sige semiconductor devices for cryogenic power electronics – iii
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SiGe Semiconductor Devices for Cryogenic Power Electronics – III. IMAPS Advanced Technology Workshop on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments. Pasadena, 21-23 February 2005. Outline. The Team and Coordination Goals & Applications - PowerPoint PPT PresentationTRANSCRIPT
SiGe Semiconductor Devices for
Cryogenic Power Electronics – III
IMAPS Advanced Technology Workshop on Reliability of Advanced
Electronic Packages and Devices in Extreme Cold Environments
Pasadena, 21-23 February 2005
2
Outline
> The Team and Coordination
• Goals & Applications
• Technical Objectives & Approach
• SiGe Cryo Power HBTs
• SiGe Cryo Power Converters
• Summary & Plans
3
R. R. Ward, W. J. Dawson, L. Zhu, R. K. Kirschman
GPD Optoelectronics Corp., Salem, New Hampshire
G. Niu, R. M. Nelms
Auburn University, Dept. of Electrical and Computer
Engineering, Auburn, Alabama
O. Mueller, M. J. Hennessy, E. K. Mueller
MTECH Labs./LTE, Ballston Lake, New York
R. L. Patterson, J. E. DickmanNASA Glenn Research Center, Cleveland, Ohio
A. HammoudQSS Group Inc., Cleveland, Ohio
The Team
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NASA SBIR Phase I and II
DARPA STTR Phase I
Coordination
5
Outline
• The Team and Coordination
> Goals & Applications
• Technical Objectives & Approach
• SiGe Cryo Power HBTs
• SiGe Cryo Power Converters
• Summary & Plans
6
Overall Goal
• Semiconductor devices (diodes and transistors)
• For power management and distribution (PMAD)
– Electrical power storage and transmission
– Power conversion for motors/generators
• For superconducting or cryogenic systems
• Temperatures down to ~20 K
7
NASA Interest
• Cryogenic systems for spacecraft/aerospace
• Cold Solar System sites
• Fly-by, orbiting, landers, rovers, penetrators, ...
• Propulsion systems
• Power generation/storage/distribution systems
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Solar System Temperatures
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Temperatures for Spacecraft
TemperatureBody or location
(°C) (K)
Phobos (satellite of Mars)a –112 160
Moona –150 120
Eros (near-Earth asteroid)a –150 120
Jupiter orbitb –150 120
Europa (satellite of Jupiter) –160 110
Saturn orbitb –180 90
Titan (satellite of Saturn) –180 90
Uranus orbitb –210 60
Neptune orbitb –220 50
Pluto orbitb –230 44
Triton (satellite of Neptune) –235 38
Interstellar spaceb <–233 <40
a“Nighttime” temperature. bBlack-body equilibrium temperature.
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Specific NASA Technical Goals
• Demonstrate SiGe devices at cryogenic temperatures,
down to ~20 K
• Device types: SiGe HBTs, MOSFETs, IGBTs
• Demonstrate SiGe superiority over Si devices for
cryogenic power circuits
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Separate STTR Program from DARPA
Phase I, June - December 2004 with Auburn University
Coordination
NASA SBIR HBTs, MOSFETs,(IGBTs)
20 K “Medium” power,~100 W*
DARPA STTR Diodes, thyristors,circuits
55 K “High” power,100 W (Phase I)*1000 W (Phase II)*
*Converted power capability.
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Coordination – Goals
Device/circuit Project I (A) V (V) P (W) f (MHz) T (K) Notes
HBT NASA SBIR Ph II 2 100 - - - 0.1 to 20
MOSFET NASA SBIR Ph II 2 (5) 40 (100) - - - 0.1 (1) to 20 [1]
IGBT (if possible) NASA SBIR Ph II 2 (5) 100 (200) - - - 0.1 (0.5) to 20 [1]
Diode DARPA STTR Ph I 10 300 - - - - - - to 55 [2]
Thyristor simulate DARPA STTR Ph I - - - - - - - - - - - - to 55 [3]
Thyristor DARPA STTR Ph II 5 >300 - - - - - - to 55 [3]
Power converter DARPA STTR Ph I - - - - - - >/=100 - - - to 55 [4]
Power converter DARPA STTR Ph II - - - - - - >/=1000 - - - to 55 [4]
Power converter DARPA STTR Ph II - - - - - - >/=1000 - - - to 55 [5]
[1] Numbers in parentheses for I, V, f are additional goals beyond the minimum.
[2] Forward voltage, switching speed, and loss superior to that of equivalent Si power diodes.
[3] On-state voltage, switching speed, and loss superior to that of equivalent Si thyristors.
[4] Using SiGe diodes.
[5] Using SiGe thyristors.
grayNASA in bold, DARPA Phase II in
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Outline
• The Team and Coordination
• Goals & Applications
> Technical Approach
• SiGe Cryo Power HBTs
• SiGe Cryo Power Converters
• Summary & Plans
14
Why SiGe?• Incorporate desirable characteristics of Si and Ge
• Can optimize devices for cryogenic applications by selective use of Ge, Si and SiGe
• SiGe provides additional flexibility through band-gap engineering (% of Ge)
• Devices can operate at all cryogenic temperatures (as low as ~ 1 K if required)
• All device types work at cryogenic temperatures–
Diodes
– Field-effect transistors– Bipolar transistors
• Compatible with standard semiconductor processing
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Materials Comparison
Parameter Want Si Ge SiGe
P-N junction forward V Low High Low Medium
Reverse breakdown V High High Low High
Mobility at cryo temps High Med High High
Switching speed High Adequate Adequate High
Operating temp range RT to ~20 K RT to ~100 K(due to BJT)
RT to < 20 K RT to < 20 K
Gate dielectric for MOS High quality,easily produced
Yes Difficult Yes
Compatibility withexisting processing
High High Low High
Bold = Exhibits desirable characteristic, Italic = Predicted
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P-N Junction (Diode) Forward Voltage
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SiGe Bandgap
G. Theodorou et al., “Structural, electronic, and optical properties of strained SiGe alloys,” Phys Rev B, vo.l 50, pp. 18355-18359, 15 Dec. 1994.
0.6
0.7
0.8
0.9
1
1.1
1.2
0 0.2 0.4 0.6 0.8 1
Ge fraction, x
Si1-xGex
Si Ge
90 K
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Outline
• The Team and Coordination
• Goals & Applications
• Technical Objectives & Approach
> SiGe Cryo Power HBTs
• SiGe Cryo Power Converters
• Summary & Plans
19
~0.5 μm n+ Si
~0.4 μm p SiGe
~20 μm n– Si
Emitter contact
~150 μm n+ Si
Collector contact
Base contact
Cryo Power HBT Design Example
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A Cryo Power HBT Die
~4 mm
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Cryo Power HBT Characteristics
20 V
RT
2 A
20 V
1 A
LN
IB = 5 mA
Gain ~ 75
IB = 0.5 mA
Gain ~ 500
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Cryo Power HBT Characteristics
23
Outline
• The Team and Coordination
• Goals & Applications
• Technical Objectives & Approach
• SiGe Cryo Power HBTs
> SiGe Cryo Power Converters
• Summary and Plans
24
SiGe Boost Converter Circuit
Outputcapacitor
SiGe diode
Switching pulse
Inductor
LoadSiGe HBT
+
–
Inputcapacitor
24 V in 48 V out
~10 – 300 K
Drivecircuit
Power supply
+
–
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SiGe 100 W Cryo Boost Converter100 kHz, 24 V in, 48 V out
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SiGe 100 W Cryo Boost ConverterBackside
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LHe vendor’s dewar
LHe
~ 4”
Cu thermal mass/mounting block
SuperinsulationCooling channel(inside Cu block)
Stainless steel tubesGHe vent
Electrical feedthru
~ 8”
Converter circuitry
Cryostat for Measuring 100 W Circuits(variable temperature 300 to ~20 K)
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Cryostat for Measuring 100 W Circuits
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100 W SiGe Power Converter in Cryostat
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SiGe 100 W Cryo Boost Converter Performance
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Outline
• The Team and Coordination
• Goals & Applications
• Technical Objectives & Approach
• SiGe Cryo Power HBTs
• SiGe Cryo Power Converters
> Summary & Plans
32
Summary
• Cryogenic power conversion is of interest for a range of applications within NASA and elsewhere.
• For cryogenic power conversion, SiGe devices are potentially superior to devices based on Si or Ge.
• We have begun development of SiGe semiconductor devices (HBTs and MOSFETs) for cryogenic power applications.
• We have designed, fabricated, and used SiGe HBTs in power converters operating at cryogenic temperatures and converting >100 W.
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Plans• Improve SiGe HBT characteristics (especially at cryo temps)
– By simulation– On voltage– Off breakdown voltage– Switching speed
• Compare power converter performance at cryogenic
temperatures, comparing SiGe HBTs to Si BJTs
• Design, fabricate and use SiGe MOSFETs in cryogenic
power circuits
• If practical, fabricate SiGe IGBTs