© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Samsung Galaxy S II – Camera Module 1

9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France

Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr

October 2011 - Version 1

Written by: Romain FRAUX

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic

estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is

made of the contents of this report. The quoted trademarks are property of their owners.

© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Samsung Galaxy S II – Camera Module 2

Table of Contents

Glossary

1. Overview / Introduction……….……………….…........…4 – Executive Summary

– Reverse Costing Methodology

2. Company Profile………………..……………….……....….6 – CMOS Image Sensors – Volume Shipments

– Samsung Profile

3. Samsung Galaxy S II Teardown…………….……....….12

4. Physical Analysis………………………...……….............16

– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Camera Module Views & Dimensions

– Camera Module X-Ray

– Camera Module Disassembly

– CIS Views & Dimensions

– CIS Markings

– CIS Pads

– CIS Microlenses

– CIS Pixels

– CIS Technology node

– Camera Module Cross-section

– CIS Cross-section

– Physical Data Summary

– Short Analyze of Camera Module Version 3

5. Manufacturing Process Flow…….…………………..….74 – Global Overview

– CIS Process Flow

– BSI Detailed Process Flow

– Description of the CIS Wafer Fabrication Unit

6. Cost Analysis………………………….………………..…..80

– Synthesis of the Cost Analysis

– Main Steps of Economic Analysis

– Yields Explanation

– Yields Hypotheses

– CIS Front-End : Hypotheses

– CIS FEOL + BEOL Cost

– CSI BSI Cost

– CIS BSI Cost per Process Steps

– CIS BSI : Equipment Cost per Family

– CIS BSI : Material Cost per Family

– CIS Front-End Cost

– CIS Back-End 0 : Test & Dicing

– CIS Wafer Cost (Front-End + Back-End 0)

– CIS Die Cost

– Camera Module Assembly - Hypotheses

– Optical Module Cost

– Auto-Focus Cost

– PCB/Housing Cost

– Camera Module Cost

7. Estimated Price Analysis….………………….……..…102

– Definition of Prices

– Manufacturer Financial Ratios

– Camera Module estimated Manufacturer Price

© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Samsung Galaxy S II – Camera Module 3

Samsung Galaxy S II Teardown

• Samsung used several sources for the assembly of the Galaxy S II camera modules.

We found three camera module versions during our teardowns:

Version 1 Version 2 Version 3

• Versions 1 & 2 are very similar, they used almost the same assembly structure and share the

same CMOS Image Sensor (Samsung CIS ref. S5K3H2YX03).

•Version 3 use a different assembly structure and a different CMOS Image sensor (probably not

made by Samsung).

•Only the camera module version 2 is analyzed in this report.

© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Samsung Galaxy S II – Camera Module 4

Physical Analysis Methodology

• Package is analyzed and measured.

– X-ray pictures are used to identify the package construction and the redistribution.

• Package is opened in order to identify the elements constituting it.

• Cross-section are realized to get overall package data : dimensions, main characteristics.

• An analysis of the technologies and of the materials used is performed.

Lens #1

Lens #3

Lens #4

Lens #2

Metal

housing

Barrel

Glass plate with IR Filter

CIS

Coil

Flex PCB

IC #3

Ferrite

Spacer #4

Spacer #3

Spacer #2

4-layers

rigid-flex

PCB

Flex PCB

Spring

Spacer #1

© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Samsung Galaxy S II – Camera Module 5

Camera Module Disassembly

Module side view Module side view

Module side view Module side view

Flex PCB

Ferrite

© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Samsung Galaxy S II – Camera Module 6

CIS Microlenses

Microlenses – SEM view

© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Samsung Galaxy S II – Camera Module 7

Camera Module Cross-Section Camera Module Cross-Section

Camera module cross-section – Optical view

© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Samsung Galaxy S II – Camera Module 8

CIS Cross-Section

Thrench cross-section – SEM view

© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module – ST CIS + Heptagon WLO 9

CIS Process Flow

© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module – ST CIS + Heptagon WLO 10

CIS BSI Cost per process steps

CIS BSI Steps Cost (Simulated with MEMS CoSim+ Cost Simulation Tool)

© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module – ST CIS + Heptagon WLO 11

CIS Wafer Cost (Front-End + Back-End 0)