revolution and evolution in contactless rfid markets and ... · revolution and evolution in...

Revolution and Evolution in Contactless RFID Markets and Technologies

ICMA Card Manufacturing & Personalization Expo 2015

Market drivers for contactless card

Market development of Automated Fair Collection (AFC)

Market development of Finance

MSD

Core technologies leading to contactless cards

IC

Module

Antenna

Bonding

Lamination

OUTLINE

SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED

7 April 2015 SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED

Industries that provided the business need for development of contactless technology Access

Kaba developed the proprietary HF Legic platform for a cost effective, secure and state-of-the-art contactless technology in 1993.

Alternative to the proprietary Wiegand, proximity technology

Automated Fare Collection (AFC) Mikron (now NXP) developed the proprietary—but open source

through licensing—HF Mifare Classic 1K platform for a convenient way of fare payment in public transit as an alternative to tokens and mag stripe cards and tickets

SONY developed the proprietary HF FeliCa platform for the Hong Kong Octopus system as a secure, multi-application card for paying fares in public transit, and to make purchases within the Octopus extended merchant network

Market drivers for contactless card


Hardwired logic memory cards Mifare Classic 1K (NXP), commercially successful and provided the

basis for ISO/IEC 14443 Type A standards Legic (Kaba), proprietary design and first commercially successful

smart card using individual ASIC and single antenna for transmission of power and data

GO CARD (Cubic), first commercially available FRAM based contactless smart card, proprietary design, rolled out in USA

Microprocessor based contactless smart cards AT&T developed the first microprocessor based close coupling

contactless smart card, that was the basis for ISO/IEC 10536 standards, but was not commercially successful due to high manufacturing cost.

FeliCa (SONY), first microprocessor based contactless smart card with single ASIC, proprietary design but commercially successful in Asia

Automated Fair Collection Technologies and Standards

AFC Evolution

Coins

Tokens

Mag Stripe Cards

Smart Cards

Mobile Ticketing

Open Payment

BiBo&

NFC Mobile Apps

1940’s 1950’s 1970’s 1990’s 2000’s 2010’s

Tech

nolo

gy

SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED 7 April 2015


Lufthansa Ticketless Travel Program, Germany: launched in 1995, Mifare Classic 1K (NXP), G&D card (hot laminated), first multi-function contactless card that can be used as check-in card as well as a credit card or loyalty card

Seoul Bus, South Korea: launched in 1996, Mifare Classic 1K (NXP), Gemplus cards (cold laminated)

Hong Kong (Octopus card): launched in 1996, FeliCa (SONY), SONY cards (hot laminated)

Goiânia Bus, Brazil: launched in 1997, Mifare Classic 1K (NXP), G&D cards (hot laminated)

Washington Metro SmarTrip, USA: launched in 1997, GO CARD (Cubic), Gemplus cards (cold laminated) but later switched to G&D cards (hot laminated)

Chicago Transit, USA: launched in 2000, GO CARD (Cubic), G&D cards (hot laminated)

SPTrans, Brazil: launched in 2004, Mifare Classic 1K (NXP)

First Projects and Contributors

AFC Projects Powered by wire embedded Contactless cards

Public Transport Project Istanbul, Turkey

Cairo Metro, Egypt

Korea T-Money

Sky train Bangkok (BTS), Bangkok Metro (BMC)

Sao Paulo, Brazil(SPTrans)

Santiago de Chile

London Oyster Card

Translink Netherlands Moscow Metro, Russia

St. Petersburg Mass Transport, Russia

LTA EZ Link Card Singapore

Czech Railway Czech Republic

February 2009

RioCard, Rio de Janeiro, Brazil

Clipper Card, San Francisco, USA

RapidKL, Malaysia

Hong Kong Octopus

Auckland HOP Card,New Zealand

Wellington Snapper Card,New Zealand

Washington Metro, USA

Port Authority of NY & NJ, USA

Vancouver, CanadaToronto, Canada

Projects with significant volumes:

7 April 2015

REPUVE, Mexico

MBTA / Boston, USA

LA Metro / Los Angeles, USA

English National Concessionary Travel Card UK



Starting around 2005, a major application of the technology has been contactless payment credit and debit cards. Some major examples include:

• ExpressPay - American Express• PayPass - MasterCard• Zip - Discover• payWave - Visa

Finance MSD cards

CONTACTLESS (RFID) CARD


RFID STANDARDS

RFID Band Bandwidth AverageRange

Standards Applications

Low FrequencyLF

120 – 135 kHz 1 cm Close CouplingISO/IEC 10536ISO/IEC 18000-2

Access Control, Animal Tagging, Car Immobilizers, Waste Managment

High FrequencyHF

13.56 MHz 10 cm ProximityISO/IEC 14443ISO/IEC 18000-3

eID, ePassport, Electronic Payment, Access Control Public Transportation

Ultra High FrequencyUHF

433 MHz > 1 m VicinityISO/IEC 15693ISO/IEC 18000-7

eID, Border Control, EPC, Product Identification

860 - 960 MHz > 1 m ISO/IEC 18000-6 License Plates, Containers, Palettes

2.45 GHz > 1 m ISO/IEC 18000-4 Automated Fare Collection


ISO/IEC JTC1 /SC17, Work Group 8:

ISO STANDARD TYPES AT 13.56 MHZ

ISO 10536

ISO 14443

Close Coupling

Proximity CouplingType A

Type B

Type C

Type D

Type E

Mifare

Infineon,STM

Sony

Cubic

Inside

ISO 15695 Vicinity Coupling


Ni/Au, Au and Palladium Bumping

Grinding

Polishing

Conventional Dicing

Dicing Before Grinding

Laser Dicing

IC packaging – module and strap

WAFER PROCESSING AND MODULE PACKAGING


Antenna

Wire-Embedding

Etching

Coil Winding

Printing

Dual Interface Technology

Bonding

Thermo-Compression Bonding

Flip-Chip-Technology

Soldering

ANTENNA AND BONDING TECHNOLOGIES


PALLADIUM BUMPING

Pd bumps

Unique and patented electro-less process on wafer level using palladium to create purpose-built metallic bumps with rough and shaped surface

These kind of bumps in combination with metallic surfaces provides extremely reliable connection,so-called „cold welding connection”

The Pd bump roughness destroys surface and oxide layers (e.g. aluminum) and allows flip chipinterconnections using unfilled adhesives

PROPERTY DIMENSION

Bump height Standard 20 µm (+8 / -5 µm)

Shear strength Typical 150 MPa (Pad size 100µm by 100µm)

IC

Substrat

ElektrodenBumpACA

IC

Substrat

ElektrodenBumpNCA

Typical metallic bumps for adhesive flip chip connections – cross section views

PALLADIUM BUMPING

Electro-less Pd bump is well impressed into antenna track; cold welding inter-connection between to trackNCA is used for mechanical

Electro-less Ni-Au bump is partly connected to antenna track by particles contained in ACPACP is used for mechanical

Straight wall pure Au bump is partly connected to antenna track by particles contained in ACPACP is used for mechanical

connection between chip andsubstrate

connection between chip and substrate

connection between chip and substrate

AMERICAN EXPRESS CLEAR BLUE


CHIP PACKAGING – THE MODULE

mould

wire bondGold or Al

lead frameCuSn6

chip

module type manufacturerMOA2, MOA4, MOA8 NXPSMOA2, SMOA4, SMOB6 Smartrac


SMOA2

5.15x8.00 mm

370-390 um

SMOA4

5.15x8.00 mm

320-340 um

SMOB6

5.15 x 8.00 mm

240-260 um

CHIP PACKAGING – THE MODULE


WIRE-EMBEDDING TECHNOLOGY

Antenna embedding TC bonding

WIRE-EMBEDDED PRELAM AND CARDS

MSD card

Hybrid card

Phone sticker Prelam

COIL WINDING

LF-Antenna


PRINTING

UHF Clear Prelam

HF Prelam

US PRC

Manitoba eDL


OVERVIEW DUAL INTERFACE TECHNOLOGY

BasicTechnologies

InterconnectionTechnology

AntennaTechnology

Direct Connect

DIFPrelamMill & Fill

Conductive Glue, Tape, Paste,

Polymer

EmbeddedWire

Etched Antenna

PrintedAntenna

InductiveCoupling

Thermo Compression

Bond (TC) None Soldering;

TC-Bonding

Embedded Wire & Pad


Trend of DIF Antenna Technologies

% 2010

Cu-wireCu-etchedAl-etchedAg-printed

% 2015

Cu-Wire %

Cu-Etched %

Al-Etched %

Ag-Printed %

Expected Trend


Trend of DIF Interconnection Technologies

% 2010

conductive media

inductive coupling

direct soldering

DDI

4/7/2015

% 2015

Conductive Media %

Inductive Coupling %

Direct Soldering / Bonding %

DIF-Prelam %

Expected Trend


Eitan AvniSegment Development Finance, Transport and Access, [email protected]

SMARTRAC TECHNOLOGY Fletcher Inc.267 Cane Creek RoadFletcher, NC 28732

U.S.

smartrac-group.com

MILL & FILL TECHNOLOGY

Today most common technology

Medium to high equipment cost

Interconnection by - conductive glue / tape - conductive polymer (liquid or solid)

Main challenges:- process control - consumable cost - ageing interconnection media


INDUCTIVE COUPLING TECHNOLOGY

Low cost on equipment side

Electrically very reliable

Now also with wire embedded antenna

Now also with:PVC, PC, PET-G, Teslin

mono-block structure

Main challenges:- manufacturing tolerances- supply chain with restrictions - IP challenges

Module (COM8.6)Coil on the module

Coil on antenna inlay


MANUAL & SEMI-AUTO SOLDERING

●●● ●● ●

Very reliable interconnection

Low to high investment cost(depending on automation degree)

Current usage limited to certain regions

Main challenges:- high labor cost - human factor / process control

SMARTRAC TECHNOLOGY GROUP

FULLY AUTOMATED SOLDERING PROCESS

Very reliable interconnection

Fully automated process

Fully integrated process incl. cavity milling

∑ - Fold


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