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1. vibration testing and analysis of ball grid array package solder joints shaw fong wong*, pramod malatkar, canham rick, vijay kulkarni and ian chin intel technology sdn.…
1. vibration testing and analysis of ball grid array package solder joints shaw fong wong*, pramod malatkar, canham rick, vijay kulkarni and ian chin intel technology sdn.…
voids in solder joints voids in solder joints raiyo aspandiar intel corporation raiyofaspandiar@intelcom presented at smta boise expo and tech forum march 20 2018 contents…
hal id: hal-00189474 https://hal.archives-ouvertes.fr/hal-00189474 submitted on 21 nov 2007 hal is a multi-disciplinary open access archive for the deposit and dissemination…
electronic thin film lab materials science & engineering, ucla electromigration in solder joints and lines k. n. tu, xu gu, hua gan, and w. j. choi dept. of materials…
inclusion voiding in gull wing solder joints t.l. lewis 1 , c.o. ndiaye 2 and j.r. wilcox 3 ibm corporation 1 rochester, mn, 2 poughkeepsie, ny, 3 endicott, ny abstract solder…
vibration fatigue of pbga solder joint p.l. tu, y.c. chan, senior member ieee, c.w. tang, and j.k.l. la? department of electronic engineering, and ‘department of physics…
predicting fatigue of solder joints subjected to high number of power cycles craig hillman1 nathan blattau1 matt lacy2 1 dfr solutions beltsville md 2 advanced energy industries…
microelectronics reliability 52 (2012) 735–743 contents lists available at sciverse sciencedirect microelectronics reliability journal homepage: www.elsevier .com/locate…
design and material parameter effects on bga solder-joint reliability for automotive applications burton carpenter freescale semiconductor inc burtcarpenter@freescalecom…
mechanical characterization of lead-free solder joints j. cugnoni*, a. mellal*, th. rütti@, j. janczak@, pr. j. botsis* * lmaf / epfl ; @ empa switzerland project funded…
40 smt magazine • may 2013 by theron lewis, jim wilcox, and cheikhou o. ndiaye ibm corporation inclusion voiding in gull wing solder joints summary: while solder voiding…
pii: s0167-6636(99)00053-8thermomechanical behavior of micron scale solder joints under dynamic loads y. zhao a, c. basaran a,*, a. cartwright a, t. dishongh b a suny at
int. j. electroactive mater. 2 (2014) 8 – 16 www.electroactmater.com review corrosion of sn-9zn solder joints: a review muhammad ghaddafy affendy, muhamad zamri yahaya,…
the fundamentals of solder joint of solder joint design – part 2 – surface mount solder joints 1 solder joint criteria designed for: • electrical conductivity • …
description of the method developed for dye penetrant analysis of cracked solder joints background the extension of cracks in solder joints after fatigue testing is usually…
see discussions, stats, and author profiles for this publication at: https://www.researchgate.net/publication/261417075 mean time to failure of snagcuni solder joints under
int j fract 2008 152:37–49 doi 10.1007s10704-008-9264-9 original paper fatigue fracture of snagcu solder joints by microstructural modeling m. erinc · t. m. assman ·…
constraining and size effects in lead-free solder joints j. cugnoni1, j. botsis1, v. sivasubramaniam2, j. janczak-rusch2 1 lab. applied mechanics & reliability, epfl,…
79 pb-free high temperature solder joints for power semiconductor devices yasushi yamada*, yoshikazu takaku**, yuji yagi*, ikuo nakagawa***, takashi atsumi***, mikio shirai***,…