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small MATTERS By Jeff Milde

www.smallformfactors.com

The PC/104 Consortium has announced the latest revision of the PCI/104-Express & PCIe/104 Specification, Revision 3.0, that provides an additional option called “OneBank.”

The PCIe/104 OneBank utilizes a smaller, lower-cost bus con-nector which is compatible to the full-size PCIe/104 connector currently in use today. It allows designers to stack boards using a complimentary format that frees up PCB real estate for addi-tional components as well as potential cost savings.

The history of the stackable PC/104 architecture is tightly coupled to the concept of building on the foundation of the PC market, as defined by the major processor and peripheral chip manufacturers. This began with the ISA bus (PC/104), then the ISA and PCI buses together (PC/104-Plus), then the PCI bus only (PCI/104), and then the PCI and PCI Express buses together (PCI/104-Express). For additional room on a module, the PCIe/104 format removes the PCI bus. This roadmap allows maximum use and leveraging of the resources and economies of scale of the PC community in both hardware and software development. It also allows maximum backward compatibility with minimal stacking overhead, if any, and allows future bus advancements as technologies develop and mature.

The origin of the OneBank option to the stackable PCIe/104 bus comes from the desire to minimize the resources needed for a given application. The standard PCIe/104 bus allows for max-imum bus feature flexibility. It consists of a three-bank connector with 152 pins and is available as either Type 1 or Type 2. Both Type 1 and Type 2 have a common feature set and pin assign-ments, which include four x1 PCI Express links, two USB 2.0, ATX power and control signals: +5V standby, power supply on, power good, power: +3.3V, +5V, +12V, and SMBus. Type 1 has the common feature set plus one x16 PCI Express Link that can be configured as two x8 Links or two x4 PCI Express Links, dependent on the host. Type 2 has the common feature set plus two x4 PCI Express Links, two USB 3.0, two SATA, LPC bus, and RTC battery. With speed capability up to PCIe Gen 3, devel-opers are given plenty of bandwidth for the future.

The OneBank connector concept consists of removing two of the three “banks” of the standard PCIe/104 connector, resulting in a 52-pin connector as opposed to the full-size 156-pin con-nector. The OneBank connector is positioned so that it will plug into Bank 1 of the standard PCIe/104 connector. Thus, the

signals of the OneBank include the same four x1 PCI Express links, two USB 2.0, ATX power and control signals: +5V standby, power supply on, power good, power: +3.3V, +5V (reduced current) as found on the first bank of the standard PCIe/104 bus, making them plug-in compatible. This setup preserves the stackability and compatibility of PCI/104-Express and PCIe/104 modules along with the new OneBank modules. By removing two of the banks, 0.513 square inches of printed circuit board real estate on each side is freed up. With speed scales up to PCIe Gen 3 on the PCIe/104 bus, developers are given plenty of bandwidth for the future even with just four x1 PCIe links.

As with all of the stackable buses adopted by the PC/104 Consortium, the PCIe/104 OneBank connector can be immedi-ately incorporated across the Consortium’s 104, EPIC, and EBX form factors. It can also be utilized on other form factors not housed by the Consortium to provide convenient, cost effective mezzanine I/O expansion.

For more information about the PCI/104 Express & PCIe/104 specification, the newest OneBank option, and how it is incor-porated onto the 104, EPIC, and EBX form factors (and to down-load a free copy of the specification), go to www.pc/104.org.

The stable, long-term supply of PC/104 is valued by thou-sands of OEMs in application areas such as industrial control and instrumentation, military and aerospace, and medical. The compatibility of OneBank with existing PCIe/104 products helps to preserve customers’ investments in product designs while opening additional opportunities for cost savings, high levels of integration, and system expandability.

Jeff Milde is the Executive Director of the PC/104 Consortium.

www.pc104.org • [email protected]

PC/104 Consortium introduces OneBank option for the PCI/104-Express & PCIe/104 specification

“The OneBank connector concept

consists of removing two of the three

‘banks’ of the standard PCI/e connector,

resulting in a 52-pin connector as opposed

to the full-size 156-pin connector.”

www.smallformfactors.com PC/104 and Small Form Factors Resource Guide | Spring 2015 y 3

http://www.pc104.org





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19 Computex – Taipei – Trade Show

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2015 OpenSystems Media® © 2015 PC/104 and Small Form FactorsAll registered brands and trademarks used in PC/104 andSmall Form Factors are property of their respective owners.ISSN: Print 1096-9764, ISSN Online 1550-0373

Columns

Small Matters 3PC/104 Consortium introduces OneBank option for the PCI/104-Express & PCIe/104 specificationBy Jeff Milde, Executive Director of the PC/104 Consortium

SFF-SIG 5SoCs power legacy I/OBy Alexander Lochinger, SFF-SIG President

PC/104 Consortium 6Rugged packaging and the PC/104 architectureBy Dr. Paul Haris, PC/104 Consortium Chairman and President

Volume 19 • Number 1

FeAtures

SBCs: PC/104 for Unmanned Systems

Small form factor and ultra-small form factor mission

computer/network solutions meet expanding UAV

requirementsBy Mike Southworth,

Curtiss-Wright Defense Solutions

COMs and SOMs: Rugged Packaging

Rugged development requires integration of design

and test from start to finishBy Jeff Munch,

ADLINK Technology, Inc.

PROCESSOR ARCHITECTURE: SoCs

Flexible military radios balance SWaP, cost specs

By Paul Dillien, Lime Microsystems

8

12

16

16

12

@sff_mag

resourCe Guide PROFILE INDEX 20

COMs and SOMs 20

Hardware and Peripherals 22

SBCs and Boards 27

Systems 33

eventsEmbedded TechConJune 8-10 • San Francisco, CA www.embeddedtechcon.com


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One of the largest input/output (I/O) board ecosystems in the small form factor (SFF) marketplace uses a board-stacking architecture. Unlike I/O cards that are plugged independently into different slots of a motherboard, stack-able I/O boards are mounted one on top of another like a stack of pancakes, except that the middle boards cannot be removed without first unplugging all the boards below or above them. In terms of production quantities, the majority of such stackable I/O modules still use parallel PCI or ISA bus interfaces and are designed into rugged and demanding applications that don’t need to migrate quickly to new architectures. Besides, the I/O chips and components themselves are rarely affected by obsolescence.

Most of the processors and chip sets that used to directly drive those parallel PCI and ISA buses were on an obsolescence cycle of every five years. In this new era of powerful all-in-one systems-on-chip (SoCs), however, the good news is that processor chip life cycles have stretched out to seven years for Intel and 10 years for AMD. The “other” news is that the PCI and ISA buses are not available in those SoCs. Their primary markets – such as high-volume tablet and modular PC markets and in-vehicle “infotainment” – simply don’t need the legacy buses and I/O.

Long live legacyHope arrives in several forms. Still avail-able at the entry level is a low-cost, legacy- friendly SoC from DM&P Electronics called the Vortex86DX. The processor perfor-mance is modest, as the whole point is to meet the legacy application software and I/O where they are. SFF processor mod-ules are available from multiple suppliers with stacking PCI and ISA buses. Legacy I/O also includes universal asynchro-nous receiver/transmitter (UART) serial

ports, which are still essential in many embedded systems, and are included in the Vortex86 SoC.

Also legacy-friendly and still available is the AMD Geode LX800 processor. The built-in PCI interface only needs the external ISA bridge chip to produce both of the stacking legacy buses. Like the Vortex86 based boards, the Geode-based boards are available from many suppliers.

Boosting performanceSome embedded applications, however, need to move up substantially in pro-cessor or graphics performance or both, while keeping the legacy buses and I/O. While the new Intel Atom E38xx, Intel Celeron J1900/N2930, and AMD GX-2xx & GX-4xx SoCs fit the performance bill, the processor module designs need to add back in the serial ports and bus bridges that were eliminated from the SoCs. Plenty of PCI and LPC bus chips are available for the task. Some legacy features like I/O space, memory hole, and interrupt requests are limited, so be sure to dig into these details before porting over legacy code.

If there are no legacy code “gotchas,” the huge jump in performance to quad-core 1.2 GHz with great graphics, or to 2.0 GHz with good graphics, can pro-vide a needed facelift for old systems. Part of this stems from the ability to run modern GUIs and OSs that require sub-stantial compute and memory resources, from the various embedded Windows platforms to Linux and Android. Certain legacy applications may benefit from 64-bit register size for data handling or overall physical memory address space.

Upgrade the CPU, but don’t forget powerNow that several vendors are featuring the latest Atom processor family on their

boards with stacking PCI and ISA expan-sion and serial ports, the old stacks can be upgraded. Simply unplug the obso-lete processor module and replace it with one of these new ones. The good news doesn’t end there: The low-power, high-performance SoCs deserve the latest switching power-supply tech-nologies to finally replace some of the ancient designs that have been on the market for decades. (See example in Figure 1.) Efficient power-supply design for embedded is a topic for another column, though.

Here we are in 2015, still talking about the usefulness of stackable processor boards with ISA bus expansion. The bottom line is the staying power of the installed base of I/O cards, more than that of the CPU cards. The biggest sur-prise of all is the continued availability and even brand-new introductions of x86 SoCs on SFF boards that bring out PCI and ISA interfaces. While these boards provide the legacy signaling that the I/O cards need, don’t forget to update the power supply card while you’re at it.

Small Form Factor Special Interest Group

408-480-7900 • [email protected]

SoCs power legacy I/O

Small Form Factor SIG

By Alexander Lochinger, SFF-SIG President

www.sff-sig.org

Figure 1 | WinSystems’ PCM-PS394-500 complements the latest SoC-based processor modules.




http://www.sff-sig.org

The concept of “ruggedized systems” is all in the eye of the beholder: Ruggedizing can take many forms and mean many different things, depending on the application and the oper-ating environment.

In one application, rugged might mean splashproof, while in another application, rugged could mean waterproof to 100 meters. Some people may think that zero degrees Celsius is a hostile environment, where others may think that zero is normal and -40 is hostile. When it comes to shock and vibra-tion, one designer or user may feel that a piece of equipment on a truck is in a hostile environment, where others may feel like the truck-mounted equipment is riding on pillows. Their defini-tion of “hostile” may include how to withstand being mounted on a turret or how to handle rocket-engine heat and vibration.

No matter the application or the definition, finding a pack-aging solution for computers and control systems can be a daunting task, as other factors such as cost, availability, sole source versus open source, and packaging longevity also must be considered.

Additionally, how rugged a system will be depends not just on the mechanical package surrounding the electronics, but also on how the electronics are mounted to the enclosure, how the electronics are connected between each other, how the electronics themselves are designed and manufactured, and the choice of the components used to make up the electronics themselves. Because of all these factors, rugged system design requires a team effort of engineering, manufacturing, and economic expertise.

How does one find the best solution to meet all require-ments without getting bogged down in the details of the nitty-gritty electrical and mechanical design work and opti-mizing time to market? The process begins with selecting a computer board standard and architecture that has built into its very nature the aspects one is looking for in the deployed end product.

For more than twenty years, the PC/104 architecture has shined in this area and continues to provide one of the best architec-tures for short- and long-term applications. An inherent benefit of this architecture has always been its ability to communicate across modules without additional mechanical infrastructure, as one finds with rackmount systems. The secure stacking of

PC/104 modules through interboard bus connectors and stand-offs provides an architecture with built-in baseline rugged ness. To begin with, a PC/104 stack is a self-contained unit that can function with or without an outside enclosure while maintaining its ruggedness and ability to expand its functionality. Add the appropriate enclosure to it and you have a rugged system that has been built rugged inside and out.

A look across the many industries, OEMs, and manufacturers will reveal a multitude of packaging configurations tailored for the PC/104 architecture. Some of these configurations are custom, solving a specific task for a specific industry, while others have been configured to maintain the inherent modu-larity of the PC/104 architecture to allow quick expandability or repairability. Each approach has its benefits and tradeoffs. The bottom line: Many enclosure systems can be tailored to the end user’s particular requirements while being optimized to reduce weight and costs.

Today, you will find PC/104 at work in every facet of industry, from benign locations to the most hostile environments. As technology continues to be further integrated and embedded into our everyday personal and business products, the need for rugged packaging systems grows exponentially. The PC/104 architecture is and always has been ready to meet those requirements.

For more information visit the PC/104 Consortium website at www.pc104.org.

“...a PC/104 stack is a self-contained

unit that can function with or

without an outside enclosure while

maintaining its ruggedness and ability

to expand its functionality. Add

the appropriate enclosure to it and you

have a rugged system that has been

built rugged inside and out.”


Rugged packaging and the PC/104 architecture

PC/104 Consortium

By Dr. Paul Haris, PC/104 Consortium Chairman and President

www.pc104.org




http://www.mil-1553.com

http://www.1553couplers.com

As missions expand and the classes of different types of unmanned aerial vehicles (UAVs)

become better defined, the commercial off-the-shelf (COTS) community can meet the new

requirements with open architecture solutions that reduce design risk, lower costs, and speed

time to deployment. UAV system designers can select solutions based on their application

requirements, the line-replaceable unit- (LRU) or line-replaceable module (LRM)-based

subsystem solution that best meets mission needs, payload capabilities, and the platform’s

size, weight, and power (SWaP) limitations.

Small form factor and ultra-small form factor mission computer/ network solutions meet expanding UAV requirementsMike Southworth

When it comes to UAV processor and networking applications, one size defi-nitely does not fit all. The taxonomy of unmanned platforms continues to expand to meet a wider range of mission types and environments. These different classes of UAVs have varying opera-tional requirements and sensor payload capacities. Moreover, the amount of onboard electronics that each type of UAV needs to interface, and how much sensor data it must process, will vary greatly between the size and the class of the UAV platform.

Today’s military UAVs include high-altitude/long-endurance (HALE)-type unmanned aerial systems (UASs) such as Northrop Grumman’s RQ-4 Global Hawk and the newer MQ-4C Triton aircraft. These UAVs have a wingspan similar to that of a Boeing 747 and a service alti-tude of approximately 60,000 feet. In the medium-altitude class of long-endur-ance (MALE) UAVs are found tactical platforms such as the General Atomics MQ-1 Predator and MQ-9 Reaper. For lower-altitude or shorter-range opera-tions, smaller UAVs such as the Boeing

Scan Eagle or Textron RQ-7 Shadow – with wingspans of 10 to 14 feet and operating ceilings of 15,000 feet – are the workhorses.

Meeting the needs of UAVs with COTS solutionsThe good news is that SWaP-optimized COTS processing and network solu-tions designed to meet the needs of each of these three classes of UAV have evolved and matured in parallel. Until recently, these solutions have ranged from upgradeable 3U OpenVPX


SBCs PC/104 for Unmanned Systems

An RQ-4 Global Hawk unmanned aerial vehicle (UAV) sits on the runway before a nighttime mission. Small and ultra-small form factor technologies can be used in this and other UAVs with exacting size and weight limitations. (U.S. Air Force photo/John Schwab.)



backplane-based LRM systems at the high end to compact, self-contained LRU systems built with rugged PC/104 or COM Express-based small form factor (SFF) technologies in the midrange. A new class of extremely compact LRUs, ultra-small form factor (USFF) systems, has also recently emerged that delivers unprecedented size and weight reduc-tion without compromising network-management capabilities. These USFF systems are ideal for the smaller, low-altitude UAVs with the most pressing size and weight limiations..

For system designers – after taking into consideration their platform’s available space and weight limitations – choosing between the various classes of COTS mission computer and networking solu-tions for UAVs will typically involve trad-eoffs in terms of thermal-management requirements and processing perfor-mance. For example, 3U OpenVPX chassis systems can support a wide range of cooling options, including natural convection, air-cooled, and liquid cooling methodologies. In com-parison, the midrange SFF and USFF approaches, while significantly smaller and lighter, are limited to natural con-vection cooling. Due to its ability to cool higher temperatures, the 3U OpenVPX solution is also able to support hotter multiprocessor architectures, while SFF and USFF designs find their sweet spots best supported by mobile laptop-type class Intel Core i7 and low-power tablet-class ARM processors. Examples of these 3U OpenVPX systems are the Integrated Mission Management Computer (IMMC) systems deployed on Global Hawk and Triton. (See Table 1.)

Table 1 | A comparison of typical vs. ultra-small form factor systems.

Comparing traditional and ultra small form factor (USFF) systemsTraditional small form factor systems Ultra-small form factor systems

UAS class compatibility HALE, MALE UAS Smaller tactical UAS

Board architecture 3U VPX, PCIe104, COMe, XMC Purpose-built SFF cards

Maintenance approach LRM / LRU LRU

CPU architecture High-performance x86, FPGA, Power, GPGPU Low-power ARM, x86, FPGA

Cooling Passive / active Passive

Typical size 50-300 in² < 50 in²

Typical weight 1-10 pounds < 1.0 pound

Power dissipation 10-200 W < 10 W

Connectors MIL-DTL-38999 Micro-miniature circular

Operating temp -40 to +71 degrees C -40 to +85 degrees C

Ethernet switch ports 8 to 26 ports Up to eight ports



http://acces.io

MIL-DTL-39999-like connectors for Gigabit Ethernet connectivity. For applications requiring 10/100 Ethernet shielded connectivity or when enhanced signal integrity is required, a rectangular connector fitted with Quadrax contacts can now be supported in an USFF LRU. The specialized Quadrax connector delivers superior electromag-netic shielding of Ethernet signals, with 100-ohm differential impedance matching for all Ethernet signals. Integrated electromagnetic (EMI)/power filtering handles power input voltage, spikes, surges, transients, and EMI/EMC compatibility for air-craft installations.

An example of the new class of miniature MIL-circular connector enabled USFF network switches is the Curtiss-Wright Parvus DuraNET 20-11 8-port GbE Ethernet switch subsystem (a six-port 10/100 Ethernet switch variant with Quadrax contacts is also available). (See Figure 1.) These rugged, miniaturized, carrier-grade Layer 2/Layer 3 switch solutions have precision time stamping (IEEE-1588v2), advanced Quality of Service, SNMPv3 management, and zeroization capabilities. When fitted with Quadrax contacts, the switch can provide enhanced protection against EMI gen-erated by either the network switch or the other electronics onboard UAV platforms. This level of EMI isolation was recently required for several UAS platform installations where the mission of the UAS facilitates situational awareness for commanders to see, understand, and act decisively in time-critical situations. The network switch had to operate without being affected by or interfering with the platform’s noisy onboard communications equipment, to serve essentially as a flying cellphone tower.

Packaged in a fully sealed IP67 enclosure, these USFF LRUs have no moving parts, support extended temperature operation (-40 to +85 °C) and are resistant to high shock/vibration, humidity, altitude, and dust/water ingress. Designed for use in air-borne platforms and ground vehicles with reduced SWaP requirements, these units support power input voltage, spikes, surges, transients, and EMI/EMC compatibility per MIL-STD-704F, MIL-STD-1275D, MIL-STD-461F, and RTCA/DO-160 for use in civil and military aircraft and ground-vehicle installations.

Mike Southworth is a product manager, Curtiss-Wright Defense Solutions. He can be reached at [email protected].

Curtiss-Wright Defense Solutions cwcdefense.com

The small form factor LRU approachFor those UAV applications where avail-able space and weight preclude the use of the larger ATR-style chassis used by 3U OpenVPX systems, system designers have turned to SFF solutions. These rugged and compact “shoebox”-size COTS subsystems – frequently based on standard PCIe104 and COM Express modules – can deliver multicore fourth-generation Intel Core i7 processing and Cisco IOS network routing in five-pound LRUs that do not require fans or moving parts to handle thermal management. It is also now possible, with the use of software-based routers such as the Cisco Systems 5921 Embedded Services Router (ESR) software, to reduce weight by nearly 40 percent for applications that require both a mission computer and network router because both func-tions can be integrated into a single LRU without adding any additional weight. The combined router/mission computer approach also significantly reduces costs because the total system is priced lower than separate distributed processor and hardware router LRU system alternatives.

The emergence of ultra-small form factor COTS For the most demanding space- and weight-sensitive UAV applications, the new class of USFF subsystems holds great promise. Some of these rugged “pocket-size” solutions take up only 10 cubic inches, weigh half a pound, and consume less than 5 W of power. The first products in this class have been aimed at addressing requirements for Ethernet switching. They are targeted for technology refresh to upgrade older platforms with modern Internet Protocol (IP)-based data networks, or for deploy-ment on smaller UAVs to connect Ethernet-enabled embedded devices such as computers, cameras, sensors, and command-and-control equipment deployed at the network edge. These miniature network-switch systems are less than 10 percent of the size and 25 percent of the weight of the most recent comparable small form factor switch offerings yet are able to deliver fully managed Ethernet switching.

New connectors boost USFFHelping to make this reduction in SWaP possible is the use of new con-nector types such as microminiature

Figure 1 | The Parvus DuraNET 20-11 ultra-small form factor GbE switch measures 10 cubic inches.



“For the most demanding and weight-sensitive UAV applications,

the new class of USFF subsystems holds great promise. Some of

these rugged ‘pocket-size’ solutions take up only 10 cubic inches,

weigh half a pound, and consume less than 5 W of power.”



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In 1972, Dave Packard of Hewlett-Packard said, “There is only one road to reliability.

Build it, test it, and fix the things that go wrong. Repeat the process until the desired

reliability is achieved.” Few areas of hardware engineering require more testing than the

development of rugged industrial products. In order to develop a truly rugged solution that

meets required international standards, government regulations, general environmental

specifications, and customer-specific performance requirements, designers must incorporate

rugged design methodology into every aspect of the development process. This means

following a rigid validation and verification testing process that is as much a part of the

development cycle as the product design itself.

Rugged development requires integration of design and test from start to finishBy Jeff Munch

Rugged vs. ruggedizedThe term ruggedized often refers to commercial-grade designs that are screened at high temperatures with high yield fallout. However, ruggediza-tion of existing mechanics isn’t enough to meet the requirements of industrial

applications housed outdoors or in moving vehicles, where exposure to a variety of climates dictates the need to operate in extended temperatures and to power up in any extreme. For truly rugged electronics, boards and systems are best designed for harsh

environments from the ground up, with special attention and care given to com-ponent selection; circuit design; printed circuit board (PCB) thickness, layout, and materials; thermal solutions; enclo-sure design; and manufacturing process. Just as important to the development

COMs and SOMs Rugged Packaging

Mobility and environmental extremes are critical considerations for rugged board design in transportation applications. A comprehensive rugged hardware development methodology must integrate testing with design from the very start of the process.



for designs that can handle slightly larger SBC form factors. With just 46 square inches of surface area (8 inches by 5.75 inches), EBX balances size and functionality with a bolt-down SBC format supporting rugged embedded designs with higher- performance central processing units (CPUs), such as those using multicore technology for networking, digital signal processing (DSP), and graphics-heavy applications; EBX also sports generous onboard I/O functions to support everything from large data exchange to video. The PC/104 embedded computing format has no backplane, instead allowing modules to stack together like building blocks – more rugged than typical bus connections in PCs (such as PCI or PCI Express slot cards).

PC/104 delivers high performance combined with low power, stackable configurations, and adherence to MIL-STD; it also meets key industrial and transportation standards for electromagnetic interface/compatibility (EMI/EMC), e.g. EN50121, EN50155, EN610000-x, etc. The ability to build stacks of PC/104 modules create opportunities for developing a diversity of complex, often mobile, applications that range across

cycle is testing of the design in order to validate choices and guarantee required performance levels and solution dura-bility in a variety of simulated environ-mental conditions. Robust test methods ensure optimal product design phases in order to meet a product’s stringent requirements, such as -40 °C to +85 °C operating temperature range, MIL-STD, shock and vibration, and long-term reliability.

Conformal coating can also reduce deg-radation from exposure to outside ele-ments. A variety of conformal coating materials (such as acrylic, polyurethane, epoxy, and silicone) and application methods (such as brushing, spraying, and dipping) are currently used to pro-tect against moisture, dust, chemicals, and temperature extremes that can potentially damage electronics. The correct coating or application method varies depending on established stan-dard operating conditions for an appli-cation. With transportation applications, different coatings may be selected based on a primary need for moisture resistance versus abrasion resistance versus temperature stability.

With rugged, in-vehicle applications, vibration control is critical for per-forming functions like capturing video or securing targets. Some rugged boards offer a thicker PCB fabrication to add rigidity so that the board can withstand higher levels of vibration strain. The thicker PCB offers stability to the overall surface area, protecting electronic com-ponents from damage due to vibration. The thicker PCB also offers the ability to use more copper between layers for thermal considerations, as heat is a common unwanted byproduct of pro-cessing power.

Selecting the right form factor for rugged designsRugged boards come in many form factors, so starting with the right one is key in being able to deliver customer-specific requirements. Let’s take a quick look at industry-standard single board computers (SBCs) and computers-on-module (COMs).

Embedded Board eXpandable (EBX) and PC/104 are good format options

No one in embedded computing offers as many products and services as Elma. Our packaging, thermal and I/O interface expertise, plus years of expert embedded sub-system designs gives our customers a serious advantage.

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industrial, transportation, and defense environments where PC/104’s robust and reliable capabilities are required. (Figure 1.)

Stackable, mix-and-match modularity and the intrinsically rugged design of PC/104 is ideal for many of today’s tech-nology upgrade programs looking for commercial off-the-shelf (COTS) options, especially those that value size, weight, power, and cost (SWaP-C). In addition to ruggedness, users of PC/104 have come to expect long life cycle support. When considering shrinking DoD budgets, the robustness, longevity, and compatibility of the PC/104 ecosystem ensure strong system support and minimized costs.

In cases where an application design requires very specific I/O or physical size/shape restrictions, then a COM approach would provide better results. COMs are complete embedded com-puters built on a single circuit board for use in small or specialized applica-tions requiring low power consumption or small physical size. With the COM approach, all generic PC functions are readily available in an off-the-shelf foundation module, enabling system developers to focus on their core com-petencies and the unique functions of their systems. A custom designed car-rier board complements the COM with additional functionality that is required for specific applications. The carrier board provides all the interface con-nectors for peripherals, such as storage, Ethernet, keyboard/mouse, and display. This modularity enables the designer to upgrade the COM on the carrier board without changing any other board design features, and also allows more customization of peripherals as dictated by a specific application.

The COM Express form factor offers flex-ibility in the development and advance-ment of ultra-rugged embedded appli-cations for a wide range of industries. The modular processing block enables the designer to create a price and value advantage without getting locked into a single vendor for board creation. As it is easily swapped from a carrier board and comes in one of the smallest form fac-tors, COM Express is ideal for long-life embedded applications with a critical

development cycle, as well as more progressive applications that require frequent processor upgrades without affecting other application design elements. (Figure 2.)

Rugged design validationGuaranteeing the customer experience means not only satisfying regulatory require-ments (EMC/safety/environmental testing), but also hewing to availability and dura-bility requirements. Strength and Highly Accelerated Life Test (HALT) are used to simulate product aging to find design limits and maximum operating range by testing for issues such as displacement due to tolerances. This entire process enables hidden product defects to be exposed and addressed early in the development cycle.

Rugged designs are subjected to extensive voltage and temperature margin tests during the new-product development process, then are validated using HALT, shock and vibration testing, and voltage margining.

The HALT process consists of progressively increased extremes of temperature (both high and low), rapid thermal transition, six-axis vibration and – finally – combined tem-perature and vibration stress. Failures and the physical damage found at the destruct limits provide data, which is used to improve the ruggedness of the product design.

Rugged board products are generally shock and vibration tested to meet the MIL-STD-202G standard. This includes subjecting the product to multiple 50 G shocks and 11.95 Grms of random vibration between 100 Hz and 1,000 Hz along each axis.

Additionally, voltage and temperature margin testing is used during the product devel-opment process to subject the product to temperatures well outside the intended operating temperature range (-40°C to +85°C for extreme rugged products). The product is simultaneously subjected to minimum and maximum rated voltages (±5 percent). This process verifies products are functional and stable over combined

Figure 2 | A design using the COM Express form factor provides off-the-shelf functionality and an easy upgrade path by putting the customization on the baseboard, thereby creating more flexibility with the module without sacrificing performance.

COM Express Module

Custom Base board Design

Stack Connectors

M2.5 PEM Nuts Spacing 8 mm (5)

M2.5 Screws (5)

Figure 1 | The PC/104 embedded computing format has no backplane, instead allowing modules to stack together like building blocks. Many applications in defense and transportation still incorporate legacy devices that require an ISA-BUS interface.

PC/104 Module

CoreModule

PC/104 Module

Stack - throughExpansion

BusISA

Connectors

4-40 nut (4)

0.6 inch spacer (4)

0.6 inch spacer (4)

4-40 screw (4)

PC/104 Module

COMs and SOMs: Rugged Packaging



as rugged products are expected to per-form when taken to extremes, a compre-hensive rugged hardware- development process with equal emphasis on design and test processes must mirror those extremes.

Jeff Munch, ADLINK CTO, heads all research and development operations in North America and Asia and is responsible for

building ADLINK’s presence throughout the world. Munch has more than 20 years of experience in hardware design, software development, and engineering resource management. Before joining the company, he spent five years at Motorola Computer Group as Director of Engineering. Munch has also chaired several PICMG subcommittees. Readers can reach him at [email protected].

ADLINK Technology (408) 360-0200

extremes of both temperature and voltage, and ensures wide design margins resulting in long-term reliability under all specified operating conditions.

Fulfilling extreme expectationsIndustrial computers are used in myriad rugged applications. They are subjected to frequent vibrations aboard vehicles, are found in factories with high temperature and humidity, are deployed in deserts or high mountains with temperature differences of as hot as 90 degrees Celsius, or are designed into guided missiles as flight controllers. To provide customers with highly reliable industrial-grade products that conform to catalog specifications and rugged application environments, solution providers must put as many resources – time, money, and human – into testing as they do into design. Just

Figure 3 | The recent Extreme Rugged COTS computing platform from ADLINK, the HPERC-IBR, is an example of a system that was developed from the ground up as a rugged standards-based solution, with the entire process relying heavily on testing to meet performance expectations.

E-CASTS

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The SDR sector was given a big boost when the U.S. military Joint Tactical Radio System (JTRS) program was initi-ated in 1997. The program’s ambitious objective was to allow mobile ad hoc networks to link together disparate wire-less systems from the various branches of the military, other NATO armed forces, legacy radios, and some civilian systems. These systems included ground mobile radios (GMR), ground-to-air, and satellite communications.

The JTRS specification featured a wide range of what were termed “waveforms”

Over the last decade, engineers working to create software-defined radio (SDR)

systems have found it challenging to design a very flexible wireless system that meets the

military requirements for space, weight, and power (SWaP) at an affordable cost.

Flexible military radios balance SWaP, cost specsBy Paul Dillien

that would be modulated onto any RF frequency over a huge range from high frequency (HF) to ultra-high frequency (UHF). The spec’s physical layer included orthogonal frequency division multiplexing (OFDM) and wideband code division mul-tiple access (WCDMA) technologies to enable users to communicate via voice, data, and video simultaneously at all levels of security. The system was designed to support the need for mobile Command, Control, Communications, Computers, Intelligence, Surveillance and Reconnaissance (C4ISR) and to stay connected in the chaotic environ-ment of a battlefield by using a self-healing network.

These technologies required complex processing of the baseband signal to realize the various waveforms. In order to achieve both the speed of processing and low power consumption, the design requires some form of hardware acceleration. The two most suitable options would be a hardwired mask programmed gate array or field programmable logic, such as a field programmable gate array (FPGA). The advantages of the “classic” gate array include optimized performance and low power; however,

PROCESSOR ARCHITECTURE SoCs

U.S. Marine Corps Capt. Michael Fox, a forward air controller with Fox Company, 2nd Battalion, 8th Marines (2/8), Regimental Combat Team 7, talks over the radio during Operation Nightmare in Nowzad, Afghanistan. (U.S. Marine Corps photo by Kowshon Ye.)



660k logic elements, alongside well over 40 Mbits of on-chip memory and more than 1k DSP accelerators. The 20 nm SX devices also feature dual high-performance ARM processors.

A question: How could a designer use an Arria 10 device to meet the baseband require-ments of an SDR? The first decision is to partition the tasks between the software run-ning on the ARM processors and the hardware accelerators and interfaces that will be built in the logic fabric. The general rule is that compute-intensive functions, such as Fast Fourier Transform (FFT) encoding and decoding or Forward Error Correction (FEC), are typically more efficient in hardware. The processor is ideal for activities like data moves to memory and protocol checking and manipulating.

The equivalent of baseband “waveforms” would be various modulation standards. These could be OFDM, which demands complex FFT computations, or Code Division Multiple Access (CDMA), requiring fast spreading code generation and correlators to despread and recover the received data. The DSP blocks in the Arria device form a key element of the hardware accelerator. Modern modulation systems use data in the form of In-phase (I) and Quadrature (Q) bitstreams; this allows the RF carrier to be modulated with quadrature amplitude modulation (QAM) such as 16 (up to as high as 256 QAM), or the simpler quadrature phase shift keying (QPSK). This high-performance task can be implemented in the DSP and logic fabric to save overall system power.

The latest standard is called Multiple-Input Multiple-Output (MIMO), a complex scheme that uses two or more antennas separated by a physical distance. MIMO techniques improve the spectral efficiency and achieve a diversity gain that improves the link reliability. It is expected that MIMO will become an important addition to meet the growing demand for data throughput.

A programmable logic solution offers significant additional advantages. The logic function is defined by a configuration file held in nonvolatile external memory and loaded into the device on power-up; the memory also holds the executable code for the ARM cores. This solution allows the functionality to be updated as a midlife soft-ware update, as users could, for example, support new waveforms in the logic or add new features to the ARM code.

The ARM processors can control the data flow into the FPGA cores, using them as specially customized peripherals. As an example, one core may be allocated to con-trolling the interfaces, such as a display or video screen, while also verifying that the received data packets are valid (see Figure 1 on following page). The second pro-cessor can control the hardware accelerators built from the logic and DSP resources. The ARM can select the hardware accelerators that implement the algorithm currently required, for example, to produce QAM16, and to regulate the data transfer to and from the field programmable radio frequency (FPRF) chip.

once the design is committed to silicon it has permanently fixed functionality. Moreover, non-recurring engineering (NRE) costs have escalated dramatically for leading-edge technology, due to the long production timescales typical of defense procurement. The FPGA option provided a flexible logic fabric; because it is reprogrammable, it allowed design iterations to be tested in hardware with no NRE.

The RF challenges also proved to be very difficult. The design of an RF chain that could span a wide range of frequen-cies is far from easy, with different fre-quencies requiring tunable components and an agile antenna. The bandwidth required for voice is much narrower than that needed for video, which gave added complexity to the design. Fast frequency hopping, spread spectrum, or OFDM further compounded the problems.

Unfortunately, the specification proved too complex and difficult for the tech-nology of the day and the JTRS pro-gram was finally cancelled in late 2011. The program also suffered from fea-ture creep and bloated requirements during the 15 years of development, which rendered much of the earlier work obsolete. When the cancellation of the program was announced, the Defense Undersecretary was quoted as saying, “Our assessment is that it is unlikely that products resulting from the JTRS GMR development program will afford-ably meet service requirements, and may not meet some requirements at all. Therefore termination is necessary.”

JTRS program elements live onFast forward to 2014: Many of the requirements from the JTRS program remain relevant today.

The advance of Moore’s Law has been relentless, so that FPGAs fabricated using 20 nm planar technology are cur-rently shipping, with 14 nm Tri-Gate (FinFET) technology just around the corner. This update has dramatically boosted both complexity and perfor-mance. For example, the midrange Altera Arria 10 SX family expands to

“The design of an RF chain that could span a wide

range of frequencies is far from easy, with different frequencies

requiring tunable components and an agile antenna. The

bandwidth required for voice is much narrower than that needed

for video, which gave added complexity to the design.”



The ARM can control the FPRF device as well with a simple and fast SPI inter-face using a two-byte instruction to give it complete control of the RF domain. The processor can also process the received signal strength indicator (RSSI) that indicates the activity level at the chosen frequency. The combination of the FPGA and FPRF devices provides a highly flexible, low power, and above all, cost-effective solution to the logic and RF domains.

The LMS7002M, the second-generation FPRF device from Lime Microsystems, is a newly announced 65 nm CMOS chip that features a dual-transceiver archi-tecture. The frequency range has been extended, so that it now covers 50 MHz to 3,800 MHz, giving support to the lower frequencies often used in legacy military radios. In addition, the upper limit can be easily extended with the addition of an external PLL and mixer, so that it can cover frequencies used in satellite communications.

The LMS7002M includes an on-chip microcontroller; this setup simplifies the calibration of the chip, which otherwise would involve complex interactions with the baseband logic. It calibrates DC offset, the TX/RX LPF bandwidth tuning, transmit local oscillator leakage feed-through, IQ gain and phase mismatch in both transmit and receive chains, as well as handling on-chip resistor and capac-itor calibration. In most applications the initial calibration is sufficient; however, for military wireless systems operating at extreme temperatures and frequencies, then the microcontroller can be instructed to recalibrate to ensure optimum perfor-mance. Power-saving features include the ability to selectively power down any block when not required, with settings and calibration retained if power to the SPI memory is retained (see Figure 2). The FPRF chip is housed in an 11.5 mm x 11.5 mm package.

Various tools are available to help designers, either provided by the FPGA vendor or third-party suppliers. For example, Altera is the only FPGA vendor to offer a publicly available, Open Computing Language (OpenCL)-conformant software development kit. OpenCL allows programmers to take

Figure 2 | Each FPRF block can be selectively depowered or bypassed.

Transceiver 2

Q DAC

BBGAIN

BBGAIN

MIXER RFGAIN

I DAC

SPI CONTROL REGISTERS

LNA1

LNA3

LNA2

MIXER

BBGAIN

BBGAIN

LPFILTER

BBGAIN

BBGAIN

IADC

QADC

DIGITALINPUTS

RF

RFOUTPUT

DIGITALOUTPUTS

LPFILTER

LPFILTERDSP

DSP

DSP

DSP

Transceiver 1

TXPLL

LimeL

ight

TM I/

F

LimeL

ight

TM I/

F

FILTER BYPASS

ANALOG SIGNALSDSP BYPASS

DSP BYPASS

LPFILTER

FILTER BYPASS

ANALOG SIGNALS

RXPLL

OpenCL code and rapidly exploit the massively parallel architecture of an FPGA. It enables kernel code to be emulated and debugged, pinpoints performance bottle-necks, and profiles and recompiles to a hardware implementation. The FPRF design tool from Lime Microsystems takes the form of a graphical user interface (GUI); the GUI is available free of charge and allows complete control of the device.

Paul Dillien has worked with Lime Microsystems covering a range of marketing projects for the past two years. He previously worked in the FPGA industry for 15 years, and is the author of “The FPGA Market” report. Paul has worked in strategic and tactical marketing roles for leading U.S. and U.K. semiconductor companies and specializes in competitive analysis and negotiation. Readers may reach him at [email protected].

Lime Microsystems | 630-208-2700 | www.limemicro.com

Figure 1 | An FPGA controlling the SDR logic.

FPGA

Logic, DSPand Internal Memory

JESD

207

External Memory

I

SPI

Q

QI

Video or Message Display

DualARM Cores

I&QData

FPRF

RSSI

ControlData

ConfigurationFile

ARMCode

Interfaces Accelerators

PROCESSOR ARCHITECTURE: SoCs




http://www.limemicro.com

See you JUNE 2 - 6, 2015

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Wearable Technology

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PC/104 and Small Form Factors Resource Guide

FEATURES

ĄĄ 4th Generation Intel® Core™ i7/i5/i3 Desktop Processor with Intel Q87/H81 Chipset

ĄĄ Dual SODIMM DDR3L-1600 memory sockets (up to 16 GB)

ĄĄ PCIe x16, PCIe x1 and Mini PCIe expansion slots

ĄĄ Three DisplayPort interfaces

ĄĄ SEMA Cloud support

The AmITX-HL-G delivers a high-performance and space-saving platform for a wide array of embedded computing applications, including multi-media, automation control, and gaming applications. With a compact footprint, this Mini-ITX motherboard supports processing high-speed and high-bandwidth network con nectivity with PCI Express-based gigabit LAN and offers diverse I/O, storage, and audio interfaces.

ADLINK's AmITX-HL-G is equipped with our SEMA Cloud functionality and is ready-made for Internet of Things (IoT) applications. The AmITX-HL-G is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices and determine which data to save locally and which to send to the cloud for additional analysis.

AmITX-HL-G Mini-ITX Industrial Motherboard

COMs and SOMs

smallformfactors.opensystemsmedia.com/p372682

ADLINKwww.adlinktech.com

[email protected] 408-360-0200

http://www.adlinktech.com/PD/web/PD_detail.php?cKind=&pid=1446

PC/1

04 a

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ACCES I/O Products, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-24

ADL Embedded Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

ADL Embedded Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

ADLINK Technology, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Alphi Technology Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Connect Tech Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Connect Tech Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28-29

EMAC, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

EMAC, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Intermas, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

North Atlantic Industries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

PEAK-System Technik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-26

RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Sundance Multiprocessor Technology, Ltd. . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Themis Computer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

WinSystems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30-32

WinSystems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Company Category Page

2015 RESOURCE GUIDE INDEX






















http://smallformfactors.opensystemsmedia.com/p372682

http://www.adlinktech.com

http://www.adlinktech.com/PD/web/PD_detail.php?cKind=&pid=1446

FEATURES

ĄĄ Dual PMC/XMC & Mini-PCIe Expansion ĄĄ COM Express Type 6 compatibility ĄĄ Ruggedized, locking pin header connectors ĄĄ Small form factor (170mm x 165mm) ĄĄ Extended Temperature Range, -40° C to +85° C

Connect Tech’s COM Express® Type 6 PMC/XMC Ultra Lite Carrier Board is a compact, feature-rich carrier which offers dual PMC/XMC and Mini-PCIe expansion. This carrier board features USB 3.0 and DisplayPort, and supports the latest high performance processors.

The COM Express® Type 6 PMC/ XMC Ultra Lite Carrier Board is ideal for military and aerospace applications, and accepts a wide input voltage range from a regulated or un-regulated source of +12V to +48V DC.

COM Express® Type 6 PMC/XMC Ultra Lite Carrier

COMs and SoMs


Connect Tech Inc.www.connecttech.com/CCG-PMC-XMC

[email protected] 519-836-1291 | 800-426-8979 www.connecttech.com twitter.com/connecttechinc

FEATURES

ĄĄ Combines High-End GPUs with Latest Generation x86 Processors in a ruggedized small form factor

ĄĄ GPUs can be targeted for 4 independent display outputs OR for a headless GPU processing system utilizing CUDA cores

ĄĄ All thermal extraction points from COM Express and GPU are brought out to a single unified plane

The COM Express + GPU Embedded System from Connect Tech combines the latest generation x86 processors with high-end Graphics Processing Units (GPU) all into a ruggedized small form factor embedded system. Choose from 4th Generation Intel® Core™ i7 or i5 (Haswell) x86 processor options and from either the AMD Radeon E6760 GPU, ideal for driving multiple displays, or the NVIDIA GeForce GTX 970M/950M GPU’s for applications that require access to CUDA Cores and the ability to process complex mathematics in parallel of the on-board x86 CPU.

COM Express® + GPU Embedded System

COMs and SoMs


Connect Tech Inc.www.connecttech.com/VXG001


PC/104 and Small Form

Factors Resource Guide



http://www.connecttech.com/CCG-PMC-XMC


http://www.connecttech.com

http://www.connecttech.com/VXG001





https://twitter.com/connecttechinc

http://www.twitter.com/connecttechinc

FEATURES

ĄĄ Ethernet 10/100 RJ45 connector for interfacing to CPU or networkĄĄ 48 or 24 channel high-current TTL digital I/O linesĄĄ Compatible with industry standard I/O racks such as Grayhill, Opto 22,

Western Reserve Controls, etc.ĄĄ Eight-bit ports software selectable for inputs or outputsĄĄ All 48 digital I/O lines buffered with 32 mA source/64mA sink current

capabilitiesĄĄ Jumper selectable I/O pulled up to 5V (via 10KΩ) for contact monitoring,

pulled down to ground or floatingĄĄ Resettable 0.5A fused +5VDC output per I/O connectorĄĄ OEM version (board only), features PC/104 size and mounting compatibilityĄĄ Small, (4"x4"x1.7") rugged, steel industrial enclosureĄĄ LVTTL (3.3V) and -40°C to +85°C industrial operating temperature

available as factory options

Designed for compact control and monitoring applications, this product features 48 or 24 industrial strength TTL digital I/O lines. This Ethernet device is an ideal solution for adding portable, easy-to-install, digital I/O to any Ethernet network, even wirelessly. The ETH-DIO-48 is excellent for use in applications sensing inputs such as switch closures, TTL, LVTTL, CMOS logic, and is ideal for controlling external relays, driving indicator lights, and more. Applications include home, portable, tablet, laboratory, industrial automation, and embedded OEM.

Available accessories include a broad range of ribbon cables, screw terminal boards, optically isolated adapters, electromechanical relay boards, and industry standard solid state module racks. Special order items such as conformal coating, custom software, right angle headers, and more, are also available.

ETH-DIO-48 Ethernet 48-Channel Industrial Strength Digital I/O

Hardware and Peripherals


ACCES I/O Products, Inc.www.accesio.com/eth-dio-48

[email protected] 1-858-550-9559 linkedin.com/company/acces-i-o-products-inc. twitter.com/accesio

FEATURES

ĄĄ Atmel ARM Cortex A5 536Mhz ProcessorĄĄ 512 MB of LP DDR2 RAMĄĄ 4 GB of eMMC Flash, 16MB of Serial Data FlashĄĄ 10/100/1000 BaseT Ethernet portĄĄ 22 GPIO (3.3V) Lines ĄĄ 6x serial ports, 2x CAN portsĄĄ 6x channels of 12 bit A/D (0 to 3.3V)ĄĄ 2x USB 2.0 High Speed Host ports, 1x USB 2.0 Host/DeviceĄĄ 4 wire Resistive Touch, 24-bit LCD ControllerĄĄ 1x Synchronous Serial I/O (I2S) Audio PortĄĄ 4x PWM Channels, 5x Timer/Counters, 3x Clock OutputsĄĄ Internal Real Time Clock/Calendar, External Address/Data BusĄĄ EMAC OE Linux

Designed and manufactured in the USA, the SoM-A5D36 is a System on Module (SoM) based on the Atmel ARM Cortex A5 ATSAMA5D36 processor. This low power, wide temperature ARM 536 MHZ SoM utilizes 4GB of eMMC Flash, 16MB of serial data flash, and up to 512MB of LP DDR2 RAM. Like other modules in EMAC's SoM product line, the SoM-A5D36 is designed to plug into a custom or off-the-shelf carrier board containing all the connectors and any additional I/O components that may be required. This approach allows the customer or EMAC to design a Custom Carrier Board that meets the I/O, dimensional, and connector requirements without having to worry about the pro-cessor, memory, and standard I/O functionality. With this System on Module approach, a semi-custom hardware platform can be developed in as little as a month.

Please contact EMAC for OEM & Distributor Pricing. Quantity 1 pricing is $150.

Low Power Industrial Temperature ARM SoM-A5D36

COMs and SoMs


EMAC, Inc.www.emacinc.com/products/system_on_module/SoM-A5D36

[email protected] 618-529-4525www.emacinc.com

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http://www.accesio.com/eth-dio-48


http://www.emacinc.com/products/system_on_module/SoM-A5D36


http://www.emacinc.com



https://twitter.com/accesio

https://www.linkedin.com/company/acces-i-o-products-inc.

The mPCIe-ICM Series isolated serial communication cards measure just 30 x 51 mm and feature a selection of 4 or 2 ports of isolated RS232 serial communica-tions. 1.5kV isolation is provided port-to-computer and 500V isolation port-to-port on ALL signals at the I/O connectors. The mPCIe-ICM cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, and gaming.The RS232 ports provided by the card are 100% compatible with every other industry-standard serial COM device, supporting TX, RX, RTS, and CTS. The card provides ±15kV ESD protection on all signal pins to protect against costly dam-age to sensitive electronic devices due to electrostatic discharge. In addition, they provide Tru-Iso™ port-to-port and port-to-PC isolation. The serial ports on the device are accessed using a low-profile, latching, 5-pin Hirose connector. Optional breakout cables are available, and bring each port connection to a panel-mountable DB9-M with an industry compatible RS232 pin-out.The mPCIe-ICM cards were designed using type 16C950 UARTS and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI 16550 type UART applications and allow for users to maintain backward compatibility.

mPCIe-ICM Family PCI Express Mini Cards



ACCES I/O Products, Inc.www.accesio.com


FEATURES

ĄĄ PCI Express Mini Card (mPCIe) type F1, with latching I/O connectorsĄĄ 4 or 2-port mPCIe RS232 serial communication cardsĄĄ Tru-Iso™ 1500V isolation port-to-computer and 500V isolation

port-to-port on ALL signalsĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each

TX and RXĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standardĄĄ Supports data communication speeds up to 1 Mbps simultaneouslyĄĄ Custom baud rates easily configuredĄĄ ±15kV ESD protection on all signal pinsĄĄ 9-bit data mode fully supportedĄĄ Supports CTS and RTS handshaking

ACCES I/O Products is pleased to announce the release of a new family of mini PCI Express (mPCIe) multi-port serial communication cards. These small, low-priced, PCI Express Mini cards feature a selection of 4 or 2-ports of software selectable RS-232/422/485 asynchronous serial protocols on a port by port basis. These cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale sys-tems, kiosk design, retail, hospitality, automation, gaming and more. The small size (just 50.95mm x30mm) allows for maximum performance in applications where space is a valuable resource.Each RS-232 port is simultaneously capable of supporting data communication rates up to 921.6 kbps. RS-422/485 modes support data communication speeds up to 3 Mbps. The cards provide ±15kV ESD protection on all signal pins to protect against costly damage due to electrostatic discharge. Existing serial peripherals can connect directly to industry standard DB9M connectors on the optional breakout cable accessory kits.The mPCIe-COM cards were designed using type 16C950 UARTs and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI and PCI Express 16550 type UART applications and allow users to maintain backward compatibility.

mPCIe-COM Family PCI Express Mini Cards





FEATURES

ĄĄ PCI Express Mini Card form-factor (mPCIe) type F1, with latching I/O con-nectorsĄĄ 4 or 2-port serial communication cards with optional DB9M connectivityĄĄ Software selectable RS-232, RS-422, and RS-485 protocols, per port

stored in EEPROMĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each TX

and RXĄĄ Port-by-port field selectable termination for RS-422/485 applicationsĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standardĄĄ Supports data communication rates up to 3Mbps simultaneously, (RS-232

up to 921.6 kbps)ĄĄ Custom baud rates easily configuredĄĄ ±15kV ESD protection on all signal pinsĄĄ CTS, RTS, 9-bit data mode, and RS-485 full-duplex (4 wire) fully supportedĄĄ RS-232 only and RS-422/485 versions available











http://www.accesio.com




FEATURES

ĄĄ InterShell is a new aluminum housing enclosure composed of a top and bottom, two front panels, and four screws.ĄĄ The simple housing design offers an uncomplicated solution for small

form factors for easy and quick assembly.ĄĄ Color options are unlimited and customer-specific print is possible.ĄĄ InterShell is used for the packaging of small electronic units such as

Eurocard formats with 100x160 mm, universal formats, or as mITX formats for example.ĄĄ Excellent EMC compliancy.ĄĄ InterShell is available in the following standard dimensions (h/w/d)

as well as customized formats: • 40x106.6x168.6 mm • 60x150x120 mm • 50x190x190 mm

Intermas develops electronic enclosure systems:Cabinets, housings, subracks, and an extensive range of accesso ries for the 19" rack systems and small form factors used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection.

Intermas has an extensive product range of more than 10,000 sepa rate components and more than 30 years’ experience.

Go towww.Intermas-US.com

for our new catalog.

InterShell Enclosures



Intermas US LLCwww.Intermas-US.com


FEATURES

ĄĄ Rugged, industrialized, four-port USB hubĄĄ High-speed USB 2.0 device, USB 3.0, and 1.1 compatibleĄĄ Extended temperature operation (-40°C to +85°C)ĄĄ Data transfer rates up to 480 MbpsĄĄ Supports bus-powered and self-powered modesĄĄ Three power input connectors (power jack, screw terminals, or 3.5" drive

Berg power connector)ĄĄ LED status indicators for power and overcurrent fault conditions for each

downstream portĄĄ USB/104 form factor for OEM embedded applicationsĄĄ OEM version (board only) features PC/104 module size and mountingĄĄ Includes micro-fit embedded USB header connectors in parallel with all

standard USB connectorsĄĄ Industrial grade USB connectors feature high-retention designĄĄ Small (4" x 4" x 1"), low profile, steel enclosureĄĄ 3.5" front panel drive bay mounting provision

This small industrial/military grade hub features extended temperature operation (-40°C to +85°C), high-retention USB connectors, and an industrial steel enclosure for shock and vibration mitigation. The OEM version (board only) is PC/104 sized and can easily be installed in new or existing PC/104-based systems as well. The USB-104-HUB now makes it easy to add additional USB-based I/O to your embedded system or to connect peripherals such as external hard drives, keyboards, GPS, wireless, and more. Real-world markets include Industrial Automation, Embedded OEM, Laboratory, Kiosk, Transportation/Automotive, and Military/Government.

This versatile four-port hub can be bus powered or self powered. You may choose from three power input connectors: DC power input jack, screw terminals, or 3.5" drive power connector (Berg). Mounting provisions include DIN rail, 3.5" front panel drive bay mounting, and various panel mounting plates.

USB-104-HUB – Rugged, Industrial Grade, 4-Port USB Hub





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http://www.intermas-us.com


The PCAN-PC/104-Plus card enables the connection of one or two CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot bracket supplied.

The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides.

The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.

Optionally available: • Single-channel or dual-channel version • Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel • PC/104-ISA stack-through connector

PCAN-PC/104-Plus



PEAK-System Technik GmbHwww.peak-system.com/quick/PC104-2

[email protected] +49 (0) 6151-8173-20

FEATURES

ĄĄ Use of the 120-pin connection for the PCI busĄĄ Up to four cards can be used in one systemĄĄ Bit rates from 5 kbit/s up to 1 Mbit/sĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID)ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance

with CiA® 102)ĄĄ NXP SJA1000 CAN controller, 16 MHz clock frequencyĄĄ NXP PCA82C251 CAN transceiverĄĄ 5-Volt supply to the CAN connection can be connected through a solder

jumper, e.g. for external bus converterĄĄ Extended operating temperature range from -40 to 85 °C (-40 to 185 °F)

The PCAN-PC/104 card enables the connection of one or two CAN net-works to a PC/104 system. Multiple PCAN-PC/104 cards can easily be operated using interrupt sharing.

The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides.


Optionally available: • Single-channel or dual-channel version • Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel

PCAN-PC/104




[email protected] +49 (0) 6151-8173-20

FEATURES

ĄĄ Form factor PC/104ĄĄ Multiple PC/104 cards can be operated in parallel (interrupt sharing)ĄĄ 14 port and 8 interrupt addresses are available for configuration using

jumpersĄĄ Bit rates from 5 kbit/s up to 1 Mbit/sĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID)ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance

with CiA® 102)ĄĄ NXP SJA1000 CAN controller, 16 MHz clock frequencyĄĄ NXP PCA82C251 CAN transceiverĄĄ 5-Volt supply to the CAN connection can be connected through a solder








http://www.peak-system.com/quick/pc104-1




The PCAN-PCI/104-Express card enables the connection of one, two, or four CAN busses to a PCI/104-Express system. Up to four cards can be stacked together. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. The card is available as a single, dual, or four-channel version.


Optionally available: • Single, dual, or four-channel version • PCI-104 stack-through connector

CAN Interface for PCI/104-Express




[email protected] +49 (0) 6151-8173-20

FEATURES

ĄĄ PCI/104-Express card, 1 lane (x1)ĄĄ Form factor PC/104ĄĄ Up to four cards can be used in one systemĄĄ Bit rates from 5 kbit/s up to 1 Mbit/sĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID)ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance

with CiA® 102)ĄĄ FPGA implementation of the CAN controller (SJA1000 compatible)ĄĄ NXP PCA82C251 CAN transceiverĄĄ Galvanic isolation on the CAN connection up to 500 V, separate for each

CAN channelĄĄ Supplied only via the 5 V lineĄĄ 5-Volt supply to the CAN connection can be connected through a solder


The PCAN-PC/104-Plus Quad card enables the connection of four CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides.


Optionally available: • PC/104-ISA stack-through connector

PCAN-PC/104-Plus Quad




[email protected] +49 (0) 6151-8173-20

FEATURES

ĄĄ Form factor PC/104ĄĄ Use of the 120-pin connection for the PCI busĄĄ Up to four cards can be used in one systemĄĄ Bit rates from 5 kbit/s up to 1 Mbit/sĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID)ĄĄ Connection to CAN bus through D-Sub slot brackets, 9-pin (in accordance

with CiA® 102)ĄĄ FPGA implementation of the CAN controller (SJA1000 compatible)ĄĄ NXP PCA82C251 CAN transceiverĄĄ Galvanic isolation on the CAN connection up to 500 V, separate for each

CAN channelĄĄ 5-Volt supply to the CAN connection can be connected through a solder


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FEATURES

ĄĄ Intel® E3800 Series SoC Processors, DC/Quad ĄĄ Junction Temperature Rated at -40C to +110CĄĄ Up to 8 GB DDR3L-1333, 1.35V SoDIMM204 Socket ĄĄ Type 2 Downward-Stacking PCIe/104 V2.01 with 2x Gen2 PCIe

x1 LanesĄĄ 4x USB 2.0, 1x USB 3.0, 2x Serial COMĄĄ 2x SATA 3 Gb/s, 2x GLAN EthernetĄĄ PCI Express Mini Card 1.2 Socket, Compatible with Mini PCIe or

mSATA Modules

The ADLE3800PC is based on Intel’s first System-on-Chip (SoC) E3800 Atom product family which is built using Intel’s 22nm 3D Tri-gate process. It offers vastly superior compute performance and energy efficiency including Intel’s 7th generation graphics engine for stunning graphics performance. Improved power management capabilities result in standby power measured in milliwatts with days of standby time.Potential aPPlications include: • Military & Defense Rugged SFF • Rugged Mobile Computing • Portable Medical Devices • Mobile Autonomous Systems for Civil, Commercial and Defense Applications Including: – Unmanned Ground Vehicles – Robotic Subs – Unmanned Avionics – Unmanned Buoys and Other Surface Vehicles

NEW ADLE3800PC – Intel® E3800 Series PCIe/104 SBC

SBCs and Boards


ADL Embedded Solutions Inc.www.adl-usa.com


RTD’s IATX25110HR is a 100 Watt high-power isolated DC/DC converter for PCI/104-Express embedded systems. The supply provides +5V, +5VSTDBY, +3.3V, and +12V to the PCIe and PCI buses. Addition-ally, +5V, +3.3V, and +12V are provided at auxiliary connectors on the supply.

The robust design uses a +5V isolated supply to create +5V and +5VSTBY while the +12V isolated supply cascades to the 3.3V supply. The +5V is designed for 50 Watts, the 3.3V is designed for 10 Watts, the +12V is designed for 50 Watts, and the +5VSTBY is designed for 10 Watts.

100 Watt Isolated ATX Power Supply



RTD Embedded Technologies, Inc.www.rtd.com


FEATURES

ĄĄ PCIe/104 and PCI/104-Express configurationsĄĄ Available in modular, rugged enclosuresĄĄ Input Voltage: 10 to 36 VDCĄĄ 10 Amps of 5VĄĄ 4.17 Amps of 12VĄĄ 3.03 Amps of 3.3VĄĄ 2.0 Amps of 5VSBĄĄ Remote ON/OFF controlĄĄ Reverse voltage protectionĄĄ Input over voltage protectionĄĄ Input over current protectionĄĄ ATX functionalityĄĄ Power indicator LEDsĄĄ Operating Temperature: -40 to +85°C








http://www.rtd.com

http://www.adl-usa.com


FEATURES

ĄĄ 1x Mini PCI Express Gen 1.0 ĄĄ Dual Independent Dual Redundant MIL-STD-1553 ChannelĄĄ Two independent DDC Total-AceXtreme® EngineĄĄ BC or Multi-RT with Concurrent Bus MonitorĄĄ Programmable Bus Controller, Remote Terminal or Bus MonitorĄĄ Supports MIL-STD-1553 A/B and MIL-STD-1760ĄĄ IRIG-106 Chapter 10 MT SupportĄĄ Optional 8 I/O LinesĄĄ Optional Digital Irig Input ĄĄ Support for Linux®, Windows®, VxWorks ®drivers

The MIL-STD-1553 (1553) PCIe-Mini expansion module is a 2 Channel dual redundant 1553 controller module, where each controller can support BC or Multi-RT with Concurrent bus monitor. The controller can support the MIL-STD-1553 A/B and the MIL-STD-1760 traffic.This module can operate in a Mini PCI Express slot.Utilizing the DDC Total-AceXtreme® Engine, this 1553 card is able to perform:1553 Bus Monitor (MT) • IRIG-106 Chapter 10 Compatibility • Filter Based on RT Address, T/R bit, Sub-Address • Advanced Bit Level Error Detection to Isolate Bus Failures1553 Remote Terminal (RT) • Emulate up to 32 RT Addresses Simultaneously • Multiple Buffering Techniques • Programmable Command Illegalization • Programmable Busy by Sub-address1553 Bus Controller (BC) • Streaming and Minor/Major Frame Scheduling of Messages • High and Low Priority Asynchronous Message Insertion • Modify Messages or Data while BC is running

PCIe-Mini-1553-2

SBCs and Boards


ALPHI Technology Corporationwww.Alphitech.com


FEATURES

ĄĄ HDMI and LVDS Display OutputsĄĄ i.MX6 Quad Core 800MHz ARM Cortex-A9 ProcessorĄĄ Linux and Android BSP’s AvailableĄĄ Extended Temperature Range, -40° C to +85° C

Connect Tech’s ArcticEdge/iMX6 is designed to take you beyond the development phase of your project. ArcticEdge’s low-power, high performance design and extended temperature range make it a practical choice for taking your application from development to deployment.

The i.MX6Q 800MHz Cortex-A9 processor gives the reliability needed for long life critical applications.

ArcticEdge/iMX6

SBCs and Boards


Connect Tech Inc.www.connecttech.com/ArcticEdge


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http://www.connecttech.com/arcticedge



FEATURES

ĄĄ Atmel AT91SAM9x25 400 Mhz ProcessorĄĄ 128MB DDR2 RAM, 4GB eMMC, 16MB Serial Data Flash, Micro SDĄĄ 20 General Purpose Digital I/O lines, 16 SPI I/O Expander Based

Digital I/O, and 8 High Drive Digital OutputsĄĄ 2x USB 2.0 (High-Speed) Host Port, 1x USB 2.0 (Full-Speed) Host Port

1x USB 2.0 (High-Speed) Device Port, 1x CAN BusĄĄ 3x RS232, 1x RS232/422/485, 2x 10/100 EthernetĄĄ Up to 7 channels of 10 bit A/D, Up to 4 16-bit PWMsĄĄ Industrial operating range of -40C to +85C

Designed and manufactured in the USA, the iPac-9X25 is a Web- enabled microcontroller with the ability to run an embedded server and to display the current monitored or logged data. The Web connection is available via two 10/100-Base-T Ethernet ports or 802.11 wireless Wi-Fi networking when using the proper Linux modules and adapters. This microcontroller has all connectors brought out as headers on the board and has the same footprint of a standard PC/104 module at 3.77" x 3.54". The iPac-9X25 is perfectly suited for Industrial Tempera-ture Embedded Data Acquisition and Control applications.

Pricing for Qty 1 is $198.

Industrial Temperature iPac-9X25

SBCs and Boards


EMAC, Inc.www.emacinc.com/products/pc_compatible_sbcs/IPAC-9X25

[email protected] 618-529-4525www.emacinc.com

FEATURES

ĄĄ Super Small Form FactorĄĄ Feature Packed (HDMI, SATA, 2-Lane MIPI CSI Camera Interface)ĄĄ External SATA/mSATA Switching CircuitryĄĄ Single Wide Range Input Voltage +6V to +36V DC

Connect Tech’s SMARC/SL carrier board is ideal for your low power application. SMARC/SL has the ability to use both +3.3V and +1.8V SMARC Modules, a single Mini-PCIe/mSATA with External SATA switching, Gigabit Ethernet, HDMI Video, and MIPI CSI Camera inter-face. SMARC/SL supports an extended temperature range of -40° C to +85° C and offers a very small footprint; ideal for mobile or stationary applications.

SMARC/SL

SBCs and Boards


Connect Tech Inc.www.connecttech.com/Smarc











http://www.connecttech.com/smarc

http://www.emacinc.com/products/pc_compatible_sbcs/IPAC-9X25

http://www.emacinc.com


FEATURES

ĄĄ PCIe/104 OneBank™ Carrier BoardĄĄ Dual Core AMR9 and Xilinx Artix-7 FPGAĄĄ 96mm x 90mm without I/O Expansion boardĄĄ Compatible with stackable PC/104® conceptĄĄ Fully Compatible with VITA57.1 FMC-LPC™

ĄĄ 1x MGT Serial Link to VITA57.1 FMC-LPC™

ĄĄ 68x I/O on the VITA57.1 FMC-LPC™

The EMC2-DP™ is a PCIe/104 OneBank™ ARM+FPGA board that can be stacked with other boards to provide CPU Host Processing or dedicated I/O functions. The default version of the EMC2-DP is using the Xilinx Zynq Z7015 FPGA with integrated Dual-Core FPGA, but can also be populated with other “System-on-Module” solutions, conforming to the 4x5 form-factor. The EMC2-DP will integrate into Sundance’s “Blades-for-PC/104” of stackable enclosures to build scalable solutions for ANY Embedded Solution.

EMC2-DP

SBCs and Boards


Sundance Multiprocessor Technology Ltdwww.sundance.com/emc2

[email protected] +44 1494 793167 uk.linkedin.com/pub/flemming-christensen/0/987/649/en @OneCrazyDane

Dual ARM CPU arriveson PC/104 andtakes full advantageof the new OneBankfamily member

RTD’s robust Intel Core i7 CPU offers high-performance for rugged appli-cations in extended temperature environments. Choose from single-core, dual-core, and quad-core configurations. These fanless systems feature a synchronized power supply, an integrated 2.5-inch SATA carrier, and standard I/O including Gigabit Ethernet, USB, Serial, SVGA, DisplayPort, and programmable digital I/O. The CPU is designed with soldered SDRAM and solid-state flash storage for high shock and vibration situations.

The stackable PCIe/104 architecture allows system expandability for additional DAQ, I/O, storage, and network functionality. The Core i7 sys-tems are compatible with RTD’s complete line of data acquisition and peripheral modules. Tailored solutions include conformal coating, water-tight enclosures with cylindrical MIL-SPEC connectors, and a variety of custom mounting, LED, and paint options.

Expandable Intel Core i7 Mission Computer

SBCs and Boards




FEATURES

ĄĄ Modular, scalable Intel Core i7 mission computerĄĄ Quad-core, dual-core, and single-core configurationsĄĄ 1.5 – 2.1 GHz Processors with up to 3.1 GHz Turbo BoostĄĄ Dual-Channel DDR3 SDRAM (Surface-Mounted)ĄĄ 32GB surface-mounted industrial-grade SATA flash driveĄĄ Ideal for extended temperature environmentsĄĄ Optional stackable, modular chassis milled from solid T-6061

aluminum with standard PC or cylindrical connectors and user-defined pinoutsĄĄ Optional watertight configurations with EMI suppression and

RF isolationĄĄ Board-level and enclosure customizations available

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http://www.rtd.com

http://www.sundance.com/emc2

https://twitter.com/onecrazydane

https://www.linkedin.com/pub/flemming-christensen/0/987/649


FEATURES

ĄĄ Intel® I210 Ethernet ControllersĄĄ Two Fully Independent Ethernet ConnectionsĄĄ Small Form Factor Pluggable (SFP) InterfaceĄĄ Accepts the Wide Range of SFP Ethernet ModulesĄĄ Fanless -40° to +85°C operational temperatureĄĄ PC/104-Plus Form FactorĄĄ IEEE 1588 Precision Time Synchronization over EthernetĄĄ Robust Communication over Long DistancesĄĄ Supports Linux, Windows, and DOS Operating Systems

The PPM-N409-2 PC/104-Plus Dual Ethernet module features Small Form Factor Pluggable (SFP) transceivers, controlled by dual Intel® I210 Ethernet Controllers, bringing the latest in technology to your legacy design. Both module housings are compatible with the large variety of SFP trans-ceivers that range from optical single mode, optical dual mode, and GbE twisted pair copper. The small form factor and negligible heat signature of the PPM-N409-2 makes it ideal for installation in confined spaces. Combined with its excep-tional range of operational temperatures, low physical profile, and rugged design, the PPM-N409-2 can be deployed in even the most demanding environments. Give your systems the advantage of compact design, low power con-sumption, and high precision time synchronization of the PPM-N409-2 Ethernet controller from WinSystems. Custom design options are available upon request.

PPM-N409 – Dual PC/104-Plus Ethernet with SFP Interface

SBCs and Boards


WinSystemswww.winsystems.com

[email protected] 817-274-7553 www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc

FEATURES

ĄĄ Multi-Core Intel® Atom™ E3800 Processors ĄĄ Up to 2 GB Soldered Down DDR3 RAMĄĄ Two Fully Independent Displays (VGA, DisplayPort & LVDS)ĄĄ 1 Gb Ethernet ControllerĄĄ Fanless -40° to +85°C operational temperatureĄĄ 4 Serial Ports and 4 USB 2.0 portsĄĄ 24 Bidirectional GPIO with event senseĄĄ Bus Expansion: MiniPCIe, PC/104 & PC/104-PlusĄĄ Bootable SATA, CFAST, and mSATA

The PPM-C407 from WinSystems utilizes the E3800 family of Atom™ processors from Intel® to provide low power and performance in the versatile PC/104 form factor. Designed for harsh environments and reliability, it includes soldered RAM for added shock and vibra-tion resistance with an operating temperature range from -40°C up to +85°C.

WinSystems is offering the PPM-C407 in multi-core options depend-ing on the application requirements. The scalable performance allows you to choose between low power single-core and higher perfor-mance dual or quad-core solutions.

Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options.

PPM-C407 – Low Power PC/104 SBC with Long Term Availability

SBCs and Boards









http://www.linkedin.com/company/winsystems-inc-



https://twitter.com/winsystemsinc




http://www.winsystems.com


FEATURES

ĄĄ Multi-Core Intel® Atom™ E3800 ProcessorsĄĄ Up to two independent displays (VGA, LVDS and DisplayPort)ĄĄ Two Ethernet Controllers with IEEE 1588 time stampingĄĄ Two RS-232/422/485 Serial portsĄĄ Bus Expansion (Two MiniPCIe and IO60)ĄĄ Four USB ports (1xUSB 3.0 and 3xUSB 2.0)ĄĄ Bootable SATA, CFAST, and mSATAĄĄ Wide range 10 to 50V DC inputĄĄ Fanless -40° to +85°C operational temperature

The SBC35-CC405 series of small form factor computers utilizes the Intel® Atom™ E3800 family of processors in a standard 3.5-inch SBC format. The COM Express based solution includes two Gigabit Ethernet controllers with IEEE 1588 time-stamping, two serial channels, USB 3.0, and +10 to +50V DC input.

Engineered for rugged applications, the low-profile thermal solu-tion creates a sturdy base that protects the PCB assembly, provides convenient mounting, and enables fanless extended temperature operation.

Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options. WinSystems provides driver for Linux and Windows 7/8, as well as pre-configured operating systems.

SBC35-CC405 – Industrial Small Form Factor Computers

SBCs and Boards




FEATURES

ĄĄ Freescale® i.MX 6™ Quad-core ARM® Cortex™-A9 ProcessorsĄĄ Fanless -40° to +85°C operational temperatureĄĄ Powered by PoE or +10-50VDC InputĄĄ 10/100/1000 Ethernet with IEEE-1588™

ĄĄ USB 2.0 and USB On-The-Go PortsĄĄ FlexCAN and RS-232/422/485 Serial PortsĄĄ 24 GPIO tolerant up to 30VDCĄĄ Mini-PCIe and IO60 (I2C, SPI, TTL, and PWM) expansion

Designed for industrial applications and long-term availability, WinSystems’ SBC35-C398Q SBC features a quad-core ARM® proces-sor with options for expansion and customization. The combination of processing power and industrial I/O provides a flexible solution for a number of applications including security, industrial control, medical, transportation and MIL/COTS. This low-power design operates from -40° to +85°C without a fan or heatsink for improved reliability.

Kick-start development with our SD Cards, available preloaded with our newly released real-time Linux distribution or Android™. Our factory engineers offer technical support from pre-sales through production.

SBC35-C398Q – Industrial ARM® SBC with Real-Time Linux

SBCs and Boards




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I/O Interface with optional ARM1 ProcessorConfigure to CustomizeThe NIU1A is a small, rugged, low-power system. It consists of an integrated power supply, one function slot that can be configured with a field-proven NAI intelligent I/O and communications function module and an optional ARM Cortex-A9 processor. Ideally suited for rugged Mil-Aero applications, the NIU1A delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.Architected for VersatilityNAI’s Custom-On-Standard Architecture™ (COSA™) offers a choice of over 40 intelligent I/O and communications options. Pre-existing, fully-tested functions can be selected to quickly and easily meet system requirements. Individually dedicated I/O and communications processors allow mission computers to manage, monitor and control via single or dual Ethernet.All products are designed to operate under extreme temperature, shock, vibration and EMI environments. EMI filters and gaskets meet or exceed MIL-STD-461F and MIL-STD-810G requirements.

NIU1A – Embedded I/O System – Nano Interface Unit

Systems


North Atlantic Industries, Inc.www.naii.com

www.naii.com 631-567-1100

Made in the USACertified Small Business

FEATURES

ĄĄ Supports 1 Intelligent I/O function moduleĄĄ 2x 10/100/1000 Base-T EthernetĄĄ 1.5"H x 1.7"D x 6.8"L @ 16 oz. (454 g) with 3 mounting optionsĄĄ 128 MB DDR3 SDRAMĄĄ Optional ARM Cortex™-A9 Dual Core 800MHz ProcessorĄĄ 4 GB SATA II NAND Flash (up to 32 GB option)ĄĄ < 15 W power dissipationĄĄ Wind River® Linux, VxWorks®, Altera Linux OS SupportĄĄ 1x RS232ĄĄ Continuous Background BITĄĄ Operating temp: -40°C to +71°C

conduction cooledĄĄ 28 VDC input

The ADLMES-8200 is a highly innovative embedded enclosure design. Its highly configurable modularity makes it possible to expand or reduce a system without replacing the entire enclosure. Side wall modules may be added or removed as system requirements evolve. Three stan-dard profiles provide quick turn inventory availability. A broad portfolio of PC/104 SBC Options Ranging from low-power Intel® Atom™ to high performance 4th Generation Intel Core i7 Processors are available.

Potential aPPlications include: • Rugged Industrial Applications • Communications Applications • Mobile Routers and Other Network Appliances • Military and Defense – Rugged SFF • Railway Train Control • Transportation • Imaging Applications

ADLMES-8200 – High-Ingress Protection (IP) Modular Enclosure Systems

Systems


ADL Embedded Solutions Inc.www.adl-usa.com


FEATURES

ĄĄ Modular Sidewall Design Supports Variable PC/104 Stack Heights (2 - 6 Cards) or Expanded 3.5" SBC Intelligent Systems ĄĄ High and Low IP (Ingress Protection) Systems Possible via High IP,

Modular Chassis Design Coupled with Full Custom, Quick-Turn I/O PanelsĄĄ Broad Portfolio of PC/104 SBC Options Ranging from Low Power

Intel® E3800 Atom™ to High Performance 4th Generation Intel Core i7 ProcessorsĄĄ Fully Supported by ADL Embedded Solutions’ Team of Solidworks

Engineers for Model and or Design SupportĄĄ Options for MIL-STD 810, MIL-STD 461, and MIL-STD 704/1275





http://www.naii.com




http://www.naii.com

http://www.adl-usa.com

FEATURES

ĄĄ SWAP-C ReadyĄĄ 2RU or 3RU Chassis OptionsĄĄ Intel® Xeon® E5-2660 v3 Series processors, and Supermicro

X9DRT-IBFF motherboardsĄĄ Supports up to three 56 Gb/sec Infiniband (IB) or 40 Gbm Ethernet ports

to provide industry leading I/O bandwidthĄĄ Maximum system configuration and expansion flexibility with processor,

storage, high-speed switch, and system management modules optionsĄĄ Enhanced reliability for shock, vibration, and extended temperatureĄĄ 0° C to 55° C operating temperature rangeĄĄ 8% to 90% operating humidity (non-condensing)ĄĄ Operating vibration: 4.76 Grms, 5Hz to 2000Hz (SSD)ĄĄ MIL-STD 810F, EN60000, CE Mark

Suited for computing environments where server Size, Weight, and Power (SWAP) is important, Themis RES High Density (HD) servers are designed for virtualization, ISR, Big Data Analytics, radar processing, image processing, large Hadoop clusters, and a multitude of applications that require high-compute density and low latency access to large-data storage. RES HD Servers double compute density, enable a 50% savings in rack space, and reduce system weight by nearly 50% with per server weights as low as seven pounds.

Available in a 2RU (four bay) or 3RU (six bay) chassis, RES-HD servers provide maximum system configuration flexibility and functionality with processor, storage, high-speed switch, and system management module options. Combining leading-edge components that include Intel® Xeon® E5-2600 v3 Series processors and SuperMicro motherboards, RES servers feature expansion slots, extensive high-speed front or rear I/O, storage, and enhanced reliability options.

Themis High-Density Servers

Systems


Themis Computerwww.themis.com/hd

www.themis.com/headquartersandsales 510-252-0870 linkedin.com/company/17952 twitter.com/Themis_Computer

RTD’s scalable Gigabit Ethernet Switch Family maximizes network connectivity and system flexibility to create IoT solutions in rugged -40° to +85°C environments.

Our 8-port host module can connect directly to the PCIe/104 bus, or it can be used as a standalone GigE switch. The total number of Ethernet ports can be increased using 8-port expansion modules. Configured with RTD’s 88-watt synchronous power supply, a single system will support up to 56 total ports.

In board-level configurations, users can choose from RJ-45 jacks or 10-pin DIL connectors. RTD’s rugged, enclosed packaging can be config-ured with RJ-45 jacks or 37-pin D-sub receptacles.

Scalable GigE Switch Family

Systems




FEATURES

ĄĄ Eight 1000/100/10 Mbps Ethernet ports per sliceĄĄ Boards/slices stack together to increase total GigE portsĄĄ 10-pin DIL, 37-pin D-sub, or RJ-45 connectorsĄĄ BroadCom BCM53115 Unmanaged Gigabit Ethernet SwitchĄĄ Intel WG82574IT PCI Express Ethernet Controller for interface to

optional host CPUĄĄ Jumbo Frame Support (up to 9018 bytes)ĄĄ Auto MDI crossoverĄĄ Onboard LEDsĄĄ Connectors for external LEDsĄĄ Passive heat sinks includedĄĄ Available in stackable, rugged enclosuresĄĄ Fanless -40° to +85°C operating temperatures

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http://www.themis.com/headquartersandsales

mailto:[email protected]%EF%82%98

https://twitter.com/themis_computer

http://www.linkedin.com/company/17952

http://www.themis.com/hd

http://www.rtd.com



FEATURES

ĄĄ Multi-Core Intel® Atom™ E3800 ProcessorsĄĄ Up to two independent displays (VGA and DisplayPort)ĄĄ Two Ethernet Controllers with IEEE 1588 time stampingĄĄ Two RS-232/422/485 Serial portsĄĄ Internal Bus Expansion (Two MiniPCIe and IO60)ĄĄ Four USB ports (1xUSB 3.0 and 3xUSB 2.0)ĄĄ Bootable SATA, CFAST, and mSATAĄĄ Wide range 10 to 50V DC inputĄĄ Fanless -40° to +85°C operational temperature

The SYS-405 series of industrial computers utilizes the Intel® Atom™ E3800 family of processors in a tough aluminum enclosure. The solutions includes two Gigabit Ethernet controllers with IEEE 1588 time-stamping, two serial channels (RS-232/485/422), four USB, audio, and +10 to +50V DC input.

The rigid enclosure base is engineered for rugged applications and provides the thermal solution for the processor. The 5052 aluminum alloy enclosure protects the PCB assembly and includes access to the CFAST connector.

Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options. WinSystems provides driver for Linux and Windows 7/8, as well as pre-configured operating systems.

SYS-405 – Rugged Industrial Computers

Systems




FEATURES

ĄĄ Freescale® i.MX 6Q™ Industrial Processor @ 800MHzĄĄ Fanless -40° to +85°C operational temperatureĄĄ Powered by PoE or +10-50VDC InputĄĄ High Performance Video and GraphicsĄĄ Gigabit Ethernet (GbE) with IEEE-1588ĄĄ Six USB 2.0 Ports and One USB On-The-Go PortĄĄ Two CAN PortsĄĄ Five (RS-232/422/485) Serial Ports up to 1MbpsĄĄ 24 Lines GPIO Tolerant up to 30V DCĄĄ CFAST, SD, and MicroSD Sockets

WinSystems’ SYS-398Q quad-core industrial computer combines high-performance multimedia graphics with a rich mixture of Industrial I/O. The Freescale® i.MX 6Q™ processor’s integrated power management provides excellent efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphics applications in security, transportation, medical, and digital signage.

The low power, high-performance of ARM® cores coupled with readily available software tools make them an excellent choice for embedded systems. Leveraging Freescale’s proven track record in long term product support with the operating system and application development driven by consumer ARM® devices, the SYS-398Q is ideal for off-the-shelf industrial designs.

WinSystems OS starter image now ships with real time patches applied to the Linux kernel for improved determinism in process control applications.

SYS-398Q – Enclosed Industrial ARM with Real-Time Linux

Systems


















Accelerate Your Product Development Cycle

Speed up time-to-market with embedded solutions from WinSystems. Our industrial computers include expansion options, so customers can expedite prototyping and integration without the burden of CPU or carrier board design. These proven hardware platforms also provide the building blocks to create customized, application-specific designs. Products are in stock and available for immediate shipment from our Arlington, Texas facility.

Let our factory Application Engineers accelerate your capabilities.

715 Stadium Drive I Arlington, Texas 76011Phone: 817-274-7553 I Fax: 817-548-1358 [email protected]

Call 817-274-7553 or visit www.winsystems.com.Ask about our product evaluation!

Single Board Computers COM Express Solutions

Power SuppliesI/O Modules

Panel PCs

Small Form Factor ComputersIntel® Atom™ E3800 and i.MX6 CPUs

Fanless -40° to +85°C OperationMini PCIe and IO60 Expansion

PC/104 Single Board ComputersRugged, Stackable Form Factor

I/O Modules and Power Supplies

Industrial Computer SystemsOff-the-shelf and Custom Solutions

Fanless -40° to +85°C Operation



pc/104 and small form factors spring 2015 resource guide

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