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© Fraunhofer IISB, 2015

Über APC (hinaus): Auf der Spur von Industrie 4.0 in der Halbleiterfertigung

Jahrestagung des Fraunhofer IISB – 20. November 2015

Dr. Martin Schellenberger Fraunhofer IISB, Erlangen [email protected]

mailto:[email protected]


Industrie 4.0 und cyber-physische Systeme (CPS)

Ein Blick in die Halbleiterfertigung

Automatisierte Prozesskontrolle (APC)

Von „APC-fähigen“ Geräten zu cyber-physischen Systemen

Zusammenfassung und Ausblick


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3


Industry 4.0 History

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: D

FKI (2

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1),

sie

me

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com

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Customer

Integrated

Engineering

Application

Scenarios

Resilient

Fab

Self-

organizing,

adaptive

Logistics

Technology

data

Marketplace

Sustainability

by

Up-Cycling

Intelligent

Maintenance

Smart Factory

Architecture

Networked

Production

Industry 4.0 Application Scenarios

5

“robustness and adaptability”


Apparently: CPS is a foundation of resilient manufacturing – but …

… what is a CPS?

Wikipedia:

A cyber-physical system (CPS) is a system of collaborating computational elements controlling physical entities. Today, a precursor generation of cyber-physical systems can be found in areas as diverse as aerospace, automotive, chemical processes, civil infrastructure, energy, healthcare, manufacturing, transportation, entertainment, and consumer appliances. This generation is often referred to as embedded systems. In embedded systems the emphasis tends to be more on the computational elements, and less on an intense link between the computational and physical elements.

Industry 4.0 Cyber Physical Systems

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https://en.wikipedia.org/wiki/Embedded_system


Industry 4.0 Many Open Questions

7

“… 85% of the experts are convinced that most German companies have no clear understanding of Industry 4.0”


Industry 4.0 Many Open Questions

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“32% of the managers claim that they have not yet heard or read about Industry 4.0”








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Sources: finfacts.ie, computer-oiger.de, xbitlabs.com, de.wikipedia.org, dailytech.com

Semiconductor Manufacturing … what comes to mind

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Semiconductor Manufacturing A semiconductor view on “Industry 4.0”

Dr. T. Kaufmann,

Infineon

11th

Innovationsforum

for automation,

2014, Dresden

11


Semiconductor Manufacturing … what comes to mind

x4

x5

- high growth trend (9% over the last 20 years)

- high volatility

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Automatis ierte Prozesskontrolle (APC)




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Objective: Ensure high productiv ity and product quality

Fundamental goals of APC (“Advanced Process Control”)

to apply measures for process control close to the process

to automate control actions

Typical APC methods (SEMI E133):

SPC, FDC, FP, RtR, VM, PdM

Basis for APC:

Metrology data

Data from equipment & processes

Logistics data

APC in semiconductor manufacturing „Big data“ and Advanced Process Control

Statistical Process Control

Fault Detection and Classification

Fault Prediction

Run-to-Run Control

Virtual Metrology

Predictive Maintenance

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APC in semiconductor manufacturing Interaction of APC elements

Process n+1

Process data

Sensors Process n-1

Run-to-run control

Fault detection and classification (FDC)

Process n

Process data

Process data

Download of parameters

go / no go

Feed

forward

Feedback

(Virtual) Metrology

(Virtual) Metrology

Predictive Maintenance (PdM)

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APC in semiconductor manufacturing Examples for productivity enhancement by APC

Real-time control of plasma processes by integrated OES

Higher productivity at equipment level

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Prediction of maintenance events by PdM

Optimized tool operation and maintenance planning

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40

60

80

100

120

Tim

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o b

reak

do

wn

Time

Prognosis

Real time tobreakdown

new used broken

Ion source

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Prediction of quality parameters by v irtual metrology

Tight process control by “measuring” every wafer

Prediction of etch depth by VM - predicted data vs. metrology results

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Flexible sampling and predictive scheduling with W@R* indicator

Best quality control with minimized number of measurements


* Wafers at risk = amount of uncontrolled wafers

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APC in the Backend: Wedge-wedge wire bonding

Development of PdM system for optimized wedge tool usage

Tool tip with contamination: Correlate wear status with quality parameters and

equipment parameters

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APC in semiconductor manufacturing Estimation of benefits – RoI

Investment assessment for APC in semiconductor manufacturing

Identification of economic effects from APC – possible savings and cost

Development of models to calculate economical figures of merit, e.g., RoI, payback period

FMEA to identify and quantify new risks from the introduction of APC

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es

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Plasma Etcher Dielectric CVD Ion Implanter

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APC in semiconductor manufacturing Structured approach for development and deployment

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CPS are based on connectivity (IoT)

CPS run complex analytics

CPS extract knowledge from raw data

A cyber-physical system is characterized by a physical asset, such as a machine, and its digital twin; basically a software model that mimics the behavior of the physical asset. In contrast, the IoT in common parlance is generally limited to the physical assets, not their digital models.

From APC-enabled equipment to CPS Cyber Physical Systems – basis for Industry 4.0

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Properties of a Cyber Phys ical System

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INTERNAL EXTERNAL

From APC-enabled equipment to CPS Cyber Physical Systems – basis for Industry 4.0

25








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„Industry 4.0“

Mostly linear production processes

Combine physical objects with “intelligence” “cyber-physical systems”

Semiconductor Manufacturing

Most complex manufacturing chain

Evolving to “augmenting reactive with predictive”

Resilient

Fab

Self-

organizing,

adaptive

Logistics

Intelligent

Maintenance

Smart

Factory

Architecture

Custom

Tailored

Production Process

Control

Systems

Predictive

Scheduling

Predictive

Maintenance

Smart Fab

High mix –

low volume

Zusammenfassung und Ausblick Über APC (hinaus)

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Miss ion of Fraunhofer IISB

Merge “Industry 4.0” trend with “augmenting reactive with predictive” trend

From “APC-enhanced equipment” to “cyber-physical systems”

Intelligent Logistics

Intelligent Manufacturing

Intelligent Fabs

… … Process

Control

Systems Predictive

Scheduling

Predictive

Maintenance

Smart Fab High mix –

low volume


28


Miss ion of Fraunhofer IISB

Merge “Industry 4.0” trend with “augmenting reactive with predictive” trend

From “APC-enhanced equipment” to “cyber-physical systems”

Intelligent Logistics

Intelligent Manufacturing

Intelligent Fabs

… … Process

Control

Systems Predictive

Scheduling

Predictive

Maintenance

Smart Fab High mix –

low volume


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Dr. Production

Our solution package for APC

Consulting

Concept development

Data collection

Data evaluation

APC prototype solutions, based on

our APC “toolbox”


Achievements in semiconductor manufacturing

Standards and automation concepts evolved over more than 35 years

Proven as basis for improving productivity

Potential for other industries

“Hold on to what is good” – knowledge and definitions

Well experienced R&D and suppliers available

The chance of working together

From APC-enhanced equipment to cyber-physical systems

“Dr. Production”: proven principles to solve manufacturing problems


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Outline Acknowledgment

Part of the presented work has been performed within the context of

the European ENIAC projects IMPROVE and EPPL,

the EU projects SEA-NET and SEAL.

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Danke

für Ihre Aufmerksamkeit!

Dr. Martin Schellenberger Fraunhofer IISB, Erlangen [email protected]

mailto:[email protected]

Über apc (hinaus): auf der spur von industrie 4.0 in der ... · standards and automation concepts...

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