semiconductor embedded in substrate: sesub · ceatec2013-21 semiconductor embedded in substrate:...

CEATEC2013-21 Semiconductor Embedded in SUBstrate: SESUB Features • Small size: Higher integration of parts enables drastic miniaturization. • Low profile: 4-layer substrate can be realized with a thickness of only 300 micron. • Thermal dissipation: Efficient thermal dissipation provides higher degree of freedom for design. • Reduced noise emissions: Chip connections within substrate enhance EMI performance. Major Applications • Smartphones, mobile phones, tablet devices • Digital still cameras and other mobile devices • Healthcare products, wearable devices, etc. Advantages SESUB (Semiconductor Embedded in SUBstrate) technique for embedding extremely low-profile chips into the substrate enables the creation of extremely compact, high-performance PMUs for smartphones, as well as the world's smallest class Bluetooth module. SESUB technology from TDK realizes ultra-miniaturized power management units (PMU), Bluetooth modules, and more! Compact, low-profile, low power consumption, low noise PMU lineup Shielded switching DC-DC converter (prototype) 11.0×11.0mm Height 1.65mm (max.) μDC-DC Converter 2.9mm 2.3mm PMUs for smartphones 11×11×1.65mm 8.9×10.3×1.4mm (Prototype) Battery Charger 6.65×5.3×1.4mm (Prototype) Charge Pump 2.3×2.4×1.0mm μDC-DC Converter 2.9×2.3×1.0mm ■ 64% smaller mounting footprint (Compared to modular construction using packaged ICs) ■ Ideal for wearable devices and portable devices with emphasis on small size and elegant design Bluetooth module demonstration Conventional small-size Bluetooth tag Ultra low profile tag utilizing SESUB Thickness 5 to 13mm Thickness 2mm Easily fits into any wallet Chips are embedded in this substrate area 6.0×6.0mm Package IC Laminate Module SESUB module 8.5×8.5mm (= 72.3mm 2 ) Height 1.0mm 5.6×4.6mm (= 25.8mm 2 ) Height 1.0mm -64% Bluetooth module (Bluetooth Low Energy) 4.6mm 5.6mm 1.0mm Performance comparison Without shield With shield 76.0 74.1 72.2 70.3 68.4 66.5 64.6 62.7 60.8 58.9 57.0 55.1 53.2 51.3 49.4 47.5 45.6 43.7 41.8 39.9 38.0 (dBμV) Newly developed shielding structure for μDC-DC converter results in further reduced noise. World’s smallest class! More compact products are under development. 5.2 × 4.3 × 1.0mm 1mm IC Die IC Die 0.3mm Cross-section view of SESUB

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CEATEC2013-21

Semiconductor Embedded in SUBstrate: SESUB

Features

• Small size: Higher integration of parts enables drastic miniaturization.

• Low profile: 4-layer substrate can be realized with a thickness of only 300 micron.

• Thermal dissipation: Efficient thermal dissipation provides higher degree of freedom for design.

• Reduced noise emissions: Chip connections within substrate enhance EMI performance.

Major Applications

• Smartphones, mobile phones, tablet devices

• Digital still cameras and other mobile devices

• Healthcare products, wearable devices, etc.

Advantages

SESUB (Semiconductor Embedded in SUBstrate) technique for embedding extremely low-profile chips into

the substrate enables the creation of extremely compact, high-performance PMUs for smartphones, as well

as the world's smallest class Bluetooth module.

SESUB technology from TDK realizes ultra-miniaturized power management units (PMU), Bluetooth modules, and more!

Compact, low-profile, low power consumption, low noise

PMU lineup

Shielded switching DC-DC converter (prototype)

11.0×11.0mm Height 1.65mm (max.)

μDC-DC

Converter

2.9

2.3mm

PMUs for smartphones

11×11×1.65mm 8.9×10.3×1.4mm(Prototype)

BatteryCharger

6.65×5.3×1.4mm(Prototype)

ChargePump

2.3×2.4×1.0mm

μDC-DCConverter

2.9×2.3×1.0mm

■ 64% smaller mounting footprint

(Compared to modular construction using packaged ICs)

■ Ideal for wearable devices and portable devices with emphasis

on small size and elegant design

Bluetooth module demonstrationConventional small-size Bluetooth tag

Ultra low profile tag utilizing SESUB

Thickness 5 to 13mm

Thickness 2mm

Easily fits into any wallet

Chips are embedded in this substrate area

6.0×6.0mm

Package IC

Laminate Module SESUB module

8.5×8.5mm (= 72.3mm2)

Height 1.0mm

5.6×4.6mm (= 25.8mm2)

Height 1.0mm

-64%

Bluetooth module (Bluetooth Low Energy)

4.6m

5.6mm

1.0mm

Performance comparison

Without shield With shield

76.074.172.270.368.466.564.662.760.858.957.055.153.251.349.447.545.643.741.839.938.0

(dBμV)

Newly developed shielding structure for μDC-DC converter results in further reduced noise.

World’s smallest class!More compact products are under development.

5.2 × 4.3 × 1.0mm

1mm IC Die IC Die 0.3mm

Cross-section view of SESUB

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