DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr

June 2013 – Version 1 – Written by Sylvain Hallereau

SORAA MR16-50-B01-12-830-25 - LED

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Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Companies Profile 8– SORAA Profile

3. Lightchip Package and Tri-LED Characteristics 10– Lightchip Characteristics

4. Physical Analysis 14– Physical Analysis Methodology

– SORAA MR16 Lamp

– Lightchip Package Views & Dimensions

– Lightchip Package and the Flex

– Lightchip Package Opening

– Lightchip Package Cross-Section

– Phosphor

– Tri-LED Assembly

– Lightchip Package Characteristics

– Tri-LED Views & Dimensions

– Cathode

– Tri-LED Singulation

– Anode

– Epitaxy

– Tri-LED Thickness

– Tri-LED Characteristics

5. Manufacturing Process Flow 42– Global Overview

– Tri-LED Fabrication Unit

– Tri-LED Process Flow

– Lightchip Fabrication Unit

– Lightchip Process Flow

6. Cost Analysis 53– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields Hypotheses

– GaN Substrate

– Epitaxy Step

– Tri-LED Front-End Cost

– Tri-LED Wafer Cost

– Tri-LED Cost per process steps

– Tri-LED Equipment Cost per Family

– Tri-LED Material Cost per Family

– Back-End : Probe and cleaving Cost

– Lightchip Packaging Cost

– Lightchip Wafer Cost

– Final Assembly Cost

– Component Cost & Price

Future 74

Contact 75

SORAA MR16-50-B01-12-830-25 - LED

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• This full Reverse Costing study has been conducted in order to give insight on technology data,manufacturing cost of the Light chip and the 36 Tri-LED in the MR16-50-B01-12-830-25 MR16 lampfrom SORAA. The tri-LED component is a LED in GaN on GaN . The Lightchip is a silicon based waferlevel packaging.

• The MR16-50-B01-12-830-25 lamp contains 36 Tri-LED dies. Each LED is triangular and measures0.07sq mm.

• We estimated that SORAA design and manufacture the GaN on GaN LED and the silicon based waferlevel package in their factories in California.

Tri-LED – Triangular LED (SORAA designation)

Lightchip – name of the silicon based wafer level packaging (SORAA designation)

SORAA MR16-50-B01-12-830-25 - LED

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Lightchip Package cross-section

Lightchip Package bottom side

Lightchip dimensions:8.4mm x 8mm x 0.66mm= 67.2sq mm

Flex dimensions:13mm x 13.5mm x 0.145mm= 175.5 sq mm

13mm

13.5mm

8.5mm

8mm

0.66mm

0.145mm

SORAA MR16-50-B01-12-830-25 - LED

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Track

Wire bonding

Tri-LED

Silicon Substrate

Detachment of the film due to the analysis

SEM view : cross section of the track on the silicon

Track

SEM top view : Tracks, LEDs and wire bondings

Reflective surface

SORAA MR16-50-B01-12-830-25 - LED

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Optical views : cross_section

Cross-

Section

SEM views : top view

Cathode

Anode

• Tri-LED dimensions:

- Shape: equilateral triangle

- Thickness: xxµm

- Side: 400µm

- Surface: 0.07 sq mm

400µm

xxµm

350µm

SORAA MR16-50-B01-12-830-25 - LED

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Optical view : cross-section die, edge of the

transistor.

Silicone

P doped GaN: xxnm

P layer

End of the silver layer

SEM view : cross-section detail of the edge of

the LED

1µm

Drift layer

SEM view : cross-section detail of the edge of

the LED

Silver: 200nm

Tungsten/Titanium: xxnm

SiO2 : xxnm

Nickel: xxnm

Bump in Gold/Tin: xxµm

Silver: xxµm

Nickel: xxµm

Detachment of the film due to the analysis

SORAA MR16-50-B01-12-830-25 - LED

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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 8

SORAA MR16-50-B01-12-830-25 - LED

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• The front-end cost ranges from $xx to $xxaccording to yield variations.

• The high cost of the wafer explain the portionof the manufacturing cost is due to yieldlosses in the cost.

• The new equipment explain the portion ofthe manufacturing cost is due to theequipment at xx%.

• The manufacturing yield is between xx% andxx% in 2013

SORAA MR16-50-B01-12-830-25 - LED

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SORAA MR16-50-B01-12-830-25 - LED

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• This reverse costing analysis represents the best cost/price evaluation given the

publically available data, completed with industry expert estimates.

• These results are open for discussion. We can re-evaluate this circuit with your

information. Please contact us:

Partner:

Le Quartz

75 cours Emile Zola

69100 Lyon-Villeurbanne

+33 (0)4 72 83 01 80

www.yole.fr