e q u a t i o n :

t h e a p p r o p r i a t e t e m p e r a t u r e r a n g e . N o t e t h a t t h e e x t r e m e s i n v o l t a g e d o n o t n e c e s s a r i l y o c c u r a t t h e e x t r e m e s i n t e m p e r a t u r e . ( 4 ) O u t p u t f r e q u e n c y e q u a l s o s c i l l a t o r f r e q u e n c y f o r t h e U C 1 8 4 2 a n d U C 1 8 4 3 .

O u t p u t f r e q u e n c y i s o n e h a l f o s c i l l a t o r f r e q u e n c y f o r t h e U C 1 8 4 4 a n d U C 1 8 4 5 .

3S u b m i t D o c u m e n t a t i o n F e e d b a c k
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( 7 ) G a i n d e f i n e d a s : A+

DVPIN 1DVPIN 3

, 0v VPIN 3v 0.8 V

U C 1 8 4 2 / 3 / 4 / 5

U C 2 8 4 2 / 3 / 4 / 5


E L E C T R I C A L C H A R A C T E R I S T I C S ( c o n t i n u e d )

U n l e s s o t h e r w i s e s t a t e d , t h e s e s p e c i f i c a t i o n s a p p l y f o r 5 5 C TA 1 2 5 C f o r t h e U C 1 8 4 X ; 4 0 C TA 8 5 C f o r t h e U C 2 8 4 X ; 0 C TA 7 0 C f o r t h e 3 8 4 X ; V C C = 1 5 V ; R T = 1 0 k ; CT = 3 . 3 n F , T A = TJ.

U C 1 8 4 2 / 3 / 4 / 5 U C 3 8 4 2 / 3 / 4 / 5

U C 2 8 4 2 / 3 / 4 / 5 P A R A M E T E R T E S T C O N D I T I O N S U N I T

M I N T Y P M A X M I N T Y P M A X

E R R O R A M P S E C T I O N

I n p u t V o l t a g e V P I N 1 = 2 . 5 V 2 . 4 5 2 . 5 0 2 . 5 5 2 . 4 2 2 . 5 0 2 . 5 8 V

I n p u t B i a s C u r r e n t 0 . 3 1 0 . 3 2 A

AV O L 2 VO 4 V 6 5 9 0 6 5 9 0 d B

U n i t y G a i n B a n d w i d t h T J = 2 5 C( 5 ) 0 . 7 1 0 . 7 1 M H z

P S R R 1 2 VC C 2 5 V 6 0 7 0 6 0 7 0 d B

O u t p u t S i n k C u r r e n t V P I N 2 = 2 . 7 V , V P I N 1 = 1 . 1 V 2 6 2 6 m A

O u t p u t S o u r c e C u r r e n t V P I N 2 = 2 . 3 V , V P I N 1 = 5 V 0 . 5 0 . 8 0 . 5 0 . 8

VO U T H i g h V P I N 2 = 2 . 3 V , R L = 1 5 k t o g r o u n d 5 6 5 6 V

VO U T L o w V P I N 2 = 2 . 7 V , R L = 1 5 k t o P i n 8 0 . 7 1 . 1 0 . 7 1 . 1

C U R R E N T S E N S E S E C T I O N

G a i n S e e ( 6 ) ( 7 )

2 . 8 5 3 3 . 1 5 2 . 8 5 3 3 . 1 5 V / V M a x i m u m I n p u t S i g n a l V P I N 1 = 5 V

( 6 ) 0 . 9 1 1 . 1 0 . 9 1 1 . 1 V

P S R R 1 2 VC C 2 5 V( 5 ) ( 6 ) 7 0 7 0 d B

I n p u t B i a s C u r r e n t 2 1 0 2 1 0 A

D e l a y t o O u t p u t V P I N 3 = 0 V t o 2 V ( 5 ) 1 5 0 3 0 0 1 5 0 3 0 0 n s

O U T P U T S E C T I O N

I S I N K = 2 0 m A 0 . 1 0 . 4 0 . 1 0 . 4 O u t p u t L o w L e v e l

I S I N K = 2 0 0 m A 1 . 5 2 . 2 1 . 5 2 . 2 V

I S O U R C E = 2 0 m A 1 3 1 3 . 5 1 3 1 3 . 5 O u t p u t H i g h L e v e l

I S O U R C E = 2 0 0 m A 1 2 1 3 . 5 1 2 1 3 . 5

R i s e T i m e T J = 2 5 C , C L = 1 n F ( 5 ) 5 0 1 5 0 5 0 1 5 0

n sF a l l T i m e T J = 2 5 C , CL = 1 n F

( 5 ) 5 0 1 5 0 5 0 1 5 0

U N D E R - V O L T A G E L O C K O U T S E C T I O N

X 8 4 2 / 4 1 5 1 6 1 7 1 4 . 5 1 6 1 7 . 5 S t a r t T h r e s h o l d

X 8 4 3 / 5 7 . 8 8 . 4 9 . 0 7 . 8 8 . 4 9 . 0 V

X 8 4 2 / 4 9 1 0 1 1 8 . 5 1 0 1 1 . 5 M i n . O p e r a t i n g V o l t a g e A f t e r T u r n O n X 8 4 3 / 5 7 . 0 7 . 6 8 . 2 7 . 0 7 . 6 8 . 2

P W M S E C T I O N

X 8 4 2 / 3 9 5 % 9 7 % 1 0 0 % 9 5 % 9 7 % 1 0 0 % M a x i m u m D u t y C y c l e

X 8 4 4 / 5 4 6 % 4 8 % 5 0 % 4 7 % 4 8 % 5 0 %

M i n i m u m D u t y C y c l e 0 % 0 %

T O T A L S T A N D B Y C U R R E N T

S t a r t - U p C u r r e n t 0 . 5 1 0 . 5 1 m A

O p e r a t i n g S u p p l y C u r r e n t V P I N 2 = VP I N 3 = 0 V 1 1 1 7 1 1 1 7 VC C Z e n e r V o l t a g e r I C C = 2 5 m A 3 0 3 4 3 0 3 4 V

( 5 ) T h e s e p a r a m e t e r s , a l t h o u g h s p e c i f i e d , a r e n o t 1 0 0 % t e s t e d i n p r o d u c t i o n . ( 6 ) P a r a m e t e r m e a s u r e d a t t r i p p o i n t o f l a t c h w i t h V P I N 2 = 0 .



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E R R O R A M P C O N F I G U R A T I O N

_

+

2.5 V

2

1

VFB

COMPZF

ZI

0.5 mA

U N D E R - V O L T A G E L O C K O U T

VCC


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O S C I L L A T O R S E C T I O N

8

4

5

VREF

RT/CT

GROUND

RT

CT

For RT> 5 K f ~1.72

RTCT

30

10

3

1

0.3

td

ms

1 2.2 4.7 10 22 47 100

CT nF

Deadtime vs CT (RT >5 kW)

RT

(k

)W

100

30

10

3100 1 k 10 k 100 k 1 M

f Frequency Hz

Timing Resistance vs Frequency

O U T P U T S A T U R A T I O N C H A R A C T E R I S T I C S

4

3

2

1

0

.01 .02 .03 .04 .05 .07 .1 .2 .3 .4 .5 .7 1

SINK SAT (VOL)

SOURCE SAT

(VCCVOH)

VCC = 15 V

TA = 25C

TA = 55C

Output Current, Source or Sink A

aturaton

o

tage

E R R O R A M P L I F I E R O P E N - L O O P F R E Q U E N C Y R E S P O N S E

80

60

40

20

0

0

45

90

135

180

otage

an

PhaseMargin

Av

10 100 1 k 10 k 100 k 1 M 10 M

f Frequency Hz

U C 1 8 4 2 / 3 / 4 / 5

U C 2 8 4 2 / 3 / 4 / 5




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O P E N - L O O P L A B O R A T O R Y F I X T U R E

4.7 kW

1 kWERROR AMP

ADJUST

4.7 kW

5 kW

ISENSEADJUST

2N2222

100 kW

R1

1

2

3

4

8

7

6

5

COMP

UC1842

VFB

ISENSE

RT / CT

CT

0.1 mF

0.1 mF

A

1 kW 1 W

VREF

VCC

OUTPUT

GROUND

VREF

VCC

OUTPUT

GROUND

S H U T D O W N T E C H N I Q U E S

8

3

1 kW

330W

SHUTDOWN

500W

To Current

SENSE RESISTOR

VREF

ISENSE

1

SHUTDOWN

COMP

U C 1 8 4 2 / 3 / 4 / 5

U C 2 8 4 2 / 3 / 4 / 5


H i g h p e a k c u r r e n t s a s s o c i a t e d w i t h c a p a c i t i v e l o a d s n e c e s s i t a t e c a r e f u l g r o u n d i n g t e c h n i q u e s . T i m i n g a n d b y p a s c a p a c i t o r s s h o u l d b e c o n e c t e d c l o s e t o p i n 5 i n a s i n g l e p o i n t g r o u n d . T h e t r a n s i s t o r a n d 5 k p o t e n t i o m e t e r a r e u s e d t o s a m p l e t h e o s c i l l a t o r w a v e f o r m a n d a p p l y a n a d j u s t a b l e r a m p t o p i n 3 .

S h u t d o w n o f t h e U C 1 8 4 2 c a n b e a c c o m p l i s h e d b y t w o m e t h o d s ; e i t h e r r a i s e p i n 3 a b o v e 1 V o r p u l l p i n 1 b e l o w a v o l t a g e t w o d i o d e d r o p s a b o v e g r o u n d . E i t h e r m e t h o d c a u s s e s t h e o u t p u t o f t h e P W M c o m p a r a t o r t o b e h i g h ( r e f e r t o b l o c k d i a g r a m ) . T h e P W M l a t c h i s r e s e t d o m i n a n t s o t h a t t h e o u t p u t w i l l r e m a i n l o w u n t i l t h e n e x t c l o c k c y c l e a f t e r t h e s h u t d o w n c o n d i t i o n a t p i n 1 a n d / o r 3 i s r e m o v e d . I n o n e e x a m p l e , a n e x t e r n a l l y l a t c h e d s h u t d o w n m a y b e a c c o m p l i s h e d b y a d d i n g a n S C R w h i c h w i l l b e r e s e t b y c y c l i n g V C C b e l o w t h e l o w e r U V L O t h r e s h o l d . A t t h i s p i n t t h e r e f e r e n c e t u r n s o f f , a l l o w i n g t h e S C R t o r e s e t .

7S u b m i t D o c u m e n t a t i o n F e e d b a c k


8/27

www.ti.com

O F F L I N E F L Y B A C K R E G U L A T O R

R15 1 W

117 VAC VARO

VM 68 C1250 F250 V

R256 k

2 W

R124.7 k

2 W

C9

3300 pF

600 VNP

D41N3613

D21N3612

D31N3612

NC

R320 k

R44.7 k

C447 F25 V

R968 3 W

C3

22 F

C2100 F

25 V72

1

8

4 5

3

6

UC3844

R5 150 k

C14

100 pF

R610 k

C50.01 F

C60.0022 F

USD1120

R722

R8

1 k

C7470 pFR1320 k

R10

0.55 1 W

Q1UFN833

U9D946

N5 C104700 F

10 V

C114700 F10 V

+6 V

COM

+12 V

12 V COM

12 V

D7UF81002

N12

N12

C122200 F16 V

C132200 F16 V

D8UES1002

C8680 pF600 V

D81N3613

R11

2.7 k2 W

P o w e r S u p p l y S p e c i f i c a t i o n s

S L O P E C O M P E N S A T I O N

8

4

3

VREF

RT / CT

ISENSE

UC1842/3

0.1 mF RT

CT

R1

R2

C

ISENSE

RSENSE

U C 1 8 4 2 / 3 / 4 / 5

U C 2 8 4 2 / 3 / 4 / 5


1 . I n p u t V o l t a g e s

a . 5 V A C t o 1 3 0 V A ( 5 0 H z / 6 0 H z )

2 . L i n e I s o l a t i o n : 3 7 5 0 V

3 . S w i t c h n g F r e q u e n c y : 4 0 k H z

4 . E f f i c i e n c y a t F u l l L o a d 7 0 %

5 . O u t p u t V o l t a g e :

a . + 5 V , 5 % ; 1 A t o 4 A l o a d

R i p p l e v o l t a g e : 5 0 m V P - P M a x b . + 1 2 V , 3 % ; 0 . 1 A t o 0 . 3 A l o a d

R i p p l e v o l t a g e : 1 0 0 m V P - P M a x c . 1 2 V , 3 % ; 0 . 1 A t o 0 . 3 A l o a d

R i p p l e v o l t a g e : 1 0 0 m V P - P M a x

A f r a c t i o n o f t h e o s c i l l a t o r r a m p c a n b e r e s i s t i v e l y s u m m e d w i t h t h e c u r r e n t s e n s e s i g n a l t o p r o v i d e s l o p e c o m p e n s a t i o n f o r c o n v e r t e r s r e q u i r i n g d u t y c y c l e s o v e r 5 0 % .



9/27

PACKAGE OPTION ADDENDUM

www.ti.com 5-Sep-2011

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1) Package Type Package

DrawingPins Package Qty Eco Plan

(2) Lead/Ball Finish

MSL Peak Temp(3) Samples

(Requires Login)

5962-8670401PA ACTIVE CDIP JG 8 1 TBD Call TI Call TI

5962-8670401XA ACTIVE LCCC FK 20 1 TBD Call TI Call TI



5962-8670403PA ACTIVE CDIP JG 8 1 TBD Call TI Call TI5962-8670403XA ACTIVE LCCC FK 20 1 TBD Call TI Call TI

5962-8670404DA ACTIVE CFP W 14 1 TBD Call TI Call TI



UC1842J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type

UC1842J883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type

UC1842L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

UC1842W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type



UC1843L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type








UC1845L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type



UC1845W883B ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

UC2842D ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM


10/27



Addendum-Page 2





(Requires Login)

UC2842D8 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br)


UC2842D8G4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br)


UC2842D8TR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br)


UC2842D8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br)


UC2842DG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br)


UC2842DTR ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br)


UC2842DTRG4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br)


UC2842J OBSOLETE CDIP JG 8 TBD Call TI Call TI

UC2842N ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br)

CU NIPDAU N / A for Pkg Type

UC2842NG4 ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)




11/27



Addendum-Page 3





(Requires Login)


& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)


UC2845D ACTIVE SOIC D 14 50 Green (RoHS& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM


& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



12/27



Addendum-Page 4





(Requires Login)


& no Sb/Br)



& no Sb/Br)




& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



13/27



Addendum-Page 5





(Requires Login)


& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)


UC3843QTR OBSOLETE PLCC FN 20 TBD Call TI Call TI


& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)


UC3845AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type


14/27



Addendum-Page 6





(Requires Login)


& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)



& no Sb/Br)


(1)

The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)
http://www.ti.com/productcontent


15/27



Addendum-Page 7

(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF UC1842, UC1843, UC1844, UC1845, UC3842, UC3843, UC3844, UC3845, UC3845AM :

Catalog: UC3842, UC3843, UC3844, UC3845, UC3842M, UC3845A

Military: UC1842, UC1843, UC1844, UC1845

Space: UC1842-SP, UC1843-SP, UC1844-SP, UC1845-SP

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

Military - QML certified for Military and Defense Applications

Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
http://focus.ti.com/docs/prod/folders/print/uc1845-sp.htmlhttp://focus.ti.com/docs/prod/folders/print/uc1844-sp.htmlhttp://focus.ti.com/docs/prod/folders/print/uc1843-sp.htmlhttp://focus.ti.com/docs/prod/folders/print/uc1842-sp.htmlhttp://focus.ti.com/docs/prod/folders/print/uc1845.htmlhttp://focus.ti.com/docs/prod/folders/print/uc1844.htmlhttp://focus.ti.com/docs/prod/folders/print/uc1843.htmlhttp://focus.ti.com/docs/prod/folders/print/uc1842.htmlhttp://focus.ti.com/docs/prod/folders/print/uc3845a.htmlhttp://focus.ti.com/docs/prod/folders/print/uc3842m.htmlhttp://focus.ti.com/docs/prod/folders/print/uc3845.htmlhttp://focus.ti.com/docs/prod/folders/print/uc3844.htmlhttp://focus.ti.com/docs/prod/folders/print/uc3843.htmlhttp://focus.ti.com/docs/prod/folders/print/uc3842.html


16/27

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1(mm)

W(mm) Q

UC2842D8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0

UC2842DTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0

UC2843D8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0

UC2843DTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0

UC2844D8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0

UC2844DTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0

UC2845D8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0

UC2845DTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0

UC3842D8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0

UC3842DTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0

UC3843D8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0

UC3843DTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0

UC3844D8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0

UC3844DTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0

UC3845D8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0

UC3845DTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0

PACKAGE MATERIALS INFORMATION

www.ti.com 19-Mar-2008

Pack Materials-Page 1


17/27

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

UC2842D8TR SOIC D 8 2500 340.5 338.1 20.6

UC2842DTR SOIC D 14 2500 333.2 345.9 28.6

UC2843D8TR SOIC D 8 2500 340.5 338.1 20.6

UC2843DTR SOIC D 14 2500 333.2 345.9 28.6

UC2844D8TR SOIC D 8 2500 340.5 338.1 20.6

UC2844DTR SOIC D 14 2500 333.2 345.9 28.6

UC2845D8TR SOIC D 8 2500 340.5 338.1 20.6

UC2845DTR SOIC D 14 2500 333.2 345.9 28.6

UC3842D8TR SOIC D 8 2500 340.5 338.1 20.6

UC3842DTR SOIC D 14 2500 333.2 345.9 28.6

UC3843D8TR SOIC D 8 2500 340.5 338.1 20.6

UC3843DTR SOIC D 14 2500 333.2 345.9 28.6

UC3844D8TR SOIC D 8 2500 340.5 338.1 20.6

UC3844DTR SOIC D 14 2500 333.2 345.9 28.6

UC3845D8TR SOIC D 8 2500 340.5 338.1 20.6

UC3845DTR SOIC D 14 2500 333.2 345.9 28.6

PACKAGE MATERIALS INFORMATION

www.ti.com 19-Mar-2008

Pack Materials-Page 2


18/27

MECHANICAL DATA

MCER001A JANUARY 1995 REVISED JANUARY 1997

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE

0.310 (7,87)

0.290 (7,37)

0.014 (0,36)

0.008 (0,20)

Seating Plane

4040107/C 08/96

5

4

0.065 (1,65)

0.045 (1,14)

8

1

0.020 (0,51) MIN

0.400 (10,16)

0.355 (9,00)

0.015 (0,38)

0.023 (0,58)

0.063 (1,60)

0.015 (0,38)

0.200 (5,08) MAX

0.130 (3,30) MIN

0.245 (6,22)

0.280 (7,11)

0.100 (2,54)

015

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a ceramic lid using glass frit.

D. Index point is provided on cap for terminal identification.

E. Falls within MIL STD 1835 GDIP1-T8


19/27


20/27


21/27


22/27


23/27


24/27

MECHANICAL DATA

MPLC004A OCTOBER 1994

1POST OFFICE BOX 655303 DALLAS, TEXAS 75265

FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER

4040005/ B 03/95

20 PIN SHOWN

0.026 (0,66)

0.032 (0,81)

D2/E2

0.020 (0,51) MIN

0.180 (4,57) MAX0.120 (3,05)

0.090 (2,29)

D2/E2

0.013 (0,33)

0.021 (0,53)

Seating Plane

MAX

D2/E2

0.219 (5,56)

0.169 (4,29)

0.319 (8,10)

0.469 (11,91)

0.569 (14,45)

0.369 (9,37)

MAX

0.356 (9,04)

0.456 (11,58)

0.656 (16,66)

0.008 (0,20) NOM

1.158 (29,41)

0.958 (24,33)

0.756 (19,20)

0.191 (4,85)

0.141 (3,58)

MIN

0.441 (11,20)

0.541 (13,74)

0.291 (7,39)

0.341 (8,66)

18

19

14

13

D

D1

13

9

E1E

4

8

MINMAXMIN

PINS**

20

28

44

0.385 (9,78)

0.485 (12,32)

0.685 (17,40)

52

68

84 1.185 (30,10)

0.985 (25,02)

0.785 (19,94)

D/E

0.395 (10,03)

0.495 (12,57)

1.195 (30,35)

0.995 (25,27)

0.695 (17,65)

0.795 (20,19)

NO. OF D1/E1

0.350 (8,89)

0.450 (11,43)

1.150 (29,21)

0.950 (24,13)

0.650 (16,51)

0.750 (19,05)

0.004 (0,10)

M0.007 (0,18)

0.050 (1,27)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-018


25/27


26/27


27/27

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of salesupplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms

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slus223c current mode pwm controller (rev. c)

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