Products & Services

www.micross.com

Semiconductors

•Hermetic/CeramicPackages•Hi-RelMemory•CustomDevicePackaging•CSP/QFNAssembly•PlasticPackaging•RadiationTolerantDevices•DeviceTesting/Programming•COBAssembly•ASICDesign

Electro-Mechanical

•Hi-RelLeadAttach•RoboticHot-SolderDipping•SolderExchange(Pb&PbFree)•BGAReballing•PackageTrim&Form•XRF&OtherTesting•3DScanningTape&Reel

Bare Die & Passives

•SiliconICs•SiliconDiscretes•ChipCapacitors•ChipResistors•SiCDiscretes•KnownGoodDie(KGD)

Packaged Parts

Wafer Processing

Long-Term Storage

Obsolescence Management

Anti-Counterfeit Program

Micross Components is your single source of high-reliabilty electronics.

1.855.4COMPONENTS1 . 8 5 5 . 4 2 6 . 6 7 6 6

Products & Services

April 13, 2015 • Revision 3.4

7725 N. Orange Blossom Trail • Orlando, FL 32810 • 407.298.7100 • sales.americas@micross.com • www.micross.com

Hermetic/Ceramic Packaging

SRAM 256Kb to 16Mb Mono, 16Mb MCM, 5V & 3.3V, 10ns to 100ns, x8/x16/x32

Legacy DRAM 256Kb to 64Mb, 5V, x1 and x4 LCC, Flatpack and DIP

EEPROM 1Mb Mono, 4Mb MCM, 5V, in Flatpack, LCC, CSOJ, PGA, and CQFP

Flash 1Mb & 4Mb Mono, 16Mb to 64Mb MCM, 5V & 3V, 60ns to 150ns, multiple packages including DIP, Flatpack, LCC and CQFP

UVEPROM 256Kb to 1Mb Mono, 55ns to 200ns, in LCC, DIP

VRAM 1Mb/4Mb, 100ns to 200ns, in LCC, DIP and CSOJ

Radiation Tolerant Devices

Custom Packaging

Silicon

Linear / AnalogMixed-SignalDigitalSRAM

EEPROMNAND & NOR FlashnvSRAM

Micro-controllersSDRAM/DDRDiscretes

Custom & Standard

Ceramic

DIP (300, 400, 600 mil), ZIP, SOJ, QFP, PGA, LCC, FLATPACK

Plastic

TSOP, TQFP, QFN BGA, SOJ, LCC

Metal Can

TO-18 - TO-3(2 to 18 Pin), TO-257, TO-258, TO-254

Plastic Packaging

SDRAM SDR – 64Mb, 128Mb, 256Mb, 512Mb, PC100 or PC133

iPEMSDR– 1.2Gb, 25mm x 32mm

iPEMDDR – 1.2Gb, 2.4Gb, 25mm x 32mm & 16mm x 23mm

iPEMDDR2 – 2.1Gb, 2.4Gb, 4.2Gb, 4.8Gb, 25mm x 32mm & 16mm x 23mm

SRAM 256Kb to 16Mb, 10ns - 85ns, 5V and 3.3V

SRAM 256Kb to 16Mb, 10ns - 85ns, 5V and 3.3V

Sync SRAM 4.0Mb to 36Mb, 100-250MHZ, 3.3V, Pipeline, Flow-Through & ZBL

Flash & EEPROM

1Mb to 16Mb, 70ns to 120ns, 3V and 5V

DRAM

Standard and Low Power options available on most

Packaging: PBGA, PSOJ, SOJ, TSOP, TSOPII, TQFP

• Hermetic/ceramic packages

• Hi-rel memory

• Custom device packaging

• CSP/QFN assembly

• Plastic packaging

• Radiation tolerant devices

• COB assembly

• ASIC design

• Extensive test and burn-in capabilities

• Environmental/stress screening

• Device up-screening

• Engineering/analytical services

• IC counterfeit detection

Certifications

• DSCC QML

� MIL-PRF-38534, Class H (full)

� MIL-PRF-38535, Class Q (full)

� MIL-PRF-38535, Class V (assembly)

� MIL-STD-883, Commercial Laboratory Suitability

• Certified Class 100 Clean Room

• SMD, M Level and Q Level

• AS9100 Rev. C Registered

Flows

• Customer specific, Source Control Drawing (SCD)

• COTS/PEMS Plastic Flow

• JEDEC Standards for Plastics

Quality

Services

Micross Components is transforming specialty electronics

by offering the most comprehensive range of

high-reliability and custom solutions available from any one source.

Products & Services

April 13, 2015 • Revision 3.4

7725 N. Orange Blossom Trail • Orlando, FL 32810 • 407.298.7100 • sales.americas@micross.com • www.micross.com

Robotic Hot Solder Dipping & Solder ExchangeMicrossSXT™ (Solder Exchange Technology) is a robotic, automated solder-dipping process developed by Micross Components to increase component reliability and mitigate tin-whisker formation. With MicrossSXT™, unwanted finish can be replaced on a wide range of electronic components regardless of packaging style.

The GEIA-STD-0006 compliant process includes:

• Robotic-controlled six-axis dipping

• Solder dipping under a nitrogen blanket

• Solder-level sensing for accurate solder dipping

• Integral component wash and dry facility

• Preheating of components to negate thermal shock

• Lead tinning/solder dip

• Terminal finish conversion

• Solder exchange from Pb free (RoHS) ↔ SnPb

Anti-Counterfeit Program & BOM ManagementMicross Components is uniquely positioned to take a trusted role in your semiconductor supply chain to provide a counterfeit-free purchasing experience. Throughout our 35+ year history of providing authentic

high-reliability products, we’ve developed the software and the skills needed to handle everything from diodes to microprocessors.

If counterfeit protection is what you’re looking for... Get Real. Get Micross.

Hi-Rel Lead Attach

• Thermocompression weld lead

and high-temp solder lead

attachment processes

• J, Gullwing, and Spider Gullwing

lead forms

Trim & Form Components

• Trim, form, and solder dip to SOIC,

SOJ packages (other packages

not limited to DIP, PSOP, TSOP,

FP’s and QFP’s)

• Realign and Reform

Component Leads

3D Scanning Tape & Reel

BGA Modifications

• BGA re-balling for conversion

to tin-lead (SnPb)

• Ball attach

• BGA re-work

Test

• X-ray fluorescence

analysis (XRF)

• Ionic cleanliness test

• Solderability testing

• Particle Impact Noise Detection

test (PIND)

• Fine and gross leak testing

• Lead integrity/bond strength

Products & Services

April 13, 2015 • Revision 3.4

7725 N. Orange Blossom Trail • Orlando, FL 32810 • 407.298.7100 • sales.americas@micross.com • www.micross.com

Passives

Die Banking & Obsolescence Management

• Die and finished product banking (multiple global storage sites)

• Qualifications and approvals

• Production planning

• DMS/EOL and whole-life product support

• Form, fit and function alternative or MCM hybrid

• Risk mitigation

Complete Wafer Processing

• Wafer saw, sort and inspect

• Electrical test/environmental screening

• Wafer thinning

• Wafer bumping and RDL

Support

• Diverse supplier base

• Cross-functional relationships with suppliers, providing enhanced design and product support to end customers

• Review of SCDs with correlation to generic parts

• Class 100, 1K, and 100K clean rooms

• Full lot and wafer traceability

• Tracking for previously evaluated lots

• Visual inspection to appropriate MIL standard

• Maintain large inventory

• Mechanical and electrical verification of capacitors

Line Cards

Bare Die

Micross Components is not limited to the manufacturers above. Please contacts us for all your die, wafer and passive component needs.

1.855.4COMPONENTS1 . 8 5 5 . 4 2 6 . 6 7 6 6