r&d at imb-cnm for future accelerators
DESCRIPTION
R&D at IMB-CNM for future accelerators. Manuel Lozano Giulio Pellegrini. IFCA. CNM Clean Room expansion. From 1000 to 1500 m2 New equipments ready with partial coverage for 15 cm (6’’) wafers We plan to do prototype runs of simple detectors in 6’’ in 2010. New ion implanter for 6’’. PhD - PowerPoint PPT PresentationTRANSCRIPT
Haga clic para modificar el estilo de texto del patrónR&D at IMB-CNM for future accelerators
Manuel LozanoGiulio Pellegrini
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
CNM Clean Room expansion From 1000 to 1500 m2 New equipments ready with partial coverage for 15 cm
(6’’) wafers We plan to do prototype runs of simple detectors in 6’’
in 2010
IFCA
New ion implanter for 6’’
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Radiation Detector Group
PhD Manuel Lozano Enric Cabruja Miguel Ullán Giulio Pellegrini Celeste Fleta David Quirion Marie Ruat
Techniciens David Almansa Joaquín Rodríguez
PhD students Sergio Díez Juan Pablo Balbuena Daniela Bassignana Consuelo Guardiola
Incorporation of a CPAN Engineer and a CSIC Electronic Technician
Increased technical capacity
Better position to afford GICSERV projects.
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
R&D in radiation detectors at CNM
Collaboration with other Spanish Groups IFIC IFAE IFCA
University Santiago de Compostela
University Barcelona
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
IFIC
ALIBAVA detector readout system ALIBAVA Telescope Modules for ATLAS upgrade
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
ALIBAVA: A readout system for microstrip silicon sensors
System finished 20 units already distributed 20 more units manufactured
Upgrade for test beam telescope Upgrade for ethernet connectivity
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Modules for ATLAS upgrade
Study of radiation hardness of 0.25 µm SiGe BiCMOS technologies from IHP (Germany)
Study of radiation hardness of LDMOS transistors for DC-DC converters.
Understanding radiation degradation mechanisms
Simulation and modeling of irradiated devices (transistors, detectors, etc)
Embedded fanins for Endcap modules
Dummies2nd IHPtest chip
1st IHPtest chip
1st IBMtest chip
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
IFAE
Planar & 3D pixels for IBL and ATLAS upgrade Bump bonding packaging
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Planar & 3D pixels for IBL and ATLAS upgrade CNM and IFAE are part of the ATLAS 3D Collaboration
for the IBL (Insertable B-layer) of the ATLAS Pixel detector
Collaboration being formed. MoU to be signed soon.
Ref.: O. Rohne – Vertex 2009
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Bump Bonding In collaboration with IFAE Bump bonding already working Medipix and ATLAS pixels
successfully bonded Efficiency in bump-bond contact >
99.5% (aim for 99.99% or better) Now working to increase yield
and qualify the technology SET/Süss FC150 machine 1 micron placing accuracy Optimized reflow
2010 FPA Project to continue with bump bonding in FE-I4 chips with planar and 3D detectors
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
IFCA
IR transparent detectors Thin strip detectors for CMS and ILC 3D pixels for CMS
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
IR transparent detectors
In collaboration with IFCA Run almost finished
12 different detectors Common parameters:
active area= 1.2x1.5 cm2 circular window in the back metal 256 readout strips with 1.5 cm length
SiO2 thickness map (wafer 2)Strips with 3 µm Al width linesG
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New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Thin devices
Run already started Based on SOI wafers 100, 150 and 200 µm thick
active devices Strip detectors with integrated
fanins in double metal technology
Grooves in silicon to integrate optical fibres to measure deformation
GICSERV funded
Figure 2: Thinning of double-sided processed detectors. See text and ref. [6] for further details.
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New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
University Santiago de Compostela
3D pixels for LHCb Thin pixels
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
3D pixels for LHCb
In collaboration with Glasgow University
First 3D Medipix-like sensor bump bonded to Timepix chip
Successfully tested in CERN test beam
Pion beamIndividual pion tracks
telescope DUTGIC
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New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Thin pixels for LHCb upgrade
First tests of bump bonding of thin pixel detectors with Timepix chip.
Detectors already manufactured at CNM Waiting for thinning and bump bonding
GICSERV funded
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New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
University of Barcelona
Device simulation of Geiger mode APDs with Sentaurus AMS HV 0.35 µm CMOS technology. Difficulty to get technology parameters Some are deduced from technological kit, others are
estimated indirectly.
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Other technologies under development
3D detectors Double side strip detectors Stripixels Active edge and trenched detectors Ultrathin 3D detector Neutron detectors Avalanche Photodiodes
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
3D detector technology Second institute in the world (after Stanford) in developing a 3D
detector technology Success with Medipix type pixel sensors Now we are designing of a new mask set for ATLAS pixel sensors Work done in the framework of RD50 collaboration.
Partially funded GICSERV
Electron collecting strip detectors
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Fluence / 1015 (1 MeV neq cm-2)
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Bias Voltage fixed at 150V for all irradiated samples Non-irradiated sample biased at 18V Detector’s ceramic based board temperature between
-10°C to -15°C Measured with ALIBAVA system (25ns shaping time)G
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New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Double side strip detectors
Double side strip detectors developed for Monash University (Australia)
Also developing double side packaging and wire bonding
Future collaboration with Universidad de Huelva for nuclear physics
Stripixels Combination of the concept of double side
reading with 3D contacts Better performace than classic stripixels Single side processing 2D position sensitivity 2N readout channels (instead of N2)
Simulations and mask design ready Wafers to be processedGIC
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New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Active edge and trenched detectors
Trenches used to reduce the dead area at the edge of the sensor
(also named edgeless, slim-edge, ...) Work started in collaboration with
IFAE (Cristobal Padilla) Features:
Implanted edge side Backplane and edge in the same
electrode Designed detectors:
PAD Microstrips MediPix2 Circular
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Ultrathin 3D detector 10 µm thick detector Virtually no entry window Used for tracking of light particles
Neutron detectors Geant4 simulation Detector design and
manufacturing Conversion layer
deposition Used for dosimetry
Planar detector
Perforated detector
300um
Etched backside
Thin membrane
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New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Avalanche Photodiodes (APDs)
Power Devices and Radiation Detectors Groups at IMB-CNM have started a new research line in optoelectronic silicon detectors.
Cover the needs of the scientific community with custom made devices designed for specific applications
We have finished electrical and technological simulations
We are now designing the masks Next year we will process the devices. We plan to develop
Linear mode APDs (to use with scintillators) Geiger mode APDs high energy tracking In the future, also SiPMs
We are open for collaboration and feedback from other groups
Electric field in the avalanche zone
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New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
GICSERV
Easy access through the Spanish “Access to Large Facilities” Program: ICTS GICSERV
New call now open until 15 January 2010 Average 70 applications, 50 accesses per call
Projects related to radiation detectors: 2009: 7 projects approved (1 rejected)
3D medipix-type detectors; Stripixels; Thin pixel detectors; Thin strip detectors; Atlas pixels with slim edge; UBM for DEPFET bump bonding
2008: 5 projects approved 2007: 3 projects approved
Big increase in radiation detector activity in CNM Clean Room
GICSERV Progam working very satisfactory
New Detectors R&D Meeting. Madrid, Dec 2009
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano & Giulio Pellegrini
Announcement
Next RD50 meeting will be held in Barcelona (31st May, 1st & 2nd June 2010)
http://cern.ch/rd50/