MHI#16号機の２回目のEP2 Process log

Status of working Monitor data during EP & Rinsing process Comparison of EP2

Period : 2011/5/10 ~ 5/16Process : CP @flanges, EP2(5μm) under low current density, Improved 1st Water Rinsing,

Brushing @HOM & Flange using FM-20, Degreasing(FM-20, 2%) [1hour],Brushing @Flange, HPR x 2 [10 hours], Assembly in C.R., Vacuum evacuation,Leak check, Baking @100℃ (48hours)

Preparation : Washing vacuum components with ultrasonic, Cleaning in C.R.Workers : M. Sawabe, Kirk, M. Satoh (KEK),

K. Nakamura, N. Tasaki, F. Tsukada (Assist Engineering Co.),T. Okada (K-VAC),M. Asano, S. Imada, T. Yanagimachi (Nihon Advanced Technology)

Kirk1

STF Cavity Group Meeting @2011/5/16

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• EP acid (4/20のサンプルを使用 )• Nb ingredient : 9.6g/ℓ• HF ingredient : 25 g/ℓ (全体 34g/ℓの 65%が反応に使われる )• Al ingredient : 18mg/ℓ• Current density : ～ 37mA/cm2 (最近の傾向より )• Cavity surface temperature : <35℃• Control Voltage : 温度と電流密度を見ながら制御• With normal N2 gas flow during extracting EP acid (8ℓ/min)

• 1st water rinsing (1.5hours)• Improved version (25ℓ/minで 20分間上下から流し続ける )• 1 分毎に1秒間水抜きを繰り返す (40分間 )• 最後の 30分は 10min (storing)/3min (flushing)で行う

• Degreasing (1 hour)• FM-20(2%)

• HPR (～ 10 hours)• 5h17m (6 turns, w/o blind flanges)• 4h23m (5 turns, w/ blind flanges)

Condition of EP2 & Rinsing

Brushing @HOM & Flange

using FM-20

Brushing @Flangeusing FM-20

EP2を 1 ～ 2 回行ったぐらいではたいして変化しない

Process log ①

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5/10 9:40 Check every flange / Polishing input port by scotch bright 9:55~ Attachment of jigs for EP10:17 HPR operation starts without cavity10:44 Set cavity to EP bed with crane11:00 Installation of cathode bar to cavity [O.K.]11:04 Meeting for tomorrow’s working procedure11:12 Set data logger to cavity (totally 12ch)11:30 Leak check with N2 gas [O.K.]12:00 Lunch time13:20 HPR operation stops

Preparation for EP is completed14:00~ Vacuum parts rinsing with ultrasonic in C.R.15:30 fin.

STF Cavity Group Meeting @2011/5/16

5/11 10:10 Cavity rotation starts / EP acid flow starts10:30 EP2 starts10:47 EP2 stops [17m00s] / Idling rotation (3 rpm / 20min) / Plastic case detachment11:07 Idling rotation stops11:10 EP acid is removed from cavity with N2 gas flow(0.020MPa)11:23 First rinsing with ultra pure water starts12:54 First rinsing with ultra pure water stops [1h30m]13:00 Detachment of restriction jigs / Data logger detached13:20 Un-installation of cathode bar from cavity / washing cathode bar (No black mark)13:28 transferring cavity from EP bed to wagon / Checking inside cavity [O.K.]13:50 Detachment of jigs for EP / Detaching every blind teflon flange

/ Checking inside cavity (white mark is found at cell#9)14:00 Brushing at every flange and HOM couplers using FM-20 / Shower rinsing14:10 Checking inside cavity (white mark is found at cell#9)14:13 Attachment of flanges for degreasing14:23 Flowing FM-20 into cavity14:27 Degreasing with ultrasonic starts15:27 Degreasing with ultrasonic stops [1hour]15:30 Removing FM-20 from cavity15:40 Detachment of flanges for degreasing

Checking inside cavity (white mark is found at cell#9)15:45 Brushing at every flange using FM-20 / Shower rinsing

Process log ②

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STF Cavity Group Meeting @2011/5/16

5/11 16:00 Transferring cavity from wagon on turntable for HPR using crane16:05 Checking tolerance between position of nozzle and center of beam pipe16:19 1st HPR for inside cavity starts21:35 1st HPR for inside cavity stops [5h17m] (6 turns)21:40 Attaching every blank flange in C.R.22:09 fin.

5/12 9:08 HPR outside cavity with blind flanges starts [15mins] 9:24 2nd HPR for inside cavity with blind flanges starts13:47 2nd HPR for inside cavity with blind flanges stops [4h23m] (5 turns)13:55 Cavity enters into C.R.14:35 Assembly in C.R. (Class 10) starts16:20 Assembly in C.R. (Class 10) finishes / Moving out from Class10 to Class100016:34 Vacuum evacuation starts with heat guns16:45 Turbo pump status 100%17:15 Leak check thoroughly @~2.0x10-3Pa

Leak occurred at three ICF gaskets around bellows (Too low quality again!!!) Re-tightening screws / stop the leak / Re-leak check O.K.

17:45 Baking @100℃ startsMax Vacuum Level just after baking start : ~1.20 x 10-3Pa

18:17 Cavity vacuum : 1.08 x 10-3Pa @76℃/81℃/50℃/60 /48℃ ℃/53℃/19℃ (Cell#3/Cell#7/Top/Bottom/Input/Probe/Room)

19:55 Cavity vacuum : 3.78 x 10-4Pa @100℃/104℃/86℃/85 /?℃ ℃/79℃/19℃ (Cell#3/Cell#7/Top/Bottom/Input/Probe/Room)

Process log ③

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Process log ④

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5/13 12:00 Cavity vacuum : 3.31 x 10-5Pa @100℃/105℃/89℃/100 /87℃ ℃/90℃/21℃(Cell#3/Cell#7/Top/Bottom/Input/Probe/Room)

5/14 17:25 Cavity vacuum : 2.61 x 10-5Pa @100℃/105℃/88℃/100 /86℃ ℃/97℃/22℃(Cell#3/Cell#7/Top/Bottom/Input/Probe/Room)

17:30 Baking Off17:43 Ion Pump ON17:50 Cavity vacuum : 2.20 x 10-6Pa @82℃/86℃/?℃/71 /78℃ ℃/90℃/22℃

(Cell#3/Cell#7/Top/Bottom/Input/Probe/Room)

5/16 8:50 Cavity vacuum : 0.99 x 10-7Pa @22 (0.0 x ℃ 10-8Pa @I.P.) 9:30 MHI#16 moves to V.T. stand

MHI#16号機で見つかった白い模様

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１回目の EP2後

２回目の EP2後

色々な空洞で見つかった白い模様

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MHI#14号機の１回目の EP2後MHI#15号機の２回目の EP2後

MHI#16号機の２回目の EP2後

最近よく起こる ICFのリーク箇所

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今回の組み立て中に見つかった不良のヘリコフレックス

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スズメッキ インジウムメッキ

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Status of 2nd EP2 for MHI#16 ①

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current

voltageTcavity

Treservoir

Troom

Tcavity

average current density平均電流密度が 37mA/cm2程度になるように電圧を調整する。(low current density EP)

volt

age [

V]

avera

ge c

urr

ent

densi

ty [

mA

/cm

2]

12STF Cavity Group Meeting

@2011/5/16

Status of 2nd EP2 for MHI#16 ②左図は平均電流密度と電圧の相関右図は定常状態での分布

target

最近の定常状態の比較

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Cavity Mean temp. [℃]

R.M.S. temp. [℃]

Mean i [mA/cm2]

R.M.S. i [mA/cm2]

MHI-A 1st 26.1 0.8 36.5 1.5

MHI#12 1st 25.6 0.9 34.5 1.4

MHI#13 1st 26.9 0.9 37.4 1.5

MHI#12 2nd 26.2 0.5 36.3 1.4

MHI#13 2nd 26.6 0.7 37.6 1.6

MHI#14 1st 26.9 0.5 37.3 1.6

MHI#15 1st 27.9 0.9 36.2 1.5

MHI#14 2nd 29.0 0.8 38.0 1.2

MHI#15 2nd 28.1 0.7 37.3 0.9

MHI#16 1st 27.4 1.0 37.4 1.0

MHI#16 2nd 29.2 0.2 36.0 0.7

今回は研磨量が 5μmと少ないためドリフトの影響が少ない。

Status of 2nd EP2 for MHI#16 ③

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#1 #2 #3 #4 #5 #6 #7 #8 #9 #10

EP2の間の空洞表面温度の状況。

#11

#12

Steady state: 34.0 29.0 31.4 29.1 30.6 28.1 25.4 31.1 29.7 28.7 28.9 11.3

STF Cavity Group Meeting @2011/5/16

Status of 2nd EP2 for MHI#16 ④

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#1 #2 #3 #4 #5 #6 #7 #8 #9 #10

EP2の間の空洞表面温度の状況（前ページの最後の拡大図）。

#11

#12

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#1 #2 #3 #4 #5 #6 #7 #8 #9 #10 #11

#12

Status of UWR for MHI#16 ①

通信不良によるデータの跳びが最後になって急増した。

Steady state: 20.8 19.8 20.7 18.7 18.9 19.2 19.1 19.8 19.0 19.3 19.8 18.0

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一次洗浄中の空洞温度の状況（前ページの拡大図）

#1 #2 #3 #4 #5 #6 #7 #8 #9 #10 #11

#12

Status of UWR for MHI#16 ②

Status of UWR for MHI#16 ③

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①は最初の注水完了時。②は流量を増やした状態での洗浄中。③は流量を戻した状態での洗浄中。

①

②

③

STF Cavity Group Meeting @2011/5/16

Status of HPR for MHI#16

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ノズルは 1st HPRでは６往復、 2nd HPRでは５往復させた。

２回目は TOC、 Particle共に、最良の状態に戻っている。