ETCHING for BULK MICROMACHINING (Cavity/Cantilever Anisotropic)

ETCHING for BULK MICROMACHINING(Cavity/Cantilever Anisotropic)

DRY (Plasma) ETCHING

Deep Reactive Ion Etch (DRIE)

Single Crystal Silicon for MEMS

Single Crystal Silicon for MEMS

Single Crystal Silicon for MEMS

What is MICRO-MACHINING?

What can Micromachined Parts/Systems do for us?

Be a Conduit to Microscopic Domain:

1. Sensing (Information)2. Information Processing 3. Communication4. Manipulation (Actuation and Control)Why / Why not SILICON?Semiconductor: Active Devices + Sensors(Photo-Magneto-Strain Sensing)

Insulator:SiO2 , Si3N4 , Glass

Thin Film Conductor:Aluminum, Gold, Silicides

PhotoLithography:Planar control (+ & -)

Mechanical Material SILICON?

Stiff => Thinning is required for appreciable strainMicromachining of SILICON?MICROMACHINING of SILICON => (a) BULK (substrate)(b) SURFACE (films)Additive Processes: Chemical and Physical Deposition(Thin Layers only) (Single/Poly)Removal Processes:Chemical and Physical Etching(Wet/Dry/Plasma/Inert/Reactive) (Bulk/Film) (Anisotropic/Isotropic)