July 2016© 2016 Uniqarta, Inc.

© 2016 Uniqarta, Inc.

Today’s ICs not Suitable forTomorrow’s Flexible Devices

Standard ICs are too thick to bend

2

Thinned ICs are flexible

© 2016 Uniqarta, Inc.

Today’s Assembly Technology Can’t Handle Thin ICs

3

Challenges

• Thinning/Handling

• Dicing

• Pick-up

• Cracking

• Accuracy

• Throughput

• Interconnections

© 2016 Uniqarta, Inc.

The Ideal FHE Assembly Solution Must:

• Address all aspects of the assembly problem

• Be a post-process for any standard semiconductor wafer

• Leverage existing tooling

• Be compatible with printed conductors

• Not impact IC performance

• Be reliable and economical

4

© 2016 Uniqarta, Inc.

FlexChip™ Process Designed for Ultra-Thin ICs

5

patents pending

© 2016 Uniqarta, Inc.

On-Chip Handles Facilitate FlexChip Assembly

patents pending6

Thinned, Diced Wafer Handle Removal(pick-and-place or laser)

Die Placement

handle IC

ultra-thin IC

© 2016 Uniqarta, Inc.

How to connect printed conductors to fine pitch IC bond pads?

7

ChipStamp™ Flexible Interposer

• No vias• Thin profile• Flexible/stretchable• Off-line manufacturing

patent pending

ultra-thin IC

interposer with

redistribution circuit

flex substrate

© 2016 Uniqarta, Inc.

FHE Die Assembly Ecosystem

device wafers

WaferThinning &

Dicing

Interposer Fabrication &

Assembly

FHESystem

Integration*

* Non-IC Integration: passives, sensors, power sources, etc.

(if interposers not required)

FHE Assemblies

printedflex circuits

ExistingFlexible Electronics

Ecosystem

Existing Semiconductor

Ecosystem