request for proposal (rfp ) for fabrication, assembly

LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO

ELECTRO OPTIC SENSORS (EOS) TYPE-S of 74

Request for Proposal (RFP)for

Fabrication, Assembly, Integration, Testingand Supply of Electro-Optic Sensors (EOS)

Type-S

TECHNICALANNEXURE

LABORATORY FOR ELECTRO-OPTICS SYSTEMS (LEOS)INDIAN SPACE RESEARCH ORGANISATION (ISRO) PEENYA,

BANGALORE – 560058



Fabrication, Assembly, Integration, Testing and Supply of Electro-OpticSensors (EOS) Type-S

CONTENTS

1. Introduction2. Scope of work3. Specification for Fabrication, Assembly, Integration, Testing and Supply of Electro-

Optic Sensors (EOS) Type-S3.1 Introduction3.2 Work specification3.3 Terms and Conditions4. Statement of work for fabrication, assembly, integration, testing and supply of

Electro-Optic Sensors (EOS) Type-S4.1 General4.2 Scope of work4.3 Phase – I Training Activities And Documents4.4 Phase-II Production Activities for Fabrication, Assembly, Integration, Testing and

supply of Electro-Optic Sensors (EOS) Type-S.4.5 Inspection and Auditing4.6 Non conformance management4.7 Photographic Records4.8 Component Management4.9 Test Systems4.10 Schedule, Planning and Reporting/Quality Control4.11 Cost Breakup for Realization of EOS Type-S packages4.12 Intellectual Property Rights4.13 Roles and Responsibilities4.14 List of deliverables by vendor4.15 Safety precautions to be followed by vendor4.16 Delivery Schedules4.17 Payment Terms

Appendix A: Activities for Fabrication, assembly, integration, testing and Supply of Electro-Optic Sensors (EOS) Type-S.

Appendix B: Typical list of consumables used for Electro-Optic Sensors (EOS) Type-S.Appendix C: Typical list of Equipment for card/package fabrication and Assembly.Appendix D: Typical list of Test equipment used for Electro-Optic Sensors (EOS) Type-S.



LIST OF ABBREVIATIONS

LEOS-Laboratory for Electro Optic SystemsISRO-Indian Space Research OrganizationRFP-Request for ProposalEOS- Electro Optic SensorFIM-Free Issue of MaterialsTVAC-Thermal VacuumQC-Quality ControlPCB-Printed Circuit BoardESD-Electro Static DischargeEEE-Electrical Electronic and Electro MechanicalF/T-Functional testsLD-Liquidated DemurrageSMD-Surface Mount DevicesRCP-Radiation Shielding, Coating and PottingPTH-Plated through holeQA-Quality AssuranceNCR-Non Conformance ReviewPWB-Printed Wired Board



FABRICATION, ASSEMBLY, INTEGRATION, TESTING AND SUPPLYOF ELECTRO-OPTIC SENSORS (EOS) TYPE-S

1.0 Introduction

Laboratory for Electro Optic Systems (LEOS), an ISO 9001:2015 certified unit of ISRO is the

lead Centre in Indian Space Research Organization (ISRO) responsible for realization of all

Sensors for various ISRO Satellite programs. ISRO is embarking on a mission to double the

number of satellites to be put in orbit in the next five years and realizing 10 to 12 spacecrafts per

year in future. This calls for a large number of Sensors to be fabricated, tested and made ready for

integration with Satellite. To meet this requirement, it is planned to involve industries, wherever

required, to realize Sensor subsystems. LEOS wishes to forge long term working relationship with

vendors for realizing this hardware.

In order to increase the throughput of sensors for future satellite programs, the sensors are

standardized for production. LEOS has established facilities at its premises for production

of various types of Sensors. This hardware is to be produced with Industry Partners who are

familiar and have experience in Space Electronic Hardware realization. The vendors should

follow applicable quality and reliability standards, production practices, testing procedures and

documentation methods etc towards manufacturing of aerospace packages.

In pursuit of the above, it is decided to fabricate 45 (Forty-Five) Numbers of Electro-Optic

Sensors (EOS) Type-S through the vendors. The scope of work to be carried out by the vendor

is described in detail in the subsequent chapters as indicated below.

Section-2 gives the Scope of the work involved. Section-3 gives a detailed description of the

work, the terms and conditions, manpower requirements, the schedule, the reference standards

to be followed, documents involved and the responsibilities of LEOS and Vendor. Section 4

gives a detailed list of the documentation and the sub activities of the work involved, the

review requirements, Quality requirements, payment terms and the delivery schedules

involved.

The Appendix A,B,C,D indicate the fabrication and testing requirements for the Electro-Optic

Sensor (EOS) Type-S and also a detailed list of materials required.



2.0 Scope of work

Electro-Optic Sensors (EOS) Type-S consists of Flexi Rigid Electronic PCBs which are

integrated in a mechanical housing with a custom built optical assembly, tested and delivered

as a package after all tests. The activity involves procurement of PCB’s, Mechanical housings

and consumables from ISRO approved sources by the Vendor. EEE components, optical

modules, PCB spool files and Mechanical drawings will be supplied by LEOS as inputs. The

PCB’s are wired and tested. These tested PCB’s and optical modules are integrated with the

mechanical housings and performance evaluation at various stages and assembly is carried out

as per the procedure. Electro-Optic Sensors (EOS) Type-S 45(Forty-Five) Numbers are to be

produced after completion of these tests within a time duration of 48(Forty-Eight) months. All

the test equipment and required facilities for completion of the tests will be provided by LEOS.

The details involved in the production of the Electro-Optic Sensors (EOS) Type-S are

discussed in Section 3.

The production of Electro-Optic Sensors (EOS) Type-S through vendor is planned in two

phases. In Phase-I, the vendor’s personnel will be trained for fabrication, assembly, inspection

and testing of the first Electro-Optic Sensors (EOS) Type-S by LEOS engineers. In Phase-II, the

vendor will produce the hardware independently in LEOS. The ultimate aim is to make

the vendor well versed with the fabrication practices, Quality control procedures and their

implementation to ensure the reliability of the product.

3.0 Work Specification for Fabrication, Assembly, Integration, Testing andSupply of Electro-Optic Sensors (EOS) Type-S

3.1 Introduction

The Electro-Optic Sensors (EOS) Type-S RFP is planned to be produced by external vendors

by giving suitable training. The detailed work specification is discussed in this document. The

various responsibilities of Vendor and LEOS to execute the work is also provided.



3.2 Work Specification

The activities involved in realizing the Electro-Optic Sensors (EOS) Type-S are as enlistedbelow.

Fabrication of precision mechanical parts. Fabrication of Printed Circuit Boards. Procurement of consumables for package fabrication.

Printed Circuit Board (PCB) Wiring.

Testing of wired PCBs.

Integration of PCB’s, optical modules and mechanical housings.

Sub-assembly level Performance tests.

Final Assembly.

Testing of Assembled Package in front of Simulators.

Environmental tests.

Final Ambient Performance Tests.

Reports Preparation for Certification.

Representative activities, flow charts, component lists for Electro-Optic Sensors (EOS) Type-

S are enclosed in Appendix-A. Details of the consumables used for package fabrication is

given in Appendix B. A representative list of equipment for package fabrication and assembly

is given in Appendix C. A representative list of equipment used for testing is given in

Appendix D. Copies of Mechanical drawings, PCB fabrication and wiring details, Assembly

document, and Electrical configuration etc. of Electro-Optic Sensors (EOS) Type-S shall be

made available at LEOS for Vendor’s reference at start of production.

3.3 Terms and Conditions

3.3.1 Validity of the contract:

The Contract is for Supply of 45(Forty-Five) Electro-Optic Sensors (EOS) Type-S in 48 (Forty-

Eight) months from the date of Contract. If delivery of sensors is delayed beyond schedule due

to reasons attributable to Vendor, demurrage clauses will apply. In such case vendor is required



to complete the activities and deliver the sensors with no additional financial implication to

LEOS.

LEOS proposes to finalize a firm and fixed price contract. However, due any unforseen

exigencies due to LEOS, leading to delay in the execution of the contract, beyond the contract

period, standard price variation clause of per GFR2017 is applicable and the typical formula for

Price variation reproduced here

P1=P0{F+a[M1/M0]+b[L1/L0]}-P0

Where

P1 is the adjustment amount payable to the supplier (a minus figure will indicate a reduction in

the contract price).

P0 is the contract price at the base level.

F is the fixed element not subject to price variation.

a is the assigned percentage to the material element in the contract price.

b is the assigned percentage to the labor element in the contract price.

L0 and L1 are the wage indices at the base month and year and at the month and year of

calculation respectively.

M0 and M1 are the material indices at the base month and year and at the month and year of

calculation respectively.

3.3.2 Deliverables by LEOS

Soft copy of all necessary mechanical and thermal drawings for fabrication and

thermal treatment of all mechanical parts as Free Issue of Materials (FIM).

Details of consumables to be procured for card and package fabrication as Free Issue of

Materials (FIM).

All necessary details for PCB fabrication along with list of approved sources as FIM.

All screened EEE components and optical assemblies necessary for the production as

Free Issue of Materials (FIM).

Test jigs for card level tests, test consoles and all special test equipment as Free Issue of

Materials (FIM)

Facilities for PCB wiring, testing, assembly and environmental test facilities as Free Issue

of Materials (FIM)



3.3.3 Material procurement and Parts fabrication by vendor:

Flight Quality PCB’s with all necessary tests and reports.

The space qualified raw material like Al 6061-T6, Titanium alloy (Ti-6AL-4V), SS 304,

etc., required for fabrication of mechanical parts which are shown in mechanical

drawings of Appendix A.

Consumables used for sensor assembly, a list of which is given in Appendix B with an

approximate quantity.

All document copies like log books, fabrication details for card and package, assembly

documents required for each package fabrication.

The vendor shall fabricate the mechanical parts from LEOS approved sources only

Procurement of all items used for flight packages s h a l l be made only from LEOS

approved sources only.

3.3.4 Reference Standards to be followed for Card/Package Fabrication:

The following documents shown in Table-3.1 shall serve as reference documents for the contract

and will be made available at the production site. They cover various phases of activity including

facility requirements and certification, manpower certification, ESD and clean room

requirements. Vendors shall comply with requirements as listed out in these documents and

which are applicable to them.

Table-3.1: Reference Standards to be followed

Document Identification Document title

ISRO-PAX-300 Rev1 Workmanship Standards for the Fabrication ofSpace Electronics Packages.

ISRO-PAS-207 Storage, Handling and Transportation requirementsfor Electronics hardware.

ISRO-PAS-100 Rev 1 Non Conformance Control Requirement for ISROProjects.

ISRO-PAS-201-Rev1 Failure Reporting, Analysis and Corrective ActionProcedures

ISRO-PAS-400 Contamination Control and CleanlinessRequirements

MIL-HDBK-263B ESD Control Hand BookISRO-LEOS-QAG-MTA-GL-01 Space Electronics Production Assurance Guideline



3.3.5 Reference Documents for Electro-Optic Sensors (EOS) Type-S:

The approved reference copies of all applicable documents specific to Electro-Optic Sensors

(EOS) Type-S namely PCB fabrication and wiring details, Mechanical parts fabrication details,

mechanical assembly, electrical configuration, test matrix and log sheets shall be provided by

LEOS. Vendor shall follow the documents provided by LEOS as a guideline to carry out all

the activities. He shall record the test results and observations in the standard log sheet formats.

For detailed list of documentation refer Section 4.3. All the documents are to be used at LEOS

premises only. These should not be reproduced by any means. The copy rights of the documents

used in the course production rests with LEOS.

3.3.6 Schedule:

Phase–I: Training and realization of 1st package will be 4 months from the date of

release of Contract.

Phase-II: Delivery of 44 numbers (2nd to 45th) of Electro-Optic Sensors (EOS) Type-S

to be realized in 44 months from the training package or 48 months from the date of

release of Contract. A minimum of 6 (six) packages to be delivered every six months.

Delivery schedule chart is shown in Fig-1.

The vendor is free and encouraged to complete the activities and deliver sensors before

the schedule without any financial implications on LEOS.

3.3.7 Facilities Requirements

LEOS shall provide all the required facilities at LEOS production labs for wiring,

assembly, Ambient Performance test, environmental tests and calibration as per ISO-9001-2015

standards in vogue. The Vendor is required to carry out Wiring of PCB’s, testing at card and

package level, assembly of package and environmental tests at LEOS.

3.3.8 Manpower Requirements

1. The Vendor shall provide requisite qualified personnel supervised by a team leader for

effectively executing the project (Table 3.2 below). The team leader should be a B.E

(Electronics/Electrical) with 5 years of working experience in Aerospace/ Defense projects



and knowledgeable in Aerospace standards. The following Table-3.2 provides minimum

man power requirements for Phase-I and Phase-II and is indicative only.

Table-3.2: Minimum Manpower Requirements for completion of ContractSl.No Engineer

/TechnicianResponsibility Qualification

MinimumNo. ofstaff

Activities involvedin

1 Test Engineers(Electronics/Electrical)

Testing B.E. With 65%marks 3 Card/Package TestingActivities anddocumentation

2 MechanicalEngineer + QA

Assembly,Environmental tests

BE with 65% marks 2+1 Card/PackageMechanicalActivities &documentation

3 Technicians +QA(Electrical)

Wiring andInspection

2+1 PCB and package levelwiring anddocumentation.

4 Team Leader Overall In charge B.E(ECE/EEE)with min 5 yearsexperience inaerospace industry

1 Monitoring all aboveactivities, verification oftest results, schedulingactivities to meetdelivery schedule

2. Responsibility to suitably deploy the manpower and operate extended hours if required to

meet the delivery schedules lies with the Vendor. Delivery Schedules are to be met without

fail.

3. The Vendor shall comply with statutory rules connected with relevant and current Contract

Labor Act, Employees Provident Fund Act, Employees State Insurance Act, Insurance Act,

Payment of Wages Act, Workmen’s compensation Act, etc., and shall submit necessary

registration documents whenever called for. Vendor shall indemnify LEOS towards

compliance of minimum salaries.

4. The vendor shall insure each of technical persons deployed towards the execution of the

production contract with following minimum coverage in the event of an accident.

(a) In the event of death or permanent disability resulting from loss of both limbs:

Rs.10,00,000/- (Indian Rupees Ten Lakh)

(b) In the event of other permanent disability: Rs.7,00,000/- (Indian Rupees Seven Lakh).

The original insurance documents for each of the technical persons deployed towards the

execution of production contract shall be deposited to LEOS within 10 days of signing

the contract and would be retained at LEOS till the completion of production contract.

ITI(Technician,QA) /Diploma(QA)Certificate withFirst class

LEOS23

Typewritten text

(60% marks)

LEOS23

Typewritten text

LEOS23

Typewritten text

First class with 60% marks



5. The vendor personnel employed to carry out this activity have to work for a minimum

period of 48 months or till completion of this contract whichever is earlier. Training to the

vendor personnel will be given during the 1st phase only. Vendor should retain trained

human resources till end of contract work after training. Any training to personnel recruited

at a later stage for this activity will be charged to the vendor by LEOS. Repeated training

would increase time and resources and hence limited to two times only including initial

training. Charges for training manpower beyond the training period (2nd time) is as

indicated

Engineer (B.E/Diploma,. Electronics/Mechanical) :Rs 40,000/-

Technician (ITI Electrical) :Rs 30,000/-

6. Additional Replacement manpower to be provided by Vendor in training phase to cater to

employee attrition.

7. All the engineers and technicians will be trained and evaluated before inducting them on

actual flight version packages.

8. Manpower requirements shown are representative and Vendor may suitably scale up the

requirements to meet the delivery schedule.

9. The employees of vendor deployed to LEOS/ISRO for undertaking the work,

antecedents/police verification shall be carried out by the Vendor at his cost and when

necessary, such records will have to be produced by them (Vendor) to authority concerned.

The Vendor shall give undertaking to purchaser (LEOS) to the effect that the

engineers/technicians/employees deputed at the premises of purchaser for carrying out the

services are not involved in any crime or unlawful activities. In case of any

misbehavior/discourteous behavior they shall be immediately replaced.

10. Transport/Conveyance, canteen and medical facilities will not be extended to vendor/vendor

personnel deployed at LEOS. The vendor shall be responsible for the same.

11. The employees deputed to undertake the work by the vendor shall remain the employees of

vendor and they will not acquire any claim for future employment or regularization in LEOS

or any other LEOS, ISRO centers.



3.4 General Terms & Conditions

3.4.1 Should any component(s)/part(s)/material(s) etc., issued by LEOS to vendor be damaged

or rendered unusable/unserviceable during the realization of the Sensor, it shall be

compensated on actuals by vendor with penal interest.

3.4.2 Procurement/fabrication of other hardware by Vendor shall be from LEOS approved

vendors to ensure consistency in Quality and cost advantages.

3.4.3 Vendor shall strictly follow/adhere Quality Assurance guidelines, requirements given by

LEOS.

3.4.4 Vendor to provide warranty for a period of one year from the date of acceptance by

LEOS the performance of each of the sensor supplied by it to LEOS against

workmanship defects. Vendor shall carryout necessary repair and testing free of charge

during the warranty period.

3.4.5 The vendor shall accept and implement any modifications in components /materials/tests

/methods necessitated by functional requirement/improvement/on-orbit observations for

LEOS project needs, and brought out by LEOS, in the sensor units supplied by vendor at

no extra cost, unless the modifications call for major changes in the sensor. In the event

of configuration change requiring change in PCB or Mechanical housings, vendor would

be reimbursed suitably for PCB procured or housings fabricated. Compensation shall be

mutually agreeable basis. The date of reckoning for sensor delivery would be suitably

modified. For the deployed manpower vendor shall quote/claim for hourly basis.

3.4.6 All the information/documentation (in all forms) of the activities/works forms intellectual

property of LEOS. LEOS has complete, exclusive right on the

information/documentation (in all forms). The vendor guarantees that all the technical

information and knowhow provided by LEOS within the scope of this contract shall be

treated as confidential and will not be divulged to any other party. The Vendor also

undertakes and guarantees that the documentation issued by LEOS shall be kept by

vendor in safe custody and in good condition for the entire period of this contract. Vendor

shall return all the documents to LEOS and declare in writing that no other copy exists

with him or the personnel employed by him. Further the vendor shall execute a non

disclosure agreement with LEOS.



3.4.7 The vendor shall not disclose the production details to any other entity, without explicit

permission from LEOS. He shall not advertise/disclose/divulge or transfer by any means

in any brochures, pamphlets or in seminars/conferences without explicit, written

permission from LEOS.

3.4.8 The first sensor produced by vendor independently, after training, is considered as first

article which shall be subjected to higher level testing. On successful completion of first

article, vendor shall be given clearance for further production activities.

3.4.9 The vendors personnel deployed at LEOS for activities of contract shall carry out

pending work, if any, towards meeting schedules beyond office hours and on holidays,

with consent from LEOS, without any financial implications to LEOS.

3.4.10 The vendor shall be an established/Registered Indian company (with majority stake with

Indian owners; documentary proof to be provided) without any insolvency, and actively

doing business for past 5 years.

3.4.11 Vendor shall have valid ISO9001/AS1900 certification and confirm the same in the

quotation. Documentary evidence to be provided.

3.4.12 The vendor shall have a minimum of 3 years of experience in the nature of the present

proposed work. Documentary evidence to be provided.

3.4.13 The vendor shall have executed and successfully completed atleast one work/order

involving similar kind and scope of work involving wiring, fabrication, assembly and

testing for Aerospace, ISRO or similar organizations in India. Details are to be filled as in

Table 3.3 and necessary details with documentary proof to be provided.

Table-3.3: Experience of Vendor for past 2 years ending with current year.).(Mandatory; be sent along with or as part of technical bid; otherwise bid would be considered

invalid)Sl.

NO.Brief description

of of Work.Name of Customer,

category of customer(Aerospace, ISRO,

Defence)

Duration,Number of

products, cost,number ofmanpowerdeployed

Nature/quantum ofwork

(eg., wiring,assembly, testing,operating specialequipment etc.,)



3.4.14 The vendor shall not sub-contract either whole or any part of the work to other vendors

except for procurements and mechanical parts/PCB fabrication.

3.4.15 LEOS reserves the right to enter into parallel/adhoc contract with one or more Vendors

during the currency of this contract for same sensor.

3.4.16 Under exigencies, LEOS may have to short close its commitment to produce sensor by

vendor under this agreement. Should such exigency arise, LEOS would issue a THREE

months notice to vendor for such short closure of the Order/contract. Upon issue of short

closure notice, a committee, formed by LEOS shall work out the details of actions to be

completed by either parties, relating to free issue of materials, contract commitments,

balance of work, compensation etc., to mutual satisfaction. The committee shall complete

the evolution of mutually agreed action plan within 30 days from the date of issue of

short closure notice.

3.4.17 Both LEOS and vendor shall have the right to terminate this agreement by giving a notice

of THREE months in writing to the other for any other reason, not specified in and which

shall be by mutual consent. The payments would be made to the extent of deliverables by

vendor. Unused raw material/PCB/Mechanical parts to be handed over to LEOS and the

committee (mentioned in 3.4.16 above) shall decide all these modalities of stock taking

and termination.

3.4.18 During the effective period of this contract, if it is found that the sensors manufactured by

vendor, after training period, fail to meet the workmanship standards, fabrication and

assembly requirements repeatedly the matter may be brought to the notice of vendor by

LEOS for rectifications, free of cost to LEOS. If after a reasonable period, necessary for

rectification has not been affected or the sensor do not still meet the specifications, LEOS

reserves the right to revoke the order/contract granted to vendor without any notice and

no liability on the part of LEOS. The criteria of a defect/rework being attributable to

workmanship or design will be made by LEOS.

3.4.19 LEOS reserves the right to terminate the revoke/cancel order or terminate the contract if

vendor fails to deploy required resources towards training/executing within a reasonable

period of time (one month from the date of order) or fails to meet the obligations under

this contract.



3.4.20 Breakup of supply & service component embedded in the quoted price, to be mentioned

in percentage. (Please note for supply GST is applicable @5% since LEOS is issuing

GST Concessional Certificate and for service @18%).

3.4.21 Customs Duty Exemption: LEOS will be issuing Custom Duty Exemption Certificate

under Notification NO.5/2018 dated 25-01-2018 for imported components required for

execution of this contract. All other duties and taxes to be borne by the Vendor.

3.4.22 Arbitration/Settlement of Disputes: Disputes if any shall be settled mutually, failing

which it will be referred to a one-man arbitration appointed by Director, LEOS in

accordance with the Arbitration and Conciliation Act, 1996 and alterations/modifications

thereof whose decision shall be final and binding on both the parties.

3.4.23 Secrecy and Non Disclosure Agreement: All documents prepared for fabrication, test

procedures, log books, drawings, schematics and any other communication, codes

revealed during the process of testing will be exclusive property of LEOS and vendor

shall have no right what so ever on them. These documents are to be strictly confidential

and should not be reproduced, copied/transmitted to any media without the explicitly

permission of LEOS. Further, the vendor must not quote any of these works in any

publications or to any of their customers without explicit permission from LEOs and

adhere to strict confidentiality.

3.4.24 Compensation for damages caused for persons, goods or property: The vendor shall

indemnify and hold harmless, LEOS and/or any Officer, employees or assignees thereof

against any loss, damage or expense resulting from damage to property or personnel

injury arising out of willful misconduct or gross negligence of the Vendor or their

personnel in the execution of the work under this contract. The Vendor shall at its

expense, defend any suit or proceedings brought against LEOS on account thereof, and

shall satisfy all judgments and pay all expenses which may be incurred by or rendered

against them, in connection therewith.

3.4.25 All defective parts fabricated by Vendor are property of LEOS and shall not be returned.

3.4.26 All materials procured by Vendor are to be subjected to Third party inspection and test

certificates to be submitted to LEOS.



Section 4Statement of work for fabrication, assembly, integration, testing and supply of

Electro-Optic Sensors (EOS) Type-S

4.1 General

This statement of work comprises of nature of work and the responsibilities of the vendor inconnection with the fabrication, assembly, integration, testing and supply of Electro-OpticSensors (EOS) Type-S

4.2 Phase-1 and Phase-II Activities

The scope of the work is planned in two phases.

PHASE – I :In this phase, the vendor will be trained at LEOS by LEOS representatives. During this phase,the vendor will be trained for actual fabrication and testing of sensors. Training and realizationof first package shall be completed within 4 (four) months from the date of release of Contract.Further the vendor has to get all the required details from LEOS towards Consumablesprocurement, PCB procurement and procurement of raw materials for mechanical partsfabrication. He has to procure the materials and submit to LEOS the reports and conformancecertificates for clearance to use in Phase-2 Production Activities.

PHASE – II:In this phase, the vendor is totally responsible, for the fabrication of PCB’s and mechanical partsready for assembly in all respects. This includes mechanical parts fabrication, 100% metrology,thermal treatment (Anodising and Black painting) of parts etc. and PCB procurement. Thevendor is totally responsible for wiring of PCBs, inspection, testing at sub assembly level,assembly of total package and testing them for their performance, environmental tests andcalibration as per the approved production and test documents. The remaining 44 packages willbe fabricated and tested independently by the vendor in 44 months from the date of trainingcompletion or 48 months from the date of Contract with the 44th package delivered by the end of48th month and as per the delivery schedule given in Fig.1



4.3 PHASE – I TRAINING ACTIVITIES AND DOCUMENTS4.3.1 TRAINING PACKAGE AND DOCUMENTS TO BE REFERRED:The approved reference copies of all applicable documents namely PCB wiring, packageassembly, test matrix and log sheets shall be provided by LEOS. Based on the referencedocuments, the party has to make hard copies for the production package folders of eachindividual card and packages. The documents provided by LEOS are comprehensive describingevery minute details so as to enable the vendor to understand the requirement and produce thehardware required as per specifications and test every aspect of the functionality without leavingany issue/Sensor, without change of parts, consumables, process, procedure and method, withoutany additional Sensor/process. To summarize, these documents are self-instructive to the vendorand contain every requirement of LEOS in view that he/she should be ultimately able tofabricate, assemble, test and deliver with the least participation from LEOS. The card / packagefolder should have the following details filed based on the master copy provided by LEOS.

The documents supplied are as follows and typical contents of the document are as discussedbelow.

4.3.2 DOCUMENT TO BE REFERRED FOR PCB WIRING

01. PCB Layout, number of layers etc.02. Component details in the LEOS standard format.03. Component positioning / mounting details with component marking details.04. Drilling details for components mounting etc., on PCB.05. Mechanical details such as dimensions and stack holes sizes scheme of mounting etc.06. Mechanical housing details and stacking diagram and position of the card in the stack.07. Connector details and identification of input/output.08. Component placement and lead bending requirements specific to components.09. Conformal coating, potting and lacing requirements10. Fabrication / soldering specifications like temperature solder material, soldering time and

specific tools to be used.11. Handling precautions of the components.12. ESD protection methods and practices.13. Any special notes, as called for.14. List of Applicable ISRO / Other documents.15. Others



Layout marking etc. Inspection procedure etc. Soldering / desoldering Card identification marks Card mechanical, electrical inspection records Solder masks (if applicable) Special land patterns Cleaning Procedure

4.3.3 DOCUMENT TO BE REFERRED FOR MECHANICAL PARTS FABRICATIONa) Approved Mechanical Fabrication Drawings for mechanical fabrication.b) Drawings used for thermal treatment of Mechanical Parts.c) Details of Sample coupons.d) Quality control log books and formats for inspection / metrology / after fabrication and

thermal treatment of parts.e) Details of raw materials used like mechanical properties, chemical composition,

4.3.4 DOCUMENT TO BE REFERRED FOR ASSEMBLY OF PACKAGE.The vendor has to refer to the master copy of the assembly document provided by LEOS andstrictly follow the sequence/procedures as explained during the training of first package. Thevendor has to ensure availability of the following documents/details before starting thefabrication activities01. Flow chart showing the sequence of activities during sensor fabrication.02. Description of each activity giving the previous activity to be completed and other pre-

requisites.03. Materials, parts and special epoxies to be used.04. Tools and Instrument used for assembly.05. Documents for wire routing, connector mounting on PCB etc.06. Interconnection details such as card to mother board / package to package etc.07. Connection details input / output designations etc.08. Interconnection harness requirements etc.09. Stacking details10. Mechanical details such as card to card to spacing, torque requirements etc.11. Assembly procedure for parts including cleaning, handling procedure and precautions to be

taken.



12. Assembly environment.13. Check points / test points.14. Failure report / correction mechanism15. Log books with formats at all stages of sub-assembly and system level assembly.16. Rework procedure at different stages, incase of re-work is called for. Report of fabrication

deviations, authorizations, QC Check points.17. Time required for each activity, type of infra structure / overheads needed and estimated

utilization time on each facility and infrastructure man-hours required for each activityincluding engineers, technicians and management and supervisory staff.

18. Rework procedures.

4.3.5 DOCUMENT TO BE REFERRED FOR TEST PROCEDURE FOR EACH CARDAND SUB-ASSEMBLY

The vendor has to refer to the master copy of the test procedure document provided byLEOS and strictly follow the sequence/procedures as explained during the training of firstpackage. The vendor has to ensure availability of the following documents/details beforestarting the testing activities. Each card / sub assembly functional inputs and outputs are tobe understood and discussed with LEOS engineers while undergoing the training. Card level /sub assembly test procedure document shall have the following details01. Circuit diagram with identification of input / output and destination information.02. Block schematic03. Functional description04. Input / output specification05. Environmental requirements06. Test set up, special simulators and jigs and procedures07. ESD protection requirements08. Log book09. Analysis report10. Precautions during tests11. Environmental tests, if any12. Burn in components / devices if any13. Test results, anomalies, corrections, reviews



4.3.6 DOCUMENT TO BE REFERRED FOR TEST PROCEDURE FOR ASSEMBLEDPACKAGES.

The vendor has to refer the master copy of “Test procedure document for assembledpackages” provided by LEOS. The document contains the following details

Test Specifications: Details of various environmental tests, calibration procedure. Equipment and special jigs, simulators, mechanical equipment and special facilities for

assembly including cleanliness requirements at the place of test. Procedure for all interface checks Identification of inputs / outputs ports and their designations, expected type of signals, levels

and limits Detailed test matrix and expected results for every test Test set up required for every test to be described and to be documented. The requirement in terms of interfaces, test and measuring instruments. Test procedure for performance evaluation using special simulators, logging and test results. Alignment procedure and log sheets Precautions to be taken during tests

4.3.7 RESPONSIBILITIES OF LEOS DURING PHASE – 1

LEOS shall supply all the necessary drawings, wiring, assembly & test procedures for makingprototype sensors. The vendors will be exposed to actual fabrication work and inspectionpractices and testing of sensors. The vendor personnel will be trained by LEOS for carryingout various tasks involved in realization of first package. All the required facilities relevant tothe activity shall be provided by LEOS. The performance of fabrication, test and evaluationpersonnel of the vendor will be tested and certified by LEOS for their eligibility in theactual fabrication and testing activities.



4.3.8 RESPONSIBILITIES OF THE VENDOR DURING PHASE – IThe vendor shall position the required manpower as specified in section 3.3.8 at LEOS. Thepersonnel have to participate and get trained at each stage of fabrication, assembly andtesting. The personnel must familiarize with all the activities viz; understanding sensorterminology, understanding the mechanical drawings, mechanical parts fabrication and 100%inspection, understanding the thermal treatment aspects of mechanical parts, helicoilfixing, fabrication and assembly procedures, fabrication sequential flowcharts, mechanicaland electrical functional aspects, Quality control, ESD related, handling of special devices, testconsoles, equipment, simulators, card and package test parameters and specifications, interfaceaspects , mechanical assembly of cards and packages, environmental tests and procedures bythorough understanding of documents provided and the application of these documents forcompletion of each stage activity etc.

The vendor personnel have to get familiarized with management of folders/files containingcomplete data related to card level fabrication, package level activities folder and assemblydocument. These documents reflect the history, traceability and progress of work on day-to-day basis with record of execution of activity. The package will be certified based on theevaluation of sensor delivery requirements by auditing.

The vendor shall position the required manpower at LEOS. All the documents as explained inthe previous section shall be prepared for the first package as per the training given by LEOS andget them approved before the final documents are submitted. Changes/modifications if any fromthe documented procedures that may arise during the training period shall be recorded and usedby the vendor for updating the existing documents after necessary approvals from LEOS.



4.4 PHASE–IIPRODUCTION ACTIVITIES FOR FABRICATION, ASSEMBLY, INTEGRATION,TESTING AND SUPPLY OF ELECTRO-OPTIC SENSORS (EOS) TYPE-S.

This activity shall be executed at LEOS production facility by the Vendor personnel. Vendorhas to carry out all activities towards package realization independently. During the fabricationprocess, the following are to be followed without exception wherever applicable.

4.4.1 MECHANICAL PARTS FABRICATION

Mechanical parts fabrication as per approved drawings by fabricators approved by LEOS. Matching of parts. Serial number, Part number marking, engraving & marking of parts. Inspection of Mechanical Parts for QC. Acceptance /Rejection / Rework reports. Anodizing the parts as per approved drawings by facility approved by LEOS. Drilling, Tapping, Fitting, Helicoils fixing etc. Black painting/black dying of the parts as per approved drawings. Certificates for all thermal treated parts.

4.4.2 PCB FABRICATION

PCB fabrication as per approved spool files by an approved facility. Carrying out all tests on PCBs as specified for aerospace requirements. Visual and Mechanical Inspection reports. Submission of PCB’s along with traceability, inspection reports including Group B test

reports, test coupons to LEOS for obtaining clearance. Storage of PCB in proper condition as per procedure.

4.4.3 PCB WIRING

All the PCBs connectors, buffer connectors, auxiliary and temporary wiring shall be made asper the standards defined by LEOS.

The vendor shall strictly adhere to the ESD protection measures. The vendor shall maintain a folder to each card being fabricated and to log all relevant

information as per the prescribed log book.



Vendor shall receive components and carry out inward inspection as per component list. Getting necessary clearance for components deviating from component list or getting

replacement components. Pre-fabrication activities – card cleaning, baking and PTH filling. Component mounting, inspection and soldering and lead bending wherever applicable. Provision of chotherm and heat sinks wherever required as per the fabrication procedures. The vendor shall follow the fabricated procedures as per the guidelines of LEOS and inspect

at every stage before proceeding to the next stop. Any deviations, anomalies observed and noticed must be logged and reported to the

concerned authorities and to proceed only after clearance by competent authorities. The vendor shall make the card ready for functional tests, after completion of the fabrication

and inspection of the cards. The vendor shall obtain clearance from LEOS for functional testing and carry out the testing. Vendor shall make arrangements for the incorporation of test selectable components to

realize the design goals and complete card level testing. After completion of card testing the vendor shall carry out radiation shielding, coating,

potting, Dam and fill as per the fabrication procedures and guidelines of LEOS. Vendor shall inspect the cards after conformal coating and carry out card tests and get

clearance for next activity/assembly/initial Ambient Performance test.

4.4.4 CARD TESTING

Follow all ESD precautions for testing of the cards. To make ready all the cards and subassemblies fabricated for functional tests by visual

inspection and passive measurement of various parameters. To make the test setup as per the card test procedure and setup verification which may

include reading the stimuli’s power sources, setting up the voltage and current limits, testequipment, log books etc.

To log the test conditions, test results and reporting any deviations to the subsystem incharge and proceed only after necessary clearance.

Every card to be checked as per the pre-determined procedure and tabulate the results in theprescribed format.

After completion of the test on each card, the results are to be viewed and their complianceto be recorded. Any deviations are to be notified.



Anomaly reporting / corrective actions / trouble shooting / waivers to be followed as perISRO guidelines.

Package level assembly and testing is to be carried out after clearance for all cards.

4.4.5 PACKAGE ASSEMBLY AND PACKAGE LEVEL TESTS

After completing functional tests of all cards following activities will be carried outo Package Temporary Assembly: All the cards will be integrated and tested.o Package Final Assembly: All the cards and optical modules will be integrated with

the mechanical housings as per the approved assembly procedure. The assembledpackage shall be offered to LEOS for clearance for further activities.

o Initial Ambient Performance Checks: The assembled package will undergo Ambientperformance checks as per the test matrix. Testing is to be carried out with theassociated test jigs, test equipment and simulators.

o Stabilization tests: Package will undergo stabilization thermovac and vibrationfollowed by alignment in front of special simulators

o Vibration Test: After completing ambient performance tests and obtaining necessaryapproval/clearance from LEOS and mandatory inspection by QA, the packages willundergo vibration as per the test levels given by LEOS.

o Thermovacum Test: The packages have to undergo thermal-vacuum (TVAC) testafter vibration test. The temperature-time profile and vacuum limits (TVACprofile) will be provided by LEOS. Cursory Package performance will be monitoredthroughout thermovac and detailed readings as per test matrix will be done as per thespecified time indicated in the test profile.

o Final Ambient Performance Checks: the package after completion of all above testswill undergo Final ambient performance checks as per the test matrix. Results will beverified for matching with the results of initial ambient performance checks.

o Pre-certification: After completion of all tests, all data is to be compiled in therequired form and data is to be submitted to LEOS for obtaining QA certificate.

4.4.6 REWORK / RETESTS

To conduct the tests both on cards and package and total systems as and when required (apartfrom the above tests) due to various anomalies, requirements, suggestions, etc. If any failureoccurs at sensor level testing at any stage of the testing, the entire testing cycle is to be repeatedtowards meeting the specifications.



4.5 INSPECTION AND AUDITING

The flight fabrication activity involves inspection and audit by the vendor QC personnel. Theyshall carry out inspection on 100% basis at all stages of activity and shall make specific mentionof inspection in the fabrication folder. For inspection guidelines, vendor may refer to thereference documents section. Subsequently before every higher stage of activity as indicated inTRR, audit shall be carried out internally to assure that all activities at the earlier stage arecompleted. Formal stage audits will be carried out by LEOS and clearance will be given toproceed to next stage. The Mandatory Inspection points are where LEOS shall mandatorilyaudit/review the progress of activity and readiness of hardware for further activity . LEOS reservesthe right to inspect/audit hardware at any stage of the activity.

4.6 NON-CONFORMANCE MANAGEMENT

For non-conformances observed during fabrication, assembly and testing, following are therecommended guidelines:

All non-conformances related to materials, fabrication, assembly, testing etc to bereported to LEOS within 24 hours in writing.

For all Non-conformances, LEOS shall recommend next course of action. The NCR shall be addressed to Focal Point, LEOS.

Focal Point from Vendor shall ensure complete reporting of all non-conformances andthe assessment of Vendor to LEOS.

LEOS shall after receipt of NCR discuss in the appropriate forum and suggest furthercourse of action.

4.7 PHOTOGRAPHIC RECORDS

Photographs of the hardware shall be maintained. A checklist for mandatory photographicrecords will be given and it is the responsibility of the vendor to produce photographs as per thechecklist. Further Photographic evidence needs to be maintained as a record of thefabrication/assembly activity. Towards this purpose, fabrication records shall also carry record ofphotographs meant to record fabrication activity completion, rework completion, conformalcoating completion, tray wiring and package assembly. Images shall be captured only byinstruments provided by LEOS for this activity.



4.8 COMPONENT MANAGEMENT

1. All the EEE parts and optical modules shall be issued to vendor based on the requirementfor realization of the packages.

2. The components given by LEOS for fabrication work shall be received and acknowledgedby the vendor.

3. Vendor shall maintain all records of components received and utilized, unused componentsetc., and submit to Focal Point, LEOS a statement at the time of package delivery and returnthe unused components.

4. Vendor shall take utmost care in handling and transportation of the components.

5. Defective components, if any, found should be accounted and informed to the LEOS forreplacement.

6. Vendor is responsible for keeping track of the expiry date of the components and to wire thecomponents within the expiry date.

7. Vendor shall be responsible for any loss/ damage of components and shall make suitablecompensation to LEOS.

8. The components supplied by LEOS against each order will be used by the vendor for thesole purpose for which it is intended.

4.9 TEST SYSTEMS

Test consoles, Custom made card jigs and Electro optical simulators, general purposeinstruments required for testing at card and package level shall be provided by LEOS.

4.10 SCHEDULE, PLANNING AND REPORTING / QUALITY CONTROL

4.10.1 SCHEDULE AND PLANNING

The total time schedule of activities shall be met without fail. Schedules to be made for eachindividual package. Vendor shall make detailed plan for all sub-activities involved in realizingthe packages and communicate the same to LEOS to ensure timely availability of LEOSpersonnel and facilities wherever applicable.



4.10.2 STATUS REPORTING

Status report of major activities like fabrication, testing and documentation shall be submitted forreview on weekly basis. Any deviation from the agreed plan shall be informed to LEOS forapproval/ratification.

4.10.3 LOG BOOKS, FOLDERS AND FILE MAINTENANCE

All log books, test procedures, test results, individual card and package folders and files to bemaintained as per procedures of LEOS in vogue.

4.10.4 FOCAL POINT

Vendor will identify the focal point for all communications / instructions to have bettermanagement. Similarly, LEOS shall identify an Officer to communicate with the Vendor.

4.10.5 QUALITY PROVISIONS

Vendor shall use facilities for the fabrication, assembly and testing of Electro-OpticSensor which are approved by LEOS. All approved practices of Quality assurance ofelectronic systems, assemblies shall be adhered to. All processes used shall be approvedby LEOS-QA. All materials and components used shall be approved by LEOS-QA. AllISRO documents on Quality assurance shall be applicable Towards Review / acceptance /non-conformance / rework / authorization / waivers.

Vendor should strive to have minimum non-conformances and completely avoidrecurring of the same non-conformance by ensuring proper checks as required at allstages.

The Quality of the package will be judged based on the total number of non-conformances

4.10.6 PRICE BREAKUP FOR REALIZATION OF ELECTRO-OPTIC SENSORS (EOS)TYPE-S

The clear breakup of price for carrying out PCB wiring, PWB testing, mechanical assembly,package level testing and environmental tests, cost of consumables, fabrication cost andPCBs and mechanical parts are to be indicated as per Table-4.1 for Electro-Optic Sensors(EOS) Type-S. Vendors while making their techno-commercial bids shall carefully gothrough the requirements as spelt out in this document and respond accordingly. The price



breakup should be given as a percentage of the total price only. No price information is to bementioned while providing the breakup

(Mandatory: The above table-4.1 to be submitted in technical bid onlymentioning the price as % of total price per sensor; Actual price to besubmitted in price bid only. otherwise bid would be considered invalid)

Sl.No ActivityPercentage

PriceRemarks

1 Wiring, Assembly and Testing (Services)

1.1 PCB Wiring

Refer Appendix A1.2 Wired PCB Testing

1.3 Package Assembly

1.4 Assembled Package Tests

2 PCB, Materials, Consumables and Fabrication (Supply)

2.1 PCB for Electro-Optic Sensors (EOS) Type-SRefer Appendix A

2.2 Fabrication cost of Mechanical housings forElectro-Optic Sensors (EOS) Type-S

2.3 Consumables for package Refer Appendix B

3 Total price per sensor

Table-4.1: Price Break-up for Electro-Optic Sensor(EOS) Type-K(as a % of total price of one sensor; for example, if total price is x, andcost of PCB wiring is y (y < x), then column-3 to be entered as value of(y/x*100))



4.11 INTELLECTUAL PROPERTY RIGHTSAll documents prepared shall be the property of LEOS and all the intellectual property rights of

all documents shall be solely with LEOS. The intellectual property rights of all sensors produced

shall be with LEOS-ISRO. Vendor can at no point in time or in any format claim the design or

sensor as his own product. Exclusive, Full, complete IPR Rights rests with LEOS.

4.12 ROLES AND RESPONSIBILITIESThis section outlines the roles and responsibilities of LEOS and Vendor so as to provideclarity and to enable smooth operation of the contract. The responsibilities of LEOS and Vendorare shown in Tables -4.3.

4.12.1 RESPONSIBILIITES OF LEOS Necessary infrastructure essential for carrying out the Realization of Hardware. Training and certification of Fabrication, Technicians, training for Test Engineers

shall be provided for the first package only.

Audit/Clearance of consumables & materials procured by vendor.

Supply of EEE parts and special components as required for the realization ofhardware as per RFP and the same is to be collected by vendor as per PurchaseProcedure.

All software in embedded form. Provide sufficient documentation to carry out the activities as per contract.

Carry out audits and provide approvals for the fabrication, assembly and testing.

Disposal for all Non conformances arising at various stages of package realization.

4.12.2 RESPONSIBILIITES OF VENDOR

The vendor shall execute the work as per the content and delivery schedulementioned in the RFP.

The Vendor is responsible for safe custody of the materials supplied by LEOS. Vendor shall procure and use approved consumables, where applicable. Maintain records towards traceability of all mechanical parts, and consumable like

batch. No, Expiry data etc with each package. Ensure calibration validity of Test & Measurement equipment. Rework as well as replenishment of rejected Sensors on the basis of the feedback



from LEOS. The vendor shall nominate a technically qualified person as a Focal Point for work

scheduling, progress review and for interaction with LEOS. Submission of periodic progress report. Procurement of consumables and materials, obtaining approvals for their

acceptance & Storage at LEOS by submitting relevant reports/certificates ofconformance/compliance.

Interaction with various agencies in LEOS for smooth execution of the fabrication,testing and documentation during the period of contract through Focal Point, LEOS

Deployment of technical manpower at LEOS to carry out the stated works. Ensure submission of periodic reports. Report all non-conformances arising at any stage during fabrication and testing

within 24 hours of its occurrence to LEOS and obtain approvals for continuingwith further activities.

Safe custody of the equipment, test jigs, test consoles given towards variousactivities at LEOS.

All parts supplied by Vendor and found defective are property of LEOS and shallnot be returned in lieu of replacements.



Table 4.3: Activity Responsibility Matrix for LEOS and Vendor

SL. No. ACTIVITY RESPONSIBILITY Remarks

1 PCB Gerber files/Films LEOS

2 PCB Vendor

3 Mechanical Drawing LEOS

4 EEE Components LEOS

5 Mechanical Housings and fasteners Vendor

6 Consumables/Materials Procurement Vendor List of materials will be given by LEOS

7 Consumables Qualification Vendor By NABL accredited Lab certificate

8 Audit for Consumables LEOS Audit/Clearance by LEOS

9 Incoming Inspection, Storage & Handling ofcomponents before start of fabrication activity

Vendor

10 PCB Wiring Details LEOS Reference document will be given in the trainingperiod and has to be followed for all packages

12 PCB Wiring Vendor

13 Card Level Audit prior to card F/T Vendor and LEOS

14 Card Level Test setup Vendor Test setup preparation to be carried out by vendor

15 Testing of cards Vendor Card Level test procedure shall be given in thetraining period and to be followed for all packagesand cards

16 Card Test Results clearance LEOS

17 Radiation shielding, Conformal coating, potting Vendor



SL. No. ACTIVITY RESPONSIBILITY Remarks

18 Clearance for Functional test after coatingand potting

Vendor

19 Testing of cards after RCP Vendor

21 Package Assembly and wiring Vendor

22 Buffer harness for package level testing Vendor Wires and gold plated connectors will be provided by LEOS.23 Package level Test setup preparation Vendor Test system will be provided by LEOS. Any required harness to be

fabricated by Vendor. Test setup to be done by Vendor

24 Initial Ambient Performance Test Vendor

25 Package Permanent Assembly Vendor

26 Package Assembly Inspection as perMandatory Inspection Points

LEOS &Vendor

27 Package Tests after Assembly Vendor

28 Package Stabilization Environment testsclearance

LEOS

29 Stabilization Thermovac Vendor Facility given by LEOS30 Stabilization Vibration Vendor and LEOS Facility given by LEOS28 Package Clearance for Vibration LEOS29 Vibration Test Vendor and LEOS Facility given by LEOS30 Package Tests after Vibration Vendor31 Package Clearance for Thermovac LEOS Facility given by LEOS32 Thermovac Test Vendor and LEOS LEOS shall give the Specifications document.33 Final Ambient Performance Test Vendor Tests to be done as per procedures provided in training phase

34 Pre-certification process Vendor & LEOS All the necessary Consolidated test results and observations to beprepared for precertification

SENSORS PRODUCTION DIVISION LEOS/ISRO


4.13 LIST OF DELIVERABLES BY VENDOR

o All relevant certificates relevant to raw materials procured including proof of

purchase of raw material, mechanical inspection reports, detailed dimensional

sheets (sheets consisting of 100% inspection details), thermal treatment reports.

o All PCB fabrication reports and inspection reports.

o Electro-Optic Sensors Type-S fully fabricated and tested as per requirement.

o Fabrication history folders for each card and package.

o Test results in hardcopy and softcopy form, log books, analysis reports, failure

analysis, samples rejections etc.

o Sample test coupons (thermal treatment), unused surplus materials/ components.

o Warranty certificate related to workmanship defects for a period of 12 months

from the date of delivery

4.14 SAFETY PRECAUTIONS TO BE FOLLOWED BY VENDOR

The vendor personnel should strictly adhere to the general work rules, procedures and office

timings followed at LEOS and keep harmonious relations with staff during their stay at LEOS.

The personnel of vendor must adhere to all the safety guidelines while handling components,

cards, packages, while testing and transporting, particularly the ESD protection measures such as

wearing ESD overcoats, footwear / chapel, wrist - band etc.

4.15 DELIVERY SCHEDULE:

1. The Sensors should be delivered /completed within stipulated time from the release of

Contract or issue of last free issue of material (component/inputs/test facility) whichever

is later.

2. Delivery schedule shall be as indicated in Fig.1 in the RFP. Vendor shall be responsible

to maintain schedule. The date of delivery shall be the period as indicated in the RFP and

is to be calculated from the date of last free issue of material (components/inputs/test

facility) by LEOS. Delays attributable to awaiting clearances/test facilities availability

etc. which are to be provided by LEOS, shall not be taken into consideration for delivery



period. LD clause may be applicable for delay in delivery beyond the delivery period

indicated in Fig-1 and subject to above mentioned conditions.

3. In order to carry out reworks due to reasons like change in design the vendor has to quote

separately on hourly basis for each individual.

4. All reworks due to fabrication, assembly, handling and transportation shall be done by

vendor free of cost and within the delivery schedules.

4.16 PAYMENT TERMS

Payment shall be made either on completion of all activities as per RFP or split bills for each

package as per milestone payment terms as provided in Table-4.4.

Table 4.4: Milestone Payments for Electro-Optic Sensors (EOS) Type-S

Total Package level (%)Card Wiring Cards testing Card

Readiness forAssembly

with Optics

Package FinalAssembly, Testingand Readiness forEnvironmental tests

Vibration,Thermovac

Testing ,FinalTests & Pre-Certification.

- - 20 40 40

Test procedures and test specifications for all stages and end product specification compliance

are provided to the vendor at the start of the contract. Payments shall be made on completing

activities of all stages and meeting the final specifications

4.17 LIQUIDATED DAMAGES

If the CONTRACTOR fails to deliver the complete package to STORES within the time

stipulated in the CONTRACT or any extension thereof, the PURCHASER shall recover from the

CONTRACTOR as Liquidated Damages a sum of one-half of one percent (0.5%) of the price of

the undelivered packages for each week of delay. The total amount of liquidated damages per

package shall not exceed 10% of CONTRACT price of each package.



4.18 PERFORMANCE BANK GUARANTEE

The Contractor shall furnish Performance Bank Guarantee for 10% of Contract Value, valid till

expiry of warranty period of 12 months with a claim period of 60 days.

4.19 SECURITY DEPOSIT

The Contractor Shall furnish Security Deposit immediately after signing of the Contract by way

of Bank Guarantee for 10% of Contract Value, which shall be valid till fabrication, testing and,

supply and acceptance of last delivered package as per the delivery schedule and additional 60

days.

4.20 SECURITY DEPOSIT CUM PERFORMNCE BANK GAURANTEE

Alternately The Contractor Shall furnish Security Deposit cum Performance Bank Guarantee

immediately after signing of the Contract by way of Bank Guarantee for 10% of Contract Value,

which shall be valid till fabrication, testing and, supply and acceptance of last delivered package

as per the delivery schedule and an additional period of 14 months



Activity Month 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

Start of Activity T0

Documentation completion

Card Fabrication

Card Testing

Stack Assembly &Testing

Ambient Performance checks

Delivery of 1st Electro Optic sensor (EOS) Type-S T4

Delivery of 2nd to 7th EOS Type-S T10

Delivery of 8th to 13th EOS Type-S T16



Delivery of 26th to 31st EOS Type-S T34

Delivery of 32nd to 37th EOS Type-S T40

Delivery of 38th to 43rd EOS Type-S T46


End of Phase 1.Delivery of 1stElectro-OpticSensor (EOS)

Type-S

End of Phase 2. Delivery of45th EOS Type-S

Fig.1: DELIVERY SCHEDULE FOR ELECTRO-OPTIC SENSOR (EOS) TYPE-S



APPENDIX A

Activities for Fabrication. Assembly, Integration, Testing and Supply of

Electro-Optic Sensors (EOS) Type-S

Electro-Optic Sensors (EOS) Type-S consist of Two flexi Rigid PCB’s. Tested and approved Optical

Modules are integrated with electronic cards and mechanical housing to realize this packages. This

section discusses the fabrication, assembly, integration and testing requirements of Electro-Optic

Sensors (EOS) Type-S. A typical drawing of the Electro-Optic Sensors depicting the major parts is

shown in Fig-A1. An exploded view of the various parts is shown in Figure-A2

Figure-A1: Typical Electro-Optic Sensor (EOS) Type-S



Realization of Electro-Optic Sensors (EOS) Type-S involves the following activities

a. Fabrication of the Mechanical Parts as per drawings and their inspection and approval.

Mechanical parts and their details are given in Section A1, Table A1 and Fig-A3 to Fig-A11,

b. Fabrication of the Flexi Rigid and rigid PCBs as per spool files, their inspection and approval.

Details of PCB’s are indicated Section A2, Table-A2, Figs A-12 to A-15 and Section 4.

c. Receipt of components and their inspection. Component details are indicated in Table-A3

d. Wiring of PCB’s including mechanical mounting of connectors, heat sink plates etc followed by

radiation shielding, coating and potting. PCB wiring requirements are indicated in Table-A4 and

Section 4.

e. Testing of PCB’s is indicated in Table-A6 and Section 4.

f. Temporary package assembly.

g. Final assembly of the package. (Table A6 and Section 4)

h. Initial ambient performance tests. (Table A6 and Section 4)

i. Environmental tests (Table A6, Fig-A12, Fig-A13 and Section 4)

j. Final ambient performance tests of the package. (Table A6 and Section 4)

k. Results compilation and package certification. (Table A6 and Section 4)

Figure-A2: Typical Electro-Optic Sensor (EOS) Type-S

DETECTOR HOUSING

DETECTORHOUSINGCOVER

BUSH FORCARD MOUNT

CARDMOUNT

RTVPAD

ELECTRONICSHOUSING

CUBE PLATE& CUBE

HEAT SINK

SPACER

OPTICS



A1 Mechanical parts details:

The various mechanical parts of Electro-Optic Sensors (EOS) Type-S are shown in Table: A1.The mechanical diagrams of the major parts are shown in Fig-A3 to Fig-A11. The activitiesinvolved in fabrication of these parts are discussed in Section 4.

Table A1: Mechanical parts details

Mechanical part Sub assembly DimensionOptics Mount 1

Refer mechanicaldrawings of major

parts given in Fig- A3to A11. Part tolerancesto be strictly followed.

All parts are to beanodized. Blackpainting is to be

carried out for partsshown in Fig-A4 and

Fig-A5

Electronic housing 1

Cover plates 4

Cube Mount 1

Other Parts

Focusing ring 1

Detector Housing 1

Detector Housingcover 2

Card Mount 2



Figure-A3: Bush for Card Mount and Focus Space for Electro-Optic Sensor (EOS) Type-S



Figure-A4: Detector Housing for Electro-Optic Sensor (EOS) Type-S



Figure-A5: Detector Housing Cover for Electro-Optic Sensor (EOS) Type-S



Figure-A6: Electronics Housing for Electro-Optic Sensor (EOS) Type-S



Figure-A7: Card Mount for Electro-Optic Sensor (EOS) Type-S



Figure-A8: Card Mount With Slot for Electro-Optic Sensor (EOS) Type-S



Figure-A9: Heat Sink for Electro-Optic Sensor (EOS) Type-S



Figure-A10: Card Wiring Fixture for Electro-Optic Sensor (EOS) Type-S



Figure-A11: Card Holder for Card Wiring Fixture for Electro-Optic Sensor (EOS) Type-S



A2 PCB fabrication details

The Electro-Optic Sensors (EOS) Type-S have 2 types of PCB’s whose dimensions and componentcount of each card is shown in Table-A2 and the component details are indicated in Table-A3. Theactivities involved in fabrication of these PCB’s and typical man hours are discussed in Table-A4.The PCB’s are flexi rigid PCB’s which are manufactured to aerospace standards with all thenecessary tests and reports. PCB material is Polyimide for the rigid portion and Polyimide 35 NDupont Pyralux AP (Adhesive less) or equivalent for the flexible portion. PCB is to be sourced fromISRO approved vendors including Group B Reports. The detailed activities involved in wiring ofPCBs are discussed Section 4. The list of Deliverables for PCB procurement are as follows

1. Fabricated PCBs, as per the specifications.

2. Conformance certificate for the product (PCB’s), meeting the requirements of MIL-PRF-

55110F for rigid PCB and MIL-P-50884 for rigid flexi PCB. IPC compliance for

laminate materials (IPC-4101for Rigid PCB, IPC-4204 for Flex PCB, IPC-4203

for Flexi cover Lay, IPC-SM840 for Solder Mask), Micro-Section report along

with the micro-sectioned samples shall accompany the consignment.

3. Mechanical inspection report including Warp and Twist measurement.

4. Two test-coupons per card / panel (1 Vertical and 1 Horizontal, along wi th traceable

codes of the cards)

5. Group A inspection report.

6. Group B inspection and micro section report.

7. Flexing endurance test for static application in accordance with IPC-TM-650 to be

carried out for flexi-rigid cards. Test samples and report shall be provided.

8. BBT report as per IPC-ET-652, both for continuity and isolation after hot air

leveling of the PCB.

9. Final visual inspection report of all the cards for pad, pattern, spacing, dimension and

surface condition like weave texture, measling, creasing, blisters & de-lamination etc.

Detailed checklist will be provided by LEOS at the time of ordering.

10. Guarantee Certificate: One year guarantee certificate shall be provided.



Table A2: PCB detailsPCBNo

Type Layers No ofRigidPCBs

Dimension of Eachrigid PCB

Componentcount

Remarks

L W1 Flexi Rigid

PCB-18 1 80mm 50mm 37 Refer Fig-A12 and A13

2 Flexi RigidPCB-2

8 4 80mm(Approx.)

80mm(Approx.)

175 Refer Fig-A14 and A-153 Rigid PCBs connectedby Flexible PCB. FlexiPCB length of 29 mm toconnect 2 PCBs and 20mm to connect 3rd PCB.

Figure-A12: Mechanical Drawing of Flexi-Rigid PCB-1of Electro-Optic Sensors (EOS) Type-S



Figure-A13: PCB Data Sheet of Flexi-Rigid PCB-1 ofElectro-Optic Sensor (EOS) Type-S



Figure-A14: Mechanical Drawing of Flexi-Rigid PCB-2of Electro-Optic Sensor (EOS) Type-S



Figure-A15: PCB Data Sheet of Flexi-Rigid PCB-2 ofElectro-Optic Sensor (EOS) Type-S

/Polymidee



Table A3 Component list for Electro-Optic Sensors (EOS) Type-S

Component Type Component Style Quantity

Integrated Circuits

8-pin FP 2CDFP-14 1CDFP-16 3CDFP-24 1CDFP-28 1CDFP-36 1CFP-86 1CQFP-256 1SOP-64 1JLCC84 1MBCFP-16 3MFP-20 1

Diodes DO-35 9PAC-E 3

Transistors TO18 4TO257 1

Connectors FRB-PLUG-29pin 2

Capacitors

CDR01 6CDR02 23CDR33 58CTC21E-C 11CTC21E-D 8

ResistorsRM1206 77RWR80 8RER50 1

Note: Above list is representative and not exhaustive.



Table A4: Activities Involved In PCB Wiring And Approximate Time RequiredS.No CARD

FABRICATIONNo of sub activities Approx Man

HoursManpowerInvolved

1 Card -01 a Component Segregation

50

Technicianscertified for wiringand inspection byLEOS.

Mechanicalengineers to theextent of card levelMechanicalactivities.

Note: For radiationshielding, coatingand potting, onlyman hours isindicated. Curingtime is extra.

b Bare PCB Cleaning, Baking and PTH fillingc Component Inspectiond SMD Component Mounting and Inspectione Connector Mounting ,Torquing and Ecobondingf Flatpacks Tinning , Lead formation,g IC's Mounting and Inspectionh Soldering of componentsi Leaded Component Mounting and Inspectionj Card inspectionk Cleaningl Radiation Shielding and Pottingm Conformal Coatingn Connector Ecobonding

2 Card -02 a Component Segregation

150

b Bare PCB Cleaning, Baking and PTH fillingc Component Inspectiond SMD Component Mounting and Inspectione Connector Mounting ,Torquing and Ecobondingf IC's Mounting and Inspectiong Soldering of componentsh Leaded Component Mounting and Inspectioni Card inspectionj Cleaningk Radiation Shielding and Pottingl Conformal Coating and Connector Ecobonding



A3 Card and Package Testing details

Electro Optical Sensors (EOS) Type-S sensors undergo card level tests once the PCB’s are fabricated.The cards are assembled temporarily into a package form and tested at an integrated level. ApprovedOptics Modules are integrated with the mechanical housing and cards and the package is calibrated infront of optical simulators. Once the performance is ensured, the package is assembled permanentlyand under goes environmental tests and alignment.

Electro Optical Sensors (EOS) Type-S sensors underogo stabilization vibration and thermovac followedby acceptance vibration and thermovac. Electrical performance of sensors is tested prior to and afterthese test and during the test for acceptance thermovac. Package will undergo Vibration on a vibrationshaker as per the levels specified by LEOS and thermovacum performance checks in a thermovacumchamber. The package is to be prepared for the tests, tested to the required levels and its conformance tothe test matrix to be monitored. The package performance is to be ensured throughout the test andadequate monitoring for specifed parameters to be logged in a periodical basis

A list of tests that are carried out on the sensor are given in Table-A5 and Table-A6. The summary ofactivities involved and the corresponding references for the sub activities are given in Table-A5. Table-A6 gives a list of the activities at various stages, the responsibilities of the personnel and theapproximate time involved in the activities. The thermovac profiles are shown in Fig-A16 and Fig-A17.The flowcharts of the inputs for the various activities and the activity sequence are indicated in Fig-A18to Fig-A24. A detailed list of the activities involved in testing are also discussed in Chapter 4.

Table-A5: Card and Package Wiring, Assembly and Testing details

S.No Activity Activity Reference1 Card Wiring Table A42 Card level Functional Tests Table A6: Card and

Package levelActivities

3 Package Assembly4 Package level tests


ELECTRO-OPTIC SENSORS (EOS) TYPE-S of 74

TABLE A6: CARD AND PACKAGE LEVEL TESTSS.No CARD TESTS No of sub activities Approx Man

Hours Manpower Involved

1 Passive and Active Checksof Card -01

a Passive checks. 16

Test Engineers

b Test setup preparation and performanceverification

c Photographsd Functional Tests

2 Passive and active checksof Card-01 after Radiationshielding

a Passive checks 16b Performance verificationc Photographsd Functional Tests

3 Passive and Active Checksof Card -02

a Passive checks. 8b Test setup preparation and performance

verificationc Photographsd Functional Tests

4 Passive and active checksof Card-02 after Radiationshielding

a Passive checks 8b Performance verificationc Photographsd Functional Tests

5 Stack level Testing a Health checks and interface tests betweencard-01 and card-02

4



S.No

CARD TESTS No of sub activities ApproxMan Hours

Manpower Involved

6 Permanent Assembly andFocusing Activities

a Audit of all cards 8 QA (electrical andMechanical)

Cooler assembly with heat sink and package levelwiring, Cube bonding

24 Technician wiring,Electrical Engineer,Mechanical engineersCard-01 and Card-02 assembly as per procedure 24

Final package assembly 87 Focusing in front of Simulator -1 16 Electrical and Mechanical

Engineers8 Baffle adapter fixing and

assembly level potting16 Mechanical engineers

9 Initial Ambient Performancetests in front of simulator -1

a Power on checks 6 Test Engineersb Performance Checks and Calibration tests and report

generation6 Test Engineers

c EEPROM secondary programming 4 Test Engineers10 Initial Ambient Performance

tests in front of simulator -2a Mounting of Sensor in Front of Simulator 3 Mechanical Engineersa Programming of Calibration Parameters 17

Test Engineersb Functional Tests using Simulator-2c Report generation

11 Alignment test after each stageof environmental tests

a Isolation and Power on checks 30 Mechanical and TestEngineersb Alignment checks (Mechanical and Electrical)

12 Stabilization Thermovac Tests Sensor preparation, chamber booking, loading andunloading of sensor from thermovac

6 Mechanical Engineers

13 Stabilization Vibration Tests Sensor preparation, shaker booking, loading andunloading of sensor

8 Mechanical Engineers14 Acceptance Vibration Tests 8 Mechanical engineers15 Active Thermovac Tests a Sensor preparation for Thermovac. 3 Mechanical

Loading and unloading of sensor from thermovac. 8 Test Engineers



b Active tests during Thermovac and data logging andcompilation

24 Test Engineers(Total time of test is as perprofile. Time indicated isfor work to be carried out

by personnel)

c Periodic Sensor Monitoring during entire duration ofThermovac

20

14 Final Ambient Performancechecks in front of Simulator-1

a Performance Checks and report generation 8

Test Engineers15 Final Ambient Performancechecks in front of Simulator-2

a Final calibration parameters programming 3

b Functional tests and report generation 816 Data preparation for certification a Compilation of all data as per requirements for

certification12 Mechanical and Test

Engineers17 Mechanical parts inspection Verify fabricated mechanical parts as per the

approved drawings given, after thermal treatment,black painting and get approval from LEOS for nextactivity

56

Mechanical Engineers

18 Helicoil fixing Fix the helicoils to mechanical parts as per theapproved drawings

8



2hrs 6hrs2hrs

Ambient

2hrs2hrs6hrs

+50°

-10°

1 2

Fig A16: Stabilization Thermovac Test Profile



Temperature: Ambient : +25°C ; Hot: 50° C ; Cold: -10°C

Profile: 5 short cycles,2 hrs dwell at each extreme temperature,2 long cycles of 24hrs dwell.

Hot

Cold

1 2 3 4 5#

#

#

#

# : Measurements

Ambient

Fig A17: AcceptanceThermovac Test Profile



FLOWCHARTS FOR FABRICATION, ASSEMBLY, INTEGRATION ANDTESTING OF ELECTRO-OPTIC SENSORS (EOS) TYPE-S

PCB’s READINESS(To be fabricated by

Vendor)

MECHANICAL PARTSREADINESS(To be fabricated byVendor)

START

A

CONSUMABLESREADINESS

(To be P by Vendor)

COMPONENTSREADINESS

(Will be given byLEOS)

B C D

Fig A18: INITIAL READINESS FOR ELECTRO-OPTIC SENSORS (EOS)TYPE-S

OPTICAL MODULESREADINESS

(Will be given by LEOS)

E



Fig A19: PCB READINESS FOR ELECTRO-OPTIC SENSORS (EOS) TYPE-S

PCB READINESS

A

YES

NO

Collect PCB Spool files andMechanical Drawings from LEOS

Issue Work order for PCB fabricationfrom LEOS approved Sources

Fabrication of PCB by LEOS approvedsources through Vendor

Submit the fabricated PCB with all thereports to LEOS for clearance for flightuse

Do necessary Rework orFabricate new PCB

PCB’s are ready for flight use

A1

PCBcleared



CONSUMABLES READINESS

B

Fig A20: CONSUMABLES READINESS FOR ELECTRO-OPTIC SENSORS(EOS) TYPE-S

Collect list of all consumablerequired and their quantity from

LEOS

Issue of Work order for procurementfrom LEOS approved Sources by

Vendor

Receipt of consumables and theirinspection by Vendor

Submit the received consumables withall the reports to LEOS for clearancefor flight use

Return and procure thecorrect consumables

Consumables are ready for flightuse

B1

Consumablescleared

YES

NO



C1

C

Fig A21: MECHANICAL PARTSREADINESS FOR ELECTRO-OPTICSENSORS (EOS) TYPE-S

Collect approved drawings from LEOS

Submit Received Materials and reportsto LEOS for clearance for fabrication

Parts matching by vendor

Anodizing of all aluminum parts asper anodizing drawings

Helicoil fixing / matching

Thermal treatment as per drawings

MECHANICAL PARTS REDY FORASSEMBLY

Issue of Work order for procurement ofmaterials from LEOS approved

Sources by Vendor

Materialscleared

Fabricate the Mechanical parts throughLEOS approved Sources

Partscleared

Submit fabricated parts and inspectionreports to LEOS for clearance for thermal

treatments fabrication

Reprocure thematerial

Refabricate theparts or doreworks

YES

YES

NO

NO



Collect Components from LEOS

Inspect the components as percomponents list

If not correct or get the necessaryclarifications from LEOS

Return the componentsand collect new

components

Components are ready for flight use

D1

Componentscleared

YES

NO

COMPONENTS READINESS

D

Fig A22: COMPONENT READINESS FOR ELECTRO-OPTIC SENSORS(EOS) TYPE-S



OPTICAL MODULE READINESS

E

Fig A23: OPTICAL MODULE READINESS FOR ELECTRO-OPTICSENSORS (EOS) TYPE-S

Collect Optical Module from LEOS

Inspect the module

If any observation, get the necessaryclarifications from LEOS

Return the opticalmodule and collect new

optical module

Optics module ready for flight use

E1

Opticalmodule cleared

YES

NO



Fig A24: OVERALL ASSEMBLY, TEST SEQUENCE FOR ELECTRO-OPTICSENSORS (EOS) TYPE-S

PCB WIRING and Readiness for Testing(Refer Assembly Document for Complete Details)

Integrated Package Level Testing

Package Assembly

Package Level Test after Assembly andAlignment in front of Simulators

Stabilization Tests(thermovac and Vibration) andalignment in front of simulators after each test.

Card-1 Testing

Card-2 Testing

Card Testing

Acceptance Level Vibration andThermovac tests and alignment in front of

special simulators after each activity.

Final Ambient Performance Checks

Pre-Certification and handing over toLEOS

A1 B1 C1 D1

Integration of Optical Modules and testingin front of special SimulatorsE1



APPENDIX-BTypical list of consumables used for Electro-Optic Sensors(EOS) Type-S

CONSUMABLE FOR PCB WIRINGSl.No Item Description Known Sources Approx Quantity

Required1 Electronic Grade Isopropyl Alcohol

As per LEOS specificationEMEREK Brand, SAP Specialties, Scientificand allied productions

15 Ltrs/package

2 Conformal coating Material(PartA,Part B, S 8)

a.Cytec Industries Inc, 1405 Buffalo Street,Olean,NY- 14760b.Transwave Electronics

1 Kit/6Months

3 Dow Coming RTV3145 Gray Colouronly

Dow Corning India (P)Ltd, MumbaiTentacle aerologistix pvt ltd, BangaloreSysco Tech Systems (India) Pvt Ltd

1 tube /2packages

4 Adhesive Tape like Polymide,Kapton, Copper PTFE Etc.

Intek Tape(P) ltd, Bangalore3M,USA Inde enterprises, Chandigarh

1 reel

5 Electrical Grade Copper Sheets Sri.Anugraha Enterprises, BangaloreShanti Metals, Bangalore

6. Polyolefin Tubing 3M India Ltd; Bangalore 1 mtrs/package7. Panduit Terminals Liberty International India Ahmedabad

Advance Tech services New Delhi8. Ultrapure Solder wire As per F.S

QQ-S-571F SN63B.T.Solders(P)Ltd:Bangalore-94AAIM Inc,Canada HIE2S4Multicore Solders Ltd;HPw 4RQ-UK

50 gms/package

9. Polymide Wires & Cables Spec 55 Sanghvi Aerospace(P)Ltd,AhmedabadTyco Electronics,CA94025-USA

10 meters

10. Insulation Bushes for Diode &Transistors

Nanni Engineering Works,Bangalore-54

11. Solder Bar As per QQ-S-571F SN63 Advance Tech services Bangalore 2.5Kg/ 6 meters

12.Harnessing materials like cableties/Bushes

Inde Enterprises, ChandigarhElectrical terminal service USA

20 Nos/package

13 Self Adhesive polyester Filmlabels

Brady corporation Bangalore 1 Reel/10 Pkgs

14 Liquid FluxType R&RMA B.T.Solders(P) ltd; MysoreSumitron exports(P) ltd; New Delhi

5 Litres/6 Months

15 ConapCE1155 (Part A, Part B,CS8)

Tentacles aerologistix(P) LTD;BangaloreLiberty International 15852, USA

1 Kit /6 Months

16 Solder Terminals Sumitron Exports Bangalore17 Lacing Thread Sumitron Exports Bangalore

Tag international INC, USA1 reel/6 packages

18 Distilled Water19 Tantalum sheet Titanium Tantalum Products Chennai

United Titanium Inc,0h10-44691-USA300 x 230 mm-1Sheet

20 Chotherm Tentacles aerologistix(P) LTD;Bangalore, Syschotech

300 x 230 for 10Pkgs. 2 Sheets/10packages



Sl.NoItem Description Known Sources Approx QuantityRequired

21 PCBs fabricationapproved Vendors

1. M/s ELTEK Ltd (Rigid and Flex-Rigid PCB’s)Petach-Tikva 4910101, IsraelTel: 972-3-9395050Fax:972-3-9309581

2. M/s ASCENT Circuits Pvt.Ltd (RigidPCB Only)Plot No111, Sipcot IndustrialComplexPhase-1,Hosur-635126,Tamil NaduPh:91-4344400108/400124Fax:91-4344000128

3. M/s Micropack Ltd, Bangalore (RigidPCB Only)Plot No 16, Jigani Industrial Area,Anekal TalukBangalore-562106

As given inAppendix A



CONSUMABLE REQUIRED FOR MECHANICAL ACTITIVTIES

Sl.No Item Description Known Sources Quantity Required

22 DC 93500 Dow Corning (Asia)M/S TranswaveElectronics,Secunderabad,M/S Avimarine, Bengaluru

1 kit/6 months

23 Selflock Helicoils Armstrong Fasterning Systems,UK 50 Numbers withdifferent sizes perpackage

24 Aero tight Locking Nuts Apex stainless steel fastenerslimited unitUK Precision stainless fasteners UK

25 Non Magnetic SS 316 cheese head& CSK Screws, Washers as perDIN/ISO

Avdel India Ltd, BangaloreLPS Bossard(P)Ltd,New Delhi

26 100% Non Magnetic SS316 specialwashers &Spacers

Nanni Engineering Works, Bangalore

27 Ecobond 285 Henkel Loctite (formerly Emerson& Cumming)M/S Transwave Electronics,Secunderabad,M/S Avimarine, Bengaluru

1 Kit/5 packages

28 Ecobond 286 Henkel Loctite (formerly Emerson& Cumming)M/S Transwave Electronics,Secunderabad,M/S Avimarine, Bengaluru

1 Kit/2 packages

29 RTV11 M/S. Momentive PerformanceMaterials India Pvt Ltd, BengaluruM/S. Swetadri Associates,Bengaluru

1 Kit/5 packages

30 Cube Bacon in two parts(LCA-41,BA-5)

Bacon Industries, USAM/S Transwave Electronics,Secunderabad,M/S Avimarine, Bengaluru

1 Kit/10 packages

31 SS Shims Total 450 Nos withdifferent thickness,fixed diameter as 8 x 4mm



Sl.No Item Description Known Sources Quantity Required

33 PUC BLACK CONDUCTIVE PAINT,Z306-AEROGLAZE

a. POLYURETHANE COATINGGallon Packb. PRIMER FOR Z306-9924A-0.5Gallon Packc. PRIMER FOR Z306-9924B-0.5Gallon Packd. THINNER FOR Z306-9958-Gallon PackMake: LORD CORPORATION

M/S. UMAC AEROSPACE Pte Ltd.,391B, ORCHARD ROAD,#23-01, NGEE ANN CITY,TOWER-B,SINGAPORE-238874Indian Agent:M/S. UMAC Avionics Pvt. Ltd.,142, 18th A MAIN, HAL 2nd stage,Indira Nagar,Bengaluru-560008

1 gallon Pack for 45Electro-OpticSensors (EOS)Type-S

34 Mechanical parts fabricationapproved vendors

1.Government Tool and Training Center(GTTC), Rajajinagar, Bengaluru,2.DUCOM Aerospace, Peenya,Bengaluru3.Smart Technologies, PeenyaBengaluru,4.Delta Technologies, Peenya, Bengaluru5.Pushpak Industries, Bengaluru(Anodization and Blackanodizing/painting only)6.SRE Enterprises,Bengaluru7.Southern Electronics,Bengaluru8.Shoma Automation, Bengaluru9.Multiteck Systems,Bengaluru

As given inAppendix A

32

SCREWS

Avdel India Ltd, BangaloreLPS Bossard(P)Ltd,New Delhi

QUANTITY

1 M3 X 10L ALLEN HEAD, WITHSPRING AND PLAIN WASHER 300




5 M3 X 8L ALLEN HEAD WITHLOCKNUT 50





Note: List is only representative and not exhaustive



APPENDIX C

TYPICAL LIST OF EQUIPMENET FOR CARD/PACKAGE FABRICATION &

ASSEMBLY

WIRING EQUIPMENTS.No Equipment

PROVIDED BY LEOS1 Soldering Stations(Weller,ERSA)2 soldering bits of different sizes3 Hot air blower4 PCB mounting stands5 Turret swaging equipment6 Stands for holding blower7 Lead forming equipment8 Baking Oven9 Ultrasonic cleaning

10 Vapour degreaser11 Nitrogen purging storage12 Vinyl tables with ESD mats15 Laminar Flow tables16 Magnifiers (6X,8X,40X)17 Trays and beakers for mixing,cleaning18 ESD brushes19 Tools for conformal coating20 Tools for potting,DAM and fill21 ESD wristraps22 ESD coats ,caps,slippers

TO BE BROUGHT BY VENDOR23 Weighing Balance 0.01gms to 500gms24 Weighing Balance 1gms to 5kg25 Cutter26 Tweezer27 Thermal Wire stripper28 Manual wire stripper29 Crimping tool30 Crimping insert removal tool31 Noseblair

MECHANICAL EQUIPMENTSl.No Equipment

PROVIDED BY LEOS1 Comperssor air supply2 Grinding machine3 Torque wrench4 Drill bits5 Drilling Machine6 Micro height7 Micrometer

TO BE BROUGHT BY VENDOR6 Screw drivers7 Allen Keys Set8 M2,M2.5,M3 Allen and CSK screw bits9 Air Blow Brush

10 Scissors11 4.5mm Femal nut drive bit12 4.0 mm male nut drive bit13 Flush cutter14 Penvac15 Mixing and Potting Acessories16 Teflon Twezer17 Glass rods18 Finger cots19 Files20 Cutting Pliers21 Hammer22 Mallet Hammer23 Helicoil insert tools and accessories24 Helicoil tape set25 Files set26 Vernier claipers27 Feeler gauge28 Steel Rule29 Twezer



APPENDIX-DTYPICAL LIST OF TEST EQUIPMENT USED FO R ELECTRO-OPTIC

SENSORS (EOS) TYPE-S PROVIDED BY LEOS

The following table gives the list of general purpose equipment required to test electronic hardware.This, along with the set of specific equipment’s for specific hardware shall be required to completethe total testing activities.

Serial No Test Equipment Remarks

1 Power Supplies Will be

provided by

LEOS

2 Digital Multimeters

3 Oscilloscopes

4 Function Generator

5 Decade Resistance Box

6 On-line Monitors

7 Clip on meter

8 Current Probe Amplifier

9 LCR Meter

10 Simulators for Electro-Optic Sensors

11 Card test jigs

12 Test consoles