PCB Technology Future Trend

Joe Beers (GCE)

Dr. Karl Minten (GCE)

Supporter• Pravin Patel (IBM)

• Scott Kipp (Brocade)

• Mike Dudek (Qlogic)

• Barry Barnett(IBM)

• Mike Li (Altera)

• Myles Kimmit (Emulex)

• Mark Bugg (Molex)

• Peerouz Amleshi (Molex)

• Sunil Nigam (IBM)

Agenda

• High Speed Channel Construction components

• Processor Road Map

• Supplier Status

• Material Availability Trend and Cost factor

• Dissipation Factor of different material

• Materials on Horizon

• Summary

3

High Layer CountHigh Layer Count

Core TechnologyCore Technology

Routing Routing

DensityDensity

Environmental Environmental

RegulationRegulation

Signal Signal

IntegrityIntegrity

Interconnection Interconnection

ReliabilityReliability

Core Technology Trend for High Speed Channel Construction

1.Lead Free materials

2.ROHS (Restricted of Hazardous Substances)

3.ISO …

1.CAF (Conductive Anodic Filament)

2.IST (interconnect Stress Testing)

3.ATC (Accelerated thermal cycle)

4.Thermal stress

5.CTE (Coefficient of thermal expansion)

1.Back drill

2.Embedded Capacitor

3.Low Dk/Df materials

4.Insertion Loss control

1.Registration

2.Via In Pad

3.Reduction for Layer counts

and Line/Space

4.HDI Micro/Skip/Buried via

5

•Moving and processing more data, more quickly will continue.

•“Getting by” with “mid loss” will go away in next 1-2 years.

•Low loss materials will become “mainstream”, even “commodity” but not

yet at this stage

Core Technology Trend

Supplier Status – Taiwan Perspective

•Low + Ultra Low, less

than 13% of total market.

•If there a big explosion in

demand, cost will come

down dramatically.

•Premium material

suppliers will have a “Grip”

on progress

Material Estimated % of market

based on market data

FR-4 44%

FR-4 High Tg 14.7%

Special 13.3%

Halogen Free 13%

Paper 9.3%

Composite 5.7%

Material Availability TrendCommon representation of performance vs cost in the market, but the pyramid is getting

“flatter”

Cost now 2013 (est) 2015 (est)

Tier 1 Std Std

100%Tier 2 100%150%

Tier 3 150%

Tier 4 350% 200% 150%

Tier 5 450%

450% 300%

Tier 6 600%

Note: “Improved FR-4” defined

by 802.3ap is a Tier 2 material”Standard

FR4Tier 1

Tier 2

Tier 3

Tier 4

High Tg

FR4 Df > 0.02

Df : 0.007 ~0.01

Df : 0.005 ~0.007

Nelco

N4000-13

N4000–13(EP)

Hitachi

HE679G

MGC

EL190T

Getek

Panasonic

Megtron

Isola

FR408

FR408HR

Isola IS620

Nelco

N4000-13SI

Panasonic

Megtron4

MGC

EL230T

EL230T(F)

MGC

EL190

T

MGC

FL700

Getek II

Hitachi

FX-2

Panasonic

Megtron6

Hitachi

LX67

Df : 0.003 ~0.005Tier 5Rogers

RO435D

Isola

IS630

Dielectric Property:

(Df @ 10GHz)

Df : 0.01 ~0.02

Status of Current Material Supply - Dissipation Factor at 1, 5, 10 GHz Stacked Chart

8

0.0000

0.0020

0.0040

0.0060

0.0080

0.0100

0.0120

0.0140

0.0160

0.0180

0.0200

0.0220

0.0240

0.0260

0.0280

0.0300

Df, 1

, 5 a

nd 1

0 G

HZ

IT-1

58

NPG

N-1

50

NPG

N-1

70

TU

-862H

F

"EM

-285C

R1566V

IT-2

00LK

IS-4

15

FR

-408H

R

"Meg4C

"Meg6C

FR

-408

TU

-872LK

370H

R

HE-6

79G

FX-2

IT-1

68G

EM

-828

IT-1

80I

NPLD

II

"IT150D

AC

material GCE Testing shows progress in “Low Loss Space” but finding that “Ultra Low

Loss, low cost option (<0.007 Df at 10 GHz) is still evolving

Improved FR4

0.0092@1Ghz

Key New Low Loss Materials on Horizon

9

• Lower cost, Lower loss alternatives for material selection continue

to evolve.

• I-Speed and I-Tera are new products form From Isola of interest

• IT-150D,IT-150DA, and IT-150DA SE/L from ITEQ

• MultiClad HF from Arion

• All aimed at Lower cost and to be Low Loss

• Regarding Halogen Free I168G and Multi-Clad (Arlon) are of

interest

• Market need is beginning to offer solutions and this trend will

continue as speed increases.

New Low Loss Materials: Isola

http://www.isola-group.com/products

11

New Low Loss Materials: ITEQ

IT-150D IT-150DAIT-150DA

SE/LR-4X5X MX-6

Products informationMTg

very low lossHTg

very low lossHTg

very low loss

HTgVery low

loss

HTgvery low loss

Tg (�) DSC (2.4.25) 165 180 180 280 185

T-288 (w/ 1 Oz Cu, min) TMA (2.4.24.1) 30+ 30+ 30+ -- 30+

Td-5%(� ) TGA 5% loss (2.3.40) 365 370 370 390 410

CTE (ppm/�) a1/a2 (2.4.24) 45/260 45/250 45/250 35/-- 45/--

CTE (%), 50-260� TMA (2.4.24) 3.4 2.6 2.6 -- --

Peeling (lb/in) 1 oz (2.4.8) 6 6 6 5.0 4.6

Water absorption D-24/23 (2.6.2.1) 0.1 0.1 0.1 0.04 0.18

Dk (HP4291B) 1 GHz (2.5.5.9) 3.6 3.6 3.3 -- --

Df (HP4291B) 1 GHz (2.5.5.9) 0.004 0.004 0.004 -- --

Dk ( by frequency) 2-10GHz average 3.6 3.6 3.3 3.66 3.6

Df ( by frequency ) 2-10GHz average 0.005 0.005 0.004 0.0034 0.0032

IT150D series Dk/Df of 2-10GHz and average base on IPC TM650 2.5.5.13 resonance cavity method.

R-4X5X : Dk is based on full sheet resonance; Df is by IPC TM650 2.5.5.5 of 2.5-10GHz average.

MX6 : Dk/Df data by IPC TM650 2.5.5.5 of 2-10GHz average.

“—” : not available on data sheet.

Data of IT-150DA SE type will be formal published unit official datasheet approval.

http://www.iteq.com.tw/p4.asp

New Low Loss Materials : Arlon Material

http://www.arlon-med.com/MultiClad_HP_PressRelease.pdf

Summary

• 1M channel loss can be achieved by:

– Low loss materials (FX2, I-Speed, I-Tera, IT-150D,IT-150DA,IT-150DA SE/L, MultiClad HF and Megtron-6 )

– Tweaking of materials and process

– Smooth copper

– Square weave glass

• 1M channel presented in Beukema_01_1111 and Kipp_01_1111.pdf

• More lower loss/lower cost material on Horizon

• Magtron 6 is not the only option for future low loss material

• “What if Intel requires low loss on next platform?”

• Demand will outpace supply.

• Current maturity 2011 is “not there” However, newer materials will achieve

by 2013

• Short term “pain” will drive market solution

13

References

• Application of the Short-Pulse Propagation Technique for Broadband Characterization of PCB and Other Interconnect

technologies

Deutsch, A.; Krabbenhoft, R.S.; Melde, K.L.; Surovic, C.W.; Katopis, G.A.; Kopcsay, G.V.; Zhen Zhou; Zhaoqing

Chen; Kwark, Y.H.; Winkel, T.-M.; Xiaoxiong Gu; Standaert, T.E.;

http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5404238&tag=1

• Arlon Technology Enabling Innovation: http://www.arlon-med.com/MultiClad_HF_PressRelease.pdf

• Iteq: http://www.iteq.com.tw/p4.asp

• Isola: http://www.isola-group.com/products/