PHASTFlex Project Presentation

Photonic Hybrid ASsembly Through FLEXible waveguides

Project:

Project No: 619267

Call Identifier: FP7-ICT-2013-11

Start Date: 1/1/14

Duration: 36 months

Website: www.phastflex.eu

Contacts:

Xaveer Leijtens:

X.J.M.Leijtens@tue.nl

Tel: +31 40 247 5112

David Robbins:

dave.robbins@willowphotonics.co.uk

Tel: +44 1327 857795

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PHASTFlex in a

nutshell

PHASTFLEX proposes the development of a fully automated, high precision,

cost-effective assembly technology for next generation hybrid photonic

packages.

Challenge :

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Challenge :

Current assembly and packaging approaches to Photonic Integrated Circuits (PICs)

lead to custom-engineered solutions; packaging is at least an order of magnitude

more expensive than the photonic chips themselves, and this is a major bottle-

neck to market penetration.

The most demanding assembly task for multi-port PICs is the high-precision (±0.1μm)

alignment and fixing of the optical waveguides.

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PHASTFlex in a

nutshellSolution:

PHASTFlex proposes an innovative solution, in which InP PICs with active functions will be combined with passive TriPleXTM PICs bonded onto a suitable carrier; for example LTCC (ceramic).

In the PHASTFlex concept the waveguides in the TriPleX PIC are released during fabrication to make them movable. Actuators and fixing functions, integrated in the same PIC, place and fix the flexible waveguides in the optimal position (peak out-coupled power)

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out-coupled power)

The project aims to develop a complete assembly process and tooling to implement this concept, including pre-assembly using eutectic bonding and automated handling, with on-chip micro-fabricated fine-alignment and fixing functions.

Impact:

Proof of the concept by assembly of prototypes for challenging end-user applications

Cost reduction through high volume compatible, automated assembly methods

Goal:

Penetration of low cost photonic circuits into multiple, new application areas.

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Flexible Waveguide

Technology

• On-chip alignment of flexible optical waveguide structures:

• Alignment case:– Chip-to-Chip: InP-TriPleX

InP chip

Interposer chipTriPleX

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– Chip-to-Chip: InP-TriPleX

– Multi-port

– 100nm precision

• Main ideas:– Combine passive and active alignment

– Use micro-fabrication for flexible waveguides, alignment and fixing

Fibre Array Unit

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Assembly Concept

Passive alignment

Assembly of subcomponents

onto a silicon bench or ceramic

carrier followed by fine alignment

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FixationFinal Fixing

Active alignment

Carrier

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Concept - detail

Step 1: Passive coarse alignment and flip chip bonding of PICs

onto a LTCC carrier

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Concept - detail

Step 2: Active fine alignment using flexible waveguides,

actuators and integrated locking features

Target alignment accuracy ~0.1µm

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PHASTFlex in

numbers

• Nine project partners

– 7 industrial, of which 2 provide applications

– 2 universities

– Germany, Netherlands , UK , Spain

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– Germany, Netherlands , UK , Spain

• All recognised leading industrial and research entities

in the photonics components and systems industry

• Project duration: 36 months

• Total Cost: 3.884M€

• Total Effort: 303 person months

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Consortium Partners

and roles

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• TU Eindhoven, Netherlands

• TU Delft, Netherlands

• Oclaro Technology Ltd, UK

• LioniX BV, Netherlands

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• Willow Photonics Ltd, UK

• Ficontec Service GmbH, Germany

• TELNET REDES INTELIGENTES SA, Spain

• IMST GmbH, Germany

• Aifotec AG, Germany

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1: TU Eindhoven

Characterize

COBRACOBRACOBRACOBRA

About TU/e:• Photonic integration group part of the COBRA

Research Institute.

• Leading group on design, fabrication and research of InP photonic integrated circuits:

• Development of design libraries

• 800 m2 cleanroom facilities for InP PIC fabrication

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Design

Fabricate

Test structures for:

o Active alignment

o Flip-chip bonding

o RF Carrier

InP Application PIC

Project Tasks:

• Active alignment mapping of TriPleX flexible waveguides

• RF and DC characterization of InP PICs

• Full hybrid assembly characterization

Characterize

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2. TU Delft

About TU Delft:• Department Precision and Microsystems

Engineering (PME), Mechanical Engineering

• PME addresses fundamental questions and application challenges related to technologies, materials and methodologies

– For High-Tech Systems and Scientific Instrumentation

– Introducing the achievements of nano-science into Mechanical Engineering

Project Role:• Development of on-chip MEMS functions for fine

alignment of flexible waveguides

– Design and modelling, e.g. thermal-mechanical

– Realisation in TUD’s clean room facilities

– Mechanical characterisation

• Alignment experiments and performance characterisation

• Transfer of technology and design rules to exploiting

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Past and ongoing work

on Microfabrication and MEMS for photonic alignment

science into Mechanical Engineering • Transfer of technology and design rules to exploiting partners

MEMS for

single fibre

alignment

Passive

chip2chip

alignment

MEMS for

fibre

array

alignment

Chip2chip active

alignment using

flexible waveguides

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3. Oclaro Technology

Project Role:

Develop specification

definition for the assembly –

work package leader setting

assembly process flow

InP Photonic Integrated Circuit

About Oclaro:

Oclaro is one of the world's largest suppliers of optical

components, modules and subsystems for the global

optical communications market. A vertically-integrated

company with a strong technology focus, Oclaro employs

InP PIC technology as a cornerstone of its product strategy.

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InP Photonic Integrated Circuit

(PIC) fabrication on generic

foundry process

PIC technology development

for assembly compatibility

Challenging end user

application in 100G

transmitters and receivers

Monolithic transmitter

chip for tunable XFP

transceiver module

• 1000 chips/wafer

• Batch processed

• 3” InP wafers

• On-wafer tested

• Scalable manufacture

Multi-wavelength

transmitter and optical

switch matrix chips

fabricated for project

partners on InP generic

PIC platform

c/o TU Eindhoven,

University of Cambridge

InP PIC examples …

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4. LioniX

About LioniX: LioniX is a leading provider in co-

development

of products and manufacturing of

components based on cutting-edge

micro/nano-technology for its (OEM)

customers

Application fields

Project Tasks:Photonic functions – Design and Implimmentation in TripleX

Flexible waveguides – Technology devbelopment, T-bar joint

Actuator - Technology development and optimization

Fixing Tools – Implimnetaiton into design and technology

Assembly -0 Adapt Triplex felxiblke waveguides to ASSEMBLY

solution.s

Specific design and implementationTriPleX waveguide

cross-section

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Technology & tools� Low-loss TriPleX waveguide

technology (VIS – NIR)

� Fiber-matched and high-contrast

waveguide integration on single

chip

� Optical characterization tools

Expertise� TriPleX chip fabrication

� Optical waveguide and

functional design

� Fiber-to-chip assembly

� Waveguide characteri-zation

and preliminary circuit testing

Application fields

� (tele)-communication

� bio-medical imaging

� sensing applications

cross-section

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5. Willow Photonics

About Willow Photonics:

• One man consultancy

• Heavily involved in advancing InP-based generic platforms since 2007

• Currently working with partner TU/e to coordinate the PARADIGM FP7 project

Project Role:

• Collaborate in drawing together

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• Broad expertise in III-V semiconductor technology particularly InP based transmitters and receivers. Packaging etc

• Collaborate in drawing together

the overall designs and

specifications for the hybrid micro-

assembly

• Dissemination lead

• Support for technical co-ordination

and formal reporting

• Project administration –

coordinator support - member of

the project coordination and

management team.

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6. Ficontec

About ficonTEC:

• ficonTEC designs and produces semi-

and fully automated production and

testing equipment

• ficonTEC is the market leader in the field

of micro-optics such as laser diode

manufacture, optoelectronics, medical

technology, and telecommunications

Laser soldering

Epoxy bonding/UV Curing

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Project Role:

• ficonTEC is responsible for developing,

designing, manufacturing and testing of

the packaging equipment.

• Definition of the requirements for this

kind of new flexible and fast assembly

system

• Focus is on the flexibility of this

production equipment which must

match the flexible approach of the PIC

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technology, and telecommunications

Component placement

AL 500-AA

SEA RC H

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7. TELNET

Project Role:

End user - application in active antennas:

• TELNET is an end-user, setting up the specifications of the InP and TriPleX chips in order to achieve the multi-channel phase-shifter needed for smart beam antennas

• TELNET has also an important role in the

About TELNET:Manufacturer of

Fiber optic cables

BTS antennas

Transport and Broadband Access

equipment

TELNET works onFractal antennas for mobile

phone base stations:

Multiband / Multiservice: 790-960 MHz,

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• TELNET has also an important role in the final characterization and evaluation of the optical coupling between the chips developed for phased array antennas.

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Multiband / Multiservice: 790-960 MHz,

1710-2700MHz

Small dimensions

Low visual impact and camouflaging

Facilitate site sharing

Compact Trisector and Panel Antennas

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8. IMST GmbH

About IMST: Design, engineering and characterization of

• Wireless communications systems

• Radar Systems

• RF & Digital Hardware

• Microelectronics

• Antennas & Active Antenna Systems

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• Antennas & Active Antenna Systems

Application fields

• Short range communication (WiMOD, ZigBee, Bluetooth)

• Mobile communication (GSM, GPRS, UMTS, LTE)

• Satellite communication (GPS, Galileo, Iridium, Inmarsat)

• Radar technology

RF Carrier development (responsible)

• High frequency design �

• Thermal analysis �

• LTCC prototyping

• RF characterisation

Project Role:

Assembly, packaging and integration (support)

• Design of solder pads

• Alignment mark optimisation

• Height difference compensation of the chips

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9. Aifotec

Project Role:

• Perform the hybrid assembly of components

supplied by the consortium

• Work closely with Ficontec on the definition

and operation of the assembly equipment

• Develop the flip-chip assembly process

About Aifotec:

Deep knowledge in:

• Volume assembly

• Process development

• Design for manufacturablilty.

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• Develop the flip-chip assembly process

together with the other packaging partners

• Lead packaging assembly tasks

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Technology & tools:

• Wirebonding

• High precision gluing

• Spot size Laser soldering

• Large area oven based soldering

Oclaro/TUE

IMST

Carrier

TUD/LX

Aifotec / Ficontec