Replacement of combustion chamber for thermal abatement units 4-Oct-16

Present by Admas Chua

Presenter CV • Admas Chua Cheng Chye

• Sr Section Manager Module Engineering

• GLOBALFOUNDRIES Singapore PTE LTD

• Mr Chua Cheng Chye, has over 20 years of working experience in Manufacturing industries assuming managerial value-added roles in various process modules and key projects to optimize the Equipment Performance Improvement and Training.

• In the manufacturing sector, he has over 16 years in GLOBALFOUNDRIES Singapore PTE LTD in managing various advanced process equipment projects specializing in various initiatives in Cost Reduction, Energy saving, Yield Improvement and Championing the Training committee for the Fab. Through these high-value added projects, he has achieved many success stories such as Pump Nitrogen Usage Optimization and successful shutdown 1 Nitrogen Plant for the Fab, also had done a few major Cost Reduction project through Tool modification, such as converted expensive consumable parts to non-consumable, Equipment Particle Reduction Projects etc.

• Prior to joining GLOBALFOUNDRIES, he had 4 years of working experience in food and beverage manufacturing companies including F&N Coca-Cola (S) Pte Ltd.

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GLOBALFOUNDRIES Singapore At A Glance

pure-play foundry in Singapore

foundry in Singapore with annual

revenue of

Proven, trusted track record of

in manufacturing line

operating Fabs with employees

Awarded in 2012~2014,

customers. Achieved numerous

from key customers such

as NXP, Cisco

foundry in the world to achieve ISO

15408 (Site Security Common Criteria

Certification) for secured products

GLOBALFOUNDRIES Singapore Fabs

Tampines

Fab7

Fab3 Fab5 (JV w Avago)

Fab2

Fab6 Fab7G

300mm

200mm

Fab3E

Woodlands Campus

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Capacity

Capacity (8”) 24k/m CMOS, 7k/m MEMS

Cleanroom Area (Manufacturing) 12,000 m2

(Wafer Testing) 3500 m2

Environment (Manufacturing) Class 1

(Wafer Testing) Class 1000

Foundry Technology 0.15um/0.18um Industry Baseline

0.18um/0.22um HV, BCDLite Processes

0.18um MCU with OTP/MTP

0.18um SONOS process

Customized 0.14~0.18um HV, NVM, etc

MEMS Process (IMU/PMUT/Optics/RF)

Inherited IDM Technology 0.18um/0.15um HV (SRAM embedded)

0.18um LP SRAM

0.15, 0.18um Automotive MCU

(Flash embedded)

0.15, 0.18um Secure MCU

(Flash embedded)

Headcount (Total: 699)

GLOBALFOUNDRIES Tampines Overview

Management 3%

Engineers & A.E 40% Technicians &

Specialists 56%

Admin Staff 1%

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Thunder Bird Version 2

Application : Power Management

SPN549 (BE Retrofit)

Application : NFC in smartphone

Key Customers GLOBALFOUNDRIES

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SPN550

Application : New Generation Mobile NFC

Ontario Version 4

Application : Finger print controller

Common walkway Wafer Process Area

Cleanroom Layout (Wafer Process)

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Overview of Tool setup (CVD)

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Wafer processing tools uses SiH4/ NH3, etc to produce desired deposit on the wafer surface.

As a result of chemical/ plasma reaction, there are by-product that exhausted from the tool need to be treated/ neutralize before going to facility exhaust (Secondary treatment) before exhaust to environment.

To treat/ neutralize, using abatement system called TPU (Thermal Processing Unit)

Objective • Install Reduce Fuel Burner RFB upgrade kit to reduce LPG (Indirect Materials

BULK GAS) consumption

Benefits • Reduce LPG consumption by 31% (LPG savings per year 200 Tonnes

est USD 200 K per year LPG cost); over 10 Years USD 2 MIL !!!

• Reduce CO2 emission by 50% as less fuel is burn (Carbon Credit) est

640 Tonnes CO2 per year; over 10 Years 6400 Tonnes !!!

New Idea: TPU abatement Reduced Fuel Burner Project

Project Details • Only CVD,PVD, Diffusion module’s TPU (Abatement system)

with 12 inch size combustion region is suitable for this upgrade.

Total of 35 TPU abatement systems.

• Abatement capacity and DRE (Destruction Efficiency)

efficiency will remains same.

• Existing fuel 24 mm nozzle will change to 16 mm nozzle.

Smaller cross section area nozzle will gives better flow and

mixing of the fuel with process gas.

• With better flow and mix of fuel and process gases, the

combustion region is therefore size down from 12 inch to 6 inch

achieving the reduction of fuel LPG consumption.

• Increase length of Weir and Quench will further ensure the gas

residence duration in the whole reaction zone remain the same

and therefore abatement DRE remains the same.

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PROJECT ROADMAP

Period Key Activities

28 Mar 14 NEA Grant Application

29 Apr 14 Pilot set on CVD tool A-V02. Pre DRE done on 23 Apr. Post DRE on 25 May 14

6 Aug 14 In principal Approval by NEA (10% grant approved) and Letter of

Offer received on 23 Dec 14

Q1 15 Measurement & Verification (M&V) plan approved by NEA

Q2/3/4 15 CAPEX approved for 34 sets and completed implementation

Q4 15 – Q1

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Submit M&V Report and Post Baseline Check

Results and Conclusion

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1) First of its kind in Singapore Wafer Fab to change existing TPU design and execute on a massive scale. 2) Reduction in LPG consumption by 31%, resulted in Actual LPG savings per year is ~200 Tonnes or USD 200K per year; 640 Tonnes CO2 per year.

3) First GLOBALFOUNDRIES Module Engineering ECO Project to receive financial grant and support from NEA; approved.

Test Parameters Post-upgrade (Base

on highest on the 4

tools)

EPMA 2008 (Air

impurities) regulation

2001

Nitrogen tri-flouride

(as F, F2)

<0.3 mg/Nm3 (as F)

<0.3 mg/Nm3 (as F2)

50 mg/Nm3

2014

-31%

420

2016

613 31% Reduction in

LPG Consumption (Tonnes Per Year)

© 2013 GLOBALFOUNDRIES Inc. All rights reserved.

Thank you