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Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Nano and Microtechnologies of hybrid
bioelectronic systemsDr. Yael Hanein
Physical electronics, TAU 2004
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Computer used to be VERY big…
http://www.bell-labs.com/org/physicalsciences/timeline/
Integrated circuit technology
19991.2 GHz, 1.8V
42M Components
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Two revolutions:1. From vacuum tubes to SC devices
2. Integrated circuit
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Integrated circuit technology1947 Bell Labs
nanotechnology
2003
1980 1980 hybrid micro bioelectronicsystems
hybrid nano bioelectronicsystems
BioMEMS
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Moore’s law
Gordon Moore (co-founder of Intel) predicted in 1965 that the transistor density of semiconductor chips would double roughly every 18 months.
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Hybrid nano bioelectronicsystems
DNA, Dekker, Delft
CNT Field effect transisitor
Bio-electronics• Smaller, faster (~nm)• Built in self-assembly capabilities (DNA, Proteins)• Sensing through chemical modification
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Hybrid micro bioelectronicsystems
Neuronal recordingFromherz,
Lab on a chipMicronics
http://www.dupont.com/mcm/product/biosensors.html
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
VLSI
• IC technology• Semiconductor
Physics• Material science
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Insulators, conductors and SC
• Metals (conductors)
• Semi-conductors
• Insulators
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Insulators, conductors and SC
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Covalent and metallic bonds
Metallic bond
Covalent bonds
Energy levels in atoms
Si (14): 1s2, 2s2 2p6 = 10 (+4)
In the basic unit of a crystalline silicon solid, a silicon atom shares each of its four valence electrons with each of four neighboring atoms
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Doping
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Field effect transistor
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
IC Transistor
MaterialsProcesses• Deposition (Metals, Insulators, SC)• Doping• Patterning• Etching
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Structural properties • Single crystal materials – almost all atoms are located at well defined regular positions known as lattice sites• Amorphous materials – atoms have no long range order• Polycrystalline – a collection of small crystals randomly oriented with respect to each other.
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Crystals
• Miller indices (x,y,z)• (x,y,z) – plane• [x,y,z] – direction• x,y,z – the inverse of the points at which the
plane crosses the three axis• x,y,z – refers to all equivalent planes (100
in cubic symmetry
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Materials: SiliconFabrication: • Crystalline: Wafers • Polysilicon: thin film deposition• Amorpous : thin film depositionOptics:• Not an active optical material (indirect band gap)• Transparent at IR• <0.4 µm reflects 60% of incedent light
Chemistry/biology• Stable and resistant (brake fluid, biological medium)• Suitable for high purity gases • Benign in the body, does not release toxic substances.Cost:• Low – ultra pure electronic grade silicon wafers are available for IC
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Materials: Silicon
Slurry
Polishing table
Polishing head
Polysilicon Seed crystal
Heater
Crucible6. Edge Rounding
7. Lapping
8. Wafer Etching
9. Polishing
10. Wafer Inspection
1. Crystal Growth
2. Single Crystal Ingot
3. Crystal Trimming and Diameter Grind
4. Flat Grinding
5. Wafer Slicing
Materials: metals
Metal ρ (10-6 Ω×cm) ApplicationsAg 1.58 ElectrochemistryAl 2.7 Elect interconnects
Optical reflectionAu 2.4 High T elect interconnect
Optical refl IRelectrochemistry
Cr, Ti, TiW 12.9, 42, 75-200 Intermediate adhesion layerCu 1.7 Elect interconnectsITO 300-3000 Transparent interconnectsIr, Pt 5.1, 10.6 Electrochemistry
Bio-potential sensorsW 5.5 High T elect interconnects
Maluf table 2.3, 24
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Metal deposition
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Patterning - lithography
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Clean room class rating
MEMS
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
Motor
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein
MEMS
Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein