review of ni-cu based front side metallization for c-si solar cells

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  • 8/10/2019 Review of Ni-Cu Based Front Side Metallization for C-Si Solar Cells

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    LOGO

    Ni-Cu Based Front Side

    Metallization for Crystallize SiliconSolar Cells

    Name: Vo Ngoc Phuong Anh

    Student ID number: 14110206

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    Contents

    Process of c-Si Solar Cell Fabrication

    Methods for Pre-metallization

    Ni and Cu Plating techniques

    References

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    Process of c-Si Solar Cell Fabricat ion

    Solar Cell Manufacturing Process Flow Chart [1]Solar Cell Manufacturing Process [5]

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    Process of c-Si Solar Cell Fabricat ion

    Solar cell structures composed of metallization

    scheme based on Ni/Cu/Ag plating [2], [4]

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    Methods fo r Pre-metall izat ion

    There are a number of method forPatterning the ARC [3]:

    Etch Resist and Wet Etching BasedMethods.

    Direct Etching Based Methods.

    Laser-Assisted Methods.

    Mechanical Method for Patterning.

    Schematic mask and etch sequence. Mask

    patterning is done initially to open ARC followed by

    a process of photoresist removal [2]

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    Ni and Cu Plat ing techniques

    The metallization technique involves two main steps [2]:

    1. Ni Seed layer Formation.

    2. Cu Electroplating technique.

    Steps involved in

    formation of the

    metallization scheme

    based on Ni/Cu/Sn or

    Ag metallization

    scheme [2]

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    Ni Seed layer formation

    Electroless plating [2]:The chemical reaction:

    Step 1: (anodic reactrion)

    Step 2: (cathodic reaction)

    Sum:

    Schematic of electroless plating

    setup [3]

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    Ni Seed layer formation

    Light Induced Plating (LIP):

    Schematic image of LIP system [6]

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    Ni Seed layer formation

    Laser Assisted Ni Deposition:

    Schematic image of LIP system [6]

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    Cu Electroplating technique

    Cu electroplating is usually done by the LIPtechnique.

    Reactions taking place at anode (Cu), electrolyte solution

    (H2SO4/CuSO4) and cathode (substrate)

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    Cu Electroplating technique

    Schematic diagram of the light induced plating (LIP) based Cu

    electroplating process

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    References

    [1].Annual Report on Form 10-K of Amtech Systems, Inc.(2007)

    [2]. Atteq ur Rehman and Soo Hong Lee, Review of the Potential of the Ni/Cu

    Plating Technique for Crystalline Silicon Solar Cells, Materials (2014), 7,

    1318-1341.

    [3]. Mehul C. Raval and Chetan S. Solanki, Review of Ni-Cu Based Front

    Side Metallization for c-Si Solar Cells,Journal of Solar Energy (2013), Article

    ID 183812, 20 pages.

    [4]. Hariklia (Lili) Deligianni, Shafaat Ahmed, and Lubomyr T. Romankiw,The

    Next Frontier: Electrodeposition for Solar Cell Fabrication, The

    Electrochemical Society Interface (2011), 47-53.

    [5]. http://www.think-solar-power.com/Photovoltaic-Solar-Power.html

    [6]. J. Bartsch, A. Mondon, B.-J. Godejohann, M. Horteis, S.W. Glunz,

    Advanced Front Side Metallization for Crystalline Silicon Solar Cells Basedon a Fully Planted Contact, Presentated at the 25th European PV Solar

    Energy Conference and Exhibition (2010).

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