server memory forum shenzhen 2012 - jedec 800 1,000 1,200 1,400 1,600 1,800 ... tck vs vdd shmoo...
TRANSCRIPT
Big
Iro
nBig
Client
Evolution of IT Infra Architecture
Powerful PC The CloudMainframeServer-Client
The Web : Thin client
The Cloud : Server-Client reintroduced
Cloud with rich clients model driven by increasing power of
Internet-connected devices and the cost-utilization incentives
Context awareness
User experience
Application
responsiveness
Cost reduced byclient utilization
The Cloud : Boundaryless Society
E-mail, SNS, audio/video and collaboration services through virtualized, highly scalable servers blur boundaries
Cloud Infra: Data Center
Family
Friends
Office Connection
The Cloud is growing fast in China
0
200
400
600
800
1,000
1,200
1,400
1,600
1,800
2,000
2009 2010 2011 2012 2013 2014 2015
Total number of x86 server market shipments
Number of servers used in public cloud
China surpassed Japan after 2010 world economic crisisshowing rapid growth of x86 server used in public cloud.
Top 3 Server Markets
(Source : Gartner 2011 Q4) (Source : Gartner 2011 Nov.)
Cloud Growth in China
0
5,000
10,000
15,000
20,000
25,000
2009 2010 2011 2012 2013 2014 2015
US Japan China
revenue [m
illio
ns o
f dolla
rs]
k u
nit s
hip
ment
China > Japan
CAGR=16.9%
CAGR=36.5%
0
5,000
10,000
15,000
20,000
25,000
30,000
35,000
40,000
45,000
50,000
2008 2009 2010 2011 2012 2013 2014 2015
x86 Non x86 (RISC, IA64, others)
Mid-term Sever Market Forecast
x86 server continues proliferating for horizontal scalability. (e.g. the cloud, virtualization) But non-x86 still significant for RAS
& vertical scalability. (e.g. core infrastructure, database)
revenue [m
illio
ns o
f dolla
rs]
(Source : Gartner 2011 Q4)
CAGR=6.7%
Server Revenue by Platform Forecast on x86 Data Center
(Source : IDC 2011 Sep., Hynix)
0
2,000
4,000
6,000
8,000
10,000
12,000
14,000
2010 2014
k u
nit s
hip
ment
Total x86 Server
DC for Enterprise
DC for Cloud11%17%
Big data market can get very big
Forbes.com recently showed a groundbreaking report of forecasting astounding CAGR 58% of big data market reaching $50 billion revenue by 2017. (HW, SW, Services included)
(Source : Forbes.com/Wikibon 2012 Feb)
Requirements for Memory
Highly Parallel Workloads(HPC, Mission Critical)
Light weight workloads(Web Hosting, Contents Delivery)
Standard Workloads
High Density
Scalable PerformanceLow Power
Small Form FactorLow Power
DDR4 as Server Optimized Solution
DDR4 Feature Breakdown
Server
Common
Client
45%
CRCCA Parity
MPRMRS Readout
Fine Granul RefreshTCAR
Max Pwr Saving0.5KB Page
3DSPDA
DBIBoundary Scan
Bank GroupSelf Ref AbortGear Down
Internal VrefDQPASRTCSRCAL
VDDQ Term
Reliability
High Density
Performance
CRC (Cyclic Redundancy Check)
CA Parity (CMD/ADDR Parity)
TCAR (Temperature Compensated Auto Refresh)
MPR (Multi Purpose Register)
PDA (Per DRAM Addressability)
3DS (3 Dimensional Stack)
More than 40% of the new features were derived from server requirements.
Hynix DDR4 Development Status
30nm class 2Gb DDR4 was developed in Q1’11 with the lasted JEDEC spec at the time.
Hynix plans to mass produce JEDEC compliant 20nm class 4Gb DDR4 in 1H’13.
DDR SDRAM Supply Voltage Trend
0
0.5
1
1.5
2
2.5
200120022003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
2.5V
1.8V
1.5V1.35V
1.25V1.2V
1.0xV
DDR
DDR2
DDR3DDR3L
DDR3UDDR4
Su
pp
ly V
olta
ge
[V
]
DDR4L
Year
17%/4years?
25%/3years
17%/4years
17%/4years
DDR4L of 1.0xV anticipated in 2016 if the supply voltage trend can be maintained.
Ultra Low Voltage Operation at 1.0V
tCK vs VDD Shmoo
Passed at 1.0V 2400Mbps
VDD range for DDR4 Spec
Ultra low voltage operation of 2400Mpbs at 1.0V was verified on ATE level with 30nm class 2Gb DDR4.
40% Power Saving compared to DDR3
30nm class 2Gb DDR4 achieved 40% power saving and 35% standby current saving compared to 1.5V DDR3-2133.
40%
60%
80%
100%
IDD0 IDD2N IDD4R IDD4W IDD5 IDD6N
-40% -35%
3xnm 2Gb D3 vs D4 Power
*based on IDD measured at 2133Mbps
3xnm 2Gb D3 vs D4 IDD
*with CAL (CS to ADDR/CMD Latency) enabled
DDR3
DDR4
DDR3
DDR4
DDR4 Bank Group for Performance Scaling
0.0%
5.0%
10.0%
15.0%
20.0%
25.0%
533 667 800 933 1066 1200 1333
Ba
nd
wid
th Im
pro
ve
me
nt o
ve
rt
Data Rate [Mbps]
16 banks’ performance improvement over 8 banks
(1 Rank, Open-page)
(Source : Memory Systems, Cache/DRAM/Disk)
Bank grouping enhances performance by more than 30% providing gapless read operations with 16 banks.
> @ 2133Mbps
tCK 0.83ns(DDR2400)
Read Read Read Read Read Read
gapless read (tCCD=4nCK) @ 2400Mbps verified w/ BG
DDR4 CRC for Reliability on Data
tCRC_ALERT_PW
1.9ns
RD
MRSRDOUT_EN
MRSRDOUT_DIS
With CRC Error clear
ACTWT PRE
MRSRDOUT_EN
RD
CRC Error
tCRC_ALERT
tCRC_ALERT_PW
CRC provides error detection capability on data channel reducing BER.
CRC Alert Latency & Pulse Width Shmoo CRC Functionality Check on ATE
DDR4 CA Parity for Reliability on C/A Bus
Alert Latency & Pulse Width Shmoo Functionality Check on ATE
Active MRSREADOUTRD
MPR0
MPR1
MPR2
MPR3
RDRDRD
PARITY Error from Active command
CA Parity provides error detection on command/address bus with debug capability using MPR readout
tPAR_ON
tPAR_PW
3DS as High Density Solution
More than 1 TB of memory per CPU socket is possible with 4Hi 8Gb 3DS DDR4 based 128GB LRDIMM, which can
address SI concern on both data and c/a.
But cost challenge remains to be solved across industry.
128GB 128GB 128GB
128GB 128GB 128GB
128GB 128GB 128GB
128GB 128GB 128GB
Hynix 3DS Development
Several types of 3DS have been explored with 40nm class 2Gb DDR3 ranging from 8GB/16GB RDIMM to 16Gb PKG
Hynix has no plan for 3DS DDR3 and anticipates mass production of 3DS in DDR4
16Gb PKG (2Gb 8Hi) 8GB RDIMM (2Rx4)
3DS saves power. A lot
40nm class 2Gb 3DS 16GB DDR3 confirmed that it can drop to power a level equivalent to 8GB module.
4xnm 8GB DDR3 (2Rx4)
4xm 16GB DDR3 (4Rx4) 4xnm 16GB 3DS DDR3
(Source : IBM)
Hynix Small Form Factor Module
Hynix provides ECC-SODIMM, ULP mini UDIMM, VLP ECC UDIMM as small form factor solutions.
Network system
Small form factor
Server
Embedded system
ULP Mini-IMM
VLP ECC UDIMM
ECC SODIMM
Summary
IT infra architecture and market forces have shifted toward the Cloud, and China has become a very important part of server market.
Server optimized DDR4 will be introduced very soon capable of providing low power and scalable performance solution.
3DS will be able to answer the needs from big data market. But it may take time for cost challenge of
higher stack to be resolved.