request for proposal (rfp) for development, …...availability of design engineers, isro certified...
TRANSCRIPT
SPACE APPLICATIONS CENTRE
ISRO GOVERNMENT OF INDIA
AHMEDABAD
Request for proposal (RFP) for Development, Fabrication and Testing of Payload Power Supplies for Space use
SAC/SEDA/PPS/APRIL/2016
April 2016
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Abbreviations
ATM Analog Telemetry
BOM Bill of Material
CDR Critical Design Review
DDR Detailed Design Review
DTM Digital Telemetry
DVM Design Verification Model
EMC Electro Magnetic Compatibility
EMI Electro Magnetic Interference
QM Qualification Model
FM Flight Model
HMC Hybrid Micro Circuit
LDO Low Dropout Regulator
MIP Mandatory Inspection Points
PARD Periodic And Random Deviation
PCB Printed Circuit Board
PDR Preliminary Design Review
PFM Proto FM
POL Point of Load
PPS Payload Power Supply
PRT Peer Review Team
SCRC Standing Circuit Review Committee
Spacecraft Bus Raw Bus
T&E Test and Evaluation
TM Telemetry
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Section-A 1. Introduction Space Applications Centre (SAC), Indian Space Research Organization (ISRO) has heritage of space programs and development of payloads for GEO, LEO and planetary missions. Remote sensing and Meteorological Imaging Payloads electronics redefine their requirements in terms of processing speeds, resolutions, modularity, reliability and miniaturization. Payload Power supply (PPS) are required for providing regulated supply to various camera electronics sub-systems. The requirement of efficient, low power space worthy DC-DC converter power supplies is highly anticipated considering the present and future missions. In this context, Centre is planning to develop Payload power supplies through Indian Industry. This Request for Proposal (RFP) is to deliver Payload Power Supplies as per the details laid down in the following sections.
This RFP provides baseline converter configuration, electrical and mechanical specifications, R&QA requirement, tests to be conducted on each model, along with important developmental milestones and expected delivery schedule that should be maintained by the vendor at various stages.
There are five types of PPS to be developed. The design of the PPS will be provided by SAC. Vendor shall develop BBM, DVM, QM and FM models of all types of PPS mentioned in this RFP. The Vendor has to develop, test, qualify and deliver the power supplies.
2. Guidelines 2.1 Mandatory Guidelines
1. This RFP is intended for Indian industries only.
2. Vendor must have ISRO certified Card Fabrication Facility, ISRO qualified HMC fabrication facility and ISRO qualified man power for card fabrication. Vendor should also have ISRO qualified assembly facility
3. Vendor must have their own competent engineers to carry out independent testing, debugging and qualification of all models of PPS.
4. Vendor should submit all the certifications and Qualification documents at the time of bid. Vendor shall ensure that all the mentioned qualifications must have been completed by the time of bidding.
5. Vendor must have prior experience in fabrication and testing of space qualified DC-DC converter of either HMC or discrete version.
6. Vendor must bring out details of PPS design heritage developed for spacecraft applications of ISRO programs.
7. Vendor must have part procurement experience for Hirel EPC/ DC-DC converters.
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8. Vendor should have sufficient technical capabilities in terms of fabrication and testing. Vendor is required to provide the details of the available test and fabrication equipments like, make, brief specifications, year of procurement, number of equipments, etc.
9. Vendor must have experience in development and delivery of space qualified PPS in large quantities (similar to quantity requirement given in Table 5.1).
10. Based on the details provided by the vendor, SAC will assess the capability of the vendor to take up this work.
2.2 General Guidelines 1. The Vendor may propose PPS Development using ISRO Qualified HMC (HMC
must have been qualified for spacecraft mission). 2. All performance and R&QA requirements shall apply simultaneously and all of
them are to be fully met under the operating temperature range and environmental conditions given in subsequent sections.
3. The vendor must comply to the delivery schedules.
4. SAC will accept/reject the offer based on technical and financial bids.
5. Pre-bid discussion for the PPS development will be arranged by SAC.
6. SAC reserves the right to change/modify the specifications/requirements given in this RFP document on any ground during proposal stage and before finalization of the contract.
7. There may be minor modifications in design after the finalization of contract for performance enhancements, which will be mutually agreed upon with no cost impact.
8. Any change in design after the finalization of contract, which leads to new component procurement by the vendor shall be factored while computing the delivery milestones.
9. SAC will provide documents of ISRO Guidelines for Manufacturing the PPS, if required, at the time of contract.
10. SAC reserves the right to review the progress of work at any stage of PPS development at vendor’s premises.
11. SAC reserves the right to request for the delivery of PPS models and types based on the payload requirement.
12. The product offered shall meet all the specifications of PPS. Any non-compliance must be reported and SAC reserves the right to accept/reject the PPS.
13. SAC reserves all rights to terminate the contract before initiation of FM fabrication, if major non-compliances are observed in the development of DVM/QM units.
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14. SAC has an exclusive right to use the PPS and any HMC developed under this contract. Vendor is not permitted use the either PPS or HMC and circuit developed for this purpose in any program other than approved by SAC. Intellectual property right for PPS will rest with ISRO. The vendor will have to sign a NDA (Non-Disclosure Agreement) with SAC, prior to receiving Schematic design from SAC.
2.3 Guidelines for preparing Quotations Vendor’s quotation shall consist of two parts. The first part will be technical proposal and second part will be Cost proposal. The vendor must ensure that his quotation along with all the details reaches SAC/ISRO before the due date.
2.3.1 Technical proposal Proposal must include
1. Vendor shall submit its detailed response along with point by point compliance in conformity to this RFP, considering the requirements and specifications mentioned in this RFP.
2. Delivery schedule and development strategy for all the deliverables shall be given for each type and model along with developmental and qualification plan. The vendor must also provide fabrication plan of flight Models.
3. Vendor shall provide the detailed BOM of proposed designs, if there is any change from SAC supplied designs.
4. The proposal shall include the previous history of any similar design / subsystem delivered by the vendor for similar space programs.
5. Details of infrastructure/facilities available at vendor’s site including details on availability of design engineers, ISRO certified manpower and fabrication facilities for space quality products and testing facilities at vendor premises.
6. Complete electrical and mechanical development strategy of all the PPS types.
7. In case vendor finds any discrepancy in specifications and conditions which may result in inefficient hardware realization or possibility of malfunction in the operation of PPS, the same shall be brought out in the quotation/ in discussions with SAC.
8. The proposal shall provide hardware realization details, test matrix and delivery schedule as per RFP for all the deliverable models and identified milestones.
9. Proposal shall include a BLANK copy of the price bid, listing each line item offered but without cost portion, to enable confirmation that all aspects have been included in the bid.
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10. If any change is needed after the contract is done, SAC and the vendor will confer together and carry out the proposed change after reaching a mutual agreement.
2.3.2 Cost Proposal Proposal must include 1. Total break up of cost for quantities and models for each PPS type in the required
slabs as given in Table-5.3 2. If the vendor proposes to use any ISRO qualified HMC for the PPS design, the
vendor may quote separately for HMC versions and discrete versions. 3. Cost for development of test setups. 4. Payment terms and other financial terms and conditions. 5. The cost breakup including charges for each test to enable SAC in deciding to
include/exclude any test depending on the cost and schedule constraints. 6. SAC may assist in EMI/EMC Tests of BBM/DVM PPS at SAC premises at no extra
cost to the vendor. However, the vendor shall be solely responsible for EMI/EMC of QM PPS.
7. Vendor has to provide a warranty of minimum four years on all deliverables, from the date of delivery to SAC. This warranty shall continue to be valid for corrected or replaced units until four years after the date of final acceptance by SAC/ISRO of these units. The vendor shall provide Warranty as given below: “The units supplied here upon shall be free from any defects in material or
workmanship and in accordance with the applicable specifications and drawings.” 2.4 Undertaking by Vendor
1. Following Undertaking regarding CONFIDENTIALITY AGREEMENT: Vendor shall not reveal, divulge, transfer or disclose the information relating to the design, processes, fabrication procedures, product, quality control methods etc., that are exclusively provided by SAC for its (SAC’s) own requirements, to any third party. Vendor shall not, without prior written consent from SAC, use such information for any purpose other than for fulfilling obligations under the Contract to be placed. Vendor undertakes to restrict the access of other customers/ visitors to their establishment, to any of the details of the work/job being performed under this Contract. 2.Following Undertaking regarding Non-Disclosure Agreement (NDA): Vendor shall maintain absolute secrecy and security of the designs, codes/software, circuit schematics, drawings, process methods / documentation etc., provided by SAC for the purpose of design, fabrication and testing or stored on various computing
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systems. Vendor shall return the original and copies of the same to SAC after completion of the work. The technical information / papers / drawings to be provided by SAC from time to time, are for the execution of this Contract only; and should not be used /copied / reproduced / published in an y form or disclosed to third party, by the Vendor or his personnel. Thus, the Vendor is required to sign a Non-Disclosure Agreement (NDA) with SAC. Vendor will also be responsible for any violation or infringement of NDA by his personnel. 3. Following Undertaking regarding Intellectual Property Rights (IPR): Work carried out by the Vendor through this contract will remain the sole property of SAC. Neither the Vendor nor his personnel, carrying out the development work will claim any intellectual property rights on such works. The Intellectual property rights relating to the HMC and PPS design, development, processes, test benches and other fabrication details given to and received from the Vendor shall remain the exclusive property of SAC. Vendor or his Personnel shall make no attempt to unlawfully reveal, misuse or encroach upon the intellectual or private data/ information at SAC to which they may have access to, as part of the work carried out.
3. PPS Types and specifications 3.1 PPS Types The following tables show the PPS types to be developed by Vendor. SAC will provide designs of the given types, with which vendor may modify for enhanced performance.
Table 3.1 Type-1: Power supply Output Lines Details
Sr. No.
Output Voltage
(V)
Min. Current
(A)
Typ Current
(A)
Max. Current
(A)
PARD (mVpp)
Power max. (W)
No. of
Live Lines
No. of Return Lines
1 3.8 0.1 0.6 1 ≤10 3.8 2 2
2 5.6 0.05 0.25 0.5 ≤ 10 2.8 2 2
3 7.3 0.1 0.55 1 ≤ 10 7.3 2 2
Total Power (W) 14.0
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Table 3.2 Type-2 : Power supply Output Lines Details
Sr. No.
Output Voltage
(V)
Min. Current
(A)
Typ Current
(A)
Max. Current
(A)
PARD (mVpp)
Power max. (W)
No. of
Live Lines
No. of Return Lines
1 3.8 0.4 3.1 4 ≤15 15.2 8 8
2 5.6 0.2 2.4 3 ≤15 16.8 6 6
Total Power (W) 32.0 Table 3.3 Type-3 : Power supply Output Lines Details
Sr. No.
Output Voltage
(V)
Min. Current
(A)
Typ Current
(A)
Max. Current
(A)
PARD (mVpp)
Power max. (W)
No. of
Live Lines
No. of Return Lines
1 3.8 0.15 0.9 1.5 ≤15 5.7 3 3
2 5.6 0.05 0.1 0.12 ≤15 0.7 2 2
3 15 / 12** 0.05 0.2 0.25 ≤15 3.8/3 2 2
4 24 0.4 2.8 3.5* ≤50 84.0 6 6
Total Power (W) 94/93
Note: *Output load (dynamic in nature) is a sine wave with frequency of 50 Hz. Vendor must carry out dynamic load testing for this voltage line as described in Table 3.7.
** Jumper Selection Required Table 3.4 Type-4 : Power supply Output Lines Details
Sr. No.
Output Voltage
(V)
Min. Current
(A)
Typ Current
(A)
Max. Current
(A)
PARD (mVpp)
Power max. (W)
No. of
Live Lines
No. of Return Lines
1 3.8 0.4 3 4.2 ≤10 16.0 9 9
2 15.3 0.03 0.16 0.25 ≤15 3.8 1 1
3 22.3 0.02 0.12 0.2 ≤15 4.5 2*** 2
*** 1 line will be given to CAL package
Total Power (W) 24.0
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Table 3.5 Type-5 : Power supply Output Lines Details
Sr. No.
Output Voltage
(V)
Min. Current
(A)
Typ Current
(A)
Max. Current
(A)
PARD (mVpp)
Power max. (W)
No. of
Live Lines
No. of Return Lines
1 3.8 0.4 1.8 2.5 ≤10 9.5 6 6
2# 5.6 0.1 0.45 0.6 ≤10 3.4
3 3 15.3 0.1 0.27 0.35 ≤15 5.4
3# -5.6 0.1 0.45 0.6 ≤10 3.4
3 3 -15.3 0.05 0.22 0.3 ≤15 4.6
4 13 0.1 0.45 0.6 ≤15 7.8 3 3 5 15.3 0.05 0.16 0.2 ≤15 3.1 3 3 6 18.3 0.1 0.81 1 ≤15 18.3 3 3
Total Power (W) 46/49
# +/-5.6V or +/-15.3V to be finalized during placement of order
Note: At the time of ordering, modifications in above specifications (if any) will be finalized.
3.2 Block Diagram of PPS
Figure-1 Typical Block Diagram of PPS (For Types-1 to Type-5)
ON/OFF Block
DC-DC converter
PPS ON PPS OFF
Regulator FilterO/P Voltage
lines
Regulator Filter
Thermistor
ON/OFF Status
Generation
Temperature monitoring
Every output voltage line shall have a output return taken at the connector
ATM status
generation
Rawbus
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Figure-2 Typical Block schematic of power packages
Inrush current limiter
EMI Filter
PWM Bias circuit
PWM controller
G
S
D
Voltage line-1
PWM Bias
O/P Rtn-1
Regulator circuit
Raw Bus live 28V-42V
Protection Circuit(OCP&OVP)
PPS ON/OFFCircuit
Telecommands
DTM ATM
* Based on Output lines and performance requirement number of primary and secondary windings will be considered
Voltage line-n
O/P Rtn-2
Regulator circuit
Voltage lines 2,3....O/P Rtn 3,4,....
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3.3 Components Types
The following table shows the typical components which will be used in PPS. Table 3.6 Typical Active and Passive Component Types
Active Component Types Sr. Functionality Part No Manufacturer 1 PWM Controller ISL78845ASRH / Intersil
UC1825 / TI UC1846 TI
2 P channel MOSFET
IRHM9160 IR IRHNA597160 IR
3 N channel MOSFET
BUY25CS12J01 Infineon IRHMS57260SE_ IR
4 Voltage Regulator UC1834 TI 5 Feedback UC1901 TI 6 Transistor 2N3700 Microsemi 7 Power Diode 16CYQ100 IR 8 Zener Diode 1N6326 Microsemi 9 Zener Diode 1N6325 Microsemi
10 Signal Diode 1N5806 Microsemi 11 Schottky Diode 1N5822 Unitrode 12 Optocoupler OLS249 Isolink 13 Signal Diode 1N6642 Microsemi 14 OpAmp LM158 National 15 Relay GP250 Leach International
Passive Component Types Sr. Functionality Part No Manufacturer 1 Capacitors CKS 52 Kemet/AVX
CH 54/ CNC 56 AVX/Excellia CMR 06 CDE CLR79/81 AVX/Excellia CDR 06 Kemet CWR 29 Kemet/AVX
2 Resistors RM1206 Vishay RM2512 /RWR81 Vishay VCS, WSl & WSC Vishay
3 Cores C055047M4, Magnetics 2W40907TC Magnetics C055046A2 Magnetics
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YW40705-TC Magnetics C055037A2, Magnetics C055145M4 Magnetics OR41811A250 Magnetics
4 D Type Sub Connectors
15 Pin C&K/ITT 25 Pin C&K/ITT 37 Pin C&K/ITT 50 Pin C&K/ITT
3.4 PPS Specifications The targeted specifications of all PPS design types are listed in Table 3.5. The specifications may be updated based on final design and will be provided along with schematic design. Vendor shall analyze the design and ensure compliance to EMI/EMC MIL-STD-461E with suitable modification of circuit design, PCB layouts, mechanical design etc.
Note: At the time of ordering, modifications in below specifications (if any) will be finalized.
Table 3.7 Targeted Specifications of PPS
Sr.No Parameter Value Notes Remark
1. Input voltage 28Vdc to 42Vdc (37 V Nominal)
2. Output voltage and current As per selected PPS (Tables in section 3.1)
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3. Load regulation from Minimum to 100% load for all outputs
< 3% 8
4. Line regulation < 2 % 8 5. TC Interface 5V CMOS 64ms pulse 7 6. ATM status generation 3.8V 7. Output voltage tolerance ± 5 % or 0.5 V whichever is
lower
8. Efficiency @ 42V raw-bus input and full load and over the full qualification temperature range
> 65% May vary for each type
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Sr.No Parameter Value Notes Remark
9. Efficiency @ 42V raw-bus input and 50% load and over the full qualification temperature range
> 60% May vary for each type
10. Output ripple and noise (PARD)
As per selected PPS (Tables in section 3.1)
@ 20 MHz
11. Input inrush current as percentage of maximum operating input current
< 250% @ full load
12. Input under voltage lockout < 22 Vdc 1 13. Input to output isolation >100 Mohm 1 @500 V dc 14. Input to case isolation >100 Mohm 1 @500 V dc 15. Output to case isolation >100 Mohm 1 @500 V dc 16. Output to output isolation >100 Mohm 1 @500 V dc 17. Capacitive loading
(Unconditionally stable) >200 uF 1
18. Output over load protection PPS will turn off when input power exceeds by 25 % of the input power at full load
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19. Cross regulation on any output with min. to 100% load on any other output
< 5% 3
20. EMI/EMC Compliance Compliant to MIL-STD-461E
21. Temperature coefficient (for each output) < 0.04 % / °C 1
22. Switching frequency ≥ 100 kHz 23. Operating temperature -15°C to +70oC 24. Switch ON transient < 5% & within 20 ms for
each O/p
25. Step Line Response < 3% & with in 5ms for each O/p
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26. Step Load Response < 3% & within 5 ms 5 27. Output Dynamic Loading < 0.5V ripple in 24V Line 6
Note-1 Applicable to internal DC/DC converter of PPS Note-2 The PPS should remain OFF until the next command for PPS ON executed. Note-3 Cross regulation is to be measured with the 100% load at the one output
and 0 to 100% load on other measured output. Note-4 Step response to input line voltage change of 14 V (28V to 42V)
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Note-5 It is to be measured separately for each O/p Line with the Step load change from 50 % to 100% on line being measured, while keeping other lines at 100% load.
Note-6 Applicable only for Type 3 PPS. The 24V line is to be subjected to a sine wave loading with frequency 50Hz. The amplitude of the sine wave load shall be so adjusted to have mean dc current of 3.5A on 24V line. Load on all other lines will be 100%.
Note-7 Isource capability must be 4mA minimum. Immunity for false command is 5mS minimum. Isolated interface through optocouplers with dedicated return lines.
Note-8 Output voltage at typical load, nominal input voltage and ambient temperature shall be considered as reference measurement for all regulation calculations.
Note-9 Output voltage must be settable by ±5% with accuracy better than 1% (for typical load and nominal input voltage). The final setting value will be given at the time of development of FM PPS.
3.5 PPS Preliminary Mechanical Specifications The following table gives the preliminary size and weight of the PPS. The Preliminary mechanical drawing is shown in following figures. The package design should be done allowing the package mounting in two directions (L X W as base and L X H as base).
Inter package mechanical interfaces shall be ensured for stacking multiple power supply packages of different types.
Table 3.7 PPS Preliminary Mechanical Specifications
Specifications PPS Type-1& 2 PPS Type- 3,4 & 5
Maximum Size in mm^3 (L X H X W ) 150*120*40 approx.
150x120x60
Maximum Mass 750 gms approx. 900 gms approx.
Material Aluminium Alloy 6061T651 Surface treatment Black Anodization on all surfaces with masking as per approved drawing
Interface Number of connectors and its locations are to be finalized through mutual discussion and agreements.
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Note: Chassis GND (an electrical connection to the PSU mechanical housing) is required to be brought out on a pin of D-sub connector.
Figure -3 Tentative package outline
4. Scope of Work
The major responsibilities of the vendor are described in section 4.3. Following are major developmental milestones
A. Start of contact schedule and developmental activity B. BBM development C. PDR D. DVM & QM development E. CDR F. FM delivery
The entire work will be carried out in the sequence mentioned above After successful placement of order, Vendor shall take up the above mentioned activites.
4.1 Process Flow chart
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The following figure shows the Process Flow chart which has to be followed during the fabrication of PPS.
PLACEMENT OF ORDER & START OF DEVELOPMENTAL ACTIVITY
Documentation (SAC)
(Review of SAC designs) Vendor Modifications
NO
Any ISRO qualified HMC Proposed
HMC Delta qualification as per QA
NO
YES
Documentation and Analysis (vendor)
App (SAC)NO
Mechanical and ThermalPackage Design (Vendor)
App (SAC)
Test procedure & Test Setup (Vendor)
Component Procurement Specs (Vendor)
App (SAC)
App (SAC)NO NO
NO
Test SetupDevelopment (Vendor)
YES
Raw material and package procurement (Vendor)
Inspection and doc verification (Vendor)
PPS Layout Design (Vendor)
App (SAC)
App (SAC)
App (SAC)
ComponentProcurement (Vendor)
Inspection and doc verification (Vendor)
App (SAC)
YES
YES
NONO
YES
Prototype(BBM) Fabrication and testing (Vendor)
YES
YES
YESYES
NO
YES
PDR (SAC & Vendor)
App (SAC
YES
NO
BBM Delivery (Vendor)
Modifications(SAC & vendor)
A
Functional and Interface Testing (SAC)
OR
AND
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DVM testing (SAC)
A
Layout/Pkg/Thermal modifications
required? (Vendor)
YES
Modifications(vendor)
App (SAC)
NOYES
DVM and QM Fabrication -Same batch (Vendor)
Functional testing of DVM (Vendor)
App (SAC)
NOModifications(SAC & vendor)
YESDelivery DVM (vendor)
Qualification tests of QM (Vendor)
App (SAC)
NOModifications(vendor)
YES
CDR (SAC and Vendor)
App (SAC)
NO Modifications(vendor)
YES
QM Delivery (Vendor)
ACCEPT ? (SAC)
A
YES
NO
YES
Flight Batch Fabrication (Vendor)
Participation in final electrical tests, review of screening results (SAC)
Modification(SAC & Vendor)
NO
Sealing(Vendor)
Screening (Vendor)
NO
VOQ & DPA testsReview of test results(SAC)
Delivery of FM (Vendor)
App (SAC)
Precap Audit (SAC)
App (SAC)
NO
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4.2 Responsibility of SAC
1. SAC shall provide the following after placement of order
a. Schematic design of PPS design.
b. Electrical interface details.
c. Bill of materials for electronic components.
2. SAC may assist the vendor in radiation analysis of the PPS. 3. SAC will participate in the following activities
a. At all the MIPs.
b. In the testing BBM, QM/DVM and FM units as & when required.
c. PDR & CDR
4. SAC will audit the following
a. Quality Check
b. Procured components, materials and relevant test reports, etc for ensuring their compliance.
c. Manufacturing activities like pre sealing of HMC, Card wiring, packaging etc. 4.3 Responsibility of Vendor 1. The vendor shall go through the SAC design.
2. The vendor may also propose development of PPS using ISRO qualified HMC’s for miniaturization/improvement in performance.
3. Based on the performance/vendor past experience, the vendor may propose any suitable modifications in the SAC proposed schematic designs for better performance and compliance to EMI/EMC MIL-STD-461E. For each proposed change, the vendor must clearly provide the following details.
a. Reason for the change
b. Quantitative assessment of the improvement in performance due to this change.
c. Any other factors, which will be effected due to this change
d. Loop stability analysis
4. For the proposed HMC, the vendor may bring out the heritage of HMC. The timeline for development of PPS using ISRO qualified HMC’s must commensurate with the time line for delivery of PPS.
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5. The vendor must provide approximate PCB size including HMCs. (If HMC’s are proposed). 6. The vendor shall accommodate the PPS in the given package size.
7. Generation of the part list with procurement specifications, in compliance to the generic quality and screening requirements mentioned in the R&QA Section of this RFP, and obtain approval from SAC.
8. Vendor will be responsible for carrying out all environmental tests as mentioned in RFP either at his premises or any other facility in India, preferably excluding ISRO facilities.
9. The vendor shall develop appropriate test setup for PPS characterization complying to SAC specified interfaces.
10. All reliability analyses, including De-rating analysis, Reliability estimation, FMECA, Mechanical and Thermal analysis (as listed in QA section)
11. Qualification plan to satisfy R&QA requirements.
12. Prepare the manufacturing flow chart with mandatory inspection points (MIP).
13. Design & fabrication of mechanical packages for QM and FM PPS. Package design review should be conducted and package drawing is required to be approved by SAC. Lot acceptance test reports for packages are required to be approved by SAC before using the packages for fabrication.
14. Complete the actions arising out of non-conformances at various stages to the satisfaction of SAC. It will be vendor’s responsibility to obtain the necessary approvals/clearances from SAC at every stage.
Only after obtaining clearance from SAC on all the above aspects, the vendor shall proceed with fabrication of actual hardware.
4.3.1 Documents to be provided by the vendor Following documentation to be supplied by Vendor for review and approval by SAC at appropriate stage of development: (Refer QA Section, 18.0)
Document Stage 1. Procurement specifications for list of the components, materials, packages etc. PDR
2. Proposed final schematic with modifications (if any). PDR
3. Summary of material, components and package incoming inspection report. PDR & CDR
4. Circuits for test boards, Burn-in test jig boards for approval by SAC. PDR
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5. Generate detailed Acceptance and Qualification test documents, including list of parameters measured at each stage of testing and obtain approval from SAC.
PDR & CDR
6. Acceptance test report on PPS PDR & CDR
7. Copy of batch travelers. PDR & CDR
8. Copy of failure/deviation analysis reports, if any. PDR & CDR
9. Circuit drawing and interface details of PPS PDR & CDR
10. Circuit drawing and interface details of test jig for HMC. PDR
11. Certificates of clearances by Vendor's internal QA, based on guidelines. PDR & CDR
12. Delivery of test data. The test data should also be supplied in soft form and in a format which facilitates quick review.
PDR & CDR
13. Screening & Lot acceptance test report of packages for HMCs, before their use PDR & CDR
14. Layouts of PCB/ HMC for approval by SAC PDR & CDR
15. Test results of PPS units along with circuit diagram PDR & CDR
16. Performance results and environment test reports of all units. The results to be provided in Excel spreadsheets and also in softcopy and as bound hardcopies.
CDR & FM Delivery
17. De-rating and Reliability Analysis. CDR 18. Thermal Analysis. CDR
19. Structural Analysis. CDR
20. FMECA Analysis. (All analysis shall be as per SAC R&QA requirement) CDR
21. Three sets of manufacturing drawings PDR & CDR
22. Preliminary Design Review (PDR) Document PDR
23. Critical Design Review (CDR) Document CDR
24. Design review documents as applicable in soft form as well as in hard copies. PDR & CDR
25. End Item Data Package (EIDP) along with FM delivery CDR & FM Delivery
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4.4 Model Philosophy (Refer QA Section, 14.0)
4.4.1 Bread Board models (BBM) 1. The BBM model will be used as a proof of concept and may contain COTS
components.
2. After completion of the design, vendor shall perform PPS loop stability Analysis, de-rating, FMECA and reliability analysis and submit reports to SAC to obtain approval.
3. Vendor shall prepare layouts of the PCBs and the HMCs to be used for realization of the PPS of each type and obtain approval from SAC.
4. The vendor shall demonstrate through testing that the BBM models meet all the electrical requirements proposed and complying to EMI/EMC MIL-STD-461E. The BBM’s will be part of the deliverables of this contract. Functional Testing and these models are planned at SAC for verification.
5. In case vendor uses HMC’s in the PPS development, vendor shall follow the details provided in section 4.4.2.
6. PDR will be conducted by SAC for all the designs developed by Vendors to review the compliances, and performances of PPS units. After successful reviews, modifications and mutual agreements between vendor and SAC, design will be approved for the development of DVM/QM of PPS.
4.4.2 Delta qualification of the HMCs
1. If the PPS utilize HMCs, these shall be of a qualified and proven design. In case the vendor proposes modifications in the HMC design, for realizing the proposed PPS, then they shall be subjected to delta qualification (DT) plan as per SAC R&QA requirements, given in Section-B.
2. DT plan shall be applicable when the previously qualified HMCs used in the PPS with limited changes in components and operating conditions.
3. All the HMCs, utilized in the delta qualification shall be part of the deliverables.
4.4.3 Design verification Model (DVM) & Qualification Model (QM)
1. Vendor shall make deliverable DVM and QM PPS of each type, as defined in point 5.0 of section A meeting all R&QA requirements.
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2. Vendor has to make PCB/ HMC layouts as per SAC/ISRO guide lines and have to take SAC QA/QC approval before starting any further work. SAC will carry out periodic audit inspections at various stages.
3. There are two types of models to be developed:
DVM PPS: Fabrication of QM and DVM shall be of same batch. DVM will have same Layout and foot print as QM. Quality level of DVM & QM may be different. These models will be subjected to IBT, Temp. Operational test and FBT as described in Table-3 of section B. Subsequently these models are to be delivered to SAC. These models are planned to be used for interface test with other payload subsystems at SAC. QM Model PPS: These models must undergo full qualification. The QM Models must qualify the requirements of R&QA.
4. QM model shall meet the performance as per given specifications and there shall not be any changes and deviation in these units. Units shall comply to EMI/EMC MIL-STD-461 E specifications.
5. After the successful completion of QM level testing of each unit, the product shall be considered as qualified for flight manufacturing.
6. All the test jigs developed for functional, parametric, environmental, and mechanical, burn-in, life testing, etc. shall be delivered to SAC after completion of the work.
7. All QM units must be fabricated as per approved manufacturing drawings and there shall not be any modifications in manufacturing processes, materials or any other procedures during manufacturing and testing phase, for realization of Flight Model units.
8. These units must be qualified without any waivers in performance specifications.
9. Critical Design Review (CDR) will be carried out by SAC.
10. The resulting circuit modification due to any lesson learnt during the DVM testing will be implemented in QM.
4.4.4 Flight Model (FM) and PFM Units of the PPS 1. All the FM units must be fabricated as per the approved manufacturing drawings of qualified PPS and there shall not be any modification in manufacturing process, material or any other procedure during manufacturing and testing phase.
2. FM shall meet the performance and R&QA requirements as per given specifications and there shall not be any changes and deviation in these units.
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5. Quantity Requirement Vendor shall submit their offers for following types independently and Quantity in slab as mentioned in Table-5.1. The table gives model wise quantity break-up. The delivery schedule is given in Table-5.2. All the developed electrical and environmental test jigs shall be shipped to SAC along with the deliverable PPS types.
Table 5.1 PPS Types and requirement
PPS Type
BBM DVM QM Slab of FM quantities
Type-1 1 5 1 15-25, 26-50, >50
Type-2 1 5 1 25-50, 51-75, >75
Type-3 1 5 1 25-55, 56-75, >75
Type-4 1 5 1 25-45, 46-75, >75
Type-5 1 7 1 45-80, 81-100, >100
Total 5 27 5
Note: Quantity and Types are mentioned in the RFP, but at the time of Final Order, SAC may order any or all types of PPS in any quantity slab. Table 5.2 Development and Delivery schedule requirements
No. Milestones Delivery Schedule
Kick off Handing over schematic, BOM and Interfaces by SAC to Vendor (T0)
BBM T0 + 5 months
PDR T0 + 6 months DVM T0 + 12 months
CDR T0 + 18 months QM T0 + 20 months
FM T0 + 21 months
FM delivery starting from T0 + 21 in batch of minimum 18 per month*
* SAC will define the types to be taken up in a particular batch.
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Table 5.3 Commercial Performa
Sr.No Item Description Quantity slab Price 1 PPS Type-1-BBM -- 2 PPS Type-2-BBM -- 3 PPS Type-3-BBM -- 4 PPS Type-4-BBM -- 5 PPS Type-5-BBM -- 6 PPS Type-1-DVM 1-5 7 PPS Type-1-DVM 6-10 8 PPS Type-2-DVM 1-5 9 PPS Type-2-DVM 6-10 10 PPS Type-3-DVM 1-5 11 PPS Type-3-DVM 6-10 12 PPS Type-4-DVM 1-5 13 PPS Type-4-DVM 6-10 14 PPS Type-5-DVM 1-5 15 PPS Type-5-DVM 6-10 16 PPS Type-1-QM -- 17 PPS Type-2-QM -- 18 PPS Type-3-QM -- 19 PPS Type-4-QM -- 20 PPS Type-5-QM -- 21 PPS Type-1-FM 15-25 22 PPS Type-1-FM 26-50 23 PPS Type-1-FM >50 24 PPS Type-2-FM 25-50 25 PPS Type-2-FM 51-75 26 PPS Type-2-FM >75 27 PPS Type-3-FM 25-55 28 PPS Type-3-FM 56-75 29 PPS Type-3-FM >75 30 PPS Type-4-FM 25-45 31 PPS Type-4-FM 46-75 32 PPS Type-4-FM >75 33 PPS Type-5-FM 45-80 34 PPS Type-5-FM 81-100 35 PPS Type-5-FM >100 36 PPS-Qualification test charges 37 PPS-Electrical and Burn in Test Setup 38 PPS-NRE Charges
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SECTION-B
QA Technical Annexure for Development, Fabrication and Testing of FM Payload Power Supply (PPS) for Electro-Optical Remote Sensing Payloads
1.0 INTRODUCTION: This document describes the Reliability and Quality Assurance requirements to be followed by Vendor during fabrication, assembly and testing of ordered subsystems. In this section, Payload Power Supply (PPS) is referred as unit OR PPS.
2.0 APPLICABLE DOCUMENTS: Following reference documents are applicable during realization of the hardware.
ISRO-PAS-206
Issue-4, Nov 2012
Qualification requirements for Thick Film Hybrid Micro Circuits
ISRO-PAS-207 Storage, Handling and Transportation requirements for Electronic Hardware
ISRO-PAX-300
Issue-5, Nov 2012
Workmanship Standards for the Fabrication of Electronic Packages
ISRO-PAX-301
Issue-3, April 2013
Design Requirements for Printed circuit Board Layout
ISRO-PAX-303 Design requirement for Multi-Layer Printed Circuit Board Layout and artwork
ISRO-PAS-502 Procurement Specifications for Austenitic stainless steel Bolts and Screws
MIL-STD-202G Test Method Standard Electronic and Electrical Component Parts
MIL-STD-461E Requirements for the control of Electromagnet Interference Characteristics of Subsystems and Equipment
MIL-STD – 883 Test Method Standard for Microcircuits
MIL-PRF-38534 Performance specifications for HMCs
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3.0 RELIABILITY: The unit is designed by SAC, for space use with a minimum design life of 15 years.
3.1 Life:
a) The unit shall meet all the fabrication requirements for use onboard spacecraft with a minimum life of 15 years.
b) Additionally unit shall be capable of meeting all the functional requirements at various stages of spacecraft assembly and storage as follows:
- 3 years storage and life at various levels of spacecraft assembly
- 5 years in controlled environmental conditions.
The vendor shall inform recommended method for storage and re-test criteria, in case of longer storage.
3.2 Operating condition for Active Components:
The electrical designs are made compliant to the SAC derating requirements for space payloads. Material selection and packaging shall be such that junction/ channel temperatures of all solid-state devices shall not exceed +110ºC under worst case environmental conditions.
4.0 ENVIRONMENTAL SPECIFICATIONS: 4.1 Non-Operating Environment: The units shall be capable of withstanding following environmental conditions:
a) Temp. Range : - 40oC to +75oC
b) Pressure : Ambient and hard vacuum better than 10-5torr.
c) Relative Humidity : Max. 95% non condensing at +40oC (Applicable for storage on ground only)
4.2 Operating Environment: The units shall meet all the performance requirements as given in electrical specifications under the following environmental conditions:
a) Temp. Range:
i) FM : -15°C to +70oC* ii) QM : -20oC to +75oC*
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* Final value will be given at the time of placement of order and it will be within these limits.
b) Pressure: The unit shall be capable of operating and compliant to the specifications at ambient pressure as well as vacuum level of 10-5torr and hard vacuum of the order of 10 -13torr.
Note: All temperatures are referred to the base plate. Temperature up to +75oC of base plate should not affect the life, operation and performance of the unit.
4.3 EMI / EMC: Fabricated unit shall meet EMI / EMC requirements of MIL-STD-461E.
4.4 Space Radiation: The units shall operate without any degradation in performance or life for the following radiation environment:
a) 1.0 X 106 Rads ionising dose absorbed in silicon (TID).
b) Parts shall be ELDRS free
c) 6.0 X l014 elec./cm2 (3 MeV bulk damage equivalent)
d) Immunity against SEE / SEL / SEU (Single Event Effect / Single Event Latch-Up/ Single Event Upset): LET 80 MeV /mg/cm2
All the parts selected as per SAC supplied parts list for realizing the PPS meets the radiation environment requirements.
Localized shielding requirements shall be calculated based on the package design of unit and submitted for review and approval by SAC.
4.5 VIBRATION / SHOCK / ACCELERATION: The units shall be designed and fabricated to meet the vibration (Sine and Random) and mechanical shock requirements as per the test plan given in this exhibit.
5.0 PARTS :
The parts and materials list consisting of following details (as a minimum) shall be submitted to SAC along with deliverables Part / material name Quality level Part / material number Name of manufacturer Package style (applicable for parts) Qualification / approval status
5.1 DESIGN VERIFICATION MODEL (DVM) PARTS QUALITY:
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The quality of parts to be used shall be as follows:
a) Discrete semiconductors : JAN or better
b) Microcircuits : MIL-STD-883 class B or ESCC
c) Passive Parts : ER type with failure level "M" or better
5.2 QUALIFICATION (QM) / FLIGHT MODEL (FM) PARTS QUALITY: For QM/ FM the following criteria shall be applicable for procurement of parts:
Table-1: Parts Quality Level Device Family Applicable specification and Quality Level of the parts
Microcircuit Dice & Packaged
(Digital)
- Qualified to MIL-PRF-38535, Class R/V/S or ESCC 9000 Level B3.
The dice shall meet;
− TID requirements of 100 KRAD(Si) min. − Single Event LatchUp LET 80 Mev/mg/cm2 min.
Microcircuit Dice & Packaged
( Linear)
- Qualified to MIL-PRF-38535, Class R/V/S or ESCC 9000 Level B3.
- The dice shall meet TID requirements of 100 KRAD(Si) min.
- ELDRS Free part with QML R level is preferred.
Discrete Semiconductor Dice & Packaged
(Diode / Transistor )
- Qualified to JANS/JANKC quality level of applicable MIL-PRF-19500 specification OR Qualified to applicable ESCC specification, Level B3
- Equivalent to JANS/JANKC quality level of applicable MIL-PRF-19500 specification OR as per applicable ESCC specification, with Lot Validation Test (only when Dice are not JANKC qualified).
- The Dice shall be Radiation hardened to 100K Rad(Si). - ELDRS Free part is preferred.
Discrete Semiconductor Die
(MOSFETs)
- Qualified to JANKC quality level of applicable MIL-PRF-19500 specification OR Qualified to applicable ESCC specification, Level B3
- Equivalent to JANKC quality level of applicable MIL-PRF-19500 specification OR as per applicable ESCC
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Device Family Applicable specification and Quality Level of the parts specification, Level B2 (only when Die are not JANKC qualified).
- The Dice shall be Radiation hardened to 100K Rad(Si) and SEE immunity upto LET of 80 Mev/mg/cm2 min.
Chip Resistors
- Qualified to applicable MIL specification, ER Failure rate level ‘S’ OR Qualified to applicable ESCC specification, Level B3
- Qualified to applicable MIL specification, ER Failure rate level ‘R’ (only when no S failure rate level qualification)
- Manufactured, processed to and tested as per the applicable MIL/ESCC/GSFC specification with screening & QCI inspections. (only when neither S nor R failure rate level qualification).
Chip Capacitors
- Qualified to applicable MIL specification, ER Failure rate level ‘S’ OR Qualified to applicable ESCC specification, Level B3
- Qualified to applicable MIL specification, ER Failure rate level ‘R’ (only when no S failure rate level qualification)
- Manufactured, processed to and tested as per the applicable MIL/ESCC/GSFC specification with screening & QCI inspections. (only when neither S nor R failure rate level qualification).
All 50 volt rated ceramic capacitors from MIL qualified line shall be subjected to BMLT test as per MIL-PRF-123
Chip Capacitors
(Tantalum, Solid)
- Qualified to MIL-PRF-55365, Failure rate Weibull ‘C’ & surge current test option C OR Qualified to applicable ESCC specification, Level B3
Chip Inductors - Qualified to MIL-PRF-83446 OR Qualified to applicable ESCC specification, Level B3
Multi-pin Connectors
- Level-B of relevant ESSC specification - NASA-GSFC approved.
Micro-D Multi-pin connectors
- Qualified to MIL-DTL-83513 - NASA-GSFC requirements - Qualified to ESCC 3401 level-B
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Procurement specifications for components shall be generated by the vendor and submitted for review & approval to SAC. Components shall be procured as per the requirements of SAC approved procurement specifications. Also the components shall be procured with COC of the manufacturer and necessary data pack.
Non-standard parts, wherever used, shall also have sufficient space flight history and the quality level equivalent to the above mentioned parts. Wherever applicable, destructive physical analysis (DPA) and verification of quality (VOQ) testing shall be carried out by the vendor to gain sufficient confidence in the parts.
The HMC shall meet the QA requirements given in Section-C. Vendor shall provide details regarding the design similarity of proposed design HMC with the qualified design HMC. After review of the design similarity, applicability of CTQ / all subgroups of CTQ will be decided. In such case requirement of CTQ and/or sample size for CTQ may reduce.
Screening test data of the HMCs to be used in the PPS shall be submitted to SAC for review. Only after successful clearance of the same HMCs shall be used in PPS.
5.3 Inspection of parts:
5.3.1 Electronic parts:
All the active and passive electronic parts (packaged) shall be subjected to incoming inspection. Traceability shall be maintained for parts, from incoming inspection to the final units including batch acceptance report of PCB / MIC. (Lot No, Batch No, Date code etc). Active components procured in bare die version, visual inspection shall be carried out just prior to the assembly in the module. Additionally, if required, SAC may perform the die visual inspection on sample basis. 5.3.2 Mechanical parts:
All the mechanical parts & materials procured by the vendor shall undergo Incoming inspection / testing including measurement of critical physical, chemical & mechanical properties including Outgassing properties of specified materials. Wherever the Outgassing test results with the compliance certificate are supplied by the manufacturer along with material batch test results, out gassing test is not required.
The vendor shall carry out the fabrication of mechanical parts as per SAC approved drawings. Dimensional measurements and visual inspection of packages, boxes,
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covers, clamps etc. shall be carried out by the vendor on 100% basis. The mechanical parts shall also be inspected on 100% basis from plating / thermal painting workmanship point of view. All the bought out mechanical components including fasteners, spring, plain washers, nuts etc. shall be procured by the vendor in accordance with procurement specifications approved by SAC. Incoming screening of fasteners shall include review of Manufacturer’s Test Report (MTR) & Certificate of Compliance (CoC), as well as inspection on 100% basis GO/NO-GO gauge inspection, and dimension inspection on sampling basis by the vendor.
Declared Material List (DML) & Declared mechanical parts List (DMPL) used shall be prepared and sent to SAC for review and acceptance. List shall contain following minimum details.
a) Material designation
b) Material details (i.e Heat Treatment, Finish, Mix ratio, Cure Time etc.)
c) Applied specification, conditions
d) Manufacturer and/or Vendor name,
e) Application area in UNITs
f) Heritage
Following traceability information shall be maintained by the vendor for records & SAC audit purpose.
a) Raw material identification details, relevant in-house incoming inspection & test reports.
b) Materials batch/lot Nos. information
c) Parts identification records
d) QC inspection and clearance reports of the vendor for both bought out & in-house fabricated hardware.
e) Process documentation like process log, applicable process documents etc.
f) Certificate Of Compliance (CoC) supplied by sub-vendor/manufacturer for bought out items.
6.0 MATERIALS: Vendor shall ensure to use of ISRO approved / qualified materials. Procurement of all the mechanical and electronic fabrication materials shall be in accordance with
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Approved Materials List (AML) given in document No. SAC/QACMG/MQAD/GEN/05/ APRIL-2012 followed by incoming inspection. Any other materials, which are not available in AML shall first be qualified as per SAC test plan & cleared by SAC prior to their use. All inspection and clearance records for the materials shall be maintained by the vendor. Only approved and cleared materials shall be used.
Technical specification of other materials to be used in the hardware which are not included in the above documents shall be submitted to SAC for review and clearance before procurement. Non-compliance of specifications for any bought out or in-house fabricated materials shall be intimated to SAC for necessary review and clearance.
Materials list consisting of the name of vendor, shelf life, qualifying agency, location of application in the sub-systems shall be submitted to SAC for approval. Only Space qualified Printed Circuit Boards (PCBs), approved photo mask, patterned MICs etc. shall be used during fabrication of hardware. All PCBs / MICs shall be procured from ISRO qualified vendor.
All the materials shall be used within their shelf life. Life limited materials may be considered for use only after appropriate re-testing and approval as defined by SAC.
Ferrous and non-ferrous material used shall be of corrosion resistance type or suitably treated to resist corrosion caused by atmospheric conditions existent in storage or normal operational conditions. Only non-magnetic materials shall be used; except where use of magnetic materials are essential. Materials, which are nutrients for fungus, shall not be used.
Organic and inorganic materials shall be stable under atmospheric and high vacuum conditions. These materials shall have a Total Mass Loss (TML) of less than 1% and Collectable Volatile Condensable Materials (CVCM) of less than 0.1% when subjected to a test condition of +125ºC and 1x10-06torr pressure for 24 hours. Only space qualified epoxies, potting materials, etc. shall be used, within their shelf life and with cure schedule as specified by the vendor. However, their use shall be restricted and failure due to these shall be recorded and analysed as and when detected. Wherever the Outgassing test results with the compliance certificate are supplied by the manufacturer along with material batch test results, out gassing test is not required.
The selection and use of dissimilar materials shall be avoided, wherever it is impractical to avoid dissimilar materials in direct contact with each other, suitable protection shall be provided by space proven coatings / plating etc.
7.0 STORAGE OF HARDWARE, PARTS & MATERIALS:
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Vendor shall ensure that all the parts and fabricated hardware are stored under controlled environment in a Bonded-Store till their actual use/delivery. Storage of fabricated hardware, parts & materials shall be done as per ISRO-PAS-206. Manufacturer instruction for storage & handling of parts shall strictly be followed during the storage. Preferably dry Nitrogen purged packaging and storage cabinets shall be used for storage of bare dice and oxygen sensitive items like PCBs / mechanical hardware.
8.0 PROCESSES: Only qualified process shall be used and no new process qualification requirement is addressed for this programme. The unit shall be built to the standards normally associated with long life satellite hardware. ISRO-PAX-300 / 305 Workmanship standards for fabrication of electronic packages shall be followed for the fabrication work. All electronic fabrication processes like Etching of PCB laminates, Wiring of components, Wiring & assembly of circuits and box, Packaging and assembly etc. including HMC fabrication shall be ISRO qualified. Similarly the processes used for surface treatment of the box like plating and coating in realizing the hardware shall also be ISRO qualified. All the processes shall be carried out in accordance with PIDs reviewed & approved by SAC.
In case of processes qualified by other agencies, process qualification reports shall be submitted to QA SAC for review. After review of previous qualification plan, SAC will decide for requirement of full qualification / delta qualification of such processes. However, right for decision on feasibility of such a qualification activity will be retained by QA SAC. Particular attention shall be paid, as a minimum, in respect to the following: a) All the processes used should be qualified for space use
b) All components including torroidal / bead inductors / coils shall be suitably supported on PCB/Substrate by RTV etc.,
c) All connections through wire (insulated / Cu magnet) from feed-through to circuit shall have adequate Stress relief loop, maintaining minimum possible length.
d) Wherever wires are attached to casing for grounding etc., a higher melting point solder than that used for lid soldering, shall be used.
e) The input/output connections on pins shall also be made with high melting point solder to avoid detachment of these connections while soldering the pins to external system using SN 63 solder.
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f) The marking and plating etc. shall be permanent and should not get damaged during normal cleaning process using Isopropyl alcohol or other recommended cleaning solvents.
g) In case where consistent poor workmanship is observed, Verification of the Process Qualification (VOQ) shall be carried out at the discretion of SAC-QA.
Vendor should prepare and submit list of processes required for this programme with qualification status, alongwith technical proposal. Vendor shall also submit the standard process average for rejections / reworks for major fabrication activities.
8.1 Verification of Process Quality (VOPQ):
Witness samples shall be prepared & processed along with each batch of patterned Substrate, PCB (DSB, MLBs) and plated, painted / coated mechanical parts & components as per the requirements defined as part of process qualification certification. This witness samples shall be subjected to Batch acceptance testing, as per the SAC defined acceptance test plan. Any deviations observed on these samples shall be a cause for rejection of fabricated lot and a final disposition shall be taken after discussion with SAC regarding their impact on unit functioning and reliability. Corrective action shall be taken to ensure quality.
Items only from accepted batches will be cleared for use in FM fabrication.
9.0 Process Identification Document (PID):
All the activities involved for realisation of space QM/CTQ/PFM/FM units shall be addressed in the top level PID. Vendor shall prepare such top level document, identifying all the activities, methods / procedures, inspection check points with reference to applicable documents that will be followed for realisation and delivery of the units. The copy of PID shall be sent to SAC for review. Only SAC approved PIDs shall be followed for production of subsequent units. 9.1 FABRICATION DOCUMENTATION: For the fabrication activity, a fabrication traveller / fabrication history sheet shall be maintained for each unit, where-in all the fabrication steps and QC inspection comments are logged. This shall include any non-conformance reported by QC and its close out. This shall also include the specific serial nos. of devices used for fabrication of units.
9.2 Fabrication Sequence:
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A generalized fabrication sequence detailing each step of fabrication and QC inspection shall be worked out and provided to SAC before start of fabrication. SAC approved fabrication sequence shall only be implemented. This is to ensure smooth flow of the assembly activity and avoiding rework / rejection. This shall be clearly understood and agreed upon. The assembly flowchart shall include the following:
a) Flow of fabrication activities
b) Approved drawing nos.
c) Name of processes and PID numbers.
d) Intermediate electrical testing (at module level)
e) Handling instructions
f) Permanent/Temporary torque values.
g) Specific instructions, caution notes etc.
h) Any environmental test which is a part of fabrication process or for electrical performance check and selection TBD component values
i) Marking & Identification of unit.
10.0 QUALITY CONTROL (QC) :
Vendor’s in-house Quality Control (QC) shall carry out 100% inspection of all the fabricated / processed units as well as on-line inspection during the electronic fabrication activity. Non-destructive bond-pull test (NDT) on wire/ribbon shall be carried out on 100 % basis, prior to sealing / cover closing of the units.
All fabrication and inspection work shall be carried out by ISRO certified fabricators / inspectors of vendor. Online inspection of all the fabricated hardware and witness samples shall be carried out by QC of the vendor. These data can be used to monitor the process health. Required process control documents are to be generated and maintained by the vendor, which will be reviewed by SAC during QA audit.
The hardware for Flight shall be inspected by vendor’s QC and shall be accepted after successful inspections & clearance of witness samples. These include etching of printed circuits on substrates (PCB, Alumina etc), their soldering and the assembly of the package with fabricated mechanical parts. The mechanical units shall be inspected for dimensional compliance, finish and surface quality on 100% basis.
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11.0 QA AUDIT : The purpose of the QA audit is to ensure that all fabrication and assembly activities are carried out as per approved documents & ISRO guidelines to determine effectiveness of quality systems at vendor’s facilities. Also compliance to all planned Product Assurance activities is ensured. The QA audit shall be carried by QA/ SAC from both electronic & mechanical point of view. Following may be noted.
• The frequency for QA audit shall be decided by SAC and intimated to the Vendor. • All the fabricated Substrates / PCBs / Packages shall be first inspected and
accepted by QC/QA of the vendor and proper records shall be generated. Audit by QA/SAC shall be carried out on QC accepted hardware. Audit by SAC shall cover Electronic & Mechanical aspects for the following,
a) PFT Substrate / PCB
b) Machined package/ cover etc.
c) Surface finishing (plating / painting)
d) Wired Substrate / PCB
e) Packaging & fixing of cards/ substrates/ connectors & internal harness
f) Audit for integrated package level.
g) Test setup and unit level testing.
• SAC shall audit/ inspect all related facilities, activities which the vendor will carryout to realise the hardware. Fabrication processes, cleanliness records, QC inspected hardware, process log books/history records, overall documentation, parts & material evaluation/test reports, facilities, procedures followed etc. shall be followed as per ISRO guidelines.
• The audit report will be generated by QA/SAC. The Vendor shall generate close outs on the discrepancies observed during audit by taking appropriate corrective actions and submit the same to SAC for review and acceptance.
• The disposition on the non-conformances on actual hardware, if any, which cannot be closed by the auditee, shall be closed through vendor’s NCRB, with approval from SAC, after reviewing the impact of the non-conformance on reliability of the non-conformed hardware for intended use.
• The corrective actions implemented by the vendor shall be documented after necessary review and approval by QA/SAC.
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• Based on the compliance to ISRO guidelines and closeouts for audit observations by the vendor, stage wise clearance shall be given by QA/SAC.
• Virtual Audit (Photographic): Based on confidence level build-up on fabricated hardware, SAC may opt for virtual audit of hardware, provided vendor facility, process line, their quality system, etc found satisfactory. For this, vendor is required to submit related documents like, High resolution images of the hardware, History sheets, compatibility sheet, box dimensional report, Torque wrench calibration certificate, NCR details, plating / coating clearance report and other, if required.
12.0 MARKING AND IDENTIFICATION: The units shall be identified by assigning unique serial number (may be assigned by SAC) on the exterior surface of both package & cover by a suitable process applicable for space use. Marking shall not degrade the performance and quality of the unit. In addition to functional markings like input / output, frequency etc. following marking shall appear on each unit.
Unit Name Unit Number
Specification Number / Contract Number Serial Number
Name of the Manufacturer Date of Manufacture
Recommended Part No.: PPS-XX-ZZ-(QM/FM/DVM)-WWYY
Where XX = Type, ZZ= Sr. No., WWYY= Week and Year code
The permanency of the marking shall be sufficient to withstand the specified environmental conditions and normal cleaning operations using Isopropyl Alcohol and other cleaning solvents. The marking method to demonstrate the same shall be specified by the manufacturer.
13.0 TRANSPORTATION:
Suitable packing shall be provided for the transportation of the unit by air or road without any degradation / damage. Each unit shall be packaged in individual ESD protective packaging. This package shall protect the unit from environmental conditions encountered during transportation, like heat, humidity & dust. This individual container shall then be placed in a transportation container. More than one individual unit may be placed in the transportation container. The transportation container shall protect the units from heat, humidity, dust, mechanical shock & vibrations during transportation.
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The individual unit packages and transportation containers shall be clearly marked with following instructions along with other mandatory markings.
“ESD sensitive units”
“To be opened only under clean environment with ESD precautions”
“High reliability space usage systems”
114.0 TEST PROGRAMME: Final production tests shall be carried out just prior to submitting the units for the formal test phase, to ensure that units meeting the functional requirements. As a part of final production test it is recommended that Temperature cycling over the acceptance temperature limits should be carried out.
14.1 MODEL PHILOSOPHY: During the programme following Models shall be fabricated and tested as per the requirements of this RFP:
Ø Design Verification Model (DVM)
Ø Qualification Model (QM)
Ø Flight Model (FM)
Ø Proto Flight Model (PFM)
a) Design Verification Model (DVM):
Design Verification model shall be fabricated with DVM HMCs (whenever applicable), keeping in mind the device availability for Flight requirements. At vendor’s discretion FM quality parts (including HMCs) may be used for DVM unit. DVM unit performance shall be verified for the acceptance temperature specification.
b) Qualification Model (QM):
The design of the QM units shall be same as that for the FM units. Materials, parts and component to be used shall be as that for FM. Similarly, same processes as FM shall be used to realize QM. QM shall be subjected to the Qualification level tests as per Table-3. After completion of QM unit testing, the test report shall be submitted to SAC for review. Fabrication of FM units shall commence only after clearance from SAC of the QM test results.
c) Flight Models (FM):
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The FM units represent the final electrical & mechanical design and configuration using screened Hi-Rel parts, material and processes of qualified standard and workmanship. All the FM PSUs shall be subjected to Flight Acceptance Level Tests.
d) Proto Flight (PFM) level testing:
For this programme, PFM units are not applicable and will not be ordered. However, in following cases, vendor will be required to conduct PFM level testing on one FM unit:
(a) Corrective action implemented based on deviation observed during QM level testing
(b) In case of number of deviations during fabrication and assembly exceeds standard process average
(c) Performance deviation observed in three successive units during FM level testing (d) Depending on the final order quantity and delivery schedule, one unit per year
OR in case of break in production for more than three months.
Requirement of PFM level testing due to above cases will be decided by SAC after thorough review of the technical performance details of each of the applicable case.
14.2 TEST PLAN: The vendor shall submit to SAC the detailed test plan document for the functional & environmental tests to be conducted on QM and FM (including PFM level testing) units, whenever applicable, for approval by SAC. This includes the detailed test procedure for conducting each test consisting of test method, test conditions, test equipments etc. Only approved test plan shall be implemented. The environmental level severity for the test to be performed on different units should be as listed in the following Table.
Table – 2 Test Severity Levels
Model Type Levels DVM Acceptance QM Qualification FM Acceptance PFM Qualification
PPS shall be tested in accordance with Table 3 given below. The tests shall be performed in the listed sequence.
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Table – 3: Tests applicability
Sr. No. Test DVM QM PFM FM
1. Physical Measurements X X X X 2. Visual Inspection X X X X 3. Initial Bench Test (IBT) X X X X 4. Burn-in Test (168 Hrs.) - X X X 5. Post Burn-in electrical tests - X X X
6.
Storage tests a) Cold Storage test - X - - b) Hot Storage test - X - - c) Humidity Storage test - X - -
7. Temp. operational test X X X -
8.
EMI / EMC (MIL-STD-461E) CE102, CS101, CS114 (Curve 3), CS115 & CS116 (Imax=5 A), RE102 - X - -
CE102 - - X X 9. Sine Vibration - X X - 10. Random Vibration - X X X 11. Thermo-Vacuum test - X X X 12. Mechanical Shock - X - -
13.
ESD test Radiated Field (7 KV, 1pps, 30 pulses) - X - - Single Point Discharge (5 KV, 30 pulses,1pps) - X - - Structural Current (5KV, 1pps, 30 pulses) - X - -
14. Life Test - X X - 15. Final Bench Tests (FBT) X X X X 16. Final Visual inspection X X X X
Notes:
1. ‘X’ denotes applicability of test.
2. At the end of each environmental / mechanical test and electrical performance check shall be carried out.
3. For PFM level testing burn-in, temp. operational and Thermovac testing shall be carried out at qualification temperature level.
4. Suitable buffer connectors shall be used to protect input / output connectors of the device from wear and tear due to mating / de-mating with other connectors during testing. Record of number of time mating / de-mating of connectors shall be maintained.
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14.3 Failure:
Deviation from the agreed electrical specifications shall be treated as non-compliance and may be a cause to reject the units. Any failure observed at any stage shall be reported to SAC immediately. This shall be followed by detailed failure analysis by Vendor, clearly identifying the cause of failure as random or design related. Any modifications required in electrical, mechanical or process related aspects shall be approved by SAC. In case of mechanical or electrical design related failures; a retest plan or modification in the test plan may be necessary. Based on the failure analysis, such retest plan / modified test plan shall be decided and implemented after approval by SAC. This may include requalification of process or the unit / Proto flight level testing.
15.0 TESTS:
All the specification requirements shall be verified by testing. Vendor is required to generate test procedure, clearly showing test set-up and connection details including groundings. This test procedure shall be sent to SAC for review & clearance. Testing shall be done as per SAC approved test procedure using calibrated test & measuring instruments. It is preferred that cable types used by the vendor for harnessing during testing shall be similar or very close to cable type to be used in harnessing of FM unit in the Space craft.
Acceptance of the test set-up shall be done jointly by SAC and vendor before the testing of the QM and FM units. This shall also be audited, during the testing activity. Vendor shall inform the readiness of the test set-up as well as the schedule well in advance. Representatives from SAC may participate in the testing.
(a) Test setup calibration and accuracy:
The test instruments used during testing shall have valid calibration status. Test instruments shall have adequate measurement accuracy. These shall be verified and shall be stated in the test plan and procedures document submitted by the vendor.
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(b) Maximum Allowable Tolerance in Test Conditions:
Parameter Tolerance
Temperature ±1°C Amb. Pressure
±3°C under vacuum
Atmospheric Pressure: Greater than 0.1 Torr
Below 0.1 Torr
±5%
±50%
Relative Humidity ±5%
Acceleration ±10%
Vibration : Frequency ±2%above 25Hz, 0.5Hz below 25Hz
Sine Vibration: Amplitude
Sweep rate
Time
±10%
5%
± 1%
Random Vibration: Power Spectral Density
Overall (g-rms)
Duration
± 1.5 dB for 20-300 Hz &
±3 dB for 300-2000 Hz
±10%
+ 10% / - 0%
Shock Response Spectrum Test : Amplitude -3dB / +6dB
15.1 Test condition & details:
Following paragraphs give details of various tests to be performed on units. Electrical test shall be carried out within 96 hours after completion of each environmental test.
The test parameters to be measured during / after each of following test shall be defined in Test plan document for DVM, QM, PFM and FM units.
15.1.1 Physical Measurement:
All the units shall be examined for :
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- Mass, Dimensions& Flatness
15.1.2 Visual Inspection :
15.1.2.1 Internal Visual Inspection (Pre-Cap) :
After completion of all fabrication activities, internal visual inspection at suitable magnification of the units shall be carried out to detect any workmanship related deviation and non-conformance w.r.t respective ISRO standards. SAC may participate / audit the pre-cap visual inspection. Vendor shall inform the schedule of sealing / cover closing of QM / FM / PFM units.
15.1.2.2 External Visual Inspection :
All the units shall be examined visually at 10 X magnification before and after each environmental test. The units shall be inspected for surface finish, plating, mechanical and workmanship related defects.
15.1.3 Pre Burn-in Electrical Test (IBT) :
This test shall be performed to verify compliance to all the electrical parameters and will be taken as reference for all subsequent tests. Electrical parameters to be as per approved test plan.
15.1.4 Burn-In Test :
Units shall undergo burn-in at maximum Operating Temperature in power ‘ON’ condition. The duration of Burn-in shall be 168 hrs for all units. Data log for Time-Temperature shall be kept for verification. The critical parameters of the unit under test shall be monitored continuously during testing. However, the parameters to be monitored, duration and interval for monitoring of parameters (typically 24 hours) shall be mutually agreed between SAC and vendor.
15.1.5 Post Burn-in Electrical Test:
This test shall be conducted at ambient temperature. Electrical parameters shall be measured during Post burn-in functional tests as per approved test plan.
15.1.6 Temperature storage test :
Temperature storage test is applicable to QM units only. The units shall be subjected to minimum storage temperature for 24 hours. After this storage, electrical and visual inspection shall be performed. The test shall be repeated for maximum storage temperature for 24 hours. Units shall be in non-operating conditions for the storage duration.
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Visual inspection shall be performed after the test. Pre and post electrical measurements shall also be carried out outside the chamber on the unit.
15.1.7 Humidity Test :
This test shall be conducted on QM units as per the following conditions :
Humidity : 95 % RH
Temperature : 40 0C
Duration : 24 Hrs.
After the humidity test, units shall be visually inspected. There shall be no visual defect like, degradation of plating/coating, discoloration, patches, etc. Parameters shall be measured after the test.
15.1.8 Operational temperature test :
This test shall be performed to check the performance specifications of the units at the specified Lowest and Highest operating temperatures. The units shall be placed in a suitable thermal chamber, and connected with the external test set-up. Dwell time at temperature extreme shall be at least 6 hours. Parameters to be measured during this test shall be as per approved test plan.
15.1.9 EMI / EMC Test :
The units shall be subjected to EMI / EMC tests as per MIL-STD-461E. Test applicability is shown in Table-3. Any additional tests, if required by SAC, shall also be carried out by the vendor. Plots taken during all the tests shall be kept for verification.
15.1.10 Vibration Test :
Sine / Random vibration tests shall be carried out on applicable QM / PFM /FM units. Visual & electrical measurement shall also be performed after each Sine & Random vibration test. Vibration levels given below are tentative. Levels may change latter, depending upon mechanical configuration.
15.1.10.1 Resonance Search :
Pre & Post Vibration, resonance search shall be carried out in all the three axes as per following levels. Natural resonance frequency (Fn) shall be greater than 100 Hz and drift in pre & post vibration ‘Fn’ shall be within 10%.
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Frequency (Hz) Amplitude
10 - 2000 0.5 g
Sweep rate 2 Oct / Minute
15.1.10.2 Sine Vibration :
Sine vibration test shall be conducted only on QM and PFM units. The unit shall be in non-operating condition for the duration of vibration test. One Sweep in each axis shall be performed.
Normal to mounting plane (z-axis) Parallel to mounting plane (x & y axes)
Frequency (Hz) Amplitude Frequency (Hz) Amplitude
5-20 12.4 mm (0 to peak) 5-18 11.5 mm (0 to
peak)
20-70 20g 18-70 15g
70-100 15g 70-100 8g
sweep rate
QM
PFM
2 Oct./minute
4 Oct./minute
sweep rate
QM
PFM
2 Oct./minute
4 Oct./minute
15.1.10.3 Random Vibration:
Units shall be subjected to random vibration tests with levels as given below in passive mode. Frequency verses PSD plots shall be obtained and shall be kept along with the test results for verification.
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For QM/ PFM units :
Frequency (Hz)
Power spectral density
Normal to mounting plane
(z-axis)
Parallel to mounting plane
(X & Y axes)
20-100 + 3 dB/octave + 3 dB/octave
100-700 0.30 g2/Hz 0.10 g2/Hz
700-2000 -6 dB/octave -3 dB/octave
Overall RMS 18.1 g 11.8 g
Duration
QM
PFM
120 sec.
60 sec.
120 sec.
60 sec.
For FM units:
Frequency (Hz)
Power spectral density
Normal to mounting plane (z-axis)
Parallel to mounting plane
(X & Y axes)
20-100 + 3 dB/octave + 3 dB/octave
100-700 0.13 g2/Hz 0.044 g2/Hz
700-2000 -6 dB/octave -3 dB/octave
Overall RMS 12.1 g 7.9 g
Duration 60 sec. 60 sec.
15.1.11 Thermo vacuum Test:
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QM / FM / PFM units shall be subjected to thermo-vacuum test as per the test profiles shown in following figure.
Following points shall be considered before starting thermo-vacuum test :
§ It shall be ensured that the parameters of the thermo vacuum chamber i.e. temperature, air pressure measuring device, etc are properly calibrated prior to the start of the test.
§ It should be ensured that the temperature sensors are mounted at pre-determined locations for monitoring base plate and package temperatures as defined in test plan.
Electrical measurements shall be carried out at the points mentioned in test profiles. Cold turn-ON demonstration shall be carried out during cold storage cycle. Unit shall be turn-ON and OFF three time and voltage & current shall be recorded. Time-Temperature and Pressure data shall be logged along with electrical results for verification. Critical parameters (mutually agreed) shall be logged/monitored continuously during operating temperature cycles.
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15.1.11.1 Thermo Vacuum Test Profile:
VACUUM ≤ 1 X 10 -5 TORR
T2 0C
T3 0C
T4 0C
TE
MPE
RA
TU
RE
2Hrs
2Hrs 2Hrs 2 Hrs
2Hrs
2Hrs 2Hrs 2Hrs 2 Hrs
T1 0C
TIME
AMBIENT LAB.
UNIT ON
T3 0C 24 Hrs
24 Hrs
AMBIENT LAB.
UNIT ON
UNIT OFF
UNIT OFF
Indicates slot for measurement
Pressure better than 1× 10-05 torr
T1: MAX STORAGE TEMPERATURE T2: MIN STORAGE TEMPERATURE T3: MAX OPERATING TEMPERATURE
2Hrs
T3 0C
T4 0C T4 0C
COLD TURN-ON
UNIT ON
UNIT OFF
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15.1.12 Mechanical Shock Test:
QM unit shall be subjected to mechanical shock test as per the following test levels in all the 3 axes. Number of shocks in each axis shall be 2 and Shock levels specified with Q = 10.
Frequency (Hz) SRS
100-1000 +12 dB / Oct.
1000-5000 1000g
(levels are tentative, it may change depending mechanical configuration)
15.1.13 ESD Test
ESD tests shall be conducted on QM unit. Electrical measurements shall be carried out after ESD tests as per test plan
15.1.13.1 Radiated field Test
The unit (EUT) shall not exhibit any degradation of performance when subjected to the radiated fields of less than or equal to 7 kV ESD, simulated at 30 cm from all critical points identified by SAC. Discharge rate shall be 1 discharge per second for a period of 30 seconds at each point. The test set up is as shown in figure below.
15.1.13.2 Single point Discharge Test
The Unit (EUT) shall not exhibit any degradation of performance when subjected to discharges equal to or less than 5 kV with discharge current return wire in close proximity, applied to subsystem surface directly at critical points to simulate the discharge and local flowing of arc currents. Discharge rate shall be 1 discharge per second for a period of 30 seconds at each point. The test set up is as shown in Figure below.
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15.1.13.3 Structural current test
The Unit (EUT) shall not exhibit any malfunction, degradation of performance or deviation from the specifications when subjected to contact discharges of less than or equal 5 kV, simulating structural current transients, with discharge current return wire at diagonally opposite corners, to simulate blow-off discharge currents. Discharge rate shall be 1 discharge per second for a period of 30 seconds at each point.
15.1.14 Life test:
Life test shall be carried out during qualification testing. The unit shall be subjected at maximum operating temperature for 2000 hours, with DC biasing applied at maximum power dissipation condition. During this test, electrical measurement of critical parameters shall be carried out periodically after 240 hours, 500 hours, 1000 hours, 1500 hours and 2000 hours. The critical parameters of the unit under test shall be monitored continuously during testing. However, the parameters to be monitored, duration and interval for monitoring of parameters (typically 24 hours) shall be mutually agreed between SAC and vendor. Acceptance criteria and parametric drift shall be decided later. For PFM level testing the life test duration shall be 500 hrs.
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15.1.15 Final Bench Test (FBT) :
The final bench test shall be conducted for measurement of electrical parameters as given in test matrix. The test shall be conducted at ambient temperature. All the test results shall be recorded and any performance deviation with respect to Initial Bench Test shall be evaluated and shall be within specified limits.
15.1.16 Final Visual Inspection :
The unit shall be inspected for plating, surface, finish, mechanical deviations, corrosion and workmanship related defects. No visual degradation shall be allowed after completion of tests.
16.0 Non-Conformance Management : Effective non-conformance management mechanism shall be established. e.g. a Non-Conformance Review Board / Material Review Board may be set-up constituting representatives from design, fabrication, quality, procurement and testing departments. Major non-conformance at any stage, which affects the quality & reliability or the fabrication process of entire lot, shall be reported to SAC immediately with photographs, nature of non-conformance observed, etc. However, for all the minor non-conformances, approval from SAC is not mandatory, and shall be reviewed and discussed by the vendor’s NCR board. Major and Minor Non-conformances are broadly defined as follows.
16.1 Major or Critical NC :
Major non-conformances are those which have an impact on the contract requirements. These non-conformances, of the contractual end item which cannot be completely eliminated by rework or repair using standard repair procedures so that it could be categorised as a major NC. Major non-conformance at any stage, which affects the quality & reliability or the fabrication process of entire lot, shall be reported to SAC immediately and further action shall be taken only after clearance from SAC. In general Major NC is considered when the following properties are adversely affected:
− Functional performance − Interchangeability − Interface requirements − Reliability / Maintainability / Availability − Predicted life time − Qualification status of parts, materials and processes − Safety of personnel or equipment − EEE parts failure, in case of : − Lot/batch rejection during manufacturing, screening or testing at the manufacturer’s
facilities.
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− Failures detected during any inspection or test which affect form, fit or function and cannot be considered as random failures, where no risk for lot-related reliability or quality problem exists.
16.2 Minor NC: Any non-conformance other than major, are categorized as Minor NCs. Minor NCs shall be compiled and reported to SAC at agreed intervals.
All minor non-conformances, shall be reviewed and discussed by the NCR board. Non-conformance report shall be generated by the concerned agency and shall be reviewed and discussed by the NCR board.
Any non-conformance affecting the fabrication and/or inspection procedure shall be reported to SAC. Changes in related documents shall be implemented and revision number of the document shall be updated. This shall be followed by updating all the documentation (fabrication, inspection, and test).
All the non-conformances with the disposition given by the NCR board shall be compiled and reported to SAC periodically. This shall be followed by report of close out action completion, if any. For all the non-conformance report, SAC representative shall be the focal person.
17.0 Configuration Change Control : The manufacturer shall follow an effective configuration change control procedure during the fabrication stages. Plans for both non-conformance and configuration change control shall be made for submission to SAC for review and approval before initiation of manufacturing activities.
18.0 Documents to be supplied:
18.1 Following document shall be supplied along with quote :
a) Pont by point compliance to all the requirements of this document.
b) Details to be provided as per QA check list given in Annexture-1.
18.2 The following documents shall be supplied during the contract :
a) Parts & Materials List to be used for the fabrication of units, detailing their quality level, procurement specifications, traceability information, out gassing specifications etc.
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b) CoC, screening (at Vendors / sub-vendors) reports, incoming inspection report, batch acceptance test reports of Parts & Materials.
c) Record of Bias conditions of identifying the channel / junction temperatures of all the active devices.
d) Interface control drawing (Soft copy : AutoCAD or compatible format)
e) Details of design modifications (wherever applicable) with respect to the given details.
f) Process Identification Documents along with standard process average for rejection rate for major fabrication activities.
g) Test procedure/plan documents for QM & FM tests with test conditions, procedures, list of equipments and their calibration status, for review & approval by SAC.
h) All documents, including various Analyses as per the requirements of this document.
i) Non-conformance management plan.
j) Configuration change control plan.
k) Program management plan
18.3 Following documents shall be supplied during the programme with respect to relevant activity.
a) Status report for the fabrication activity and test schedule.
b) Schedule for Cover closing of the units
c) Details of test set-up and readiness
d) Non-conformance report at agreed intervals
e) Failure Report; as and when failure occurs
18.4 Following detailed documents shall be supplied for each unit along with deliverables, in Hard copy as well as in soft copy.
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a) T & E report of each unit containing detailed test results, test history, conformance matrix, TBD values etc.
b) CoC of the deliverable units
c) CoC of parts & materials Including screening report
d) All fabrication details supplied by SAC for fabrication
e) Non-Conformance reports with close-outs
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Annexture-1
QA Check List
Vendor to provide complete details of following with relevant certificates.
Sr. No
Details of information required Vendor response
1 Point by Point compliance provided ? Yes / No
2 List each applicable process (ISRO qualified) at your / sub-vendor’s facility, their qualification status & attach qualification certificate.
Process Name Facility Certi. No.
a) Patterned substrates : Alumina
PCB
b) Fabrication facilities : HMC
PCB
c) Component mounting & Assembly process
on, HMC
PCB
d) Plating / Surface treatment (type wise)
e) Details of other ISRO qualified processes available
6 Details of ISRO certified fabricator and Inspector for both MIC and PCB work
7 Location of test facilities likely to be used for following tests shall be provided. (whichever applicable)
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a) Physical Measurements
b) Visual Inspection (internal & external)
c) Electrical measurements
d) Burn-in
e) Temperature tests : Storage temperature test, Humidity Storage and Temp. operational test
f) EMI / EMC & ESD
g) Vibration test (sine & Random)
h) Thermo-Vacuum
i) Mechanical Shock
j) Life Test
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Annexure-2
TEST MATRIX FOR DVM/QM/FM/PFM
Electrical parameters to be measured during testing as per applicable tests on DVM, QM, FM and PFM units
Note :1. ‘X’ denotes applicability of test.
Sr. No.
Parameter
IBT
Burn
-in
Post
Bur
n-in
ele
ctric
al
Post
col
d st
orag
e
Post
hot
sto
rage
Post
Hum
idity
sto
rage
Tem
p. o
pera
tiona
l tes
t
EMI/
EMC
sin
e vi
brat
ion
Ran
dom
vib
ratio
n
Ther
mov
ac
Post
mec
hani
cal s
hock
ESD
Li
fe te
st
FBT
Parameter-1
Vendor to propose and SAC will approve Parameter-2
….
Parameter-n
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Annexure-3
58
59
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SECTION-C
QA Annexure for Development, Fabrication and Testing of HMCs
1.0 SCOPE OF WORK : The HMC fabrication line should be a qualified line as per ISRO-PAS-206. This document shall be applicable and governing document for HMCs. Vendor shall carry out the major mile stone based the activities listed below and will be responsible for the actions arising out of non-compliance / non-conformance at various stages of design, development, fabrication, testing and delivery.
(i) Ensuring Line Qualification certification, full or incremental Line Certification / Qualification for all applicable processes required for HMCs for this programme (It is to be noted that no new process qualification is addressed for this programme).
(ii) HMC Layout design based on circuit diagrams with component details & approval.
(iii) Component procurement for fabrication of HMC’s.
(iv) Fabrication of jigs, preparing test setups and approval.
(v) Test procedure document and approval.
(vi) Prototype HMC fabrication and Electrical evaluation.
(vii) HMC fabrication for DVM, CTQ, FM.
(viii) Screening and Qualification (CTQ) of HMC’s.
(ix) Derating, Thermal and Reliability analysis.
(x) Flight Model fabrication, Screening & VOQ testing.
(xi) Delivery of the HMCs etc.
SAC will broadly review the development activities as given below during HMC project life cycle. SAC will provide necessary documents, specifications and approvals.
a) Circuit diagram.
b) Component type, power rating, tolerance etc.
c) Functional and Electrical test specification of HMC’s based on SAC input.
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d) Preliminary Test procedures for electrical testing of HMC’s.
e) Environmental test specifications.
f) Audit Inspection.
g) Review and approval of development at various stages.
2.0 QUALITY LEVEL of HMCs: The HMC shall meet the design, fabrication and test requirements as identified for class ‘S’ HMC in ISRO–PAS–206, Issue–4 and the additional requirements given below. Development and fabrication shall be carried out on ISRO qualified line.
3.0 MODEL PHILOSOPHY 3.1 PROTOTYPE: Prototype HMC will be used for verifying electrical performance, adequacy of discrete design implementation in HMC version, checking correctness of layout design and adequacy of electrical test procedure before fabrication of CTQ/FM.
3.2 Circuit Type Qualification : For this programme, qualified HMC designs are targeted and CTQ is not anticipated. However, based on qualification status of proposed HMC design, CTQ may be required. In such case, the circuit type qualification (CTQ) device will be used to qualify the HMC design as per ISRO-PAS-206, Issue 4 with all the parts, material and process and testing to be carried out on flight model. The components used for CTQ shall be from same batch of flight model parts.
3.3 Flight Model (FM): The FM model HMC is the final configuration to be used for FM package of PSU for Space usage.
3.4 Verification of Qualification : For proposed HMC designs, vendor shall provide details of design modifications / similarity of HMC designs already qualified through CTQ. This will be reviewed by SAC for Qualification by Similarity and requirement of CTQ. After review of these details; Wherever, it is established that the design changes are minor CTQ will not be applicable. In such case, Verification of Qualification shall be established by test as per Table-8 on samples from screened lot as defined in this document.
4.0 Analyses Documents : Derating, Thermal, Reliability and Radiation Analysis shall be carried out for the HMC after the development of Proto HMC and report shall be submitted to SAC for review.
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5.0 COMPONENTS: 5.1 Prototype HMC Parts: The quality of parts to be used shall be as follows: a) Discrete semiconductors : JAN or better b) Microcircuits : MIL-STD-883 class B or ESCC c) Passive Parts : ER type with failure level "M" or better 5.1.1 CTQ /FM HMC PARTS: For CTQ/FM the following criteria shall be applicable for procurement of parts :
Table-5 Parts Quality Level Device Family Applicable specification and Quality Level of the parts
Microcircuit Dice (Digital)
- Qualified to MIL-PRF-38535, Class R/V/S or ESCC 9000 Level B3. The dice shall meet;
− TID requirements of 100 KRAD(Si) min. − Single Event LatchUp LET 80 Mev/mg/cm2 min.
Microcircuit Dice ( Linear)
- Qualified to MIL-PRF-38535, Class R/V/S or ESCC 9000 Level B3.
- The dice shall meet TID requirements of 100 KRAD(Si)min. - ELDRS Free part with QML R level is preferred.
Discrete Semiconductor Dice (Diode / Transistor )
- Qualified to JANKC quality level of applicable MIL-PRF-19500 specification OR Qualified to applicable ESCC specification, Level B3
- Equivalent to JANKC quality level of applicable MIL-PRF-19500 specification OR as per applicable ESCC specification, with Lot Validation Test (only when Dice are not JANKC qualified).
- The Dice shall be Radiation hardened to 100K Rad(Si). - ELDRS Free part is preferred.
Discrete Semiconductor Dice
(MOSFETs)
- Qualified to JANKC quality level of applicable MIL-PRF-19500 specification OR Qualified to applicable ESCC specification, Level B3
- Equivalent to JANKC quality level of applicable MIL-PRF-19500 specification OR as per applicable ESCC specification, Level B2 (only when Dice are not JANKC qualified).
- The Dice shall be Radiation hardened to 100K Rad(Si) and SEE immunity upto LET of 80 Mev/mg/cm2 min.
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Device Family Applicable specification and Quality Level of the parts
Chip Resistors
- Qualified to applicable MIL specification, ER Failure rate level ‘S’ OR Qualified to applicable ESCC specification, Level B3
- Qualified to applicable MIL specification, ER Failure rate level ‘R’ (only when no S failure rate level qualification)
- Manufactured, processed to and tested as per the applicable MIL/ESCC/GSFC specification with screening & QCI inspections. (only when neither S nor R failure rate level qualification).
Chip Capacitors
- Qualified to applicable MIL specification, ER Failure rate level ‘S’ OR Qualified to applicable ESCC specification, Level B3
- Qualified to applicable MIL specification, ER Failure rate level ‘R’ (only when no S failure rate level qualification)
- Manufactured, processed to and tested as per the applicable MIL/ESCC/GSFC specification with screening & QCI inspections. (only when neither S nor R failure rate level qualification).
All 50 volt rated ceramic capacitors from MIL qualified line shall be subjected to BMLT test as per MIL-PRF-123
Chip Capacitors
(Tantalum, Solid)
- Qualified to MIL-PRF-55365, Failure rate Weibull ‘C’ & surge current test option C OR Qualified to applicable ESCC specification, Level B3
Chip Inductors - Qualified to MIL-PRF-83446 OR Qualified to applicable ESCC specification, Level B3
The components shall meet the Radiation requirement as specified in Para 4.4 of SECTION-B. The Power MOSFET devices shall be Radiation Hardened devices and SOA shall meet the SEE requirements. The detailed procurement specifications of the components shall be generated and submitted for SAC approval. It is preferable that components used for CTQ and FM HMCs shall be from same lot.
6.0 MATERIALS: All the material shall comply with the requirement as per ISRO-PAS-206. Materials shall be selected from qualified material list, through a qualified vendor and its authorized distributor or from Hi-Rel Parts Procurement Agent (HRPPA). Any new material which is not qualified for Space flight usage shall undergo qualification prior to usage.
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Organic and in-organic materials shall be stable under atmospheric and high vacuum conditions. These materials shall have a Total Mass Loss (TML) of less than 1% and Collectable Volatile Condensable Materials (CVCM) of less than 0.1% when subjected to test condition of +125°C and 1x10-06 torr pressure for 24 hours. Only space qualified epoxies, potting materials etc. shall be used, within their shelf life and with cure schedule as specified by the vendor.
7.0 PACKAGE: The HMC shall be fabricated using hermetically sealed package The specification of the packages and materials to be used including qualification/ screening tests and manufacturing shall be as per ISRO approved Process Identification Document (PID) for HMC.
8.0 LAYOUT DESIGN: The layout of HMCs shall in general conform to Appendix-1 of ISRO-PAS-206 Issue-4. Optimization of track width, distance between components, conductive patterns, component placement etc. shall be carried out to enhance functional, performance, thermal and reliability aspects. The layout shall be designed to minimise noise. Any deviation to the requirement shall be dealt with on case by case basis with mutual discussion and agreement of ISRO.
9.0 PROCESS: Vendor should supply Line Certification status along with the proposal. Line to be used for fabrication of HMC’s should be qualified by ISRO for fabrication of flight model HMC’s. All the fabrication shall be carried out as per the controlled version of PID, which has been approved by ISRO during line certification. It is to be noted that no new process qualification is addressed for this programme. If any of the processes required during the fabrication of HMC are not qualified, they should be clearly identified. Usage of such process and incremental Qualification testing will be reviewed by SAC, based on which acceptability of technical quote will be decided. A copy of PID shall be given to SAC for reference.
10.0 INSPECTION ASPECT : All inspections at various stages of development of HMC shall be carried out by an independent agency (QC) of Vendor for its compliance with respect to ISRO-PAS-206 and additional agreed upon guidelines.
10.1 INCOMING INSPECTION OF COMPONENTS : All components shall undergo incoming inspection by Vendor. Records of the inspection along with traceability information shall be maintained to aid failure analysis if required.
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10.2 INCOMING INSPECTION OF FABRICATION MATERIALS : All materials including HMC package shall undergo incoming inspection by Vendor against approved accept/reject criterion. Vendor to provide the approval certificate (given by SAC/ISAC) to SAC-QA for all qualified materials and Qualified processes used for fabrication of HMC’s. The sample used for incoming material inspection shall be preserved for possible inspection during facility audit. Vendor should have proper handling and storage facility for components and material with all ESD safety precautions.
10.3 ON – LINE INSPECTION OF PROCESS: An independent quality group and well defined Quality Control (QC) mechanism of Vendor shall be responsible for all in process inspection steps like printing, firing, trimming, die-attach, substrate-attach, wire bonding (including 100% non destructive bond pull test as per method 2023.4 of MIL-STD-883, scaling including verification, setting and logging of critical process / machine parameters (i.e wire bonding) etc. It shall be detailed in the fabrication PID.
10.4 PRE-CAP VISUAL INSPECTION: Vendor shall visually inspect all the HMC’s on 100% basis before package sealing, as per method 2017 of MIL-STD-883. SAC team, at its discretion shall carry out audit inspection through its representatives; Vendor shall inform the schedule for pre-cap visual inspection stage in advance with a minimum of 10 days.
11.0 AUDIT: SAC at its discretion shall periodically audit the facility to confirm the quality compliance requirement. Vendor shall maintain a record and documentation of data for verification and traceability as per details in the PID and ISRO-PAS-206, Issue 4. Representatives from SAC shall be permitted to review the fabrication and inspection practices. They shall have full access to the fabrication, inspection and rework data for all process steps including incoming inspection and final electrical tests. All deviations / comments shall be discussed by SAC and Vendor and the compliance shall be intimated.
All the Electrical test setup, Burn-in circuits, Burn-in jig or any other fixtures/ test jigs to be used for any Electrical test or environmental test shall have prior approval of SAC. The vendor shall provide the detailed schedule for fabrication and test activities in advance to facilitate audit by SAC at various stages. The audit program shall be generated and communicated to the vendor.
12.0 NON CONFORMANCE CONTROL Vendor shall have an effective Non conformance control setup and resolving mechanism for the project. Vendor shall raise an alert immediately on non-conforming item during any of the activities (Procurement, Fabrication, Electrical or Environmental testing, etc). Vendor shall provide the details of the non-conformance with analysis and probable
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solution, decision along with schedule implications to SAC. Further work shall proceed only after understanding the impact / resolution and consent from SAC.
The rework of any deviation in no way hamper / alter quality of final product and shall strictly conform to the requirements of section 4.5 of ISRO-PAS-206 ISSUE–4 as applicable to class ‘K’ HMC’s. If any major rework is to be carried out on any HMC prior permission of SAC is required. All the deviations / report shall be recorded in the device traveller. Copies of all the inspection / test report in case of non-compliance shall be provided to SAC along with deliverables.
Any failure / deviation noticed during electrical test, screening and VOQ test shall be analyzed jointly by SAC and Vendor to generate appropriate solution and actions. Vendor shall comply with the decision arrived after the due consideration.
In the eventuality of device / batch rejection, Vendor shall fabricate fresh device / batch at no additional cost. New device/batch shall undergo the full test sequence.
13.0 HMC Testing 13.1 Electrical Test The testing of HMC’s and development of all necessary test jigs will be the responsibility of vendor. Vendor will test each HMC for functionality and performance at all the identified stages of development, qualification and screening. For circuit to be realised in HMC version (as suggested by SAC) will provide documents for electrical specifications, test conditions and procedures in general. SAC will also provide functional requirements of test jigs. For vendor proposed HMC configurations, vendor shall generate and submit these documents for review and approval by SAC.
Vendor shall design and develop test jigs in consultation with SAC to cater to
§ Functional & performance testing.
§ Stabilization Bake, Temperature cycling and other environmental & mechanical tests.
§ Burn-in.
All the electrical test setups and circuits, burn-in circuits, burn-in jigs/boards or any other fixtures / test jigs to be used for any electrical test or environmental test shall have prior approval from SAC. While designing the electrical test setups and burn-in boards, care shall be taken to provide adequate protection network to safeguard the HMC from test induced failure.
The general requirements of the test equipments, HMC parameter specifications and suggested test methods shall be generated by the vendor. SAC will identify the
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parameters to be measured during various environmental tests and accept / reject criterion. Vendor will prepare a consolidated document detailing the HMC specifications, test methods, test equipment and electrical test setup, burning jig, burn in procedure, result sheet etc. SAC and vendor will finalize this document after discussion and mutual agreement.
SAC reserves the right to review, add or update any test at any stage during the project in consultation with vendor.
13.2 Screening Test : All the HMCs fabricated for CTQ, VOQ and Flight batch shall undergo 100% screening test as per the Table-6.
13.3 Test for Circuit Type Qualification (CTQ) Only qualified HMCs are targeted for this programme. However, after review of qualified HMC design and qualification status, SAC shall decide requirement of Qualification / Delta Qualification. In case of Delta qualification requirements for proposed HMC, Applicability of any/multiple subgroups of CTQ (Table-7) will be decided by SAC. Where ever, CTQ/Delta Qualification is decided for HMC, such HMC shall undergo CTQ before fabrication of flight batch is taken up. HMCs fabricated for CTQ shall be subjected to screening as per Table-6, followed by applicable qualification. Vendor shall fabricate adequate number of devices to meet this requirement. Fabrication of flight HMC shall be taken up only after successful completion of CTQ unless otherwise authorized by SAC.
TABLE – 6 SCREENING TEST (ON 100% of Batch)
Sr. No.
TEST REQUIREMENT MIL-STD-883/ Test Method
1 Non Destructive bond pull test
As per MIL-STD-883 2023
2 Internal visual inspection
As per MIL-STD-883 2017
3 Hermetic sealing As per qualified process
4 External visual examination
10X 2009
5 Initial electrical measurement
As per electrical specifications
As per SAC approved procedure
6 Stabilisation Bake As per MIL-STD-883 1008 7 Thermal cycling As per MIL-STD-883 1010
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Sr. No.
TEST REQUIREMENT MIL-STD-883/ Test Method
8 Mechanical shock OR Constant Acceleration (Note-1)
3000g, Y1 axis
2002 Cond A or B 2001, Cond A
9 PIND As per MIL-STD-883 2020, Cond A 10 Pre-burn in
Electrical test As per electrical specifications
As per SAC approved procedure
11 Burn-in TBD°C Powered, 320 Hrs As per SAC approved procedure
12 Interim and Post Burn-in
Interim electrical test after 160 hours of Burn-in
As per SAC approved procedure
13 Active Thermal Cycling (ATC)
-30°C to +65°C 2 short cycles - 2 hrs. 1 long cycle - 48 hrs. cold
24 hrs. hot 2 short cycles - 2 hrs.
As per SAC approved procedure
14 Post ATC Electrical Test
As per electrical specifications
15 Seal leak test i) Fine leak (Note-2) ii) Gross leak
Fine leak < 5x10-8 atm cc/sec Gross leak: free from stream of bubbles.
1014
16 Final electrical measurements
As per electrical specifications
As per SAC approved procedure
17 External visual examination
10X 2009
Notes :
1. Applicability of Mechanical shock or Constant acceleration test, and test condition will be finalised based on review of construction, configuration, dimensions and mass of HMC.
2. Acceptable leak rate will be decided based on the configuration and dimensions of HMC.
3. PDA and Drift criterion to be decided after mutual discussion and agreement with SAC.
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4. Electrical measurements and visual inspection shall be performed after completion of each test.
5. Temperature limits for the thermal tests shall be operating or Non-operating temperature limits (as applicable) shall be as per ISRO-PAS-206 requirements and to be defined, however these shall be severe than those specified in Para 4.2 of Section-B.
TABLE – 7: TEST on 14 Screened Accepted Samples (CTQ BATCH)
Sub Group
Test MIL-STD-883 No. of Samples /No. of Rejections allowed*
Method Condition 01
(a) Mech. Shock (b) Vibration (c) Constant
Acceleration (d) Seal ( Fine & Gross) (e) Electrical & Visual
Inspection
2002 2007 2001 1014 ---
B A A --- ---
4/1
02
(a) Thermo-vacuum Test
(b) Solderability (c) Thermal Shock (d) Temperature Cycling (e) Seal ( Fine & Gross) (f) Electrical & Visual
Inspection
2003 1011 1010 1014 ---
C B, (15 Cycles) B(100 Cycles) ---
4/1
03
(a) Operating Life Test (b) Seal (Fine & Gross) (c) Electrical & Visual
Inspection
1005 1014 ---
2000 hrs @ 125 ºC --- ---
6/1
• Total of 1 failure is allowed out of all three Groups.
• Electrical and Visual Inspection shall be performed at the completion of each test.
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TABLE – 8: TEST on 2 Screened Accepted Samples (VOQ BATCH)
Test MIL-STD-883 No. of Samples /No. of Rejections allowed*
Method Condition
(a) Operating Life Test
(b) Seal ( Fine & Gross)
(c) Electrical & Visual Inspection
1005
1014
---
2000hrs@125 ºC
---
---
2 / 0
14. SAC PARTICIPATION: SAC may participate, in any of the test performed by the vendor. Vendor will submit all the test results to SAC for review and approval by SAC.
15. DELIVERABLES: All the test jigs developed for Functional, Parametric, Environmental, Mechanical, Burn-in, Life Testing etc. will be delivered to SAC at the completion of the work.
15.1 Documents to be supplied by Vendor for review and approval by SAC at appropriate stage of development:
Ø Vendor shall generate a Product Assurance document after signing of the contract, detailing each activity to be performed by the vendor indicating Test procedures, the requirement of materials, inspection check points, accept reject criteria, etc.
Ø Procurement specification for components, materials, Package etc. before procurement of the same.
Ø Elemental evaluation data for components procured by the vendor for HMC fabrication on receipt, for approval of the component to be used in HMC.
Ø Lot acceptance test report for package, before using the package for fabrication.
Ø Derating and Thermal Analysis Report
Ø Layout of HMC. For approval by SAC for further processing.
Ø Circuit for test boards, Burn-in boards for approval by SAC for use in testing HMC’s.
Ø Performance results and environment test reports at various stages.
Ø Nonconformance report
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15.2 Documents to be supplied by Vendor along with deliverable HMC Ø Summary of material and package incoming inspection report.
Ø Copy of batch traveller.
Ø Copy of failure / deviation analysis reports, if any.
Ø Test Data for HMC and PSU shall be logged in the Excel worksheet in the mutually agreed format. One set of Hard copy and 3 sets of soft copy shall be supplied along with the deliverable units.
Ø Certificate by Vendor’s internal QA.
Ø All the original technical documents provided by SAC at the time of placement purchase Order or subsequently
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HMC FLOW CHART
Contd.
COMPONENT PROCUREMENT SPECIFICATIONS (SAC)
INCOMING NSPECTION & DOCUMENT VERIFICATION
(VENDOR)
DOCUMENTATION (SAC)
TEST PROCEDURE & TEST CIRCUITS REQUIREMENTS FOR HMC & JIGS (SAC)
JIG DEVELOPMENT (VENDOR)
COMPONENT PROCUREMENT RAW MATERIAL &
PACKAGE PROCUREMENT
(VENDOR)
INCOMING INSPECTION
(VENDOR)
A
B
JIG EVALUATION (VENDOR)
C
Approval (SAC)
YES
NO
SAC VENDOR
DELIVERY TO VENDOR
LAYOUT DESIGN OF HMC (VENDOR)
Approval (SAC)
YES
NO
PROTOTYPE FABRICATION
(VENDOR)
PROTOTYPE TESTING
(VENDOR)
REVIEW OF RESULTS & TEST SAMPLE (SAC)
ACCEPT? (SAC)
YES
NO
MODIFICATION (SAC & VENDOR)
CTQ BATCH FABRICATION
(VENDOR)
PRECAP AUDIT (SAC) SEALING
(VENDOR)
SCREENING CTQ (VENDOR)
CTQ
PARTICIPATION FINAL ELECTRICAL TEST REVIEW OF SCREENING RESULTS &
DPA (SAC)
ACCEPT? (SAC)
YES
MODIFICATION (SAC & VENDOR)
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ACCEPT ? (SAC)
B
YES
ACCEPT? (SAC)
NO
YES
DELIVERY (Vendor)
YESFLIGHT BATCH FABRICATION
(VENDOR)
PARTICIPATION IN FINAL ELECTRICAL TESTS, REVIEW OF
SCREENING RESULTS (SAC)
ACCEPT? (SAC)
MODIFICATION (SAC & VENDOR)
NO
PRECAP AUDIT (SAC)
SEALING (Vendor)
SCREENING (Vendor)
C A
NO
VOQ & DPA TESTS REVIEW OF TEST RESULTS (SAC)