response surface channel modeling · 2012-08-21 · response surfaces •visualize response...
TRANSCRIPT
© 2011 ANSYS, Inc. September 14, 2011
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Response Surface Channel Modeling Designer SI & DesignXplorer
© 2011 ANSYS, Inc. September 14, 2011
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Outline
Product Introductions
• Designer SI
• DesignXplorer
Intro to DOE & Response Surface Modeling
• Response Surfaces
• Sensitivity Plots
• Optimization/tradeoff
• Design simplification
• Defects Per Million Opportunities (DPMO)
Summary
© 2011 ANSYS, Inc. September 14, 2011
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Designer SI
•Circuit Simulator- Nexxim Engine (transient, fast convolution, statistical and IBIS-AMI circuit simulation) •Integrated Schematic capture and layout tool •Design management front-end linking EM simulation products (HFSS, Q3D, SIwave, ..) •2D quasi-static field solver
© 2011 ANSYS, Inc. September 14, 2011
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Nexxim Circuit Engine Strengths
Statistical analysis and transient simulation: New features VerifEye and QuickEye provide statistical analysis and fast convolution simulation capabilities. Time-domain simulation using frequency-domain S-parameters: Nexxim's inherent automatic enforcement of passivity and causality to accurately model and simulate physical behavior in the time domain (complex interconnects in signal integrity applications). To address the problem of passivity enforcement for large port count, non-passive S-parameter based models; "Passivity by Perturbation" option. Nexxim also includes the patented "TWA" algorithm. "TWA" will dramatically speed up the State Space fitting procedure often by orders of magnitude. State Space model generation is a critical need for time domain S-parameter simulation. Higher capacity at increased simulation speed: Cutting-edge numerical algorithms provide Nexxim with the capacity and speed to handle simulations of very large transistor/device counts, and high harmonic content without sacrificing simulation accuracy. Robust convergence: Nexxim includes robust algorithms across all analysis domains (DC, time and frequency) that ensure convergence even as circuit size, harmonic content and circuit nonlinearities increase.
© 2011 ANSYS, Inc. September 14, 2011
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DesignXplorer
DesignXplorer (DX) explores a wide range of responses from a limited number of actual solutions.
It creates Response Surfaces • Allows for optimization and six-sigma studies that include a large number of
variations without requiring a simulation for all variations
DX uses Design of Experiments (DOE) – DOE method determines how many, and which design points should be solved
for the most efficient approach to optimization
– Response surface is fit to solved DOE
© 2011 ANSYS, Inc. September 14, 2011
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Why Response Surface Modeling?
Response Surface Modeling enables the designer to model and consider all aspects of a high speed channel design. We fit a statistical model to outputs of the design as a function of the change in input variables. A DOE table is used to select design points to solve explicitly for and the statistical model so to speak, “fills in the gaps”
Optimized conditions and worst case scenarios are obtainable within the set of all possible design combinations within a realistic simulation timeframe.
For example consider 30 variables or “factors”, if each variable has only 5 variations or “levels” we are looking at a huge number of possible combinations in order to find optimal solutions and or worst case scenarios.
!!!!530 FactorsLevelsnsCombinatio
© 2011 ANSYS, Inc. September 14, 2011
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PCIe Channel Example
PCB Board Model
Pad Ball
PCIConnectorPackage 1 Socket
TlineVias Vias
TLines
Package 2PCIBoard
PCIe Gen 3 DOE Channel Simulation
TX
RX
0 0 0 0 0 0 0 0
P2_Pad1_p P2_Pad1_n
P2_Pad2_p2
P2_Pad2_n2
P2_Pad3_n P2_Pad3_p
Pad3_n
Pad3_p
Pad2_p
Pad2_n
Pad1_n
Pad1_p
Ball1_n
Ball1_p
Ball2_n
Ball2_p
Ball3_n
Ball3_p
Pin1
Pin2
Pin3
Pin4
Pin5
Pin6
Pin7
Pin8
Pin9
Pin10
Pin11
Pin12
p1
p3
p5
p7
p9
p11
Die_1n
Die_1p
Die_2n
Die_2p
Die_3n
Die_3p
Pin1
Pin3
Pin5
Pin7
Pin9
Pin11
Pin2
Pin4
Pin6
Pin8
Pin10
Pin12
Pin1
Pin2
Pin3
Pin4
Pin1
Pin2
Pin3
Pin4
Pin1
Pin2
Pin3
Pin4
1
2
3
4
5
6
W103
Pin1
Pin2
Pin3
Pin4
Pin1
Pin2
Pin3
Pin4
Pin1
Pin2
Pin3
Pin4
p1
p3
p5
p7
p9
p11
Die_1n
Die_1p
Die_2n
Die_2p
Die_3n
Die_3p
ID=156
ID=157
ID=158
ID=164
ID=165
1
2
3
4
5
6
W176
1
2
3
4
5
6
W177
Pad3_n
Pad3_p
Pad2_p
Pad2_n
Pad1_n
Pad1_p
Ball1_n
Ball1_p
Ball2_n
Ball2_p
Ball3_n
Ball3_p
ID=187
1
2
3
4
5
6
W190
12 components consisting of multiple design parameters varying from material specific to physical.
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Example of model details
•Trace width and space •Different dielectric regions for fiber skew •Varying degrees of trace etching •Varying dielectric materials •Dielectric thickness
•Via stub lengths •Routing configurations •Via thickness •Anti-pad sizes
© 2011 ANSYS, Inc. September 14, 2011
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Problem Scale
30 different factors isn’t unreasonable considering an entire PCIe Channel, Example:
Package
• Thickness, Pad breakout, trace length, ball pitch, dielectric material (5)
Socket
• Thickness, material properties, SG via ratio (3)
Board
• MS and SL trace & space, etch factors, Cu roughness, dielectric materials, via config (8)
Connector
• Various vendor models, often only one or two options. (1)
2nd Board
• MS, SL, etch factors, Cu roughness, dielectric materials, via config (8)
2nd Package
• Thickness, Pad breakout, trace length, ball pitch, dielectric material (5)
© 2011 ANSYS, Inc. September 14, 2011
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DOE Workflow
© 2011 ANSYS, Inc. September 14, 2011
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Circuit Simulation- HPC
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DOE Methodology
© 2011 ANSYS, Inc. September 14, 2011
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PCIe Channel Example – DOE Setup
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PCIe Channel Example – DOE Setup
© 2011 ANSYS, Inc. September 14, 2011
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Response Surfaces
•Visualize response surfaces in 3D or 2D plots (continuous, discreet, mixed) variables •The Measure of fit provides a metric for evaluating the accuracy of the response surface model.
•Eye Height Coefficient of Determination (R-Squared) = 0.9962
•Eye Width Coefficient of Determination (R-Squared).= 0.9891
Provides a measure of how well future Outcomes will be predicted By the statistical model
© 2011 ANSYS, Inc. September 14, 2011
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Sensitivity Plots
Which variables have the most impact on the output.
• Negative numbers show a decrease impact on output
• Positive numbers show an increase impact on output
Sensitivity plots help us make the decision; which variable in my design offers the most impact changing my eye height or width.
More importantly is shows up which inputs we may consider fixing thus narrowing the data set
© 2011 ANSYS, Inc. September 14, 2011
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Optimization –Min. EYE Height/Width
© 2011 ANSYS, Inc. September 14, 2011
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Narrowing the field
At this stage we know two valuable insights;
• which variable set yields the worst case eye
• which of those variables don’t contribute much to this case.
Additional judgment also comes into play here for example:
• Manufacturability
• Cost
We narrow the field of variables and re-run the DOE for improved accuracy.
Minimized to just the Package, Board, and Card T-line lengths
© 2011 ANSYS, Inc. September 14, 2011
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Sensitivities updated of second DOE
Change in relative significance
Package Length
board Length
© 2011 ANSYS, Inc. September 14, 2011
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Defect Rate Prediction (DPMO)
If we cannot achieve an acceptable design on one or more of our output criteria we need to determine whether or not our design can meet a specific defect rate target in this case, 1000ppm.
For this case we will leave the design in the worst case and see how it does in the six sigma analysis for DPMO (Defects Per Million Opportunities) or ppm ( parts per million)
© 2011 ANSYS, Inc. September 14, 2011
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6-Sigma Distribution functions
Plots showing the normal probability distribution and Cumulative distribution functions for Eye Width and Eye Height.
© 2011 ANSYS, Inc. September 14, 2011
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Distribution Characteristics
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DPMO
•Eye Height at worst case is with in the PCIe spec at 25mVPP •Eye Width simulation shows possible violations of 0.3(UI) with a Sigma Level of 3.259 •With a Sigma Level at 3.259 corresponding to 559 DPMO were within our 1000DPMO goal!!
© 2011 ANSYS, Inc. September 14, 2011
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Summary
Response Surface Modeling enables the designer to model and consider all aspects of a high speed channel design.
optimized conditions and worst case scenarios are obtainable within the set of all possible design combinations within a realistic simulation timeframe.
Using a cohesive tool set such as Designer SI and DesignXplorer improves simulation time, and reduces operator error.
Designer Si as the circuit simulation tool directly linked to electromagnetic models yields the highest possible accuracy.
Transient, statistical transient, peak distortion analysis, and equalization schemes are all inclusive within the Designer environments and can be part of the DOE, “improves goodness of fit R^2”
© 2011 ANSYS, Inc. September 14, 2011
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Summary of tools
Designer SI Circuit
HFSS SOD
DesignXplorer
HPC pack