quality control procedureengg.hbl.in/qms/pdfs/procedures/eg-qc-pr-01 rev1 procedure... · iqc...

QUALITY CONTROL PROCEDURE

Procedure No. EG-QC-PR-01

Revision No. 01

Page No: 2 of 15

Revision History

Rev.No Date of

Revision

Details of

Changes Reason for Change

Rev.No

From To

00 20-04-2017 Initial release Upgraded to ISO

9001:2015 -- 00

01 19-08-2019

Flow chart,

Sampling plan

modified and

Reference for

Formats, Work

Instructions

Modified to meet the

process requirements 00 01

Distribution List This Documented Information will be uploaded in QMS application for reference.



Revision No. 01

Page No: 3 of 15

List of Abbreviations

S.No. Abbreviation Expansion

1. AQL Acceptable Quality Level

2. AVL Approved Vendor List

3. BOM Bill Of Materials

4. CAR Corrective Action Report

5. DGM Deputy General Manager

6. EG Electronics Group

7. FCBC Float Cum Boost Charger

8. GRN Goods Receipt Note

9. I/C In - Charge

10. IQC Inward Quality Control

11. NCR Non conformance Report

12. PCB Printed Circuit Board

13. PCBA Printed Circuit Board Assembly

14. PMM Permanent Magnet Machines

15. PO Purchase Order

16. PR Procedure

17. QC Quality Control

18. SCAR Supplier Corrective Action Report

19. SPI Solar Pump Inverter



Revision No. 01

Page No: 4 of 15

Table of Contents 1 Purpose ........................................................................................................................................... 5

2 Scope .............................................................................................................................................. 5

3 Organization chart ......................................................................................................................... 5

4 Roles, Responsibilities and Authorities ...................................................................................... 6

5 Process Flow Chart ....................................................................................................................... 7

6 Procedure ..................................................................................................................................... 10

6.1 Inward Material Inspection ...................................................................................................... 10

6.2 PCB Assembly: ........................................................................................................................ 12

6.3 Modules Assembly: ................................................................................................................ 13

6.4 Rack Level (Final QC) : ............................................................................................. 13

7.0 Documented Information ............................................................................................................. 14

List of Tables

Table 1: Roles, Responsibilities and Authorities .............................................................................. 6

List of Figures

Figure 1: Organization Chart ............................................................................................................... 5

Figure 2: Process Flow Chart .............................................................................................................. 9



Revision No. 01

Page No: 5 of 15

1 Purpose

This Procedure shall ensure that the Inward materials inspection, in-process inspection, Final

inspection of all products being manufactured shall be done as per the controlled BOM / AVL /

Drawing requirements.

2 Scope

This procedure shall cover all Quality Control activities from component level to finished product

and packing.

3 Organization chart

Figure 1: Organization Chart

I/C RACK LEVEL

FINAL QC

I/C PCB

ASSEMBLY

INSPECTION

I/C INWARD

MATERIAL

INSPECTION

I/C MODULE

ASSEMBLY

INSPECTION

All Projects

All Projects

Technicians

Technicians

Technicians

Technicians

DGM-QUALITY

All Projects

All Projects



Revision No. 01

Page No: 6 of 15

4 Roles, Responsibilities and Authorities

DGM-Quality

Responsibilities: Overall responsibility of the Quality for

Electronics Group.

Authorities: Recruit, Train and deploy the Manpower in the

Quality Dept. Approval of department QUALITY Procedures.

In-charge Inward Material

Inspection

Responsibilities: Responsible for inward material inspection.

Authorities: Inspection and clearance of inward material for

manufacturing.

In-charge PCB Assembly

Inspection

Responsibilities: Responsible for In-Process inspection of

PCB Assemblies.

Authorities: Inspection and clearance of PCB Assemblies to

next stage for further process.

In-charge Module Assembly Inspection

Responsibilities: Responsible for monitoring and controlling of quality activities of in-process inspection and functional testing of of SPI, Looms and Calibration.

Authorities: Authorized to raise and closure of NCR and

to give Finished Goods dispatch clearance.

In-charge Rack Level Final QC

Responsibilities: Responsible for monitoring and controlling of quality activities of in-process inspection and functional testing of all projects related to HBL Rail and other projects called as FCBC and PMM,

Authorities: Authorized to raise and closure of NCR and to

give Finished Goods dispatch clearance

Technicians

Responsibilities:

Inspection of inward materials as per the BOM / AVL / Drawing. Inspection of in-process assemblies as per the BOM / AVL / Drawing / controlled procedures.

Authorities:

Authorized to give clearance of items from one stage to

another stage of concerned product.

Table 1: Roles, Responsibilities and Authorities



Revision No. 01

Page No: 7 of 15

5 Process Flow Chart

Electronics / Electrical / Mechanical Items /

Consumables / Packing Materials / Job work

materials

Inward Materials

Inspect as per BOM/AVL/GRN/

DWG/Specifications

Material

Accept Reject

Indicate Status on Material & GRN through

SAP.

Indicate Status on Material & GRN through

SAP.

GRN Return to Stores Handover NCR with

GRN to Stores & NCR to

Purchase



Revision No. 01

Page No: 8 of 15

PCB Assembly Modules / Sub-systems / Cabinets / Racks

manufacturing

PCBA

Inspection

In-process

Inspection

System Integration / Rack Assembly

A

Rework Rework

Production Work Order

Accept Accept

Reject Reject



Revision No. 01

Page No: 9 of 15

Figure 2: Process Flow Chart

A

Inspection

Functional

Testing

Packing

Inspection

Rework

Rework

Rework

DISPATCH THROUGH COMMERCIAL / STORES

END

Reject

Reject

Accept

Accept

Accept

Reject



Revision No. 01

Page No: 10 of 15

6 Procedure

6.1 Inward Material Inspection

1. Inward Quality Control (IQC) receives material from Stores along with GRN.

2. Inspection of received materials shall be carried out as per sampling plan (Reference Standard:

IS 2500,Part-1,Single sampling Plan for Normal Inspection, Special inspection level –II). Refer

ANNEXURE-I.

3. Inward Inspection shall be done as per GRN Description, and controlled AVL / BOM /

Specifications, Drawing, given by Engineering.

4. Check and ensure that the received Materials Description, Part Number mentioned in the GRN

should match with the received materials.

5. GRN for Materials which are used for Project / Maintenance, R&D, Stationary etc., are passed

by IQC on the basis of Visual quality / user‟s approval.

6. If BOM / AVL is not available, then inspect the components as per the GRN Description.

7. Accepted materials shall be labeled with ACCEPTED label and hand over to stores along with

the GRN duly filled and signed by QC Inspector and approved by HEAD-QUALITY.

8. Accepted materials shall be stored at allocated location at holding materials store.

9. Non-conformance materials may be accepted on DEVIATION if the deviations are minor

and deviations approved by Head – QUALITY, Head - Production, Head - Engg, Head -

Purchase. If required, take the deviation from the internal user.

10. All the inspected parameters shall be recorded in the inspection format.

11. Rejected material shall be sent to stores duly identified by a rejected tag, if specifications are

not meeting with PO/AVL/BOM/ Specifications, Drawing, given by Engineering department.

Raise the NCR which shall be signed by HEAD's of Quality, Production, Engineering, Purchase

and send it to purchase.

12. Rejected materials shall be stored at a 'separate location' allocated by the Stores.

13. Upon receipt of NCR, Purchase Department shall prepare and send the SCAR duly filled to the

supplier and shall get the filled SCAR from the supplier.



Revision No. 01

Page No: 11 of 15

14. Classification of Materials and Inspection Levels / Quantum of Inspection:

Sl.No Component Visual Inspection Functional Testing 1 TRANSFORMERS** AQL 2.5% AQL 0.65%

2 CHOKES / Inductors** AQL 2.5% AQL 0.65%

3 POPULATED PCB's AQL 2.5% 100%

4 IC‟s (DIP)+ IC's(all SMD packages)* TRANSISTORS* TRANSISTORS*(all SMD packages)

AQL 2.5% AQL 2.5% AQL 2.5% AQL 2.5%

AQL 0.65% for DIP IC's ---------------- AQL 0.65%% ----------------

5 SWITCHES AQL 2.5% AQL 0.65%(Continuity test)

6 D-Type Connector (With cables) AQL 2.5% ---------

7 CONTACTORS AQL 2.5% ---------

8 SHUNTS AQL 2.5% AQL 0.65%

9 BLANK PCB** AQL 2.5% ---------

10 LED's AQL 2.5% AQL 0.65%

11 MOSFET's MOSFET(SMD)

AQL 2.5% AQL 2.5%

AQL 0.65% --------

12 POTENTIOMETERS AQL 2.5% AQL 0.65%

13 REISITORS /SMD Resistors AQL 2.5% AQL 0.65%

14 CAPACITORS / SMD capacitors AQL 2.5% AQL 0.65%

15 DIODES DIODES(SMD packages)

AQL 2.5% AQL 2.5%

AQL 0.65% -----------

16 RELAYS** AQL 2.5% AQL 0.65%

17 ZENER DIODES ZENER DIODES(SMD packages)

AQL 2.5% AQL 2.5%

AQL 0.65% ---------

18 HRC FUSE BASE * Fuses

AQL 2.5% AQL 2.5%

-------- AQL 0.65%(Continuity test)

19 RACK & MODULE * AQL 2.5% --------

20 CABLES, WIRES** AQL 2.5% --------

21 PULSE TRANSFORMERS** AQL 2.5% --------

22 Adhesives 1No per Lot Visual / as per label & coc

23 Plastics and Rubber Parts, Gaskets

AQL 2.5% as per COC

24 Solder Bars/Paste/Wire AQL 2.5% as per COC

25 Chemicals, Flux 1No / batch Visual / as per coc & label

26 Metal Parts, Hardware Items,Tubes AQL 2.5% AQL 0.65%(Dimensional inspection)

27 Adapters AQL 2.5% AQL 0.65%(Dimensional inspection)

28 Connectors AQL 2.5% AQL 0.65%(Dimensional inspection)

29 LCD** AQL 2.5% As per COC/Test Reports

30 Packing Boxes / Materials AQL 2.5% --------------

31 Name Plates/Stickers/Labels AQL 2.5% --------------

32 Valves AQL 2.5% --------------

33 Antennas** AQL 2.5% -------------

34 SENSORS/ RF ID SENSORS** AQL 2.5% ------------

35 Regulators AQL 2.5% AQL 0.65%

36 Controllers AQL 2.5% ----------------

37 Crystals / MOV's/Varistors/ Thermistors/SPD

AQL 2.5% ------------



Revision No. 01

Page No: 12 of 15

NOTE:

1. COC, Test reports are required for all Projects need based.

2. Materials not listed in the above table, shall be inspected and accepted as per the

COC/Test reports/ or IQC inspection reports.

3. *Catalog items/Bought out items, Standard items shall be inspected and accepted as

per the catalog/data sheet specifications and COC/Test reports.

4. * * Materials shall be accepted based on the functional parameters of the Supplier test

reports.

5. „+ shall be tested as per available IC test programs. If program is not available, only

Visual Inspection, verification of Part Number, Date of Manufacture/Packing shall be

done and accepted.

6. The AQL may be revised depending upon the Materials Rejection data.

6.2 PCB Assembly:

1. Controlled copies of BOM / AVL / Drawings / Schematics / Test Procedures / Work

Instructions shall be taken from share point or from Engineering Dept.

2. Product work flow inspection shall be controlled by “ROUTE CARD”.

3. Feeder Verification and set up approval shall be done at Pick & place machine for SMD

Components.

4. In Process Inspection shall be carried out as given below:

a. Through hole components assembled on the PCBs are visually inspected (100%).

b. SMD Components are inspected with AOI machine / visually (100%).

5. Functional Testing of PCB‟s shall be done 100% by the ICT / Test Jigs (if supplied by

the customer) by the production.

6. QC shall test 5% samples. If all samples are passed, then LOT shall be accepted. if one

sample is failed, then LOT shall be rejected and returned back to Production for rework /

retesting. After completion of rework / retesting, QC shall test 5% samples and accept

the LOT if all samples Passed. Reject the Lot if one sample is failed. Corrective Action

shall be taken for any repeated failures.

7. All accepted PCB Assemblies are identified with accepted sticker and shall be cleared for

dispatch with Dispatch Instructions signed by authorized Quality persons



Revision No. 01

Page No: 13 of 15

8. All Final Inspection reports / Route cards shall be maintained as hard copies or soft

copies with respective Project Quality In-charges for traceability

6.3 Modules Assembly:

1. Sub Systems / Modules shall be tested as per test procedure by testing team of

production. QC team shall monitor the testing activities. In case of any problems during

testing, QC team shall report to Production team for further action. This shall be done

through NCR/mails.

2. Visual inspection of Product / Modules Assembly, etc. shall be carried out on 100%.

3. QC Shall do 5% sample testing of Modules/console wiring as per the respective

Drawing/BOM.

4. During the Inspection, if any process / product non-conformity found, shall be sent back

to previous process stage for re-work with “REWORK” tag. QC inspector shall re-inspect

the same after rework and ensure the compliance of product specifications.

5. NCR shall be raised for any non-conforming product/process and give it to the

Production. Production shall find the root cause and take corrective action and close the

NCR and move to the next process.

6.4 Rack Level (Final QC) :

1. After receipt of accepted Modules and Racks from In-process inspection, system / final

product shall be integrated.

2. Functional testing shall be carried out on integrated system / final product.

3. In order to comply with customer requirements, QC shall use Internal Test Report and

shall do 5% sample testing. If all samples are passed, then LOT shall be accepted. If

one sample is failed, then LOT shall be rejected and returned back to Production for

rework / retesting. After completion of rework / retesting, QC shall test 5% samples and

accept the LOT, if all samples Passed. Reject the LOT if one sample is failed. Corrective

Action shall be taken for any repeated failures.

4. During functional testing, if product requirements / process requirements are not met

and reported as MAJOR non conformity which is non-repairable, then that particular

sub- module / module / Rack shall be rejected with “REJECTED” tag.



Revision No. 01

Page No: 14 of 15

5. All accepted products are identified with Customer Holograms or Customer Stamps or

Accepted sticker whichever is applicable and shall be cleared for dispatch with Dispatch

Instructions signed by authorized Quality persons.

6. All Inspection Certificates, I-Notes, Internal Test Reports, Acceptance Test Reports,

Final Inspection reports, Dispatch Memos whichever is applicable shall be maintained as

Hard Copies or scanned soft copies with respective Project Quality In-charges and shall

be maintained in share point for traceability.

7. Refer QUALITY MANUAL (EG-MR-AN-07) for Inspection formats, Test formats, Work

Instructions.

7.0 Documented Information

Refer QUALITY MANUAL (EG-MR-AN-07) for Inspection formats, Test formats, Work Instructions.

S.

No.

Documented Information

(Records) Retention Time

Person

Responsible Storage location

1

Inspection Reports

(IQC, Rail Electronics, SPI,

PMM)

3-years Project In-charge Thumkunta /

Shameerpet

2 Inspection Reports (DCH) 10-years from the

close of Contract Project In-charge Thumkunta



Revision No. 01

Page No: 15 of 15

ANNEXURE-I

SAMPLING PLAN (Reference Standard: IS-2500 ; Part-I)

S.N

o

Lo

t s

ize

Sa

mp

le s

ize

Single Sampling Plan for Normal Inspection

Visual Inspection AQL Functional inspection AQL

2.50% 0.65%

Ac <= Re >= Ac <= Re >=

1 2 to 8 2 0 1 0 1

2 9 to 15 2 0 1 0 1

3 16 to 25 2 0 1 0 1

4 26 to 50 3 0 1 0 1

5 51 to 90 3 0 1 0 1

6 91 to 150 3 0 1 0 1

7 151 to 280 5 0 1 0 1

8 281 to 500 5 0 1 0 1

9 501 to 1200 5 0 1 0 1

10 1201 to 3200 8 1 2 1 2

11 3201 to 10000 8 1 2 1 2

12 10001 to 35000 8 1 2 1 2

13 35001 to 150000 13 1 2 1 2

14 150001 to 500000 13 1 2 1 2

15 500001 over 13 1 2 1 2

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