microelectromechanical systems mems”subcommittee …qualification stress test modifications that...
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Microelectromechanical_systems“MEMS”subcommittee workshop
24-Apr-2014Earl Fischer
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MEMS Subcommittee Scope
�Determine the need to modify AEC Q100’s:
�Qualification tests (Table 2)
�Process Change Qualification … Selection of Tests (Table 3)
�Definition of a Product Qualification Family (Appendix 1)
�Others as needed.
� We need members to join.
� It would be good to have a balance of OEM, user and supplier companies contributing.
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Automotive MEMS functions
�Accelerometers
� Crash Sensors
�Angular rate Sensors (Gyros)
� Yaw and rollover
�Pressure Sensors
� Tire Pressure, Side Impact
�Microphones
� Hands free
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High Level Overview from the Internet
� The following slides in this section are to give a simple introduction to MEMS construction. Then potential qualification test changes to Q100 could be understood.
� To assure integrity and confidentiality only internet files are included in these examples.
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MEMS Accelerometer Basic Elements
From page 6 ofhttp://mafija.fmf.uni-lj.si/seminar/files/2007_2008/MEMS_accelerometers-koncna.pdf
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� From:
� http://www.analog.com/library/analogdialogue/archives/43-02/mems_microphones.html
ADXL50 MEMS accelerometer structure.
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Analog Devices ADXRS Gyro die
� From
� http://www.analog.com/library/analogdialogue/archives/37-03/gyro.html
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Electrical interfacing
� Analog Devices ADXL345B Image from:
http://www.memsindustrygroup.org/images/newsletter/Oct2009/fig5215_mems_asic.jpg
Cap
MEMS
ASIC
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Pressure Sensors
� From
� http://www.sensorsmag.com/automotive/making-sense-automotive-pressure-sensors-1403
An ultra-small piezoresistive absolute pressure sensor die, covered by a silicone-gel coating (the light blue area at the bottom right of the structure) to protect the piezo-resistive structures and the micro-machined silicon membrane of the airbag pressure sensor from harsh environmental conditions.
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MEMS Microphones
� From: http://www.eeherald.com/section/design-guide/mems-microphone.html
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MEMS Failure Mechanisms Examples
�Particle
�Cracked structure
�Contaminant
�Cap seal breech
�Package stress impacts parasitic or sensor structure
�Moisture impacts parasitic in package or sensor structure
�Stiction
� “KPPI” Key Product Parameter Indicator shifts
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Qualification test changes to Q100
� In the attached file qualification and characterization tests are included as thought starters.
�Qualification stress test modifications that impact MEMS can be filtered by selecting items beginning with M in column A.
� Failure mechanism columns have been added for discussion on what test could discover or activate a failure mechanism.
Q100 exceptions
for MEMS 1.1
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