nepcon west - national electronic packaging and production … · 2008-07-15 · technicalsession35...

Proceedingsof the

Technical

ProgramVolume III

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Conference: February 24-28,1991 Exposition: February 25-28,1991Anaheim Convention Center Anaheim, California

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lNpOR^uUj;:^r:OTHEKA World Class Electronic Manufacturing Event

TECHNICAL SESSION 32

Waste Treatment for the Board ShopChairman: Jim McCarron, Director, Training 'n' Technology, Inc.

"Waste Minimization - The Economics and Technical Impact of Waste Minimization Projectfor a Printed Orcait Shop" 139?

Victoria R. Allies, President, TNT Technology Co.

'Criteria Used for Selection of Technology, System Design, and Vendor Qualifications for

a High Quality Printed Circuit Board Facility' N/A

Gary McCauley, Process Engineer, Cray Research, Inc.

•Why Have a Batch Waste Treatment System in Your PC Shop" 1407

Conrad J. Micale, Technical Sales Representative, Circuit Image Systems and

Richard D. Hallack, A-10 Equipment Corp.

"Mebranes for Waste Minimization and Recycling' 1410

William W. Coudie, Technical Consultant, and Americus C. Vitalc, Market Development Manager, DuPont Co.

'An Update on the Regulations, Cost of Compliance and

Some Suggestions on How to Meet the California Regulations* N/ASteven P. Carnevale, President, Hazardous Chemical Safety Consultants

"Organizing a Task Force for Regulatory Compliance" 1419

Rich Rolfe and Rich Van Langcn, Orange County Sanitation District


Sample Inspection Option of MIL-STD-2000: Results

Chairman: Mike La Versa, Continuous Process Improvement, Inc.

Tri-Service SPC Initiative at TT N/A

John Pulliam, Manager QRPS - Avionic Systems, Texas Instruments

"Sample Inspection Results at Norden' 1423

David Wentz, Manager Product Assurance Eng, Norden

•SPC and Process Improvement at ITT Avionics* N/ADick Pilkington, SPC Coordinator, ITT Avionics


Design tor ManufacturingChairman: Peter Chai, Texas Instruments

"Design For Manufacturing in Solving Design Challenges in the Electronics Industry" 1434John Cocco, Sr. Technical Service Eng, Louis MolTa and Dennis Callanan, Loctite Corporation

"Bridging the Gap Between Design and Manufacturing' 1451Dick Gunderson, Mfg. Development Eng. Mgr., ADC Telecommunications

"Manufacturing Simulation Model of a PCB and Test Facility' 1457Gerald Lindner, Sr. Automation Systems Eng, Unisys Corporation

"Knowledge-Based System for Designing PCS With High Speed and High Frequency Circuit 1478Wei Xu Huang, Design Engineer, Compact Software, Inc.; Q. Xiang, Marotta Scientific Control, Inc.;M.C. Leu, New Jersey Institute of Technology


MulMchip Connections

Chairman/Co-Speaker. Wulf H. Knausenberger, AT&T Bell Labs.

Co-chairman: AG Lubowe, AT&T Bell Labs

•A High Density Land Grid Array Connector for MCMV 1491

Michael E St Lawrence and Scott Simpson, Rogers Corp.

"Elastomeric Connectors: Attributes, Comparisons and Potential' 1512

William R. Lambert and Wulf H. Knausenberger, AT&T Bell Labs

"MCMs Interconnection Options* 1527

Martin Freedman, AMP Inc.

'Applications of Coplanax Pleasure Connectors' 1530

Ron Kuntz, Unisys

"ModuPafc A New, Low Cost, High Speed MCM Socketing System ' 1537

Dimitri Grabbe, AMP Inc

* Organized by International Electronics Packaging Society


Improving Quality and Reliability Through Process Control

Chairman: MeMn Scott, U.S. Navy, Electronics Mfg. Productivity Facility

Ultrasonic Cleaning of Military Printed Wiring Assemblies' 1541

Tim Crawford and Bill Vuono, U.S. Navy, Electronics Mfg. Productivity Facility

"Manual Soldering Process Monitoring System Software' 1552

Tim Kertis, U.S. Navy, Electronics Mfg. Productivity Facility

"Solder Paste Tackiness' 1561

Hamid Farsad, U.S. Navy, Electronics Mfg. Productivity Facility

"Hot Airknifc Effects on Wave Soldered Printed Circuit Assemblies' 1572

Tim Scott, U.S. Navy, Electronics Mfg. Productivity Facility

'An Alternative Look at Automated Laser Inspection" 1591

Joel Mearig, U.S. Navy, Electronics Mfg. Productivity Facility

"Material Solderabflity. 1960-1990' 1605

John Guy, U.S. Navy, Electronics Mfg. Productivity Facility


Panel Discussion

Regulatory/Environmental Issues for the *90*s

Chairman: Thomas Kozinski, Photo Chemical Machining Institute 1619

Co-Chairman: Robert Capaccio, Mabbett, Capaccio & Associates

Panelists:

•OSHA* Steven Witt, Special Assistant to the Assistant Secretary, U.S. Department of Labor - OSHA

"Enforcement* George Van Cleve, Deputy Assistant Attorney General, U.S. Department of Justice,Environment & Natural Resource Division

"Hazardous Waste "Land Ban" Robert Scarberry, Regualatory Affairs Manager, Chmeical Waste Management, Inc.

Air Quality Regulations' Ken Bigos, Chief of Air Operations Branch, EPA Air & Toxic Operations Branch

" NPDES for POTWs/Future POTW User Regulations* Robert Wills, Chief of the Sludge Pretreatment and

Storm Water Section, U.S. EPA

* Organized by the Photo Chemical Machining Institute


Non-CFC f*»"fag Alternatives: No-Clean and Water-Clean

Chairman: Kai-Lam Wun, Hewlett Packard Co.

"A Comparison of Foam Fluxing Versus Spray Fluxing for Non-dean Wave Soldering* 1623Mona Ostrander, Development Engineer, Kai Lam Wun and Jim Baker, Hewlett Packard Co.

Implementation of the No-Clean Process in SMD Assembly* 1640

George Allen, Senior Chemist, Apple Computers, Inc.

The No-Clean Alternatives to CFC* 1643Dr. Wallace Rubin, Technical Director, Multicore Solders Limited

"No-Clean Solder Paste Evaluation" 1649Irene Sterian, Staff Engineer, Kevin Posivy, Jim White and Betty Hicks, IBM Canada Ltd.

TECHNICAL SESSION 39Advances in SMT Mass Reflow Soldering Technology

Chairman/Speaker. Stephen Dow, Reflow Systems Product Manager, Conceptronic U.S.A

•Local Soldering with Light Beam Using Optical Fiber" 1661Makoto Kobayashi, M. Matsushita Industrial Equipment Corp. and Marty Weil, PFA

The Use of Pattern-Specific Infrared Energy for Removal and Replacement of SMT Components" 1683Dave Helton, Conceptronics U.S.A

"High Quality Control High Mix Reflow with Forced Convection and Medium Wave Radiation' 1690Norbert Mittelstadt, Sales Manager, and Roland Meibner, Heraeus

"Practical Steps to Thermal Profiling on Forced Convection Reflow Systems' 1697Francois Parent, Engineer, Electrovert, Ltd.

"Development of a Controlled Atmosphere Forced Convection Reflow System" 1703Stephen Dow, Reflow Systems Product Manager, Conceptronic U.S.A


Reducing Soldering Defects

Chairman: Charles Lowell Senior Scientist, Hollis Automation

"SMT Wave Soldering Techniques" 1717

Charles Lowell, Senior Scientist, Robert M. Botham, Richard A Burke and Janet R. Sterrilt, Hollis Automation

"Benefits of Inert Oas Soldering' 1728

Gert Schouten, Engineer, Dover Soltec

Via Starvation Teaching Old Vias New Tricks" N/A

Darrel Baker, Marketing Manager, Mentor Graphics Corp.

"Preventing Rejects When Plating Circuit Boards, Memory Disks, Electrical Contacts and

Other Electrical Components" 1735

Jack Berg, President, Serfilco, Ltd.

"Reducing Copper Plating Pita in PWB's* 1742

Richard Olson, Supervisor, DuPont

"Identifying Residues After Inert Wave Soldering' 1754

Donald A Elliott, Director of Advanced Technology, Elcctrovcrt


Selecting X-Ray Based Inspection Technologies for Circuit Boards and Other Electrical ComponentsChairman/Speaker. Richard Bossi, Boeing Aerospace & Electronics

Co-Chairman: Robert Kruse, Boeing Aerospace & Electronics

"X-Ray Computed Tomography Inspection Techniques on Electrical Components' 1761

Richard Bossi, Boeing Aerospace & Electronics

"Economics of Process Control in SMT Assembly" 1770

T. Strocbcl, IRT Corporation

•Qualification and Implementation of an Automated X-Ray Inspection System' N/A

Steve Rooks and Thilo Sacks, IBM Canada Ltd.

"X-Ray Computed Laminography for PWA Inner-Layer Trace Analysis' 1788

Mike Dixon, Scientific Measurement Systems

'Automated X-Ray Inspection of Hidden Solder Joint In A Thick and Dense Multi-Layer Circuit Board' N/A

Dr. Sukumar Sikdar, Unisys and Dr. Arthur H Rogers, Synergistic Detector Designs


Quality A Reliability in Design/DevelopmentChairman/Speaker. Dr. Nien-Tsu Shen, Quality Engineering Manager, Digital Equipment Corp.

•Frontend Loaded Quality' I801

Dr. Nien-Tsu Shen, Quality Engineering Manager, Digital Equipment Corporation

"Robust Design with Examples' 1803

Marilyn Hwan, Statistician, LSI Logic

•Design for Manufacturability - Case Study - VAX9000 HDSC Packaging" 1815

Dr. Vincent Wang, Engineer Manager, DEC

Translating Customer's Requirements into Design - Everlasting Solution to a Problem" N/A

Dr. Amanual Gobena, Corporate SPC Manager, National Semiconductor


Passive Components for Mulrfcnip Modules

Chairman/Speaker. Gordon Love, ALCOA Electronic Systems

"An Overview of the Choices of Passive Components in MCM-D Technology" 1821

Gordon Love, Alcoa and John Baldc, IDC Corporation

"Using Discrete Resistors and Capacitors for Murdchip Modules" 1825

Dr. Linton Salmon, Bringham Young University

•Capacitors with Silicon Substrates' N/A

Nick Teneketges, Space Corporation

Thin Film Capacitors, Tantalum Pentoxide or Barium TUanate?' 1833

John F. McDonald and To-Ming Lu, P. Li, EJ. Rymaszcwski and H.J. Grcub, Rensselaer Polytechnic Institute



Integrating SMT/PTH Into a Focused FactoryChairman: Tim Pilson, Alcatel

"Successful Management of a Focused Factory Means Team Work' 1844

John Powers, Alcatel Network Systems

"Line Configuration Options For a Focused Factory* N/A

William H. Odcn, GE Mobile Communications

Front-End Planning For a Focused Factory" 1852

Timothy G. Pilson, Alcatel Network Systems

"Process Challenges with SMT' 1861

Joel Scutchfiekl, United Technologies

IBM Surface Mount Technology Introduction* N/A

Stan Jensen, IBM Corp.


Semi-Aqueous Deflodng of SMT Assemblies

Chairman/Co-Spcaker. Robert Pfahl, Jr., Director, Motorola, Inc.

•Environmental Advantages of The Semi-Aqueous Cleaning Process* 1870

Dr. Kenneth T. Dishart, Research Associate, E.T., DuPont de Nemours & Company, Inc.

•Comparison of Technologies for SeminAqueous Cleaning' 1883

L A Hagncr, Senior Staff Engineer; R.C. Pfahl, Director; J.A. Wretzel, Senior Staff Engineer, Motorola, Inc.

"SemkAqueous Cleaning, The Environmental Issues" 1897

Gary Attalla, Product Manager Cleaner Division, Vitronics Corporation

•New Semi-Aqueous Cleaning Equipment For High Volume Applications* N/A

Donald R. Gerard, Director of Engineering, Detrex Corporation

Equipment Design Considerations for SemUAqueous Cleaning* 1907

Jonathan Harman, V.P. - Marketing Product Development, Crest Ultrasonics

TECHNICAL SESSION 46The Future Trends of Polymer Thick FDm for the Mid-1990'i in Multilayer and Interconnection Circuitry

Chairman: Ken Russell, President, Minico, Asahi Chemical of America

Infrared Curing of Polymer Thick and Conductive Adhesive Materiali" 1915Art Schneiderwind, Manager of Research and Development, Lindbcrg

Test Method of PTF for Telecommunications' N/ARoger Finn, Bell Northern Research

"Application of PTF in Computer Fabrication" N/ASteve Duncan, IBM

"Vapor Phase Curing of Polymer Thick Film and Adhesives' 1925Nile Plapp, V.P. - Technical Marketing, Centech Corporation

"New Copper Polymer Thick FDm Makes 100% Additive Process Production a Reality for High Density and

Multilayer Interconnections" 1927Ken Russell, President, Minico, Asahi Chemical of America

"Preftooroporyethers, Versatile Primary Fluids for Vapour Phase Curing of Thermosetting Polymers" 1942R.S. Briggs and P. Srinivasan, EniMont UK Ltd.

•Conductive Epoxy Surface Mount Adhesive For Solder Replacement' 1955Justin C. Bolger, Emerson & Cuming Inc., (W.R. Grace)


Practical Approach to Fine Pitch Rework

Chairman/Speaker. Wilfred A Bcrnier, Process Engineer, AT&T Technologies

"Who' of the Rework Process' N/AWilfred A Bernier, Process Engineer, AT&T Technologies

"Where* of the Rework Process" 1965John Romano, Sales Manager, SRT Research Technology

"HoV of the Rework Process' N/AJose Angullio, Factory Development Engineer, Hewlett Packard

"Whaf of the Rework Process' 1968

Kirbit Cole, Engineer, AT&T


Requirements for Solder Mask for F-PD.'s with Regard to Compatibutiy with Flux and Solder Paste

Chairman/Speaker: James P. Langan, Engineering Consultant, SMT Consulting Services

Impact of the Water Cleaning Process on High Density SMD Assemblies' 1975

Vern Solberg, Marketing Manager - New Product Development, SCI Manufacturing Co.

"PCS Solder Mask and Flux CbmpatMlty' 1981

Timothy Slima, Walter Wickem and Tim Young, Process Engineers, N.CR. Corporation

"Double Sided Electrostatic Spray Coatings for Fine Pitch SMDV N/ADr. Lawrence Crane, Research Director, W.R. Grace & Company

•Low Residue Flux with Curtain Coated Solder Resist' N/A

Anthony Lore, Manager - Technical Service, CIBA GEIGY

•Solder Mask Requirements For Fine Pitch SMDV N/A

William Sepp, Marketing Manager, Lea Ronal Inc

"Flux Considerations for PhotoimageablB Solder Mask for High Density Assemblies' 1987

James P. Langan, Engineering Consultant, IP. Langan Associates


A New Decade in Bare Board TestingChairman/Speaker: Michael Mathews, Manager - Technical Marketing, DIT-MCO International

Trxturing Considerations for Bare Board Testing* 1993Joseph Creeden, President, Interface Technology and George Hroundas, Trace Instruments

Testing Solutions for Fine Pitch Printed Circuits' N/AMichael Mathews, Manager • Technical Marketing, DIT-MCO International

"Software Technology for Test Fixture Manufacturing' N/ANikita Andrekv, President, Consultck Software Systems, Inc.

* Organized by American Society of Test Engineers

TECHNICAL SESSION SO

EMI DesignChairman/Speaker. George M. Kunkel, Spira Manufacturing Corporation

"Introduction to EMI Design" 2015Bonnie A Kunkel, Spira Manufacturing Corporation

•Grounding A Bonding For EMC Design" 2017Dr. William Leahy, Interactive Control Technologies, Inc.

"Shielding of Electromagnetic Waves'2026

George M. Kunkel, Spira Manufacturing Corporation

"Facility Power Line Filter. What the User Should Know" 2034Richard Guerena, Genisco Technology

* Organized by International Electronic Packaging Society


Tape Automated BondingChairman: Carl Lchtonen, Silicon Coast Assoc.

The Role of TAB In MnrrJchto Modules"N/A

Christopher James, Manager Microinterconnect, Unisys Corp.

•COB and TAB: Technologies for the WOTs?'N/A

David A FeindeL, Director of Marketing, Marpet Enterprises Inc.

Tape and Reel Technology for Automatic Packaging and Feeding of Connectors* 2041William A Mahoney, Vice President of Marketing, GPAX International, Inc.

TAB'S Role in Manufacturing MuWchip Modules: A Survey" 2051E. Jan Vardaman, President, TechSearch International, Inc.



Improve Electronic Production Performance, Reporting, and Feedback with Bar Codes

Chairman: Ben Nelson, Markcm Corp.

"New 2D Bar Codes For The Electronic Industry' 2065

Sprague Acklcy, V.P. Research, Intcrmcc Corp.

"Integrating a Bar Code System" N/A

J. Charles Olinger, V.P. Sales & Marketing, True Data Corporation

"Why Bar Code Electronic Parts" 2074

Paul Audiss, Applications Engineer and James Drisko, EPC Identification Systems

"How to Print Bar Code Symbols" 2078

Jim Williams, President, IMTEC


New Products that Eliminate the Use of CFC

Chairman: George Lepidas, Director of Research & Technical Services, Cramco Inc.

"Case Studies of HCFC Cleaning" 2097

Lou A Dorsey, HCFC Technical Specialist, Allied Signal Inc.

"Qualification of Water Soluable Flux for Solder Paste Applications' 2103

Pciman Amoukhtch, Engineering Manager, Selectron

•No Cleaning Soldering Study' 2111

Dr. Carl Raleigh, Senior Staff Engineer and Cindy Mellon, Motorola, Inc.

•Water Soluble Paste For The 90V N/A

Derek UAndrade, Technical Director, The Surface Mount Technology Centre Inc.


Placement Technology for Fine Pitch and Very Fine Pitch Components

Chairman: Harold Hyman, Sierra Research & Technology Inc.

'Assessing Fine Pitch Placement Machine From a System Standpoint' 2125

Y.F. Michael Kou, Digital Equipment Corp.

'A Comparison of Alignment and Placement Methods for Fine Pitch Components* 2135

John M. DeCarlo, Sierra Research and Technology, Inc.

Tooling Considerations For Fine Pitch Placement* 2142

Ken Cavallaro, Knight Tool Co., Inc.

•Fine Pitch Manufacturing 101* N/A

Syed Akbar, Symbol Technologies, Inc.

"Determination of Placement Accuracy Requirements for Fine Pitch and Very Fine Pitch Assembly" 2154

David J. Arnone and Jason J. Tong AT&T Bell Laboratories

•SMT Placement Tool Capability Analysis"N/A

Wayne W. Ford, SMT Process Eng., IBM Canada


Options in Fine Line Soldering

Chairman/Speaker: Dr. Armin Rahn, President, Fluocon Technologies, Inc.

•Point and Bar Soldering of Fine Line Circuitry" N/A

RolfDiehm, ERSA

iQaracterizing Carrier Ring PQFPs For SMT Assembry* 2170

Robert Froehlich, Bell Northern Research

•Wave Soldering of Fine-Line PCBV N/APeter Fodor, President, SMT Automation, Inc.

•Fmeiine Soldering and Heat Characteristics in Condensation Vapours* N/A

Dr. Armin Rahn, President, Fluocon Technologies Inc.


Conforms! Coating Process Developments and Innovations

Chairman: Brad Stoops, Nordson Corporation

"Selection Criteria for the Use of Conformal Coatings" 2174

John Waryold, V.P - General Manager and Jim Lawrence, Product Development Manager, HumiScal

"UV Curing Solvent Free Silicone Coatings" 2183

Chris Marinelli, Technical Service Manager, L.D. Bennington and P.J. Courtney, Loctitc Corporation

"Ultraviolet Conformal Coating and Masking Equipment* 2190

Richard Quade, Union Carbide Corporation

"Ultraviolet Conformal Coating and Masking Applications" 2195

Mary OConnell Litteral, Manufacturing Engineer, Delco Electronics

"Method of Quantifying Relative Stress in Conformal Coating* 2202

Roger Olson, Nova Tran

MANAGEMENT TECHNICAL SESSION 1

Partnerships in Board Fabrication

Chairman: David Kocka, Reliance Comm/Tec

"Board Fabrication, PaneHzation, Supplier Coordination" 2209Dick Schneider, Schneider Sales

"Short Cuts to Quality in Board Fabrication" N/ARobert Duke, Electronic Support Systems

"Plotted Artwork and Modem Transmission' N/AMonica Arena, Fine Line

"What's New In Laminates*

Elaine Smith, G.E.2296


Using Wastewater Treatment for Competitive AdvantageChairman: Michael Greene, Bio-Recovery Systems

"Cost Effective Treatment of Etectroless Copper Rinsewater* 2215/ Michael Hosea, Director of Product Chemistry, Bio-Recovery Systems

"Chokes - Wastewater Treatments for a New Printed Circuit Facility* 2224Gary McCauley, Senior Environmental Engineer, Cray Research

"Environmental Compliance tor Competitive Advantage' N/ACynthia Retallick, Market Manager, MacDcrmid, Inc.

"A Successful Waste Treatment and Waste Minimization Program' N/ADave Ungcr, Environmental Engineering Supervisor, Alternate Circuit Technology


Users' Experiences with Contract ManufacturingChairman: Pamela Gordon, President, Technology Forecasters

"PWB Standardization: A Business Strategy for Contract Manufacturing" 2231Sudhir Shah, Producibility Manager, Boeing Aerospace and Electronics

"Advanced, Very Large-Scale, Custom Electronic System Production Off-Load Design and Manufacturing Resources*. .

N/A

Robert W. Tibbit, Program Manager for Advanced Develop. Space Syst., E-Systems

"Using Contractors for High-Volume, Flex-Circuit Assemblies" N/A

Penny J. Marazzo, LXT Product Engineering Manager, Maxtor Corporation


Simulation Modeling of Electronics Manufacturing SystemsChairman: Kcrim Tumay, Marketing Director, Production Modeling Corp. of Utah

"Minimum Cost Test Planning in Electro-Mechanical Assembly" 2239

Roy Henderson, Mgr. of Industrial Engineering, Imed Corporation and Dr. Ali Kiran, President, Kiran & Associates

"Minimizing Cycle Times Using Simulation Analysis" 2247

Dr. Gerald T. Mackulak, Professor of Engineering, Arizona State University, Dept. of Industrial Eng. & Mgmt. Systems


High Performance Manufacturing Alternatives

Chairman: David Bello, Project Manager, GE Aerospace

Panel and Subject Papers:

"World Class Plant Design for the 1990V N/A

Keith Krenz, President, Technology Systems Corp.

•Factory of the 90"s: A Case Study of the Toronto Plant* 2259

Dr. Dennis Nabieszko, Process Eng. Manager and Gunter Ladewig, Advisory Engineer, IBM Canada Ltd.

•Manufacturing in Mexico* N/A

Charles H. Dodson, CEO, Elamex Corp.

"Strategic Manufacturing Partnerships" 2263

Walter W. Wilson, Sr. Vice President of Operations, Solectron

"Users' Regional Comparisons of Contract Manufacturers* 2266

Pamela J. Gordon, President, Technology Forecasters


Interfacing or Not Interfacing with Contract ManufacturingChairman: Harvey Miller, Kirk-Miller Associates

Panelist:

Ray Prasad, Intel Corporation 2273Les Hymes, GE Medical 2280Gene Selven, Electronic Trends Publications

nepcon west - national electronic packaging and production … · 2008-07-15 · technicalsession35...

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