microwave induced plasma (mip) decapsulation - jiaco instruments
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Email: [email protected] Website: www.jiaco-instruments.com
Phone: +31 6 2526 1648 Address: Feldmannweg 17, 2628 CT, Delft, The Netherlands
DECAPSULATION TECHNOLOGY FOR QUALITY CONTROL AND FAILURE ANALYSIS
MICROWAVE INDUCED PLASMA (MIP)DECAPSULATION SYSTEM
Copper wire IC package decapsulationJIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing O2-only recipes. The system has been proven for Cu, PdCu, Ag, Au bond wires and for advanced package types like 3D, SiP, WLCSP, BOAC; all without process induced damage for reliable failure analysis and quality control.
MIP applications in failure analysis
MIP decapsulation+ No process induced damage+ Preservation of surface features+ Preservation of original
contaminants and failure sites
Acid decapsulation- Reduced wire diameter- Reduced mechanical strength- Corrosion damage on copper
wire and aluminium bond pad
I. Challenge due to wire:• Ag wire (new)• Cu, PdCu, Au wire packages
after thermal stress
II. Challenge due to no wire:• WLCSP (new)• In-FO (new)• PBO removal to expose RDL
III. Challenge due to chip:• BOAC (new)• GaAs • GaN
VI. Challenge due to encapsulant:• High Tg mold compound (new)• FOW (new)• Underfill• Transparent mold compound
V. Challenge due to package:• 1x1mm package • Chip on Board (new)• SiP (new)• 3D stacked-die
IV. Challenge due to failure type:• EOS • Contamination• Localized decapsulation
Before decapsulation
After MIP
DECAPSULATION TECHNOLOGY FOR QUALITY CONTROL AND FAILURE ANALYSIS
MICROWAVE INDUCED PLASMA (MIP)DECAPSULATION SYSTEM
Silver wire IC package MIP decapsulationNo damage to Ag wires, Ag ball bonds, bond pads, passivation and die.
Conventional plasma- CF4 etching damage to passivation and die- Long processing time even with CF4 addition
into plasma- Manual filler removal between etching cycles- Removal of original surface contamination- Vacuum system, higher maintenance and repair
MIP decapsulation+ O2 only, no damage to passivation and die+ 70% reduction in processing time compared to
conventional plasma+ Fully automated processing+ Preservation of original contaminants & failures+ Atmospheric, reducing maintenance and repair
Email: [email protected] Website: www.jiaco-instruments.com
Phone: +31 6 2526 1648 Address: Feldmannweg 17, 2628 CT, Delft, The Netherlands