pcb production introduction /how to make pcb (1)

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PCB Production Introduction PCB means printed circuits board or printed wiring boards. @ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||cus

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Page 1: PCB Production Introduction /How to Make PCB (1)

PCB Production Introduction

PCB means printed circuits board or

printed wiring boards.@ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com

Page 2: PCB Production Introduction /How to Make PCB (1)

PCB is used to carry the electronic components and provide connection the parts.

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By Hardness

PCB TypesPCB Types

By Hole DepthFabrication and

Customer RequirementsBy Contracture

@ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com

Page 3: PCB Production Introduction /How to Make PCB (1)

PCB Base Structure

Prepreg

Copper Foil

Copper foil thickness: 1/4 oz,1/3oz,1/2oz,1oz,2oz,3oz etc.

@ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com

Page 4: PCB Production Introduction /How to Make PCB (1)

Finished PCB

As picture below:

Solder mask

Annual ring

Screen Marks

PAD

Production Number

3C601

3C6013C601

12658Golden Finger

@ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com

Page 5: PCB Production Introduction /How to Make PCB (1)

Difference between double side PCB and multi layer PCB

From the production process :

1. Double-sided PCB lamination with only prepreg and copper foil. Multilayer PCB with inner core except prepreg and copper foil.

 2. Multilayer PCB is with inner layer production, and double layer PCB

PCB manufacture| Printed circuit board production| How to make PCB| China PCB house

Page 6: PCB Production Introduction /How to Make PCB (1)

PCB Base Material Introduction

There are mainly 3 types divided from TG:

1.TG 130 , the resin consisted by two functional groups ℃

 Character: low TG, poor heat resistance.

2. TG 140 , the resin is consisted by four functional groups.℃

Character: good heat resistance, good stability, is most commonly used PCB material.

@ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com

Page 7: PCB Production Introduction /How to Make PCB (1)

3. High TG (TG >150 ), the resin is composed of a plurality of functional groups.℃

Character: TG higher means better heat resistance, but also higher price. The

production process is relatively more complex.

By different related parts:

1. Halogen material

Characters: Most of PCB material used currently is halogen material. It is harmful as it

produces dioxides, dioxin TCDD, dioxin ring cyclohexane when burned, ben

furan and others who with heavy smoke, highly toxic, carcinogenic, once

printed circuit board manufacture|pcb production process|pcb manufacturing|china pcb

Page 8: PCB Production Introduction /How to Make PCB (1)

intake couldn’t exhaust , will harm to health.

2.Halogen-free material.

Characters: Little proportion of halogen content. According to JPCA-ES-01-2003

standard CL, Br, I content less than 0.09% by weight could call

halogen free material. Due to its harm to human ,relevant laws and

regulations prohibit to use halogen materials for PCB plate (WEEE, ROHS).

@ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com

Page 9: PCB Production Introduction /How to Make PCB (1)

PCB Base Material Introduction

Divided by solder process    

1. Leaded PCB manufacturing process is with toxic, harmful, reflected in mental

decline, nausea, headache, insomnia, loss of appetite and so on. Typically is

anemia, central nervous system disorder.

2.Leadfree is defined as the lead content <0.1% according to EU. But Japan is

0.2% as lead-free. It includes the coating of soldering, semiconductor, plated

@ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com

Page 10: PCB Production Introduction /How to Make PCB (1)

PCB Base Material Introduction through hole and PCB pads, stabilizers and related (halogenated resins, wire, paint,

dye, glass bonding materials etc.)

1)Less toxic to the human body;

      2)The melting point of solder material rises (about 217 );℃

       3)High requirement on heat resistance of PCB material

        4) PCB sheet material requires low DK value, low CET ( before Z-axis expansion coefficient tg point 50PPM / , after tg 250PPM / ). Normal PCB material ℃ ℃sheet is before TG point 80PPM / , after TG point 300PPM / ℃ ℃

@ Agile Circuit Co., Ltd All Right Reserved ||[email protected] ||custompcbboards.com