The world’s smallest single chip system modules

NXP single chip system modules are a suite of highly integrated products in an ultra-small form factor.

SCM-i.MX 6Dual/6Quad

The first members of this portfolio, the NXP SCM-i.MX 6Dual and SCM-i.MX6Quad, drastically reduce time to market by providing a solution that significantly reduces design complexity and design cycle time. We’ve integrated and validated NXP’s flagship i.MX 6 series applications processors, i.MX 6Dual and i.MX 6Quad, with the power management system, flash memory, and over a hundred passive system components. The result is a tightly integrated system solution that will reduce your time to market and allow you to create a CPU/PMIC/memory sub-system design that is 50% smaller vs. a discrete implementation.

The SCM-i.MX 6Dual/Quad speeds and eases development time by eliminating the need for high-speed DDR layout, reducing the power management design complexity, eliminating the need to place bulky passive components, and providing a known tested hardware configuration of CPU core plus memory plus power management. The product is enabled and validated with LPDDR2 memory via Package-on-Package (PoP) technology.

TARGET APPLICATIONS

Digital signage

Human-machine interface

Home energy management systems

Intelligent industrial control systems

Portable medical

Drones

Secure smart connected devices

Service robot

Industrial scanner or printer

Building control

Exercise Equipment with Display

Industrial gateway

SCM-i.MX 6DUAL/6QUAD PACKAGING TECHNOLOGY

The SCM packaging technology allows the build-out of highly integrated devices in an incredibly small footprint. At 14mm x 17mm x 1.7mm the package is smaller than a US dime. In addition, the SCM- i.MX 6Dual/6Quad package is designed to enable LPDDR2 memory via Package-on-Package (PoP) configuration. This provides advantages not just in the elimination of high-speed memory design layout, but provides additional benefit in terms of PCBarea size, enabling you to create ultra-compact designs and/or more feature-packed products. New to Package-on-Package technology? We have partners that can help you assemble your own PoP designs or you can order pre-stacked SCM devices through Arrow Electronics.

Keypad

Clock and Reset

Smart DMA

IOMUX

Timer x 3

PWM x 4

Watch Dog x 2

MMC 4.4/SD 3.0 x 3

MMC 4.4/SDXC

UART x 5,5 Mbit/s

MIPI HSI

S/PDIFTx/Rx

PCIe® 2.0(1-lane)I2C x 3,

SPI x 5

ESAI, I2S/SSIx 3

3.3 V GPIO

Keypad

USB2 OTG and PHY

USB2 Host and PHY

System Control Connectivity

Multimedia

TrustZone®

Ciphers

RNG Security Cntrl.

TemperatureMonitor

PowerSupplies

Secure RTC

eFuses

Power Management

ROM RAM

Internal Memory

Security

Hardware Graphics Accelerators

Vector Graphics3D

2DFlexCAN x 2

1Gbit Ethernet+ IEEE 1588

NAND Cntrl.(BCH40)

S-ATA and PHY 3 Gbps

Dual-channelx 32 LPDDR2

400 MHz

USB2 HSICHost x 2

1080p30 Enc/Dec ASRCVideo Codecs Audio

Imaging Processing UnitResizing & Blending

Inversion/Rotation

Image Enhancement

Display and Camera Interface

HDMI and PHY

MIPI DSI

MIPI CSI2

20-bit CSI

ARM® Cortex®–A9 Core

32 KB I-Cacheper Core

Secure JTAG

PLL, Osc

NEONTM per Core

32 KB D-Cacheper Core

PTM per Core

CPU Platform

1 MB L2-Cache + VFPv3

24-bit RGB, LVDS (x 2)

OTP Startup Configuration Power Generation

Switching Regulators

SW1A/B/C (0.3 to 1.875 V)

Configurable 4.5 A or 2.5 A+2.0 A

SW2(0.4 to 3.3 V, 2 A)

SW3A/B(0.4 to 3.3 V)

Configurable 2.5 A or 1.25 A+1.25 A

SW4(0.4 to 3.3 V, 1 A)

Boost Regulator(5 to 5.15 V, 600 mA)

USB OTG Supply

Linear Regulators

VGEN1(0.8 to 1.55 V, 100 mA)

VGEN2(0.8 to 1.55 V, 250 mA)

VGEN3(1.8 to 3.3 V, 100 mA)

VGEN4(1.8 to 3.3 V, 350 mA)

VGEN5(1.8 to 3.3 V, 100 mA)

VGEN6(1.8 to 3.3 V, 200 mA)

VSNVS(1.0 to 3.0 V, 400 µA)

RTC Supply with Coin Cell Charger

OTP Prototyping (Try before buy) Voltage

Sequence and Timing

Phasing andFrequency Selection

DDR Voltage Reference

Parallel MCU Interface

Thermal Current Limit

Short Circuit

16 MB SPI NOR FLASH

Package-on-package (PoP) memory option

Reference resistors, bulk capacitors and decoupling capacitors

Regulator Control

I2C Communication and Registers

Internal Core Voltage Reference

Bias and References

Logic and Control

Fault Detection and Protection

SCM-i.MX 6QUAD BLOCK DIAGRAMSCM-i.MX 6DUAL/6QUAD BLOCK DIAGRAM

SCM-i.MX 6DUAL/6QUAD FEATURES AND BENEFITS

Features Benefits

Majority of the components integrated inside the module

Reduce your hardware design time by up to 25% - bring your products to market faster

Unprecedented, ultra-small form factor (17x14x1.7 mm) >50% PCB area reduction over current discrete solutions

Enabled for LPDDR2 PoP memory and embedded power management

Reduce your design complexity and cost of integrating and validating DDR memory and power management sub-system

NXP, with its partners, provide SW/HW customization and support

Reduces your supply chain complexity and provides proven options to improve your product time to market

SCM-i.MX 6DUAL/6QUAD ECOSYSTEM

NXP has collaborated with over 10 different companies to bring this device to market. These companies include engineering designers, component suppliers and manufacturing partners.

Software customization services, hardware design services, and PoP assembly services will be available through the partners in the ecosystem.

SCM-i.MX 6DUAL/6QUAD SOFTWARE SUPPORT

The software solution is Linux based leveraging the i.MX 6 Series General Available (GA) BSP. The GA provides software components: tool suite, boot loader, Linux kernel, and root file system. The 16MB SPI NOR flash is sized to support the storage of uboot, Linux kernel image, and an optimized Linux OS.

SCM-i.MX 6DUAL/6QUAD TECHNOLOGY INSIDE

NXP i.MX 6Dual/Quad processor based on ARM® Cortex™-A9, operating up to 800 MHz

NXP MMPF0100 for power management

16 MB SPI NOR flash

> 100 discrete components

The i.MX 6Quad family provides a quad-core ARM® Cortex™-A9 platform running up to 800 MHz per core with 1 MB of L2 cache, hardware accelerated graphics, 1080p video and 2-channel, 32-bit LPDDR2 support. Integrated FlexCAN, Ethernet Controller, PCI Express® and SATA-2 provide a wide range of connectivity and storage options while integration of dual lane MIPI display ports, MIPI camera port, LCD (RGB and LVDS ports) and HDMI v1.4 provides versatility to address the user interface requirements across a wide range of consumer and industrial multimedia applications.

The i.MX 6Dual family provides dual cores running up to 800 MHz per core with 1 MB of L2 cache. Leveraging the same integration of the i.MX 6Quad family, the i.MX 6Dual provides a scalable solutionfor consumer and industrial applications.

The PF0100 SMARTMOS Power Management Integrated Circuit (PMIC) provides a highly programmable/ configurable architecture. With up to six buck converters, six linear regulators, RTC supply, and coin-cell charger, the PF0100 can provide power for a complete system, including applications processors, memory, and system peripherals, in a wide range of applications while requiring only a single external supply.

Other components in the system include 16 MB SPI NOR flash and over one hundred discrete components, which are key systems capacitors and unique current reference resistors for the i.MX 6Dual/Quad.

www.nxp.com/scm

© 2015–2016 NXP B.V.

NXP, the NXP logo and SMARTMOS are trademarks of NXP B.V. All other product or service names are the property of their respective owners. ARM, Cortex and TrustZone are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. NEON is a trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.

Document Number: SCMIMX6DUALFS REV 4