sgs germany gmbh test report no.: e25l0002 · sgs germany gmbh, hofmannstr. 50, d-81379 munich is...
TRANSCRIPT
This document was signed electronically.
SGS Germany GmbH, Hofmannstr. 50, D-81379 Munich is accredited by DAkkS for
COMPONENTS TESTING ENVIRONMENTAL ENGINEERING ELECTROMAGNETIC COMPATIBILITY PRODUCT SAFETY
TELECOM CONFORMANCE TESTS
Phone +49 89-787475-100, Fax +49 89-787475-114, Internet www.sgs-cqe.de
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SGS Germany GmbH
Test Report No.: E25L0002
Order No.: E25L Pages: 42 Munich, Oct 26, 2012
Client: ept GmbH
Equipment Under Test: COM Express 0.5 mm SMT board-to-board connector system “Colibri” Part no. male: 401-55101-51 Part no. female: 402-51101-51
Manufacturer: ept GmbH
Task: Qualification of the COM Express 0.5 mm SMT board-to-board connector system “Colibri”
Test Specification(s): [covered by accreditation]
See chapter 2.1
Test Specification(s): [not covered by accreditation]
See chapter 2.2
Result: All test groups were passed.
The results relate only to the items tested as described in this test report. approved by: Date Signature
Garcia-Baglietto Lab Manager Environmental Simulation Oct 29, 2012
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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CONTENTS
1 Summary .................................................................................................................................. 4
2 References ............................................................................................................................... 7
2.1 Specifications covered by accreditation ........................................................................ 7
2.2 Specifications not covered by accreditation .................................................................. 8
3 General Information ................................................................................................................ 9
3.1 Identification of Client .................................................................................................... 9
3.2 Test Laboratory ............................................................................................................. 9
3.3 Time Schedule .............................................................................................................. 9
3.4 Participants ................................................................................................................... 9
4 Equipment Under Test .......................................................................................................... 10
5 Test Equipment ...................................................................................................................... 11
5.1 Test Facility ................................................................................................................. 11
5.2 Measuring Equipment ................................................................................................. 11
6 Test Specifications and Results .......................................................................................... 13
6.1 General ....................................................................................................................... 13
6.1.1 Insulation Resistance and Dielectric withstanding voltage ..................................... 13
6.1.2 Contact Resistance ................................................................................................ 13
6.2 Test Group 1: Humidity - Temperature Cycling, Dielectric Withstanding Voltage and Insulation Resistance ........................................................................................... 14
6.3 Test Group 2: Humidity - Temperature Cycling, Termination Resistance .................. 16
6.4 Test Group 3: Vibration and Physical Shock .............................................................. 18
6.5 Test Group 4: Connector Mating and Unmating Force and Durability ........................ 23
6.6 Test Group 5: Solderability ......................................................................................... 26
6.7 Test Group 7: Thermal Shock .................................................................................... 27
6.8 Test Group 8: Salt Spray ............................................................................................ 31
6.9 Test Group 9: Industrial Gas (SO2) ............................................................................. 33
6.10 Test Group 10: Temperature Life (Heat Aging) .......................................................... 36
6.11 Test Group 11: Resistance to Cold............................................................................. 39
7 Disclaimer .............................................................................................................................. 42
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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LIST OF FIGURES Fig. 1 Diagram of humidity-temperature cycling ............................................................ 15 Fig. 2 Diagram of sinus vibration ................................................................................... 19 Fig. 3 Diagram of physical shock + direction................................................................. 20 Fig. 4 Diagram of physical shock - direction ................................................................. 20 Fig. 5 Diagram of contact disturbance .......................................................................... 21 Fig. 6 Diagram of temperature shock ............................................................................ 28 Fig. 7 Diagram of temperature life ................................................................................. 37 Fig. 8 Diagram of resistance to cold .............................................................................. 40 LIST OF TABLES Table 1 Results TG1-3 ....................................................................................................... 4 Table 2 Results TG 4, 5 and 7 ........................................................................................... 5 Table 3 Results TG 8-11 .................................................................................................... 6 Table 4 Contact resistance TG 2 ..................................................................................... 17 Table 5 Contact resistance TG 3 ..................................................................................... 22 Table 6 Contact resistance TG 4 ..................................................................................... 25 Table 7 Unmating and mating forces ............................................................................... 25 Table 8 Contact resistance TG 7 ..................................................................................... 30 Table 9 Contact resistance TG 8 ..................................................................................... 32 Table 10 Contact resistance TG 9 ..................................................................................... 35 Table 11 Contact resistance TG 10 ................................................................................... 38 Table 12 Contact resistance TG 11 ................................................................................... 41 LIST OF PHOTOS Pic. 1 Female connector on PCBs for contact disturbance ........................................... 10 Pic. 2 Male connector on PCBs for contact disturbance ............................................... 10 Pic. 3 Female connector on PCBs for contact resistance ............................................. 10 Pic. 4 Male connector on PCBs for contact resistance ................................................. 10 Pic. 5 Female connector on PCBs for insulation resistance and dielectric withstanding
voltage ................................................................................................................. 10 Pic. 6 Male connector on PCBs for insulation resistance and dielectric withstanding
voltage ................................................................................................................. 10 Pic. 7 PCB layer 1 contact resistance ........................................................................... 13 Pic. 8 PCB layer 2 contact resistance ........................................................................... 13 Pic. 9 Samples in the climatic chamber ........................................................................ 14 Pic. 10 Samples mounted for vibration and physical shock ............................................ 19 Pic. 11 Samples during durability .................................................................................... 24 Pic. 12 Test equipment for solderability .......................................................................... 26 Pic. 13 Samples in the temperature shock chamber ....................................................... 28 Pic. 14 Samples in the salt mist chamber ....................................................................... 31 Pic. 15 Samples in the chamber for Industrial atmosphere ............................................. 33 Pic. 16 Samples in the chamber for dry heat .................................................................. 36 Pic. 17 Samples in the climatic chamber for resistance to cold ...................................... 39
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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1 Summary
The following table gives an overview of the results of the individual test groups.
Test group Test Parameter Test Severity No. of Test Samples
Test passed?Y/N
1
Visual Inspection Magnification Naked eye
2 Y
Insulation Resistance Voltage Duration
500 V DC 60 s
Dielectric Withstanding Voltage
Voltage Duration
0,2 k V AC 60 s
Humidity – Temperature Cycling
Temperature Humidity Cycles
25~65°C 95%r.h. 10
Insulation Resistance Voltage Duration
500 V DC 60 s
Dielectric Withstanding Voltage
Voltage Duration
0,2 k V AC 60 s
Visual Inspection Magnification Naked eye
2
Visual Inspection Magnification Naked eye
2 Y
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Humidity – Temperature Cycling
Temperature Humidity Cycles
25~65°C 95%r.h. 10
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Visual Inspection Magnification Naked eye
3
Visual Inspection Magnification Naked eye
1+3 Y
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Contact Disturbance Voltage Max. Current Discontinuity
10 V 100 mA ≤ 1µsec.
Vibration
Displacement Acceleration
Frequency rangeSweep rate Number of sweeps Axes of vibrationDuration per axis
1,52 m 18,5 g 10-55-10 Hz 4,92 oct/min 77 3 2 h
Physical Shock
Pulse Shape Acceleration Shock duration Number of ShocksDirections of Shocks
half sine 490 m/s² 11 ms 3 in each dir. 6
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Visual Inspection Magnification Naked eye
Table 1 Results TG1-3
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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Test group Test Parameter Test Severity No. of Test
Samples Test passed?Y/N
4
Visual Inspection Magnification Naked eye
2+2 Y
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Insulation Resistance Voltage Duration
500 V DC 60 s
Dielectric Withstanding Voltage
Voltage Duration
0,2 k V AC 60 s
Unmating and Mating Force
Pull speed Direction
100 mm/min Along contact
Durability (Repeated Mate and Unmating)
Pull speed Direction No. of Cycles
100 mm/min Along contact 47 cycles
Unmating and Mating Force
Pull speed Direction
100 mm/min Along contact
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Insulation Resistance Voltage Duration
500 V DC 60 s
Dielectric Withstanding Voltage
Voltage Duration
0,2 k V AC 60 s
Visual Inspection Magnification Naked eye
5
Visual Inspection Magnification 6x
6 Single pins
Y Solderability
Solder temperature Immersion duration Flux
230±5°C 3±0,5seconds SSK 15
Visual Inspection Magnification 6x
7
Visual Inspection Magnification Naked eye
4 Y
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Thermal Shock
TU
TO
Cycles Transition time
-40 °C/30min. +85 °C/30min. 5 < 10 s
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Visual Inspection Magnification Naked eye
Table 2 Results TG 4, 5 and 7
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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Test group Test Parameter Test Severity No. of Test
Samples Test passed?Y/N
8
Visual Inspection Magnification Naked eye
2 Y
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Salt Spray Salt Concentration Duration
5% 24h
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Visual Inspection Magnification Naked eye
9
Visual Inspection Magnification Naked eye
4 Y
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Industrial Gas (SO2)
SO2 Temperature
10ppm 25°C
Humidity Duration
95%r.h. 24h
Mated connector
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Visual Inspection Magnification Naked eye
10
Visual Inspection Magnification Naked eye
4 Y
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Temperature Life (Heat Aging)
Temperature Duration
85°C 96h
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Visual Inspection Magnification Naked eye
11
Visual Inspection Magnification Naked eye
4 Y
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Resistance to Cold Temperature Duration
-40°C 96h
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
Visual Inspection Magnification Naked eye
Table 3 Results TG 8-11
For detailed results see chapter 6.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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2 References
2.1 Specifications covered by accreditation
[1] IEC 60512-1-1: 2002-02 Connectors for electronic equipment – Tests and measurements – Part 1-1: General examination – Test 1a: Visual examination
[2] IEC 60512-2-1: 2002-02 Connectors for electronic equipment – Tests and measurements – Part 2-1: Electrical continuity and contact resistance tests – Test 2a: Contact resistance – Millivolt level method
[3] IEC 60512-2-5: 2003-05 Connectors for electronic equipment – Tests and measurements – Part 2-2: Electrical continuity and contact resistance tests – Test 2e: Contact disturbance
[4] IEC 60512-3-1: 2002-02 Connectors for electronic equipment – Tests and measurements – Part 3-1: Insulation tests – Test 3a: Insulation resistance
[5] IEC 60512-11-9: 2002-02 Connectors for electronic equipment – Tests and measurements – Part 11-9: Climatic tests – Test 11i: Dry heat
[6] IEC 60512-11-9: 2002-02 Connectors for electronic equipment – Tests and measurements – Part 11-10: Climatic tests – Test 11j: Cold
[7] IEC 60512-13-2: 2006-02 Connectors for electronic equipment – Tests and measurements Part 13-2: Mechanical operation tests – Test 13b: Insertion and withdrawal forces
[8] IEC 60512-4-1: 2003-05 Connectors for electronic equipment – Tests and measurements Part 4-1: Voltage stress test - Test 4a: Voltage proof
[9] IEC 60068-2-30: 2005-8 Environmental testing – Part 2-30: Tests – Test DB: Damp heat, cyclic (12h + 12h cycle)
[10] IEC 60068-2-6: 2007-12 Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
[11] IEC 60068-2-14: 2009-01 Environmental testing – Part 2-14: Tests – Test N: Change of temperature
[12] IEC 60068-2-27: 2008-02 Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
[13] IEC 60068-2-1: 2008-01 Environmental testing – Part 2-1: Tests – Test A: Cold
[14] IEC 60068-2-2: 2008-05 Environmental testing – Part 2-2: Tests – Test B: Dry heat
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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[15] IEC 60068-2-42: 2004-04 Environmental testing – Part 2-42: Tests – Test KC: Sulphur dioxide tests for contacts and connections
[16] IEC 60068-2-20: 2008-07 Environmental testing – Part 2: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads Solder Bath
2.2 Specifications not covered by accreditation
[17] AMP 108-5560: 1999-11 Product Specification Rev. A1
[18] MIL-STD-202G: 2002-02 Department of Defence, Test Method Standard for Electronic and Electrical Components Parts Method 101E
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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3 General Information
3.1 Identification of Client
ept GmbH Technischer Innendienst Bergwerkstr. 50 86971 Peiting
3.2 Test Laboratory
SGS Germany GmbH Hofmannstraße 50 81379 München
3.3 Time Schedule
Delivery of EUT: Sep 17, 2012 Start of test: Sep 17, 2012 End of test: Oct 17, 2012
3.4 Participants
Name Function Phone E-Mail
Michael Dermühl Accredited testing +49 89 787475-322 [email protected]
Claus-Peter Finsterer Accredited testing +49 89 787475-323 [email protected]
Michael Schwarzenböck
Accredited testing, Editor
+49 89 787475-326 [email protected]
Sebastian Nier Accredited testing +49 89 787475-319 [email protected]
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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4 Equipment Under Test
Pic. 1 Female connector on PCBs for contact disturbance
Pic. 2 Male connector on PCBs for contact disturbance
Pic. 3 Female connector on PCBs for contact resistance
Pic. 4 Male connector on PCBs for contact resistance
Pic. 5 Female connector on PCBs for insulation resistance and dielectric withstanding voltage
Pic. 6 Male connector on PCBs for insulation resistance and dielectric withstanding voltage
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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5 Test Equipment
5.1 Test Facility
The measurements were carried out by SGS Germany GmbH, Department Environmental Simulation, Hofmannstraße 50, 81379 München, Germany.
5.2 Measuring Equipment
ID No. Equipment Type Manufacturer Status Last Cal. Next Cal. S5916 System switch /
Multimeter 3706 Keithley cnn
S5970 Laptop ThinkPad Lenovo cnn S3242 Micro-
Ohmmeter 580 Keithley cal Feb 03,
2012 Feb 2014
S0398 Megohmmeter M1500P Sefelec cpu S0092 High Voltage
Tester HA 2000D SPS Elektronik cal Oct 17,
2011 Oct 2013
S3266 Handheld Multimeter
97 Escort cal Oct 27, 2011
Oct 2013
S0094 Universal Testing Machine
144660 Zwick cal Mar 02, 2011
Mar 2013
S0213 Force Meter 10 kN Zwick cal Mar 01, 2011
Mar 2013
S5534 SUA Spray Chest
5400 Weiss
S6142 Contact Disturbance Test System
Gnostic64 QED ind
S0473 Oscilloscope D1011 Siemens ind S0796 External
Display L44RS1A8 Newport ind
S1421 Sliding Table VIB 2000
ET900/700 ELIN cnn
S5419 Vibration Control and Analysis System (VIB2000)
Vibrunner Agilent cal Feb 22, 2012
Feb 2013
S5450 Software Version 2.10.28
Vib Control/NT f. VIB 2000
M&P cnn
S5793 Vibration Exciter VIB2000
SW 8140 RMS cnn
S5794 Cooling Unit VIB2000
SWG 731/5 RMS cnn
S5795 Amplifier VIB2000
TGE 10-5 RMS cnn
S5956 Control PC VIB2000
Lenovo ThinkCentre
Lenovo cnn
S0044 Discussion Microscope
355110 Leitz ind
S5497 Test Chamber Climate
VC 7034 Vötsch chk Jun 25, 2012
Jun 2013
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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ID No. Equipment Type Manufacturer Status Last Cal. Next Cal. S5949 SO2 Analyzer
(Single Gas) SSM 6000 Pronova ind
S5771 Dosing Pump Ritmo R05-30 Fink Chem+Tech ind S0682 Membrane
Pump MZ2C cnn
S5663 Temp. Shock Chamber
VT 7012 S2 Vötsch chk Jul 09, 2012
Jul 2013
S0203 Test Chamber Temperature
T6060 Heraeus ind
S5691 Climatic Chamber
VCL 6003 Vötsch chk Mar 05, 2012
Mar 2013
S3117 Temperature Chamber
VCS 7034-5 Heraeus Vötsch chk Jun 19, 2012
Jun 2013
cal = Calibration, car = Calibration restricted use, chk = Check, chr = Check restricted use, cpu = Check prior to use, calchk = Calibration and check, ind = for indication only, cnn = Calibration not necessary
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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6 Test Specifications and Results
The test results in the report refer exclusively to the test object described in section 4 and the test period in section 3.3.
6.1 General
6.1.1 Insulation Resistance and Dielectric withstanding voltage
In a number of the test groups the insulation resistance and dielectric withstanding voltage was measured. The measurement method pins against neighbouring pins were performed.
6.1.2 Contact Resistance
In a number of the test groups the contact resistance was measured. 22 contacts were measured out of 220 contacts on the connector. The contacts of the shielding sheet were not monitored.
Pic. 7 PCB layer 1 contact resistance Pic. 8 PCB layer 2 contact resistance
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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6.2 Test Group 1: Humidity - Temperature Cycling, Dielectric Withstanding Voltage and Insulation Resistance
Test Specification
In this test group 2 connector pairs were tested. Test Parameter Test Severity Reference Method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Insulation Resistance Voltage Duration
500 V DC 60 s
IEC 60512-3-1 3a: Insulation resistance
Dielectric Withstanding Voltage
Voltage Duration
0,2 k V AC 60 s
IEC 60512-4-1 4a: Voltage proof
Humidity – Temperature Cycling
Temperature Humidity Cycles
25~65°C 95%r.h. 10
IEC 60068-2-30 AMP 108-5560
Test Db: Damp, cyclic (12h + 12h cycle) Product specification
Insulation Resistance Voltage Duration
500 V DC 60 s
IEC 60512-3-1 3a: Insulation resistance
Dielectric Withstanding Voltage
Voltage Duration
0,2 k V AC 60 s
IEC 60512-4-1 4a: Voltage proof
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Requirements:
• Limit for the initial insulation resistance: Min. 500MΩ • Limit for the final insulation resistance: Min. 100MΩ • Limit for the dielectric withstanding voltage: No creeping discharge. Nor flashover shall
occur. Current leakage: 5mA Max.
Test Performance
Pic. 9 Samples in the climatic chamber
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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Fig. 1 Diagram of humidity-temperature cycling Test Results Visual Inspection The initial visual inspection showed no abnormalities. The final visual examination showed no differences compared to the initial one. Insulation Resistance and Dielectric withstanding voltage The requirement for the insulation resistance and withstanding voltage was met.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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6.3 Test Group 2: Humidity - Temperature Cycling, Termination Resistance
Test Specification
In this test group 2 connector pairs were tested. Test Parameter Test Severity Reference Method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Humidity – Temperature Cycling
Temperature Humidity Cycles
25~65°C 95%r.h. 10
IEC 60068-2-30 AMP 108-5560
Test Db: Damp, cyclic (12h + 12h cycle) Product specification
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Requirements: • Limit for the initial contact resistance: Max. 55mΩ • Limit for the final contact resistance: Max. ΔR=20mΩ
Test Performance See chapter 6.2 Test Results Visual Inspection The initial visual inspection showed no abnormalities. The final visual examination showed no differences compared to the initial one. Contact Resistance The requirement for the contact resistance was met.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
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Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,01816 0,01876988 0,00061 1 0,01884 0,02039093 0,001552 0,01919 0,01955102 0,00036 2 0,01942 0,01893281 -0,000493 0,01884 0,01925165 0,00041 3 0,02054 0,01944655 -0,001094 0,01916 0,01946004 0,00030 4 0,02021 0,01892444 -0,001295 0,01906 0,01922123 0,00016 5 0,02176 0,02023246 -0,001536 0,01900 0,01920206 0,00020 6 0,02052 0,01924084 -0,001287 0,01930 0,01903646 -0,00026 7 0,02009 0,01933096 -0,000768 0,01917 0,01884361 -0,00033 8 0,01953 0,01949041 -0,000049 0,01859 0,01841561 -0,00018 9 0,01886 0,01893792 0,0000810 0,01898 0,01932996 0,00035 10 0,01848 0,01844764 -0,0000311 0,01824 0,01916551 0,00093 11 0,01848 0,01892231 0,0004412 0,01760 0,01788575 0,00029 12 0,01768 0,01877093 0,0010913 0,01750 0,0172231 -0,00028 13 0,01795 0,0177582 -0,0001914 0,01738 0,01728708 -0,00009 14 0,01856 0,01851402 -0,0000415 0,01733 0,01720193 -0,00012 15 0,01820 0,01800328 -0,0001916 0,01760 0,01762327 0,00002 16 0,01816 0,01838338 0,0002217 0,01728 0,01770173 0,00042 17 0,01799 0,01831051 0,0003218 0,01716 0,01751836 0,00036 18 0,01917 0,01907283 -0,0000919 0,01753 0,01789596 0,00036 19 0,01844 0,01902032 0,0005820 0,01748 0,0175493 0,00007 20 0,01884 0,01921392 0,0003721 0,01783 0,01838447 0,00055 21 0,01919 0,01898092 -0,0002122 0,01785 0,01805576 0,00021 22 0,02011 0,01964163 -0,00047
Min 0,01716 0,01720 -0,00033 Min 0,01768 0,01776 -0,00153Max 0,01930 0,01955 0,00093 Max 0,02176 0,02039 0,00155
Average 0,01819 0,01839 0,00020 Average 0,01914 0,01900 -0,00014
2
RC in Ω
1
RC in Ω
Table 4 Contact resistance TG 2
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 18 / 42
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6.4 Test Group 3: Vibration and Physical Shock
Test Specification
In this test group 4 connector pairs were tested. For 1 samples contact resistance was measured and for the other three samples contact disturbance was measured. Test Parameter Test Severity Reference Method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Contact Disturbance Voltage Max. Current Discontinuity
10 V 100 mA ≤ 1µsec.
IEC 60512-2-5 AMP 108-5560
2e: Contact disturbance Product specification
Vibration Displacement Acceleration
Frequency range Sweep rate Number of sweepsAxes of vibration Duration per axis
1,52 m 18,5 g 10-55-10 Hz 4,92 oct/min 77 3 2 h
IEC 60068-2-6 AMP 108-5560
Fc: Vibration (sinusoidal) Product specification
Physical Shock Pulse Shape Acceleration Shock duration Number of ShocksDirections of Shocks
half sine 490 m/s² 11 ms 3 in each dir. 6
IEC 60068-2-27 AMP 108-5560
Ea: Shock Product specification
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Requirements:
• Limit for the initial contact resistance: Max. 55mΩ • Limit for the final contact resistance: Max. ΔR=20mΩ • Limit for the electrical discontinuity: ≤ 0,1µs
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 19 / 42
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Test Performance For vibration and shock the samples were mounted to an aluminium mounting plate with a thickness of 30 mm. Those were fixed over a rigid aluminium cube to the shaker table. For vibration and shock 3 connectors were monitored for discontinuity. All contacts of one connector were connected in series and build one channel. Thus in total three channels were monitored.
Pic. 10 Samples mounted for vibration and physical shock
10 15 20 25 30 35 40 45 50 55
[Hz]
0,1
1
10
100 [g]
Chan.no: 1Chan.type: CW FilteredSweep type: logarithmicSweeps done: 239Sweeps req.: 240Sweep direct.: upSweep rate: 4,92 Oct/minContr.strat.: MaximumUnit: gContr.strat.: Closed loop -- Testing time --elapsed: 002:00:00remaining: 000:00:00 Date: 09-28-12Time: 14:09:00
Mounting PlateSine
Fig. 2 Diagram of sinus vibration
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 20 / 42
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0,00 0,02 0,04 0,06 0,08 0,10 0,12 0,14 0,16 0,18 0,20 0,22 0,25
[s]
-10
-5
0
5
10
15
20
25
30
35
40
45
50
[g]
Chan.no: 1Chan.type: C Level: 0.0 dBResolution: 2.44e-004 sUnit: gPeak (act.): 50.46 Peak (req.): 50 -- Pulses on act. level --done: 3remaining: 0 -- Pulses total --done: 13remaining: 6 Date: 10-01-12Time: 10:13:45
Mounting plateClassical Shock
Fig. 3 Diagram of physical shock + direction
0,00 0,02 0,04 0,06 0,08 0,10 0,12 0,14 0,16 0,18 0,20 0,22 0,25
[s]
-40
-35
-30
-25
-20
-15
-10
-5
0
5
[g]
Chan.no: 1Chan.type: C Level: -3.0 dBResolution: 2.44e-004 sUnit: gPeak (act.): -36.26 Peak (req.): -35.4 -- Pulses on act. level --done: 3remaining: 0 -- Pulses total --done: 16remaining: 3 Date: 10-01-12Time: 10:13:51
Mounting plateClassical Shock
Fig. 4 Diagram of physical shock - direction
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 21 / 42
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Test Results Visual Inspection The initial visual inspection showed no abnormalities. The final visual examination showed no differences compared to the initial one. Monitoring for Discontinuity During the test no contact interruptions were detected, thus the requirement for electrical discontinuity was met.
Fig. 5 Diagram of contact disturbance Contact Resistance The requirement for the contact resistance was met.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 22 / 42
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Sample Contact no. Initial Post test Δ to initial1 0,01893 0,01933 0,000402 0,01915 0,01943 0,000283 0,01828 0,01861 0,000334 0,01778 0,01817 0,000395 0,01871 0,01874 0,000036 0,01856 0,01866 0,000107 0,01844 0,01856 0,000128 0,01864 0,01866 0,000029 0,01895 0,01880 -0,0001510 0,01793 0,01823 0,0003011 0,01868 0,01880 0,0001112 0,01754 0,01747 -0,0000613 0,01871 0,01942 0,0007114 0,01750 0,01753 0,0000315 0,01787 0,01786 -0,0000216 0,01807 0,01801 -0,0000617 0,01803 0,01806 0,0000318 0,01853 0,01834 -0,0001819 0,01802 0,01802 0,0000020 0,01830 0,01832 0,0000221 0,01866 0,01886 0,0002122 0,01898 0,01986 0,00088
Min 0,01750 0,01747 -0,00018Max 0,01915 0,01986 0,00088
Average 0,01838 0,01853 0,00016
1
RC in Ω
Table 5 Contact resistance TG 3
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 23 / 42
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6.5 Test Group 4: Connector Mating and Unmating Force and DurabilityTest Specification
In this test group 4 connector pairs were tested. For 2 samples contact resistance was measured and for the other both samples insulation resistance and dielectric withstanding voltage was measured. Test Parameter Test Severity Reference Method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Insulation Resistance Voltage Duration
500 V DC 60 s
IEC 60512-3-1 3a: Insulation resistance
Dielectric Withstanding Voltage
Voltage Duration
0,2 k V AC 60 s
IEC 60512-4-1 4a: Voltage proof
Unmating and Mating Force
Pull speed Direction
100 mm/min Along contact
IEC 60512-13-2 13b: Insertion and withdrawal forces
Durability (Repeated Mate and Unmating)
Pull speed Direction No. of Cycles
100 mm/min Along contact 47 cycles 1
AMP 108-5560 Product specification
Unmating and Mating Force
Pull speed Direction
100 mm/min Along contact
IEC 60512-13-2 13b: Insertion and withdrawal forces
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Insulation Resistance Voltage Duration
500 V DC 60 s
IEC 60512-3-1 3a: Insulation resistance
Dielectric Withstanding Voltage
Voltage Duration
0,2 k V AC 60 s
IEC 60512-4-1 4a: Voltage proof
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Requirements:
• Limit for the initial contact resistance: Max. 55mΩ • Limit for the final contact resistance: Max. ΔR=20mΩ • Limit for the initial insulation resistance: Min. 500MΩ • Limit for the final insulation resistance: Min. 100MΩ • Limit for the dielectric withstanding voltage: No creeping discharge. Nor flashover shall
occur. Current leakage: 5mA Max. • Limit for the mating forces: Max. 198N / connector. Data supplied by the customer • Limit for the unmating forces: Min. 22N / connector. Data supplied by the customer
1 Customer requirement
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 24 / 42
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Test Performance
Pic. 11 Samples during durability Test Results Visual Inspection The initial visual inspection showed no abnormalities. The final visual examination showed no abnormalities. Connector Mating and Unmating Forces The requirement for the mating and unmating forces was met. For detailed results see chapter 7. Insulation Resistance and Dielectric withstanding voltage The requirement for the insulation resistance and withstanding voltage was met. Contact Resistance The requirement for the contact resistance was met.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 25 / 42
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Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,01850 0,01956 0,00107 1 0,01888 0,02006 0,001192 0,01832 0,01936 0,00104 2 0,01978 0,02063 0,000853 0,01893 0,01837 -0,00056 3 0,02047 0,02279 0,002324 0,01898 0,01849 -0,00049 4 0,02062 0,02159 0,000975 0,01940 0,01822 -0,00118 5 0,02080 0,02613 0,005336 0,01840 0,01868 0,00028 6 0,02060 0,02320 0,002607 0,01907 0,01854 -0,00052 7 0,02000 0,02263 0,002638 0,01839 0,01872 0,00033 8 0,02046 0,02119 0,000749 0,01857 0,01833 -0,00024 9 0,01934 0,02206 0,0027110 0,01836 0,01899 0,00063 10 0,01935 0,02274 0,0033911 0,01845 0,01832 -0,00013 11 0,01865 0,02268 0,0040312 0,01811 0,02061 0,00250 12 0,01702 0,01556 -0,0014613 0,01831 0,01932 0,00101 13 0,01798 0,01654 -0,0014514 0,01759 0,01810 0,00050 14 0,01722 0,01704 -0,0001815 0,01852 0,01876 0,00024 15 0,01710 0,01753 0,0004316 0,01833 0,01779 -0,00054 16 0,01771 0,02792 0,0102017 0,01785 0,01773 -0,00012 17 0,01695 0,01782 0,0008718 0,01793 0,01769 -0,00024 18 0,01794 0,02029 0,0023519 0,01804 0,01800 -0,00004 19 0,01746 0,02080 0,0033420 0,01860 0,01908 0,00047 20 0,01682 0,02412 0,0073121 0,01794 0,01773 -0,00021 21 0,01695 0,01882 0,0018722 0,01791 0,01806 0,00015 22 0,01710 0,02654 0,00944
Min 0,01759 0,01769 -0,00118 Min 0,01682 0,01556 -0,00146Max 0,01940 0,02061 0,00250 Max 0,02080 0,02792 0,01020
Average 0,01839 0,01857 0,00018 Average 0,01860 0,02130 0,00270
1
RC in Ω
2
RC in Ω
Table 6 Contact resistance TG 4
Unmating Force Mating Force[N] [N]
Initial 69,2 134,8After durability 89,8 91,7
Initial 71,1 91,9After durability 50,8 101,1
Initial 94,6 97,9After durability 26,7 60,2
Initial 60,2 81,8After durability 77,5 89,5
Sample
1
2
3
4
Table 7 Unmating and mating forces
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 26 / 42
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6.6 Test Group 5: Solderability
Test Specification
In this test group 6 single pins were tested. Test Parameter Test Severity Reference Method
Visual Inspection Magnification 6x IEC 60512-1-1 1a: Visual examination
Solderability Solder temperature Immersion duration Flux
230±5°C 3±0,5seconds SSK 15
IEC 60068-2-20 AMP 108-5560
Test T: Soldering Product specification
Visual Inspection Magnification 6x IEC 60512-1-1 1a: Visual examination
Requirements:
• Limit for the wet solder coverage: Min. 95% wet solder coverage Test Performance
Pic. 12 Test equipment for solderability Test Results Visual Inspection The initial visual inspection showed no abnormalities. The final visual examination showed: Wet solder coverage = >95%.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 27 / 42
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6.7 Test Group 7: Thermal Shock
Test Specification
In this test group 4 connector pairs were tested. Test Parameter Test Severity Reference Method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Thermal Shock TU
TO
Cycles Transition time
-40 °C/30min. +85 °C/30min. 5 < 10 s
IEC 60068-2-14 AMP 108-5560
Na: Rapid change of temperature Product specification
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Requirements:
• Limit for the initial contact resistance: Max. 55mΩ • Limit for the final contact resistance: Max. ΔR=20mΩ
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 28 / 42
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Test Performance
Pic. 13 Samples in the temperature shock chamber
Fig. 6 Diagram of temperature shock
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 29 / 42
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Test Results Visual Inspection The initial visual inspection showed no abnormalities. The final visual examination showed no differences compared to the initial one. Contact Resistance The requirement for the contact resistance was met.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 30 / 42
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Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,02067 0,02073 0,00006 1 0,01672 0,01860 0,001882 0,02093 0,02137 0,00044 2 0,02013 0,01996 -0,000173 0,02258 0,02306 0,00048 3 0,02114 0,02109 -0,000064 0,02132 0,02085 -0,00047 4 0,02084 0,02183 0,000995 0,02153 0,02093 -0,00060 5 0,02164 0,02159 -0,000056 0,02089 0,02010 -0,00079 6 0,01968 0,02106 0,001387 0,02044 0,01954 -0,00090 7 0,02101 0,02043 -0,000588 0,02076 0,01984 -0,00092 8 0,02013 0,01920 -0,000939 0,01969 0,01911 -0,00058 9 0,01694 0,01860 0,0016710 0,01841 0,01812 -0,00030 10 0,01756 0,01762 0,0000611 0,01852 0,01884 0,00031 11 0,02073 0,01821 -0,0025312 0,01724 0,01795 0,00071 12 0,01841 0,01854 0,0001313 0,01752 0,01756 0,00004 13 0,01797 0,01775 -0,0002214 0,01733 0,01742 0,00008 14 0,01719 0,01734 0,0001615 0,01737 0,01728 -0,00009 15 0,01794 0,01725 -0,0006916 0,01738 0,01732 -0,00006 16 0,01756 0,01745 -0,0001117 0,01773 0,01772 -0,00001 17 0,01709 0,01721 0,0001318 0,01773 0,01783 0,00011 18 0,01739 0,01739 0,0000019 0,01814 0,01827 0,00012 19 0,01782 0,01750 -0,0003220 0,01742 0,01751 0,00009 20 0,01760 0,01720 -0,0004021 0,01834 0,01907 0,00073 21 0,01796 0,01741 -0,0005522 0,01851 0,01912 0,00062 22 0,01852 0,01809 -0,00043
Min 0,01724 0,01728 -0,00092 Min 0,01672 0,01720 -0,00253Max 0,02258 0,02306 0,00073 Max 0,02164 0,02183 0,00188
Average 0,01911 0,01907 -0,00004 Average 0,01873 0,01870 -0,00003
Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,01858 0,01921 0,00063 1 0,01904 0,01925 0,000212 0,02008 0,02046 0,00037 2 0,01897 0,01921 0,000243 0,02069 0,02067 -0,00003 3 0,01875 0,01916 0,000414 0,02141 0,02114 -0,00027 4 0,01873 0,01925 0,000525 0,02099 0,02084 -0,00015 5 0,01910 0,01968 0,000586 0,02143 0,02107 -0,00036 6 0,01857 0,01890 0,000337 0,02065 0,02016 -0,00049 7 0,01844 0,01843 -0,000018 0,01931 0,01921 -0,00010 8 0,01851 0,01838 -0,000139 0,01845 0,01860 0,00015 9 0,01912 0,01888 -0,0002410 0,01856 0,01883 0,00026 10 0,01874 0,01855 -0,0001911 0,01888 0,01869 -0,00019 11 0,01894 0,01899 0,0000612 0,01709 0,01704 -0,00006 12 0,01892 0,01854 -0,0003813 0,01710 0,01725 0,00016 13 0,01857 0,01863 0,0000514 0,01692 0,01706 0,00014 14 0,01848 0,01849 0,0000115 0,01708 0,01712 0,00004 15 0,01887 0,01876 -0,0001116 0,01688 0,01705 0,00017 16 0,01855 0,01850 -0,0000517 0,01702 0,01717 0,00014 17 0,01849 0,01844 -0,0000518 0,01694 0,01695 0,00001 18 0,01900 0,01927 0,0002719 0,01685 0,01684 -0,00001 19 0,01851 0,01899 0,0004820 0,01727 0,01738 0,00011 20 0,01822 0,01870 0,0004821 0,01733 0,01758 0,00025 21 0,01798 0,01826 0,0002822 0,01825 0,01841 0,00016 22 0,01851 0,01904 0,00053
Min 0,01685 0,01684 -0,00049 Min 0,01798 0,01826 -0,00038Max 0,02143 0,02114 0,00063 Max 0,01912 0,01968 0,00058
Average 0,01854 0,01858 0,00004 Average 0,01868 0,01883 0,00015RC in Ω
12
34
RC in Ω
RC in Ω
RC in Ω
Table 8 Contact resistance TG 7
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 31 / 42
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6.8 Test Group 8: Salt Spray
Test Specification
In this test group 2 connector pairs were tested. Test Parameter Test Severity Reference Method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Salt Spray Salt ConcentrationDuration
5% 24h
MIL-STD 202 AMP 108-5560
Method 101E Product specification
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Requirements:
• Limit for the initial contact resistance: Max. 55mΩ • Limit for the final contact resistance: Max. ΔR=20mΩ
Test Performance
Pic. 14 Samples in the salt mist chamber Test Results Visual Inspection The initial visual inspection showed no abnormalities. The final visual examination showed salt remaining outside of the connector. Contact Resistance The requirement for the contact resistance was met.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 32 / 42
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Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,01844 0,02007 0,00163 1 0,01948 0,02003 0,000552 0,01917 0,02091 0,00174 2 0,02036 0,02152 0,001153 0,01984 0,02131 0,00147 3 0,02197 0,02341 0,001444 0,02003 0,02165 0,00163 4 0,02229 0,02413 0,001845 0,02119 0,02318 0,00199 5 0,02233 0,02447 0,002146 0,02033 0,02195 0,00162 6 0,02154 0,02342 0,001877 0,02194 0,02136 -0,00057 7 0,01974 0,02152 0,001788 0,02004 0,02059 0,00054 8 0,01958 0,02158 0,002009 0,01991 0,02075 0,00084 9 0,01803 0,01963 0,0016010 0,01964 0,01944 -0,00020 10 0,01819 0,01909 0,0009011 0,02047 0,01859 -0,00188 11 0,01850 0,01882 0,0003212 0,01773 0,01816 0,00043 12 0,01878 0,01872 -0,0000613 0,01775 0,01818 0,00043 13 0,01816 0,01872 0,0005714 0,01752 0,01749 -0,00003 14 0,01806 0,01823 0,0001715 0,01733 0,01734 0,00001 15 0,01830 0,01803 -0,0002716 0,01726 0,01722 -0,00004 16 0,01864 0,01850 -0,0001417 0,01740 0,01754 0,00014 17 0,01839 0,01866 0,0002718 0,01761 0,01773 0,00012 18 0,01882 0,01903 0,0002019 0,01774 0,01786 0,00012 19 0,01786 0,01844 0,0005820 0,01769 0,01797 0,00028 20 0,01785 0,01823 0,0003821 0,01781 0,01807 0,00026 21 0,01912 0,01877 -0,0003522 0,01785 0,01913 0,00127 22 0,01875 0,01906 0,00030
Min 0,01726 0,01722 -0,00188 Min 0,01785 0,01803 -0,00035Max 0,02194 0,02318 0,00199 Max 0,02233 0,02447 0,00214
Average 0,01885 0,01939 0,00054 Average 0,01931 0,02009 0,00078RC in Ω
1 2
RC in Ω
Table 9 Contact resistance TG 8
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 33 / 42
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6.9 Test Group 9: Industrial Gas (SO2)
Test Specification
In this test group 4 connector pairs were tested. Test Parameter Test Severity Reference Method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Industrial Gas (SO2)
SO2 Temperature
10ppm 25°C
IEC 60068-2-42 Test Kc: Sulphur dioxide test for contacts and connections
Humidity Duration
95%r.h. 24h
AMP 108-5560 Product specification
Mated connector
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Requirements:
• Limit for the initial contact resistance: Max. 55mΩ • Limit for the final contact resistance: Max. ΔR=20mΩ
Test Performance
Pic. 15 Samples in the chamber for Industrial atmosphere
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 34 / 42
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Test Results Visual Inspection The initial visual inspection showed no abnormalities. The final visual inspection showed some effects:
• Slight discoloration of the shielding sheet. Inside the connector the final visual examination showed now differences compared to the initial one. Contact Resistance The requirement for the contact resistance was met.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 35 / 42
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Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,01821 0,01837 0,00016 1 0,01943 0,01941 -0,000022 0,01863 0,02019 0,00156 2 0,02100 0,02051 -0,000503 0,01905 0,02133 0,00228 3 0,02148 0,02053 -0,000944 0,01945 0,02208 0,00263 4 0,02199 0,02075 -0,001255 0,01999 0,02229 0,00230 5 0,02165 0,02057 -0,001076 0,02056 0,02175 0,00119 6 0,02163 0,02071 -0,000927 0,01909 0,02053 0,00143 7 0,02031 0,01957 -0,000748 0,01914 0,01952 0,00038 8 0,01987 0,01937 -0,000509 0,01825 0,01849 0,00024 9 0,01845 0,01832 -0,0001310 0,01846 0,01830 -0,00016 10 0,01865 0,01849 -0,0001611 0,01977 0,01930 -0,00048 11 0,01782 0,01780 -0,0000212 0,01858 0,01814 -0,00044 12 0,01824 0,01765 -0,0005913 0,01876 0,01848 -0,00027 13 0,01859 0,01856 -0,0000414 0,01781 0,01783 0,00002 14 0,01841 0,01823 -0,0001915 0,01786 0,01778 -0,00007 15 0,01908 0,01873 -0,0003516 0,01833 0,01812 -0,00021 16 0,01875 0,01849 -0,0002617 0,01797 0,01792 -0,00006 17 0,01848 0,01840 -0,0000818 0,01843 0,01813 -0,00030 18 0,01944 0,01936 -0,0000819 0,01776 0,01795 0,00019 19 0,01870 0,01855 -0,0001520 0,01788 0,01809 0,00021 20 0,01863 0,01855 -0,0000821 0,01818 0,01830 0,00012 21 0,01838 0,01835 -0,0000422 0,01797 0,01857 0,00060 22 0,01805 0,01773 -0,00033
Min 0,01776 0,01778 -0,00048 Min 0,01782 0,01765 -0,00125Max 0,02056 0,02229 0,00263 Max 0,02199 0,02075 -0,00002
Average 0,01864 0,01916 0,00051 Average 0,01941 0,01903 -0,00038
Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,01898 0,01889 -0,00009 1 0,01916 0,01946 0,000302 0,01914 0,01812 -0,00101 2 0,02148 0,02164 0,000153 0,02025 0,01849 -0,00176 3 0,02291 0,02336 0,000454 0,02015 0,01813 -0,00202 4 0,02331 0,02348 0,000185 0,02058 0,01863 -0,00195 5 0,02442 0,02452 0,000096 0,02039 0,01846 -0,00193 6 0,02332 0,02346 0,000137 0,01931 0,01808 -0,00123 7 0,02268 0,02266 -0,000028 0,01872 0,01827 -0,00045 8 0,02146 0,02148 0,000029 0,01873 0,01936 0,00063 9 0,02073 0,02074 0,0000110 0,01738 0,01806 0,00068 10 0,01980 0,01987 0,0000811 0,01702 0,01829 0,00127 11 0,01876 0,01931 0,0005512 0,01744 0,01834 0,00091 12 0,01760 0,01776 0,0001613 0,01806 0,01902 0,00095 13 0,01778 0,01774 -0,0000414 0,01700 0,01705 0,00005 14 0,01696 0,01705 0,0000915 0,01699 0,01695 -0,00004 15 0,01720 0,01721 0,0000216 0,01716 0,01709 -0,00007 16 0,01746 0,01742 -0,0000417 0,01800 0,01801 0,00001 17 0,01758 0,01742 -0,0001718 0,01808 0,01807 -0,00001 18 0,01781 0,01767 -0,0001419 0,01779 0,01795 0,00016 19 0,01748 0,01749 0,0000020 0,01789 0,01796 0,00007 20 0,01698 0,01704 0,0000621 0,01760 0,01771 0,00011 21 0,01747 0,01759 0,0001222 0,01897 0,01875 -0,00022 22 0,01755 0,02242 0,00488
Min 0,01699 0,01695 -0,00202 Min 0,01696 0,01704 -0,00017Max 0,02058 0,01936 0,00127 Max 0,02442 0,02452 0,00488
Average 0,01844 0,01817 -0,00027 Average 0,01954 0,01985 0,00031RC in Ω
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RC in Ω
RC in Ω
RC in Ω
Table 10 Contact resistance TG 9
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 36 / 42
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6.10 Test Group 10: Temperature Life (Heat Aging)
Test Specification
In this test group 4 connector pairs were tested. Test Parameter Test Severity Reference Method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Temperature Life (Heat Aging)
Temperature Duration
85°C 96h
IEC 60512-11-9 IEC 60068-2-2 AMP 108-5560
Test 11i: Dry heat Test B: Dry heat Product specification
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Requirements:
• Limit for the initial contact resistance: Max. 55mΩ • Limit for the final contact resistance: Max. ΔR=20mΩ
Test Performance
Pic. 16 Samples in the chamber for dry heat
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 37 / 42
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Fig. 7 Diagram of temperature life Test Results Visual Inspection The initial visual inspection showed no abnormalities. The final visual examination showed now differences compared to the initial one. Contact Resistance The requirement for the contact resistance was met.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 38 / 42
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Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,01955 0,01922 -0,00033 1 0,02037 0,01871 -0,001662 0,02092 0,02022 -0,00070 2 0,01889 0,01902 0,000133 0,02031 0,01986 -0,00045 3 0,01949 0,01911 -0,000384 0,02082 0,02009 -0,00072 4 0,01824 0,01876 0,000535 0,02137 0,02055 -0,00082 5 0,01876 0,01831 -0,000456 0,02067 0,02010 -0,00056 6 0,02004 0,01877 -0,001277 0,02036 0,02066 0,00030 7 0,01913 0,01876 -0,000368 0,02048 0,02036 -0,00012 8 0,01852 0,01850 -0,000019 0,01998 0,02053 0,00056 9 0,01877 0,01879 0,0000210 0,01862 0,01944 0,00082 10 0,01822 0,01867 0,0004511 0,01847 0,01986 0,00139 11 0,01841 0,01935 0,0009412 0,01731 0,01790 0,00059 12 0,01763 0,01757 -0,0000613 0,01719 0,01754 0,00036 13 0,01731 0,01778 0,0004714 0,01706 0,01739 0,00033 14 0,01777 0,01772 -0,0000515 0,01770 0,01795 0,00025 15 0,01718 0,01706 -0,0001216 0,01692 0,01692 0,00001 16 0,01740 0,01744 0,0000417 0,01749 0,01749 0,00000 17 0,01754 0,01742 -0,0001218 0,01781 0,01798 0,00018 18 0,01824 0,01825 0,0000119 0,01818 0,01829 0,00011 19 0,01746 0,01799 0,0005320 0,01792 0,01785 -0,00007 20 0,01768 0,01856 0,0008821 0,01763 0,01757 -0,00006 21 0,01775 0,01886 0,0011122 0,01839 0,01946 0,00106 22 0,01827 0,01951 0,00124
Min 0,01692 0,01692 -0,00082 Min 0,01718 0,01706 -0,00166Max 0,02137 0,02066 0,00139 Max 0,02037 0,01951 0,00124
Average 0,01887 0,01897 0,00010 Average 0,01832 0,01840 0,00008
Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,01772 0,01743 -0,00029 1 0,01979 0,01932 -0,000472 0,01791 0,01774 -0,00018 2 0,01842 0,02073 0,002313 0,01766 0,01721 -0,00045 3 0,02178 0,02289 0,001104 0,01800 0,01771 -0,00029 4 0,02224 0,02323 0,000995 0,01815 0,01799 -0,00017 5 0,02335 0,02439 0,001046 0,01809 0,01780 -0,00029 6 0,02265 0,02298 0,000337 0,01836 0,01814 -0,00022 7 0,02221 0,02330 0,001108 0,01861 0,01855 -0,00006 8 0,02162 0,02192 0,000309 0,01875 0,01861 -0,00014 9 0,02080 0,02125 0,0004610 0,01822 0,01815 -0,00007 10 0,02004 0,02127 0,0012311 0,01803 0,01899 0,00096 11 0,01904 0,01938 0,0003512 0,01845 0,01828 -0,00017 12 0,01453 0,01625 0,0017213 0,01886 0,01905 0,00019 13 0,01470 0,01579 0,0010814 0,01850 0,01830 -0,00020 14 0,01736 0,01727 -0,0000915 0,01847 0,01817 -0,00030 15 0,01586 0,01773 0,0018716 0,01847 0,01843 -0,00004 16 0,01757 0,01903 0,0014617 0,01855 0,01860 0,00005 17 0,01695 0,01733 0,0003818 0,01906 0,01904 -0,00002 18 0,01836 0,01944 0,0010819 0,01985 0,01979 -0,00006 19 0,01713 0,01794 0,0008220 0,01979 0,01962 -0,00018 20 0,01716 0,02142 0,0042721 0,02039 0,02068 0,00028 21 0,01849 0,02431 0,0058222 0,01911 0,02002 0,00091 22 0,02199 0,02631 0,00432
Min 0,01766 0,01721 -0,00045 Min 0,01453 0,01579 -0,00047Max 0,02039 0,02068 0,00096 Max 0,02335 0,02631 0,00582
Average 0,01859 0,01856 -0,00003 Average 0,01918 0,02061 0,00143RC in Ω
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RC in Ω
RC in Ω
RC in Ω
Table 11 Contact resistance TG 10
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 39 / 42
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6.11 Test Group 11: Resistance to Cold
Test Specification
In this test group 4 connector pairs were tested. Test Parameter Test Severity Reference Method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Resistance to Cold Temperature Duration
-40°C 96h
IEC 60512-11-10 IEC 60068-2-1 AMP 108-5560
Test 11j: Cold Test A: Cold Product specification
Contact Resistance Max. Voltage Max. Current
20 mV 100 mA
IEC 60512-2-1 2a: Contact resistance – millivolt level method
Visual Inspection Magnification Naked eye IEC 60512-1-1 1a: Visual examination
Requirements:
• Limit for the initial contact resistance: Max. 55mΩ • Limit for the final contact resistance: Max. ΔR=20mΩ
Test Performance
Pic. 17 Samples in the climatic chamber for resistance to cold
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 40 / 42
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Fig. 8 Diagram of resistance to cold Test Results Visual Inspection The initial visual inspection showed no abnormalities. The final visual examination showed now differences compared to the initial one. Contact Resistance The requirement for the contact resistance was met.
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 41 / 42
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Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,01749 0,01716 -0,00033 1 0,01887 0,01893 0,000062 0,01773 0,01795 0,00022 2 0,01936 0,01934 -0,000023 0,01781 0,01784 0,00003 3 0,01951 0,01975 0,000244 0,01824 0,01838 0,00015 4 0,01960 0,01991 0,000325 0,01812 0,01832 0,00020 5 0,02005 0,02035 0,000296 0,01880 0,01892 0,00011 6 0,01996 0,02013 0,000177 0,01835 0,01848 0,00013 7 0,02044 0,02055 0,000118 0,01771 0,01776 0,00006 8 0,01938 0,01945 0,000079 0,01936 0,01797 -0,00139 9 0,01959 0,01973 0,0001410 0,01799 0,01818 0,00019 10 0,01784 0,01799 0,0001411 0,01880 0,01835 -0,00046 11 0,01769 0,01785 0,0001612 0,01919 0,01907 -0,00011 12 0,01805 0,01800 -0,0000513 0,01961 0,01954 -0,00007 13 0,01804 0,01832 0,0002814 0,01908 0,01903 -0,00005 14 0,01793 0,01785 -0,0000815 0,01880 0,01884 0,00004 15 0,01796 0,01796 0,0000116 0,01907 0,01902 -0,00005 16 0,01857 0,01854 -0,0000317 0,01852 0,01858 0,00006 17 0,01809 0,01812 0,0000218 0,01931 0,01965 0,00035 18 0,01798 0,01800 0,0000219 0,01943 0,01987 0,00044 19 0,01847 0,01839 -0,0000820 0,01963 0,01994 0,00030 20 0,01789 0,01786 -0,0000321 0,01982 0,01939 -0,00043 21 0,01769 0,01771 0,0000222 0,01931 0,01994 0,00062 22 0,01823 0,01879 0,00056
Min 0,01749 0,01716 -0,00139 Min 0,01769 0,01771 -0,00008Max 0,01982 0,01994 0,00062 Max 0,02044 0,02055 0,00056
Average 0,01874 0,01874 0,00000 Average 0,01869 0,01880 0,00011
Sample contact no. Initial Post test Δ to Initial Sample contact no. Initial Post test Δ to Initial1 0,01908 0,01955 0,00047 1 0,01863 0,01898 0,000352 0,02016 0,01974 -0,00042 2 0,01900 0,01858 -0,000423 0,02062 0,02150 0,00088 3 0,01843 0,01770 -0,000734 0,02250 0,02172 -0,00078 4 0,01914 0,01812 -0,001025 0,02089 0,02066 -0,00023 5 0,02037 0,01948 -0,000886 0,02088 0,02078 -0,00010 6 0,01900 0,01817 -0,000837 0,01980 0,01931 -0,00049 7 0,01833 0,01774 -0,000598 0,01984 0,01910 -0,00074 8 0,01803 0,01760 -0,000439 0,01913 0,01901 -0,00012 9 0,01826 0,01798 -0,0002810 0,01870 0,01830 -0,00040 10 0,01845 0,01837 -0,0000911 0,01830 0,01810 -0,00020 11 0,01782 0,01803 0,0002112 0,01725 0,01772 0,00047 12 0,01890 0,01852 -0,0003813 0,01724 0,01805 0,00082 13 0,01862 0,01966 0,0010414 0,01701 0,01718 0,00017 14 0,01880 0,01860 -0,0002015 0,01699 0,01731 0,00033 15 0,01877 0,01880 0,0000316 0,01721 0,01722 0,00001 16 0,01790 0,01796 0,0000617 0,01714 0,01775 0,00062 17 0,01730 0,01737 0,0000718 0,01729 0,01762 0,00033 18 0,01909 0,01905 -0,0000419 0,01688 0,01713 0,00025 19 0,01817 0,01798 -0,0001920 0,01721 0,01731 0,00010 20 0,01793 0,01787 -0,0000621 0,01710 0,01740 0,00031 21 0,01791 0,01798 0,0000622 0,01641 0,01663 0,00022 22 0,01839 0,01850 0,00011
Min 0,01641 0,01663 -0,00078 Min 0,01730 0,01737 -0,00102Max 0,02250 0,02172 0,00088 Max 0,02037 0,01966 0,00104
Average 0,01853 0,01860 0,00007 Average 0,01851 0,01832 -0,00019RC in Ω
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RC in Ω
RC in Ω
RC in Ω
Table 12 Contact resistance TG 11
Test Report No.: E25L0002
Date: Oct 26, 2012 COM Express 0.5 mm SMT board-to-board connector system “Colibri”
page 42 / 42
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7 Disclaimer
This document is issued by the Company under its General Conditions of Service accessible at http://www.sgs.com/en/Terms-and-Conditions.aspx. Attention is drawn to the limitation of liability, indemnification and jurisdiction issues defined therein. Any holder of this document is advised that information contained hereon reflects the Company’s findings at the time of its intervention only and within the limits of Client’s instructions, if any. The Company’s sole responsibility is to its Client and this document does not exonerate parties to a transaction from exercising all their rights and obligations under the transaction documents. Any unauthorized alteration, forgery or falsification of the content or appearance of this document is unlawful and offenders may be prosecuted to the fullest extent of the law.