our technology. your advantage. - nylund · optical display lamination and touch screen bonding 4.2...
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2 UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly
Our Technology. Your Advantage.
At Dymax we combine our product offering with our expert knowledge of light-cure technology. Where others only supply products, we are committed to developing a true collaborative partnership, bringing our total process knowledge to our customer’s specific application challenges.
Because we understand the process as a whole, and not just individual aspects of it, we can offer our customers a solution where chemistry and equipment work seamlessly together with maximum efficiency. Our application engineering team works side-by-side with our customers, providing assistance with testing, evaluation, and equipment selection if needed.
UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly 3
Dymax Materials for Electronics Assembly
Dymax one-part, solvent-free, UV light-curable electronic materials cure in seconds upon exposure to UV/Visible
light and can be used in a wide variety of applications for circuit protection and electronic assembly. The products
are electrically insulating and are designed for various operations including conformal coating, encapsulation,
bonding, keypad coatings, thermal management, masking, and display bonding and lamination. Most products are
available in multiple-viscosity grades, so the material flow may be tailored to the individual application. For
shadowed areas, several cure options are available, including Dual-Cure light/moisture cure and Multi-Cure®
light/heat cure technologies. IPC approved, MIL-I-46058C, and UL listed self-extinguishing grades are also
available.
Environmental Benefits of Dymax Light-Curable Materials
Dymax understands that safe, ecologically friendly products benefit our customers, the environment, and us. We have created materials with attributes that lower product costs, life-cycle costs, and ecological impact. These attributes include: Solvent-free materials Halogen-free materials RoHS compliance REACH - no substance of very high concern (SVHC) Eco-friendly, one-component materials
Dymax Halogen-Free conformal coatings, encapsulants, and adhesives are documented by an independent laboratory to meet or exceed standards set forth in IEC 61249-2-21. This international directive defines halogen-free as <900 ppm for chlorine, <900 ppm for bromine and <1,500 ppm total level of both combined. The current test method used for certification is BS EN 14582:2007.
Masking
Peelable Mask
Glob Top Encapsulant
Encapsulation Wire Tacking
Thermal Interface
Encapsulation
Staking
Conformal Coating
Strain Relief
Ruggedization/Cornerbond
Reinforcement
Cure-In-Place Gasket
4 UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly
Conformal Coatings
Reliable Board Protection in Seconds
Product Number*
Description Nominal Viscosity
(cP)
Durometer Hardness
Modulus of Elasticity MPa [psi]
Dielectric Strength (Volts/mil)
Approvals Halogen
Free?
9-20351-UR
Easy one-pass coverage of high-profile leads and tall components without seeping into shadowed areas
Secondary heat cure for shadowed areas
13,500 D60 30.3
[4,400] 500 –
9-20557
Medium viscosity for wetting components
Low modulus for thermal cycling performance
Secondary heat cure for shadowed areas
2,300 D60 37.9
[5,500] >1,500
MIL-I-46058C listed IPC-CC-830 approved
UL recognized
9-20557-LV
Low viscosity for thin coatings
Low modulus for enhanced thermal cycling performance
Secondary heat cure for shadowed areas
850 D70 310
[45,000] >1,500
MIL-I-46058C listed IPC-CC-830 approved
984-LVUF Rigid for high chemical and abrasion
resistance
Secondary heat cure for shadowed areas
160 D85 724
[1015,100] 1,800
MIL-I-46058 listed IPC-CC-830 approved
UL recognized
987 High chemical and abrasion resistance
Secondary heat cure for shadowed areas 150 D85
900 [130,000]
>1,500 MIL-I-46058 listed
IPC-CC-830 approved
9451
True black coating ideal for covering sensitive information
Secondary heat cure for shadowed areas
Optimized for single pass coating
6,000 - 717
[104,000] 1,200 UL 94V-0
9452-FC
Extremely low viscosity for film/flow coating applications
Very good thermal shock resistance
LED curable
Secondary heat cure for shadowed areas
Blue fluorescing
20 D60 1,137
[165,000] 1,000 UL 94V-0
9481-E
Room-temperature secondary moisture cure for shadowed areas
Highest chemical and abrasion resistance
Low viscosity for thin coatings
125 D75 150 [21,800] >1,500
MIL-I-46058 listed IPC-CC-830 approved
UL 94V-0 UL 746E
9482
Room-temperature secondary moisture cure for shadowed areas
Superior re-workability
Chemical and thermal shock resistance
1,100 D70 275 [40,000] 1,100
MIL-I-46058 listed IPC-CC-830 approved
UL 94V-0 UL 746E
*Other grades are available for specific applications requiring physical properties different from standard products listed here. NOTE: Consult Dymax Conformal Coating Validation Report for more detailed information on conformal coatings.
Blue Fluorescing Coatings
Ultra-Red® Fluorescing
Coatings
Coatings with Secondary Heat or Moisture Cure
Solvent free Adhesion to flex circuit substrates (FPC)
Tack-free UV cures in seconds Low stress under thermal cycling
Excellent environmental resistance Rigid and flexible coatings available
Black grades available Variety of available viscosities
UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly 5
Thermal Interface Adhesives Efficient Thermal Transfer Between Heat Sinks and Electronics
Product Number
Description Applications Thermal
Conductivity Nominal
Viscosity (cP) Halogen
Free?
9-20801 Light cure in seconds
Secondary activator or heat cure for shadowed areas*
Highly thixotropic for optimal placement
Mounting heat sinks on PCBs
LED heat dissipation 0.9 W/m*K 110,000
*Dymax 501-E is the recommended activator for shadowed areas
Bonding Heat Sinks
Sets in seconds with light exposure Low stress for mismatched CTE’s
Cure shadow areas with activator or heat Room-temperature storage and cure
High-strength bonds
Chip Encapsulants and Wire Bonders For Superior Protection on Flexible and Rigid Platforms
Product Number
Description Applications Durometer Hardness
Nominal Viscosity
(cP)
Elongation at Break
(%)
Modulus of Elasticity MPa [psi]
Halogen Free?
9001-E-v3.1 UV/Visible light cure for fastest
processing
Secondary heat cure for shadowed areas
Multiple viscosities available for optimal flow and coverage
Low modulus for wire bonding
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding
Bare-die encapsulation
D45
4,500
150 17 [2,500]
9001-E-v3.5 17,000
9001-E-v3.7 50,000
9008
Flexible
Highly moisture-resistant bonds to diverse surfaces such as polyimide, DAP, glass, epoxy board, metal, PET
High adhesion, even at -40°C
Chip-on-flex encapsulation
Flex circuit bonding and attachment to PCB and glass
A85 4,500 300 –
9101 UV/Visible light cure with secondary
moisture cure
Flexible
Moisture and thermal resistance
Chip-on-board
Chip-on-flex
Chip-on-glass
Wire bonding
D30-D50
7,000 38 17.5 [2,550]
9102 17,000 34 18.4 [2,670]
9103 25,000 36 17.6 [2,560]
Secondary Heat or Moisture Cure
Chip Encapsulants
Flex Circuit Encapsulants/ Wire Bonding
Black Encapsulants
100% solvent free Low stress under thermal cycling
Instant UV/Visible cures Electrically insulating
High ionic purity Room-temperature storage
Tenacious adhesion to flex circuit substrates (polyimide and PET)
Thermal shock and moisture resistance
6 UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly
Ruggedization Photocurable Technology Offers Lower Costs and Increased Productivity
Product Number
Description and Applications Nominal Viscosity
(cP)
Durometer Hardness
Tensile @ Break
MPa [psi]
Cure Depth mm [in]
Halogen Free?
9309-SC Highly thixotropic
Formulated with See-Cure technology for easy visual confirmation of full cure
45,000 D57 22 [3,000] 6.5 [0.26]
9422-SC
Highly thixotropic for optimal placement and wetting of components
Formulated with See-Cure technology for easy visual confirmation of full cure
38,000 D50 16 [2,300] 6.5 [0.26]
Peelable Masks
Product Number Description and Applications Cure Depth**
(mm [in]) Durometer Hardness
Cure Speed* (sec)
Viscosity (cP)
Halogen Free?
9-20479-B-REV-A
Wave-solder resistant
Blue color for easy visual inspection
Highly thixotropic for manual or automated dispensing
4.90 [0.19] A70 1 150,000
9-318-F Wave-solder resistant
Fluoresces blue for easy inspection
Very fast curing
6.40 [0.25] A55 <4 50,000
9-7001 Wave-solder resistant
Visible pink color in uncured state
Lower shrinkage
8.36 [0.33] A70 1 40,000
* Cure speed depends on the intensity and distance from the light source. Cure speed was measured at an intensity of 175 mW/cm2. ** 5 second cure
Fluorescing Mask
Electronic Mask
Peelable Mask
100% solids Fluorescing and colored grades
UV/Visible cure in seconds One part – no mixing
No ionic contamination
Ruggedizing
Fast dispense and cure Holds shape after dispense
Simple visual inspection (See-Cure blue-to-colorless change)
Improved bond strength for die and pry testing
Reduce stress on interconnects during push, pull, shock, drop, and vibration
Engineered bead shape for wetting both board surface and component edge without seeping into shadowed area
Easy rework Jettable
Leadless Component
Edgebonding/ Cornerbonding
UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly 7
Acrylated Urethane Potting and Sealing For Shallow Potting in 10-30 Seconds or Less – Highest Adhesion to Substrates
Product Number
Description and Applications Recommended
Substrates
UV Cure* Speed (sec)/
Depth (mm [in])
Durometer Hardness
Nominal Viscosity
(cP)
Halogen Free?
921-T Connectors, thermal switches
Tamperproofing
Translucent bonds with high adhesion
ABS, filled nylon, metal, glass
30/6.4 [0.25] D75
3,500
921-VT 11,000
921-Gel 25,000
9001-E V3.1 Sensors
Flexible
Excellent adhesion to engineering plastics
ABS, PC, PVC, FR-4, metals
15/6.4 [0.25] D45
4,500
9001-E V3.5 17,000
9001-E V3.7 50,000
*UV cure speed depends on the intensity reaching the surface of the resin. Cure speed was measured at an intensity of 175 mW/cm2.
LED Encapsulating
Bonding, Potting, and Sealing in Seconds
Product Number
Description Applications Linear
Shrinkage (%)
Nominal Viscosity
(cP)
HalogenFree?
LIGHT-CAP® 9622
UV/Visible light cure in seconds
No mixing required
Heat resistant to 100°C
Resistant to long-term UV exposure
High light transmittance
Durometer between silicone and epoxy
Instant casting of LEDs
Rapid forming of protective optical lens 0.79 12,000
LED Airport Flight Display
LED Light
One component, no mixing required
Enhances light transmittance
Fast cure
Solvent free
Resistant to heat-induced yellowing
Optically clear
Cable Potting
Deep Layer Potting
Chip Potting
Full UV/Visible cure in seconds
Solvent free
High adhesion to substrates
Flexible and rigid products available
8 UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly
Display Bonding and Laminating
Product Number
Description Applications Volumetric Shrinkage
(%)
Nominal Viscosity
(cP)
HalogenFree?
9701
Excellent re-workability
Good thermal shock resistance
Low shrinkage
Non-yellowing
Optical display lamination and touch screen bonding
4.9 200
9702
Excellent re-workability
Good thermal shock resistance
Low shrinkage
Non-yellowing
Optical display lamination and touch screen bonding
4.2 950
9703
Excellent re-workability
Good thermal shock resistance
Low shrinkage
Non-yellowing
Optical display lamination and edge damming
4.2 30,000
Touch Screen Lamination with 9700-Series Adhesives
Touch Screen or Cover Window Optical Bonding
One component, no mixing required
Flexible
Fast cure
Bonds various substrates
Resistant to yellowing High optical clarity
Wire Tacking Photocurable Technology Offers Lower Costs and Increased Productivity
Product Number
Description Nominal
Viscosity (cP) Durometer Hardness
Tensile @ Break MPa [psi]
Halogen Free?
9-911 Rev A On-demand cure for optimal positioning
Exposed areas cure in seconds for immediate strength
36,000 D80 28 [4,000]
Instant UV cure Fluorescing additive for in-line quality control
One part Excellent adhesion to solder masks and wires
Solvent free Thermal shock and moisture resistance
Unlimited pot life
Wire Tacking
UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly 9
Dymax Adhesive Technologies
See-Cure Technology
Dymax light-curable adhesives with patented See-Cure technology have built-in
cure validation that makes it easy for operators or simple automated inspection
equipment to confirm cure without investing in additional specialized equipment.
See-Cure technology is an indicator of cure that intentionally transitions the color
of the adhesive after it has cured and builds a visible safety factor into the
assembly process.
Ultra-Red™ Fluorescing Technology
Ultra-Red™ fluorescing technology, formulated into Dymax adhesives, enhances
bond-line inspection processes and product authentication. The adhesives
remain clear until exposed to low-intensity UV light at which point they fluoresce
bright red. This is particularly effective while bonding plastics that naturally
fluoresce blue, such as PVC and PET. Ultra-Red technology also produces a
unique spectral signature that can be used by manufacturers for product
authentication.
Multi-Cure® Light/Heat-Cure Technology
Multi-Cure adhesives combine the high-speed cure of UV or UV/Visible light with
secondary cure mechanisms that enhance polymerization. Secondary cure
mechanisms, which include thermal (heat) cure or activator cure, are useful when
light can only reach a portion of the bond line, or when tacking a part prior to
thermal cure to allow easier handling and transport during the manufacturing
process.
Dual-Cure Light/Moisture-Cure Technology
Dual-Cure coatings are formulated to ensure complete cure in applications where
shadowed areas on high-density circuit boards are a concern. Previously, areas
shadowed from light were managed by selective coating – eliminating the need to
cure in shadowed areas – or a secondary heat-cure process. Shadowed areas
cure over time with moisture, eliminating the need for that second process step
or concerns of component life degradation due to temperature exposure.
LED Light-Curable Adhesives
Dymax offers specially formulated LED light-curable adhesives for use with
Dymax LED UV/Visible light-curing systems. The adhesives range from fast to
ultra-fast cure speeds in order to accommodate specific electronic assembly
needs.
10 UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly
Flood Chambers and Conveyor Curing Systems for Electronic and Photonic Applications
Successful UV processing demands that the curing equipment be matched to the resin to optimize both
performance and cost savings. Dymax manufactures UV light-curable resins and UV light-curing equipment and
specializes in the optimization of UV light-curing processes. Our technical specialists are ready to help you
optimize your process, and maximize your profit and product performance. For resin and equipment selection
assistance please contact Dymax Application Engineering.
Dymax 5000 Flood Lamp Systems
Most Popular and Versatile
Ideal for potting, sealing, and encapsulating applications
Dymax 2000 Flood Lamp Systems
Largest Cure Area
Ideal for LED and masking applications
Dymax UVCS Series UV Curing Conveyor Systems with 5000-EC Lamps
Ideal for conformal coating applications
Dymax Heavy-Duty UV Curing WIDECURE Conveyor Systems
Ideal for curing adhesives, coatings, and inks
UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly 11
UV Light-Curing Spot Lamps for Electronic and Photonic Applications
Dispensing Systems
Dymax has developed high-quality, field-proven dispense systems to fit
many types of adhesive and fluid dispensing applications. These systems
include various automated and manual dispensing valves, spray valves
and guns, controllers, material reservoirs, and related components for
seamless integration into assembly processes. The systems provide
accurate, consistent dispense for a range of low- to high-viscosity fluids.
Dispensing systems with adjustable suck-back control and dispensing
valves that offer contaminate-free dispensing are available.
Liquid Lightguides
Come in an assortment of sizes and split wand configurations
ACCU-CAL™ 50 Radiometer
Ideal for process monitoring
Dymax BlueWave® 200 Version 3.0
UV-Curing Spot Lamp
Ideal for fastest processing of small curing areas
Dymax BlueWave® LED Prime UVA
Visible Spot Light-Curing System
Ideal for cool spot curing coatings
© 2003-2017 Dymax Corporation. All rights reserved. All trademarks in this guide, except where noted, are the property of, or used under license by Dymax Corporation, U.S.A.
The data contained in this bulletin is of a general nature and is based on laboratory test conditions. Dymax does not warrant the data contained in this bulletin. Any warranty applicable to the product, its application and use is strictly limited to that contained in Dymax’s standard Conditions of Sale. Dymax does not assume responsibility for test or performance results obtained by users. It is the user’s responsibility to determine the suitability for the product application and purposes and the suitability for use in the user’s intended manufacturing apparatus and methods. The user should adopt such precautions and use guidelines as may be reasonably advisable or necessary for the protection of property and persons. Nothing in this bulletin shall act as a representation that the product use or application will not infringe a patent owned by someone other than Dymax or act as a grant of license under any Dymax Corporation Patent. Dymax recommends that each user adequately test its proposed use and application before actual repetitive use, using the data contained in this bulletin as a general guide. LIT019 2/8/2017
Dymax Corporation +1.860.482.1010 | [email protected] | www.dymax.com
Dymax Oligomers & Coatings +1.860.626.7006 | [email protected] | www.dymax-oc.com
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Dymax Europe GmbH +49 611.962.7900 | [email protected] | www.dymax.de
Dymax UV Adhesives & Equipment (Shanghai) Co. Ltd. +86.21.37285759 | [email protected] | www.dymax.com.cn
Dymax Asia Pacific Pte. Ltd. +65.6752.2887 | [email protected] | www.dymax-ap.com
Dymax Engineering Adhesives Ireland Ltd. +353 21.237.3016 | [email protected] | www.dymax.ie
Dymax UV Adhesives & Equipment (Shenzhen) Co. Ltd. +86.755.83485759 | [email protected] | www.dymax.com.cn
Dymax Korea LLC +82.2.784.3434 | [email protected] | www.dymax.com/kr
Reduced environmental impact and energy conservation are core pillars of the Dymax mission. Over the last
30 years, Dymax light-curable materials and curing equipment have become the industry standard for fast,
environmentally conscious assembly. Dymax products replace technologies that contain hazardous ingredients,
produce waste, or require higher amounts of energy to process. Dymax understands that safe ecologically friendly
products benefit our customers, the environment, and us. We have created materials with attributes that lower
product costs, life-cycle costs, and ecological impact.
Dymax Eco underlines the Dymax commitment to the environment. Information for Environmental Health and
Safety officers, government officials, and engineers to assist in making informed decisions when comparing
assembly processes is available by visiting www.dymax.com/eco.