samsung galaxy s5 home button synaptics fingerprint sensor teardown reverse costing report by...
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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]
August 2014 – Version 1 – Written by Elena Barbarini
Galaxy 5S Fingerprint Sensor
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Glossary
1. Overview / Introduction 4– Executive Summary
– Reverse Costing Methodology
2. Company Profile 8– Validity/Synaptics
– Samsung
3. Physical Analysis 12
– Synthesis of the Physical Analysis
– Galaxy S5 Fingerprint button disassembly 16
– Fingerprint Button Removal
– Fingerprint Button Assembly 20
– Fingerprint Button Assembly Views
– Fingerprint Button View
– Fingerprint Sensor Disassembly
– Fingerprint Sensor Packaging 25
– Package View & Dimensions
– Package Opening
– Package Cross-Section
– Fingerprint Sensor Patents
– Sensing PCB 32
– Sensing PCB View & Dimensions
– Sensing PCB Delayering
– Sensing PCB Cross-Section
– Sening PCB Process Characteristics
– ASIC Die 41
– ASIC Die View & Dimensions
– ASIC Die marking
– ASIC Die Delayering
– ASIC Die
– ASIC Die main Blocs
– ASIC Die Process
– ASIC Die Cross-Section
– ASIC Die Process Characteristic
– Flex PCB 57
– Flex PCB View & Dimensions
– Flex PCB Cross-Section
– Flex PCB Process Characteristics
4. Sensor Manufacturing Process 62– ASIC Front-End Process
– ASIC Front-End Wafer Fabrication Unit
– Sensing PCB Fabrication Unit
– Synthesis of the main parts
5. Cost Analysis 67– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Explanation
– Yields Hypotheses
– ASIC die 72
– ASIC Front-End Cost
– ASIC Probe Test, Thinning, Bumping & Dicing
– ASIC Wafer Cost
– ASIC Die Cost
– Sensing PCB Cost 78
– Home Button Assembly 81
– Assembled Components Cost
– Synthesis of the assembling
– Home Button Assembly Cost
6. Samsung’s vs Apple’s fingerprint sensor 88
Contact
Galaxy 5S Fingerprint Sensor
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• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the Samsung Galaxy S5 Fingerprint Sensor Assembly.
• For the first time Samsung integrates a fingerprint sensor in the Galaxy product line. The Fingerprint
Sensor technology has been developed by Validity Inc. which, since November 2013 is part of
Synaptics Inc., world leader in capacitive sensing human interface solutions for consumer
electronics companies.
• Samsung’s technological choice for the fingerprint sensor go to the opposite direction than Apple’s
one. Differences on the capacitive technology, on the manufacturing and the packaging materials,
lead to a specific supply chain and a device with smaller footprint and manufacturing cost.
• Samsung’s fingerprint sensor PCB based technology includes multiple conductive elements which
are sequentially excited by short electronic waveform burst. Swiping a finger across the gaps
between the conductive elements, a two-dimensional image of the fingerprint based on
capacitances is generated.
• The fingerprint sensor of the Galaxy S5 is located above the home button and it has the dimension
of 17.5x5.5 mm. The sensor is incorporated within a rectangular shaped housing composed of an
aluminum ring and a stainless steel base. The sensor is protected by a white plastic cover.
Galaxy 5S Fingerprint Sensor
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Fingerprint Button Assembly:
Electronic components assembly: Surface-mounted device (SMD)
Fingerprint PCB sensor
Fingerprint IC sensor
Electrical Connections and support: flex PCB, 2 metal layers
Protective cover
IC Sensor
Fingerprint PCB Sensor
Fingerprint PCB Sensor:
Sensing Principle: capacitive
Process:
FR4, 4 metal layers, microvias
Placement : soldered to the flex substrate.
Flex PCB
Galaxy S5 Fingerprint sensor Assembly
Fingerprint IC Sensor:
Process:
CMOS 0.13µm 1P 8M
Electrical Connection: copper pillars
Placement : flip chip to rigid PCB.
Stainless steel base
Galaxy 5S Fingerprint Sensor
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Galaxy 5S Fingerprint Sensor
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Galaxy 5S Fingerprint Sensor
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 7Rigid PCB Cross-Section – SEM View
Galaxy 5S Fingerprint Sensor
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• The die marking includes:
Ⓜ 2008
© VAL004A8-T
Sensor Die Marking
Galaxy 5S Fingerprint Sensor
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 9Sensor Die cross-section – SEM View
Galaxy 5S Fingerprint Sensor
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Galaxy 5S Fingerprint Sensor
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• We perform the economic analysis of the Sensor IC Front-End & Back-End 0 with the IC Price+ tool.
• We perform the economic analysis of the Sensor rigid PCB with the PCB Price+ tool.
Galaxy 5S Fingerprint Sensor
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Galaxy 5S Fingerprint Sensor
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Galaxy 5S Fingerprint Sensor
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Galaxy 5S Fingerprint Sensor
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Galaxy 5S Fingerprint Sensor
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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
European & USA Office
• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: [email protected]
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Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: [email protected]
• For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]
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- Fax: (82) 2 2010 8899 – Email: [email protected]