microsystems & nanoengineering
TRANSCRIPT
Microsystems & Nanoengineering
Microsystems & Nanoengineering is the first engineering journal initiated by Nature Publishing Group (now part of Springer Nature) and Chinese Academy of Sciences in 2014.Microsystems & Nanoengineering is an open access and fully peer-reviewed journal which publishes original articles and reviews on cutting-edge and emerging topics related to MEMS/ NEMS and nanotechnology.
Microsystems & Nanoengineering now is abstracted & indexed by SCIE, Ei, PubMed Central, Scopus and DOAJ, etc.
EIC:Professor Yirong WuAcademician of CAS and Di-rector of AIRCAS
Professor Tianhong CuiUniversity of Minnesota
Professor Ian White FREngUniversity of Bath and Uni-versity of Cambridge
Website Weixin/WeChat
Submit your manuscript on:https://www.nature.com/micronano/
About the Journal
Abstracted & Indexed in
New physics of micro- and nano-systemsMicro- and nano-mechanics, modellingNew materials for micro- and nano-systemsMicro- and nano-structuresMicro- and nano-sensorsMicro- and nano-actuatorsMicro- and nano-fluidicsPolymer MEMS and NEMSBiomedical MEMS and NEMSEnergy harvesting and power MEMSMicro- and nano-optics, optical MEMS
Integrated photonics, hybrid optical and electronic integrationNanophotonic systems and circuits, microwave photonicsMicro- and nano-engineered systems, integrated microsytems and functional nanosystemsMicro-and nano-fabrication technologies, “top-down” and “bottom-up” technologiesCharacterization of micro- and nano-systemsMicro- and nano-scale mass and heat transferApplied sciences of micro- and nano-systems
Topics of particular interest within the journal's scope include, but are not limited to
Microsystems & Nanoengineering
Chong H. Ahn, University of Cincinnati (UC), USAJ. Stewart Aitchison, University of Toronto, CanadaMarkG. Allen, University of Pennsylvania, USAFumihito Arai, University of Tokyo, JapanKarl F. Böhringer, University of Washington, USATarik Bourouina, CNRS and Université Gustave Eiffel, FranceXinxia Cai, Institute of Electronics, CAS, ChinaJonathan M. Cooper, University of Glasgow, UKGraham J. Davies, University of New South Wales, AustraliaXianting Ding, Shanghai Jiao Tong University, ChinaZ. Hugh Fan, University of Florida, USANicholas Xuanlai Fang, Massachusetts Institute of Technology, USAYogesh Gianchandani, University of Michigan, USAPeter J. Hesketh, Georgia Institute of Technology, USAAndreas Hierlemann, ETH Zurich, SwitzerlandShery Huang, University of Cambridge, UKLan Jiang, Beijing Institute of Technology, ChinaZhuangde Jiang, Xi'an Jiaotong University, ChinaSatoshi Konishi, Ritsumeikan University, JapanXinxin Li, Shanghai Institute of Microsystem andInformation Technology, CAS, ChinaZhihong Li, Peking University, China
Chwee Teck Lim, National University of Singapore, SingaporeFrancis Lin, University of Manitoba, CanadaLiwei Lin, University of California at Berkeley, USASheng Liu, Wuhan University, ChinaXinyu Liu, University of Toronto, CanadaMarc Madou, University of California, Irvine, USATakahito Ono, Tohoku University, JapanMuthukumaran Packirisamy, Concordia University, CanadaIan Papautsky, University of Illinois at Chicago, USAAlexander Revzin, Department of Physiology andJunsuk Rho, Pohang university of science and technology,KoreaBiomedical Engineering, Mayo Clinic, USAJohn A. Rogers, Northwestern University, USAAnderson Shum, University of Hong Kong, Hong Kong, ChinaTerrence Simon, University of Minnesota, USAGöran Stemme, Royal Institute of Technology in Sweden, SwedenBoris Stoeber, The University of British Columbia, CanadaDaoheng Sun, Xiamen University, ChinaYu Sun, University of Toronto, CanadaOsamu Tabata, Kyoto University of Advanced Science, JapanYu Chong Tai, California Institute of Technology, USAEvelyn N Wang, Massachusetts Institute of Technology,USA
Ping Wang, Zhejiang University, ChinaXiaohong Wang, Tsinghua University, ChinaAlbert van den Berg, University of Twente , the NetherlandsShanhong Xia, Aerospace Information Research Institute,Chinese Academy of Sciences (AIRCAS), ChinaXi Xie, Sun Yat Sen University, ChinaJun Yang, The University of Western Ontario, CanadaEric Yeatman, Imperial College London, UKS. J. Ben Yoo, University of California, Davis, USAAlice Zhang, Peking University, ChinaTing Zhang, Suzhou Institute of Nanotech and NanoBionics, CAS, China
Editorial OfficeManagerNa Li Email: [email protected] Ruan Email: [email protected]
Add: No. 19, North 4th Ring Road West, Haid-ian District, Beijing 100190, ChinaTel.: +86 10 5888 7066Fax: +86 10 5888 7539Email: [email protected]: //www.nature.com/micronano
Editors
Highlights:Geo Coverage - Today researchers who are the readers of Microsystems & Nanoengi-
neering come from worldwide.
Worldwide Audience
Average Monthly Full-Text Article Requests (2017-2020):
SPEED
32 NO.of days fromsubmission to first decision (2020)
USAGE
IMPACT
7.127IF 2020
572 Number of SocialMedia mentions (2020)
2020 Acceptance Rate
466,634No. of downloads (2020)
Totals2017 2018
233,616
2019
290,777
2020
466,634148,638
36%
160 Countries accessing content
29%USA+Canada
23% Europe12%China
36%ROW
23743
Microsystems & Nanoengineering
2021
Q1