may 31- june 3, 2016 cosmopolitan hotel, las …...i t h e r m 2 0 1 6 the intersociety conference...

ITHERM

2016

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

May 31- June 3, 2016Cosmopolitan Hotel,

Las Vegas, Nevada, USA

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ITHERM 2016: Organizing Committee

General Chair: Dr. Madhusudan Iyengar, Google

Technical Program Chair: Prof. Michael Ohadi, University of Maryland

Thermal Management Track:

Chair: Dr. Thomas Brunschwiler, IBM Corp. Co-chairs: Dr. Peter de Bock, General Electric Prof. Justin Weibel, Purdue University Dr. Baris Dogruoz, Cisco Dr. Kamal Sikka, IBM

Mechanics Track:Chair: Dr. Kaustubh Nagarkar, General ElectricCo-chairs: Dr. Jin Yang, Intel Dr. Kaushik Mysore, Advanced Micro Devices Prof. Ricky Lee, Hong Kong University of Science & Technology

Emerging Technologies Track: Chair: Dr. Ashish Gupta, Intel Corporation Co-Chairs: Prof. Amy Marconnet, Purdue University Dr. Vadim Gektin, Futurewei Technologies Prof. Patrick McCluskey, University of Maryland

Student Poster & Networking Track: Chair: Dr. Milnes P. David, IBM Co-chairs: Dr. Amir Shooshtari, University of Maryland Prof. Jaeho Lee, University of California at Irvine

Panels Track: Chair: Dr. Victor Chiriac, QualcommCo-chair: Prof. Y.C. Lee, University of Colorado

Technology Talk Sessions: Chair: Dr. Karl Geisler, 3MCo-chair: Mike Ellsworth, IBM

ITherm/ECTC Tutorials: Prof. Dereje Agonafer, University of Arlington

Artistic Committee: Chair: Disha Bora, AnveshakCo-chair: Darin Sharar, Army Research Lab

May 31 - June 3, 2016Cosmopolitan Hotel, Las Vegas, Nevada, USA

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ITHERM 2016: Organizing Committee

Entertainment & A/V Logistics Chair: Dr. Prititsh Parida, IBM

Data Center Outreach Coordinator: Mr. Dan Comperchio, Wildan Energy Solutions

Hospitality Chair: Prof. Joshua Gess, Oregon State University

Sponsorship & Exhibits Committee: Prof. Mehdi Asheghi, Stanford University Dr. Sandeep Tonapi, Anveshak

Treasurer: Dr. Dustin Demetriou, IBM Corp.

Administration Chair: Paul Wesling, HP (retired)

Publications Chair: Paul Wesling, HP (retired)

ITherm Achievement Award Committee: Prof. Sushil Bhavnani, Auburn University Dr. Koneru Ramakrishna, Cirrus Logic Inc.

Prof. Dereje Agonafer University of Texas at Arlington, USAProf. Cristina H. Amon University of Toronto, CANProf. Mehdi Asheghi Stanford University, USAProf. Avram Bar-Cohen University of Maryland, USAProf. Sushil H. Bhavnani Auburn University, USADr. Madhusudan Iyengar Google, USAProf. Yogendra K. Joshi Georgia Institute of Technology, USADr. Gary B. Kromann Freescale Semiconductor, Inc., Austin, TX, USADr. Tom Lee Xilinx, Inc., San Jose, CA USAProf. Alfonso Ortega Villanova University, USADr. Koneru Ramakrishna Hewlett-Packard Company, Houston, TX USAProf. Baghat Sammakia State University of New York at Binghamton, USA Dr. Sandeep Tonapi Anveshak Technology and Knowledge Solutions, USA

ITHERM 2016: Executive Committee

ITHERM 2016

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ITHERM 2016: Keynote Speakers

Session B1, Wednesday, June 1, 9:35 am - 10:35 am, Condessa 3

Flexible Data Center Design Building A global network of efcient, large-scale data centers requires exible designs to accommodate local conditions and constraints, while allowing for rapidly changing IT hardware and software requirements. This presentation will discuss some of the approaches we've taken and how Google continues to improve data center efciency.

Dr. Christopher G. Malone is a Distinguished Engineer at Google and leads the Data Center Research and Development team, which is responsible for developing Google's next-generation data centers and IT hardware with a focus on efciency, sustainability, and exibility. Chris has authored numerous refereed technical papers, and has been granted over 100 US and international patents. He is involved with several industry groups and government agency initiatives focused on improving IT efciency. Prior to joining Google, Chris was a senior technologist at Hewlett-Packard responsible for enterprise server architecture and technology strategy.

Chris is an ASME Fellow and received his MS and PhD in Mechanical Engineering from the Massachusetts Institute of Technology, Cambridge, MA and the BEng (with Highest Honors) from the Technical University of Nova Scotia (now Dalhousie), Halifax, Nova Scotia.

Session H1, Thursday, June 2, 9:35 am - 10:30 am, Condessa 3

The Development of the Die Stacked AMD Radeon™ R9 Fury This talk walks through the challenges of an 8.5 year technical journey that culminated in the rst die stacked AMD product, the AMD Radeon™ R9 Fury family of graphics products.

Dr. Bryan Black received his Ph.D. in Electrical and Computer Engineering from Carnegie Mellon. With over 20 years of experience, Black has had the honor of working at Motorola, Intel, and AMD. He has done a little of everything from devices to circuits to micro-architecture to DRAM to test to packaging to manufacturing. Currently Black is a Senior AMD Fellow responsible for all aspects of AMD's die stacking technology effort. Recently AMD introduced its rst die stacked products integrating High Bandwidth Memory (HBM) on an interposer, the AMD Radeon™ R9 Fury family of graphics products.

Session O1, Friday, June 3, 9:35 am - 10:35 am, Condessa 3

Innovations in Heterogeneous Integration and SiP During his talk, William (Bill) Chen will discuss the crucial role of the heterogeneous integration through SiP, increasingly being applied within the broad electronic device market and quickly meeting the challenges for the emerging internet of things (IoT) and migration to the cloud. Chen will review the re-invention of core packaging technologies and the emergence of new innovations as platforms for SiP. In tracing the development of Fan Out from Fan in packages, he will then demonstrate how this new core technology has great potential to meet the complex challenges of integration and miniaturization posed by a demanding market place.

Dr. William (Bill) T. Chen holds the position of ASE Fellow and Senior Technical Advisor at ASE Group. Prior to joining the ASE, he was the Director at the Institute of Materials Research & Engineering in Singapore. He retired from IBM Corporation after over thirty years in various R&D positions. He has held adjunct and visiting faculty positions at Cornell University, Hong Kong University of Science and Technology, and Binghamton University. He is the co-chair of the ITRS Assembly Packaging Technical Working Group. He was a past President of the IEEE CPMT Society. He has been elected a Fellow of IEEE and a Fellow of ASME. He received B. Sc from London University, M.Sc from Brown University and PhD from Cornell University.

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ITHERM 2016: Achievement Award Winner

Luncheon Talk on Wednesday, June 1, 12:15 pm - 1:45 pm (Condessa 3 and 4)

The Challenge of Thermal Management

Presented by winner Professor Suresh Garimella, Purdue University

Abstract: The primary challenge in thermal management lies at its rich variety of interfaces. There are the familiar thermal interfaces across the many packaging levels. But while academic research has made great advances over the last few decades in specic thermal management technologies, the transfer of ideas from lab to market has been less successful because of the impedance posed across a variety of other interfaces, real and virtual, be they technical, intellectual property-related, procedural, or due to a cultural mismatch between academia and industry. Along with research advances, real progress will necessitate a recognition, understanding and bridging of these interfaces impeding the lab-to-product transition.

Bio: Professor Suresh Garimella is Purdue University's Executive Vice President for Research and Partnerships, and the Goodson Distinguished Professor of Mechanical Engineering. He is also Director of the National Science Foundation Cooling Technologies Research Center. He previously served as Purdue's Chief Global Affairs Ofcer (2013-2014), and as Associate Vice President for Engagement (2011-2013). He received his PhD from the University of California at Berkeley in 1989, his MS from The Ohio State University in 1986, and his Bachelor's degree from the Indian Institute of Technology Madras in 1985.

Dr. Garimella's research group has made seminal contributions in micro- and nano-scale thermal and uidic engineering, novel materials for thermal management, materials processing and manufacturing, and renewable energy. He has supervised over 85 PhD and MS students, and co-authored 500 refereed journal and conference publications and 21 patents and patent applications. Eighteen alumni from his research group are now faculty members in prestigious universities around the world. Dr. Garimella has held honorary faculty positions in Germany, China, and Australia, and serves on the Board of Directors of Modine Manufacturing Company.

The group has addressed a wide range of topics including microchannel transport, electromechanical microuidic actuation and micropumps, novel microscale diagnostics, thin lm transport and heat pipes, micro- and nano-structured surface engineering, transport in bubbles, piezoelectric fans, refrigeration, jet impingement, thermal contact resistance, heat transfer enhancement, phase change energy storage and metal foams, melting and solidication, plasmas, and renewable and sustainable energy systems including solar thermal energy storage and waste heat recovery.

Dr. Garimella served as Jefferson Science Fellow at the U.S. Department of State from 2010 to 2011. He explored pathways to a clean energy future, analyzing cross-cutting issues at the intersection of energy security and climate change. He also served a ve-year term (2011-16) as Senior Fellow of the State Department's Energy and Climate Partnership of the Americas (ECPA), a regional partnership announced by President Obama at the 2009 Summit of the Americas to promote clean energy, advance energy security, ght energy poverty, reduce greenhouse gas emissions, support strategies for sustainable landscapes and build capacity for climate change adaptation.

Dr. Garimella serves in editorial roles with several leading journals. He is Fellow of the American Association for the Advancement of Science (AAAS) and the American Society of Mechanical Engineers (ASME). His efforts in research and engineering education have been recognized with the 2014 ASME Charles Russ Richards Memorial Award, 2011 NSF Alexander Schwarzkopf Prize for Technological Innovation, 2010 ASME Heat Transfer Memorial Award, 2010 Distinguished Alumnus Award from IIT Madras, 2009 ASME Allan Kraus Thermal Management Award, and 2004 ASME Gustus L. Larson Memorial Award, among others.

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Session C4 (Panel 1) - Wednesday, June 1, 10:40 am - 12:10 pm, Condessa 9

Micro-Two-Phase Liquid Cooling Systems for Electronics

Moderators: Professor John R. Thome, Ecole Polytechnique Fédérale de Lausanne

Abstract: Two-phase cooling is gaining traction in the cooling of electronics (IGBT's, CPU's, LED's, optical lasers, etc.). The panel will address special issues, questions and concerns regarding adoption of two-phase cooling systems. The panel will also cover some case studies on existing and pending applications and an overview of methods and simulators for designing of two-phase cold plates and their cooling systems (gravity-driven and pump-driven systems). The panel will furthermore address the pros/cons when choosing the best working uid for applications.

Panelists: Ÿ Dr. David Copeland, Oracle Ÿ Dr. Thomas Brunschwiler, IBMŸ Dr. Todd Salamon, Nokia/Bell LabsŸ Dr. Abhinav Dixit, Eaton Ÿ Dr. Soheil Farshchian, Google Ÿ Dr. Jackson Marcinichen, EPFL

Session D4 (Panel 2) - Wednesday, June 1, 1:50 pm - 3:20 pm, Condessa 9

X-ray Characterization of Diamondand Other Highly Conductive Materials

Moderators: Professor Ali Khounsary, IIT; Professor Avi Bar-Cohen, University of Maryland; Dr. Kaiser Matin, ECS-Federal

Abstract: Highly conductive substrate materials, in particular diamonds, are of special interest in the thermal management of high heat ux electronic systems such as high power radio frequency ampliers incorporating gallium nitride (GaN) transistors. GaN based systems are lighter, smaller, more efcient, and are in demand for such critical applications as airborne radar systems. Careful evaluation of diamond and its interface with the electronic circuitry is essential in the development of these systems. Diamonds, however, are grown by various manufacturers and under differing conditions resulting in varying compositions, structures, and properties. Although there are several complementary techniques for evaluating diamond quality, there is no comprehensive and generally accepted characterization protocol for qualifying diamonds for critical applications. The thermal interface between diamond grown

ITHERM 2016: Panels

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ITHERM 2016: Panels

on or attached to the electronic circuitry is similarly important, and a characterization scheme is needed to ensure the interfaces are robust, stable, and can withstand electronic/environmental conditions and thermal cycles with minimal thermal resistance.

Fortunately, there are a number of X-ray techniques that can be employed for comprehensive characterization of both the substrates and its interface with the electronic circuitry. These techniques can provide - non-destructively - information about the composition (spectroscopy), structure (tomography), grain size and distribution (scattering, depth proling), grain structure (topography), stress (diffraction), etc., paving the way for the development of protocol for the characterization of diamond substrates and the interfaces. In this spirit, this panel brings together for the rst time a group of X-ray scientists and engineers active in the eld for a broad discussion of the techniques that can help bridge any knowledge gap and help accelerate progress towards the successful implantation of diamond and the like for the thermal management of high power electronics.

Panelists: Ÿ Professor Piero Pianetta, StanfordŸ Professor Samuel Graham, Georgia Tech Ÿ Professor Sunil Sinha, UC San Diego Ÿ Professor Phil Eisenlohr, Michigan State Ÿ Dr. Daniel Twitchen, Element 6

Session I4 (Panel 3) - Thursday, June 2, 10:40 am - 12:10 pm, Condessa 9

LED packaging: Thermal and Mechanical Challenges and Future Direction

Moderators: Professor Xiaobing Luo, Huazhong University of Science and Technology; Professor Mehmet Arik, Ozyegin University

Abstract: LED packaging present numerous thermal and mechanical problems, obtaining a full understanding of these problems enables advancements in the development of LED processes and design. This panel will focus on the thermal and mechanical challenges in LED packaging and applications. The panelists will provide insight into their personal or organization's perspective in addressing these challenges. This panel will also discuss the current and future direction in thermal management and mechanical reliability of LED packaging. Panelists will address thermal/optical performances and manufacturability aspects in different LED applications beyond general lighting. Audience comments and questions will also be responded.

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Panelists: Ÿ Professor Mehmet Arik,Ozyegin University Ÿ Professor Sheng Liu, Wuhan UniversityŸ Professor Samuel Graham, GIT Ÿ Dr. Thomas Dreeben, OrsamŸ Professor Frank Shi, University of California at Irvine

Session K4 (Panel 4) - Thursday, June 2, 2:25 pm - 3:55 pm, Condessa 9

Advances in Thermal, Thermomechanical and Packaging Issues for Mobile Devices

Moderators: Dr. Victor Chiriac, Qualcomm

Abstract: In the last 5-10 years there has been a signicant growth in computing platforms ranging from handhelds to servers. This growth led to increased concerns for thermal management and other packaging issues ranging from low to high form factors (mobile internet devices, smartphones, tablets, laptop computers, thin rack servers & blade servers and data centers). The majority of research today is CPU-centric whereas in the mobile/portable space, the device skin as well as the other components, which do not have dedicated thermal solutions, are equally challenging to cool. A panel of experts will discuss these aspects and will share their vision on the future of electronics thermal management and other advanced packaging solutions.

Panelists: Ÿ Professor John Thome, EPFL SwitzerlandŸ Dr. Je-Young Chang, Intel Corp. Ÿ Professor YC Lee, University of Colorado at BoulderŸ Professor Yogendra Joshi, Georgia Tech Ÿ Mr. Rick Beyerle, Graftech Inc.

ITHERM 2016: Panels

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Session N4 (Panel 5) - Friday, June 3, 8:00 am - 9:30 am, Condessa 9

Data Centers and Emerging Technologies Next Wave of Innovations for Energy - Efficiency

Moderators: Dr. Niru Kumari, Hewlett Packard Labs; Dr. Banafsheh Barabadi, MIT

Abstract: Big data explosion and the need for real-time analytics/intelligence continues to strain data centers resources. We have also reached a plateau in evolutionary improvement of energy efciency of the computing infrastructures. Therefore, there is a need for a dramatic improvement via novel devices, which can provide up to 10x – 100x computation per Watt. Examples of such devices include non-volatile memory, optics-based networking switches and 3D stacks of CPU with memory and networking. There are important opportunities for thermal engineers and researchers to co-design these devices removing thermal barriers. Our distinguished panel members will discuss key thermal challenges and provide future directions in thermal management for data centers.

Panelists: Ÿ Dr. Eric Pop, Stanford UniversityŸ Dr. Ashish Gupta, IntelŸ Dr. Avram Bar-Cohen, University of MarylandŸ Professor Yogendra Joshi, Georgia TechŸ Professor YC Lee, University of Colorado at Boulder

Session Q4 (Panel 6)-Friday, June 3, 1:55 pm-3:25 pm, Condessa 9

Thermal and Mechanical Design Challenges in Internet of Things – IoT

Moderators: Dr. Baris Dogruoz, Cisco − San Jose

Abstract: Internet of Things (IoT) connects people, things, processes, data, i.e. simply everything which generate tremendous opportunities for people and organizations. IoT makes connection to applications, which enhance efciency, and create new and unique services. In order to support these connections, IoT related hardware equipment need to be designed accordingly and carefully. This panel will focus on the thermal and mechanical design aspects of the IoT related hardware and structures. These devices and structures vary greatly in size, i.e. from micro sensors/small hand-held devices to data centers. The panelists will present their views in addressing the current challenges encountered in the IoT related hardware design and the future direction in these areas. Audience comments and questions will be answered.

ITHERM 2016: Panels

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Panelists: Ÿ Professor Mehmet Arik, Ozyegin University Ÿ Don Le, Qualcomm Ÿ Professor Dereje Agonafer, University of Texas − ArlingtonŸ Dr. Terry O'Shea, Hewlett Packard Ÿ Dr. Angel Han, Huawei Technologies Ÿ Bradley Urban, Lab126

Professional Development Courses at ECTC

We especially call your attention to the following courses covering the thermal field:

[6] Integrated Thermal Packaging and Reliability of Power ElectronicsCourse Leaders: Patrick McCluskey and Avram Bar-Cohen – University of Maryland

[9] Thermo-Electric Coolers: Characterization, Reliability, and ModelingCourse Leader: Jaime Sanchez – Intel Corporation

[18] Thermo-Electrical Co-Design of 3D Chip StacksCourse Leaders: Ankur Srivastava and Avram Bar-Cohen – University of Maryland

ITHERM 2016

ITHERM 2016: Panels

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ITHERM 2016: Technology/Science Talks

Session A4 (TT-1)- Wednesday, June 1, 8:00 am - 9:30 am, Condessa 9

Advanced Cooling Solutions for Photonics

Chair: Domhnaill Hernon, Nokia

Thermally Integrated Photonics Systems - Ryan Enright, Bell Labs Ireland

Network data trafc is growing at unprecedented rates and, as a result, there are signicant hardware changes occurring in the network. To a large extent the capacity of our systems is dictated by the capacity we can achieve in small form factor pluggable (SFP) or CFP type optical interconnect packages. However, existing thermal solutions for large bandwidth transceivers employing wavelength division multiplexing and coherent communications cannot scale to meet the demands of future networks and a new, integrated approach to thermal management is required. Here we present a thermal architecture for silicon photonics called TIPS (Thermally Integrated Photonics Systems) that provides thermal component building blocks to enable >>Tb/s capacities with reduced J/bit in the smallest form factors possible.

Dr. Ryan Enright earned his B. Eng. (Hons) and PhD. degrees in Mechanical Engineering from the University of Limerick, Ireland in 2004 and 2008, respectively. He was a Research Assistant at Bell Labs in Murray Hill, New Jersey from 2005-2007 during his doctoral work. After receiving his Ph.D. he was a CTVR postdoctoral associate at the University of Limerick from 2008-2009 and a Marie-Curie fellow at the Massachusetts Institute of Technology from 2009-2012. He joined Bell Labs Ireland in 2012 where he is currently a senior member of technical staff, the technical lead for the Thermally Integrated Photonics Systems (TIPS) program and a Research-in-Residence at the AMBER@CRANN Institute, Trinity College Dublin, a research institute focused on the development and application of nanomaterials. Ryan conducts experimental and theoretical research in the area of micro/nanoscale heat and mass transfer and has a strong interest in applied surface science and integrated optoelectronic system cooling.

Low Viscosity Non-Newtonian Flows for Enhanced Local Heat Transfer in Micro Devices - Kevin Nolan, Bell Labs Ireland

Local hotspot cooling in high-ux ICT devices is often targeted with microuidic cooling solutions such as arrays of forced convection microchannels. While such approaches can offer excellent cooling performance, this comes at the cost of an increasing pumping penalty with reduced channel diameter. We present investigations into the efciency gains that result from employing shear-thinning viscoelastic uids, with low zero-shear viscosities, in geometries designed to promote local mixing at hotspots while maintaining a low pressure drop elsewhere in the ow loop. This approach allows greater integration of a complete liquid cooling solution within the package for next generation photonics devices.

Dr. Kevin Nolan holds a B.Eng. (Hons) in Aeronautical Engineering from the University of Limerick (2004) and a PhD in experimental uid mechanics from the Stokes Institute (2008) also at UL. After his doctoral studies he was a postdoctoral researcher at the Stokes Institute where he worked on novel low-prole cooling technologies for the ICT sector. Subsequently, in 2009 he was a senior Engineer at Life Technologies where he developed optical systems and software for next generation q-PCR and genotyping instruments.in2010 he joined the Flow Science and Engineering group at Imperial College London as a Marie Curie fellow where he worked on large scale DNS simulations of turbulent ows. He joined Bell Labs Ireland in 2012 as a Member of Technical Staff where he leads the microuidics research activities within the thermal group. Kevin's interests and research activities include multi-scale experimental uid mechanics, turbulence, non-Newtonian and two phase ows, optics and image processing.

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Session E4 (TT-2), Wednesday, June 1, 3:55 pm - 5:25 pm, Condessa 9

High Thermal Conductivity Diamond Films and Substrates for Power Electronics Thermal Management

Chair: Ali Khounsary, Illinois Institute of Technology; Mehdi Asheghi, Stanford University

The Diamond Renaissance for Power Electronics - Ken Goodson, Stanford University

Diamond research is experiencing a renaissance. This material offers a route to the likely limit of electronics cooling, which is in demand for power applications including RF ampliers. While graphene and carbon nanotubes have captured headlines, these low-dimensional media cannot compete with 3D diamond for power management. Materials researchers are striving to bond or deposit high-quality diamond within tens of nanometers of active GaN and silicon transistors. This talk will summarize the latest thermal simulations and metrology approaches that are sorting out phonon transport details in composite diamond substrates. Effective thermal boundary resistance models account for phonon scattering on near-interfacial defects in the diamond and in strained interfacial regions. Time domain thermoreectance is used for benchmarking and is complicated by the anisotropy, nonhomogeneity, and phase and stoichiometric impurities in the polycrystalline diamond. This talk will also place the resurgence of diamond research in context considering the rich, century-long history on this topic.

Dr. Ken Goodson chairs the Mechanical Engineering Department at Stanford University, where he holds the Davies Family Provostial Professorship. His lab has graduated 40 PhDs, nearly half of whom are professors from UC Berkeley and MIT to Stanford and Purdue. Goodson studied at MIT (PhD93) and has co-authored 30 US patents, 190 archival journal articles, and 250 conference papers. Goodson is a Fellow with ASME, IEEE, APS, and AAAS. Recognition includes the ASME Kraus Medal, the Heat Transfer Memorial Award for Science, the THERMI Award, the AiChE Kern Award and, in 2015, named lectureships at MIT, Purdue, and the University of Illinois at Urbana Champaign. Goodson co-founded Cooligy, which built microuidic cooling systems for the Apple G5 and was acquired by Emerson in 2006.

Investigating CVD Diamond Films for Electronics Thermal Management - Sam Graham, Georgia Institute of Technology

Diamond lms grown by chemical vapor deposition are desired as a critical component for the thermal management of high heat ux and and high power density electronics, especially in the application of wide band gap rf devices. Understanding the thermal properties of the diamond in the near interface region is critical to the success of integrated CVD diamond layers for thermal management. In this talk, we will discuss some of the latest thermal metrology efforts through the DARPA Diamond Round Robin to characterize the vertical and lateral thermal conductivity CVD diamond on Si and GaN. in addition to the thermal conductivity, measurements of the thermal boundary resistance will also be presented. We will show several thermal conductivity measurement approaches that are being used, and compare the results of these techniques on CVD diamond lms ranging from 1 - 500 um in thickness. Corresponding microstructural characterization which reveals the grain morphology as well as sp2/sp3 content in the diamond lms will be presented and correlated with the measured thermal conductivity trends. Overall, the goal of the talk will be to give a better understanding of the thermal properties of CVD diamond in the near interface region as well as the challenges associated with the metrology of these layers.

Dr. Samuel Graham is the Rae S. and Frank H. Neely Professor in the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. He also serves as the Associate Chair for Research and holds a joint appointment with the Energy and Transportation Science Division at Oak Ridge National Laboratory. His research focuses on the thermal metrology and reliability of wide bandgap devices made from III-Vs as well as the packaging and reliability of organic and exible electronics. He is a Fellow of ASME and has published over 125 refereed journal publications.

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Session G4 (TT-3), Thursday, June 2, 8:00 am - 9:30 am, Condessa 9

Microfluidics

Chair: Karl Geisler, 3M

Efciency and Performance of Emerging Meso Scale Microuidic Devices for Electronics Cooling – Recent Computational and Experimental Studies - Mehmet Arik, Ozyegin University; M. Baris Dogruoz, Cisco Systems

As electronic devices continuously become more compact, the need for more effective and efcient active cooling technologies also increases. Meso scale cooling devices have recently been of interest to solve thermal problems in such low form factor or tight space thermal estates. Among these devices, synthetic jets serve as a potential candidate to fulll the thermal management needs of the next generation electronics − operating based on micro uidic principles and disturbing the boundary layer causing signicant heat transfer over conventional free convection, as well as forced convection systems. This presentation will start with the introduction of synthetic jet physics, followed by the discussion on the state-of-the-art synthetic jet devices. Recent experimental ad computational studies investigating the momentum and pressure elds of synthetic jets will be reviewed and discussed. Alternative computational methods will be shown with examples. A further study on ow physics via particle image velocimetry experiments will be shown and the importance of dimensionless numbers on the performance will be outlined. Later, the discussions will focus on the heat transfer and the temperature distributions produced by synthetic jets in both mixed and forced convection environments. The thermal performance of these devices will be investigated over two major congurations − impingement and cross ow – in the case of low, medium and high frequency operating conditions. Finally, attention will be turned into mechanical behavior of such devices. Effect of mode shapes at the jet performance and consequences on the power consumption and thermodynamic efciency will be dıscussed. Presentation will conclude with various structural, hydraulic and thermal correlations proposed by different research studies

Dr. Mehmet Arik obtained his B.S. degree in mechanical engineering from İstanbul Technical University, İstanbul, Turkey, M.S. degree from the University of Miami, USA, and Ph.D. degree from the University of Minnesota, USA, in 2001. He has worked at the General Electric Global Research Center in Niskayuna, NY, as a senior research scientist and project leader between 2000 and 2011. Dr. Arik has joined department of mechanical engineering at Ozyegin University as a full time faculty member in 2011. He is a member of ASME and IEEE. He is an ASME fellow. He published over 140 papers in international journals and conferences, 4 books and book chapters in the elds of electronics cooling, energy systems, and MEMS. He holds over 110 US/EU/Asia and world patents and several applications are pending. Dr. Arik serves as an associate editor for IEEE Components and Packaging Technologies, ASME Journal of Electronics Packaging and ASME Thermal Sciences and Engineering Applications journals. He also serves for Journal of Solid State Lighting editorial board and scientic committee member for International Center for Heat and Mass Transfer.

Dr. Baris Dogruoz is the Technical Leader of Thermal Engineering in Data Center Group (DCG) at Cisco Systems Inc., responsible from the hydraulic, thermal and acoustic architecture and development of Cisco's data center product portfolio. Previously, he was a CFD Specialist with Fluent Inc., a Senior CFD/Thermouids Specialist with Ansys Inc., and a Lead CFD Specialist/Consultant with Amoeba Technologies Inc.He has published 35 peer-reviewed international conference and journal articles and 4 U.S. patents (pending). Dr. Dogruoz is the recipient of the Young Engineer Award in 2014 from the American Society of Mechanical Engineers (ASME) Electronic and Photonic Packaging Division (EPPD). He is a senior member of IEEE, member of ASME and has held several committee memberships at these organizations. He received the B.S. degree with honors in Mechanical Engineering from Middle East Technical University, Ankara, Turkey and the Ph.D. degree in Mechanical Engineering with a Minor in Applied Mathematics from The University of Arizona, in 1998 and 2005, respectively.


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Session L4 (TT-4), Thursday, June 2, 4:00 pm - 5:30 pm, Condessa 9

Aerospace Thermal Management

Chair: Peter de Bock, GE Global Research

Advanced Cooling Techniques and Thermal Design Procedures for Airborne Electronic Equipment - Ross Wilcoxon, Rockwell Collins

“Advanced Cooling Techniques and Thermal Design Procedures for Airborne Electronic Equipment” was the title of a research proposal that was submitted by Collins Radio Company to the United States Air Force System Command in November, 1968. This presentation will describe the electronics cooling approaches addressed in that proposal and how technologies used in avionics have progressed over the nearly half-century since it was written. Lessons learned from reecting on this previous work, combined with reviewing trends in electronics packaging and aerospace systems, will be used to assess what the future looks like for thermal management of avionics.

Dr. Ross Wilcoxon is a Principal Mechanical Engineer in the Rockwell Collins Advanced Technology Center. His research areas have included rapid test methods for evaluating component reliability, heat pipes, liquid metal cooling, advanced composites and tin whisker mitigation. Prior to joining Rockwell Collins in 1998, he was an assistant professor at South Dakota State University. He received B.S. and M.S. degrees in mechanical engineering from South Dakota State University and a Ph.D. in mechanical engineering from the University of Minnesota.

Development of Advanced Spacecraft Thermal Management Subsystems - Jeff Didion, NASA Goddard Space Flight Center

The Goddard Space Flight Center Thermal Engineering Branch maintains a robust thermal technology development program to validate advanced thermal control systems for future spacecraft. This program consists of fundamental research as well as development of proof of concept, breadboard and prototype hardware for spaceight validation. The fundamental investigations include meso-, micro-, and nano-scale heat transfer; our focus is electrically and capillary driven phenomena. The hardware development efforts concentrate upon spaceight validation of embedded and intelligent integrated thermal management components (heat acquisition and rejection) for multi-functional structures and electronics subsystems to enable both Decadal Missions and small footprint spacecraft such as CubeSats.

Next Generation Heat Transfer Devices using Innovative Materials and Manufacturing Processes - Michael Stoia and Arun Muley, Boeing Research and Technology

Advances in Additive Manufacturing (AM), using metal and polymer materials, has enabled the creation of complex geometries that cannot be produced using traditional manufacturing approaches. These advances are currently being leveraged to provide rapid prototyping and demonstration of next generation heat exchangers, heat pipes and heat sinks while work continues towards developing AM processes for full-scale production of affordable thermal management devices. This presentation provides a brief summary of recent advances in AM of thin-walled structures for thermal management devices, development of new heat exchanger geometries that provide air-side heat transfer augmentation, and development of thermally conductive polymer composites. This work is a collaborative effort, involving multiple Boeing sites and partners in both industry and academia, with funding received through IR&D and CR&D programs.

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Michael Stoia is a Power, Propulsion and Thermal Management Engineer with Boeing Research & Technology in Huntington Beach, CA. He currently supports development of thermal energy storage devices, surfaces with compound air-side heat transfer enhancement, and conductive polymer composites for next generation heat exchangers. He received his MS (1997) from the University of Wisconsin, and his MBA (1995) and BS (1994) from Rutgers University.

Dr. Arum Muley is a Thermal Management Lead at Boeing Research and Technology in Huntington Beach, CA. He joined the Boeing Company in 2010 where he is leading several advanced thermal and heat exchanger programs which include CRAD and university research. He is a Fellow of the American Society of Mechanical Engineers (ASME), a member of the Executive Committee of the Heat Transfer division and an Associate Editor of journal of Thermal Science and Engineering Applications. He received his Ph.D. (1997) and MS (1992) from the University of Cincinnati, and BS (1988) from the National Institute ofTechnology, Calicut, Kerala, India.

ITHERM 2016

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Session P4 (TT-5), Friday, June 3, 10:40 am - 12:10 pm, Condessa 9

Embedded Inter/Intra-chip Cooling I

Chair: Justin A Weibel, Purdue University

Recent Advances in Simulation of DARPA ICECool Fundamental's Embedded Two-Phase Cooling - Kaiser Matin, ECS-Federal

This talk addresses various advancements in simulation strategies and numerical techniques adopted by the DARPA ICECool Fundamental performers, with attention devoted to two phase ow through advanced processors and RF MMIC power ampliers. Challenges involve achieving high exit qualities with low pressure drop, effect of CTE mismatch on integrity, factors affecting erosion/corrosion in the channels, electro-migration and joule heating effects. How these multi-physics are co-designed in estimating near wall heat transfer coefcients, predicting CHF and preventing dryout will also be addressed.

Dr. Kaiser Matin is a Senior Principal Engineer at ECS-Federal LLC in Arlington, VA. He provides strategy and technology support as a DARPA/MTO Technical SETA contractor. Kaiser is a member of IEEE and ASME. Previously, he was a Staff Engineer at United Technologies and was responsible for the thermal design of airborne electronic boxes, motors and generators. Kaiser received his MS and PhD degrees from Texas Tech.

Near Junction Intra-chip Thermal Management Technology for High Power GaN- David H. Altman, Raytheon

Self-heating effects are known to limit power density in Gallium Nitride (GaN) on Silicon Carbide (SiC) MMICs.at present, thermally-induced performance and reliability degradation must generally be mitigated by reducing drain voltage and/or increasing gate-to-gate spacing, reducing MMIC RF power density. While thermal packaging techniques continue to advance, near junction intra-chip thermal management improvements for GaN are needed if we are to unlock its intrinsic electromagnetic potential. This talk reviews progress in the development of near junction intra-chip cooling technologies for GaN, focusing on the integration of diamond substrates and application of microuidic cooling techniques. Emphasis will be placed on electro-thermal co-design, fabrication and application considerations and challenges.

David Altman is an Engineering Fellow at Raytheon Integrated Defense Systems (IDS) in Marlborough, MA. As a member of IDS Advanced Technology Programs, his current work focuses on development of new thermal management and energy technologies. David holds BS and MS degrees from Rensselaer Polytechnic Institute and Boston University.

Assessing Reliability of Integrated Microuidics for Power Electronics Cooling - Patrick McCluskey, University of Maryland

The trend in power electronics is to accommodate increasing power levels in ever smaller modules. Even with the increases in efciency made possible by the use of wide bandgap devices, the power loss density continues to increase. Ever more elaborate thermal management schemes are thus needed to keep the module cool, including the integration of microuidic devices into the power packaging. This talk will discuss the reliability concerns involved in the structural integration of these coolers. The talk will also discuss issues related to the reliability of the coolers themselves, including the development of models for both clogging and erosion/corrosion, and their calibration and validation.

Dr. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland, College Park, where he conducts research in the Center for Advanced Life Cycle Engineering (CALCE) focusing in the areas of thermal management, reliability, and packaging of electronic systems for use in extreme temperature environments and high power applications. He is an associate editor of the IEEE TCP, a fellow of IMAPS, a senior member of IEEE, and a member of ASME.

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Session R4(TT-6), Friday, June 3, 3:30 pm - 5:00 pm, Condessa 9

Embedded Inter/Intra-chip Cooling II

Chair: Michael M. Ohadi, University of Maryland; Darin Sharar, General Technical Services

Impingement Cooled Embedded Diamond GaN HEMTs - Vincent Gambin, Northrop Grumman Aerospace Systems

Extending the performance of GaN power amplier MMICs to higher RF output power at a reduced die size has been an ongoing research area to improve system SWaP-C. We report developments under the DARPA ICECool Applications program to dramatically reduce the thermal resistance of a GaN HEMT MMIC using an impingement cooled embedded diamond approach in this design, a near-junction diamond heat spreader is integrated with distributed, submerged microuidic impingement jets. The proposed technique is shown to mitigate self-heating thermal limitations and enable extremely aggressive design compaction not possible with existing state of the art GaN-on-SiC technology. This research was developed with funding from DARPA.

Dr. Vincent Gambin received his PhD from Stanford University in Material Science and Engineering. He's worked at Northrop Grumman for 14 years as manager in semiconductor materials development in the Microelectronics Center. His research focus has been in the area of optoelectronics and RF electronics, developing advanced GaAs, InP and GaN semiconductor devices. Recently he has taken on a new role standing up a semiconductors and devices basic research group in the new NG NEXT organization. He is currently the PI for DARPA's ICECool Applications program.

Chip Embedded Two Phase Cooling for High Performance Computing - Timothy Chainer, IBM T J Watson Research Center

Dr. Timothy Chainer is a Principal Research Staff Member at IBM Research with broad experience in technology innovation and development. In his current role, Dr. Chainer leads a Subsystem Cooling and Integration team and is the Principal Investigator for the IBM DARPA ICECool Fundamentals and ICECool Applications programs which focus on the development of embedded cooling for high performance computing. He is a Senior Member of the IEEE and an elected member of the IBM Academy of Technology. Dr. Chainer received his PhD in Low Temperature Experimental Physics from Rutgers University.

Liquid Cooling of Microsystems Using Pin Fin Enhanced Microgaps - Yogendra Joshi, Georgia Institute of Technology

High performance planar and 3D stacked chip microsystems of the future have been projected by DARPA to result in background heat uxes in excess of 1 kW/cm2 and localized hot spots of >5 kW/cm2. Requirements for routing of electrical interconnects across the entire 3D chip stack, along with the need for enhancement of heat transfer surface area have made microgaps incorporating pin n arrays an attractive design conguration. I will discuss single phase forced convection in enhanced microgaps using a variable density of pin ns to handle highly non-uniform power maps. Single phase convection in results in increasing chip temperature in the ow direction. Higher chip temperature uniformity, and reduced liquid mass ow rate and pumping power may be achieved by ow boiling. However, boiling instabilities and dryout remain key concerns. Characteristics of ow boiling for the enhanced microgap will be discussed for a range of heat and mass uxes.

Dr. Yogendra Joshi is Professor and John M. McKenney and Warren D. Shiver Distinguished Chair at the G.W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. at Georgia Tech he is the PI of the Ofce of Naval Research Consortium for Resource-Secure Outposts (CORSO), and Site Director for the NSF I/UCRC on Energy Efcient Electronic Systems. He received a Ph.D. in Mechanical Engineering and Applied Mechanics, from the University of Pennsylvania in 1984. He is an elected Fellow of the ASME, the American Association for the Advancement of Science, and IEEE.

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Session A1 (Thermal):

Heat Pipes/Vapor Chamber

Condessa 2

Session Organizers:Sreekant Narumanchi, NREL;Satish Kandlikar, RIT

1. Experiment on Evaporation Heat Transfer Performance of Porous Surface Shigeki Hirasawa,Takuya Nakajima, Tetsuya Urimoto, Yuya Tsujimoto, Yusuke Takeuchi, Tsuyoshi Kawanami, Katsuaki Shirai, Kobe University

2. Thermal Behavior of Water-Copper and Water-Stainless Steel Heat Pipes Operating in Cycles Debora Silva, Roger Riehl, National Institute for Space Research

3. A Review on Thermal Performance of CuO-Water Nanouids Applied to Heat Pipes and Their Characteristics Eliel Marcelino, Roger Riehl, Debora Silva, National Institute for Space Research

4. Detailed Thermal Resistance Model for Characterization of the Overall Effective Thermal Conductivity of a Flat Heat Pipe Sivanand Somasundaram, Singapore MIT Alliance; Kevin Robert Bagnall, Solomon Adera, MIT; Bein He, Singapore MIT Alliance; Mengyao Wei, Chuan Seng Tan, Singapore MIT Alliance and Nanyang Technological University; Evelyn Wang, Singapore MIT Alliance and MIT

5. Optimization of Hybrid Wick Structures for Extreme Spreading in High Performance Vapor Chambers Tanya Liu, Srilakshmi Lingamneni, James Palko, Mehdi Asheghi, Kenneth Goodson, Stanford University

6. Capillary Flow Characteristics of a Novel Micropillar Array for Applications in Capillary-driven Two-phase Cooling Systems Ashley Byers, Jeff Darabi, Southern Illinois University Edwardsville

Session A2 (Mechanics):

Mechanics for 3D Packaging

Condessa 5

Session Organizers:Pradeep Lall, Auburn University; Liang Yin, GE

1. Stress Reduction Methods within the Back End of Line (BEOL) for Fine Pitch and 2.5D/3D Packaging Congurations Krishna Tunga, Thomas Wassick, Luc Guerin, Maryse Cournoyer, IBM

2. Geometric Optimization and Mechanical Risk Mitigation in 2.5D Flip- chip Packages using Parametric Finite Element Analysis (FEA) Simulations Tuhin SInha, Shidong Li, Krishna Tunga, Jeffrey A Zitz, Kamal K Sikka, IBM

3. Minimization of Residual Stress in TSV Interconnections by Controlling Their Crystallinity Jiatong Liu, Takeru Kato, Ken Suzuki, Hideo Miura, Tohoku University

4. Thermo-Mechanically and Electrically Induced Interfacial Incompatibility in 3D Packages with Through Silicon Vias Hanry Yang, Lutz Meinshausen, Indranath Dutta, Washington State University; Tae-Kyu Lee, Cisco Systems

5. Inuence of Temperature Gradient on Electromigration Failures in 3D Packaging Ramdev Kanapady, MSCWorks; Darryl Moore, Arun Raghupathy, William Maltz, Electronics Cooling Solutions

Wednesday, June 1, 8:00 am – 9:30 am

ITHERM 2016: Detailed Technical Program

ITherm Sponsors & Exhibits9:00 am - 12:30 pm

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Session A3 (Emerging Technologies):

Advanced Thermal Packaging

Condessa 6

Session Organizers:Mehdi Saeidi, Qualcomm; Xiaobing Luo, Huazhong University; Hasan Celek, Izmir Institute of Technology

1. Embedded Two-Phase Cooling of High Flux Electronics using a Directly- Bonded FEEDS Manifold Raphael Mandel, Serguei Dessiatoun, Michael Ohadi, University of Maryland

2. Design, Microfabrication and Thermal Characterization of a Hotspot Cooler Testbed for Convective Boiling Experiments in Extreme-microgap with Integrated Micropin-ns Xuchen Zhang, Mohamed H. Nasr, David Casey Woodrum, Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Yogendra K. Joshi, Suresh K. Sitaraman, Andrei G. Fedorov, Muhannad S. Bakir, Georgia Tech

3. Thermal Annealing Effects on Copper Microstructure in Through-Silicon- Vias Yaqin Song, Reza Abbaspour, Muhannad S. Bakir, Suresh K. Sitaraman, Georgia Tech

4. A High Performance Multi Component Carrier with Chip Scale Package Hongqing Zhang, Charles Reynolds, Tuhin Sinha, Jeff Zitz, Frank Pompeo, IBM

5. Effect of Removal of Layers of WCSP Assembly under Thermal Cyclic Loading: A Computational Approach Trina Barua, Anik Mahmood, Karthik Rajashekar, Sayalee Sabne, A R Nazmus Sakib, Dereje Agonafer, UT-Arlington

6. Thermal-Mechanical Considerations during Thermal Solution Assembly of Bare-Die Packages Je-Young Chang, Tannaz Harirchian, Shubhada Sahasrabudhe, Steve Klein, Frank Liang, Haowen Liu, Moss Weng, Mark Gallina, Marco A. Cartas-Ayala, Radha Muddu, Ashish Gupta, Intel

Session A4 (Technology Talk 1): Advanced Cooling Solutions for Photonics - Condessa 9Chair: Domhnaill Hernon, Nokia

1. Thermally Integrated Photonics Systems - Ryan Enright, Bell Labs Ireland 2. Low Viscosity Non-Newtonian Flows for Enhanced Local Heat Transfer in Micro Devices - Kevin Nolan, Bell Labs Ireland

Session B1 (Keynote) - Condessa 3

Flexible Data Center Design Building - Christopher G. Malone, Google

Session C1 (Thermal):

TIM/PCM

Condessa 2

Session Organizers:Jeffrey Zitz, IBM; Sergio Chan Arguedas, Intel

1. Thermal Management Solutions for a Traction Robot for Use in Downhole Extreme Conditions Shuang Gao, Jingjing Cheng, Ming Zhou, Zhiyu Gong, Huazhong University; Aihua Tao, China Oileld Service

2. Experimental and Computational Evaluation of Phase Change Materials for Handheld Computing Ramdev Kanapady, MSCWorks; Darryl Moore, Arun Prakash Raghupathy, William Maltz, Electronic Cooling Solutions

Wednesday, June 1, 8:00 am – 9:30 am (Cont.)

Wednesday, June 1, 9:35 am – 10:35 am

Wednesday, June 1, 10:40 am – 12:10 pm


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TIM/PCM

Condessa 2

Session Organizers:Jeffrey Zitz, IBM; Sergio Chan Arguedas, Intel

3. Integration of Metallic Phase Change Material in Power Electronics Ulrich Soupremanien, Helga Szambolics, Sebastien Quenard, Philippe Bouchut, Marilyne Roumanie, Remi Bottazzini, Nicolas Dunoyer, CEA-LITEN

4. Fabrication of Compliant Three-Dimensional Microstructures as Surface Coatings for Dry Contact Thermal Conductance Enhancement Ryan G Wasielewski, Jin Cui, Liang Pan, Justin A Weibel, Purdue University

5. Electroplated Copper Nanowires as Thermal Interface Materials Justin Chow, Suresh K. Sitaraman, Georgia Tech

6. Review of Percolating and Neck-based Underlls with Thermal Conductivities of Up-to 3 W/m-K Thomas Brunschwiler, Jonas Zuercher, Severin Zimmermann, Brian Burg, Gerd Schlottig, Xi Chen, Tuhin Sinha, Rahel Straessle, IBM; Mario Baum, Christian Hofmann, Remi Pantou, Fraunhofer ENAS; Albert Achen, Lord Germany; Uwe Zschenderlein, Sridhar Kumar, Bernhard Wunderle, TU Chemnitz; Marie Haupt, Florian Schindler-Saefkow, AMIC


Air Cooling / Heat Sinks

Condessa 5

Session Organizers:Ryan Enright, Bell Labs; Karthik Bodla, GE

1. Heat Transfer Enhancement of a Heat Sink Using Electromagnetically- Driven Oscillating Sheet Array Hsienchin Su, Dastrong; YenFeng Li, Notus

2. Investigation of Power Distribution on an Axial Fan Haz M. Hashim, Ozyegin University; Yusuf Yasa, Yildiz Technical University; M. Baris Dogruoz, Cisco; Mehmet Arik; Erkan Mese, Yildiz Technical University

3. Thermally Conductive Plastics for Innovative Thermal Management Solutions Chandrashekar Raman, Peter Schmidt Sane, Momentive Performance Materials

4. Kinetic Cooling for Thermal Management of High Power Electronics Lino Gonzalez, Ben Kessel, Jiyue Zhang, CoolChip Tech

5. Doubling the Output of Automotive LED Headlight with Efcient Cooling using Thermal Pyrolytic Graphite Wei Fan, Eelco Galestien, Creighton Tomek, S. Manjunath, Momentive Performance Materials Quartz

Session C3 (Emerging Technologies):

Automotive/LED

Condessa 6

Session Organizers:Zhihua Li, Amazon; Liyong Sun, Penn State

1. Evaluation of Performance and Opportunities for Improvements in Automotive Power Electronics Systems Gilberto Moreno, Kevin Bennion, Chales King, Sreekant Narumanchi, NREL

2. Fundamental Study on Subcooled Boiling of Binary Mixture of Anti- freezing Liquid toward Advanced Cooling Technology for a SiC-based On-vehicle Inverter Tadashi Furusho, Kazuhisa Yuki, Koichi Suzuki, Tokyo University of Science-Yamaguchi

3. Encapsulant Thickness Options as a Factor to Impact Thermal Performance of Chip-on-Board (COB) Light Emitting Diodes Linjuan Huang, Yuchou Shih, Frank Shi, UC-Irvine

Wednesday, June 1, 10:40 am – 12:10 pm (Cont.)



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Session C3 (Emerging Technologies):

Automotive/LED

Condessa 6

Session Organizers:Zhihua Li, Amazon; Liyong Sun, Penn State

4. Inverse Approach to Characterize Die-Attach Thermal Interface of Light Emitting Diodes Dae-Suk Kim, Bongtae Han, Avram Bar-Cohen, University of Maryland

5. A Comparison of Temperature and Humidity Effects on Phosphor Converted LED Package and the Prediction of Remaining Useful Life with State Estimation Pradeep Lall, Hao Zhang, Auburn University; Lynn Davis, RTI International

Session C4 (Panel 1): Micro-Two-Phase Liquid Cooling Systems for Electronics - Condessa 9

Moderator: John R. Thome, Ecole Polytechnique Fédérale de Lausanne

Panelists: David Copeland, Oracle; Thomas Brunschwiler, IBM; Todd Salamon, Nokia/Bell Labs; Abhinav Dixit, Eaton; Soheil Farshchian, Google; Jackson Marcinichen EPFL

Luncheon Talk by ITherm Achievement Award Winner - Condessa 3 and 4

Presented by Suresh Garimella, Purdue University

Session D1 (Thermal):

MCM/3D Packaging

Condessa 2

Session Organizers:Timothy Chainer, IBM; Kaushik Mysore, AMD

1. Temperature Estimation of High Temperature Data Acquisition Multichip Module for Oil Field Apparatus Xianglong Meng, Shuang Gao, Jingjing Cheng, Huazhong University; Guangwei Wang, China Oileld Service; Hui Cao, Xian Microelectronics Technology Institute

2. Dynamic Compact Thermal Modeling of Package-on-Package by Thermal Resistor-Capacitor Ladder Taiyu Chen, Sheng-Liang Kuo, Jih-Ming Hsu, Chi-Wen Pan, Mediatek

3. Model Abstraction of 3D-Integrated/Interposer-Based High Performance Systems for Faster Thermal Simulation Andy Heinig, Dimitrios Papaioannou, Robert Fischbach, Fraunhofer IIS EAS

4. Topology Optimization for Efcient Heat Removal in 3D Packages Chun- Pei Chen, Yifan Weng, Ganesh Subbarayan, Purdue University

5. Electronics Cooling with On Board Conformal Encapsulation S. J. Young, General Dynamics; D. Janssen, E. A. Wenzel, B. M. Shadakofsky, Frank Kulacki, University of Minnesota

6. Analytical Modeling for Prediction of Chip Package-level Thermal Performance Tanya Liu, Kenneth Goodson, Stanford; Madhusudan Iyengar, Chris Malone, Google

Wednesday, June 1, 10:40 am – 12:10 pm (Cont.)

Wednesday, June 1, 12:15 pm – 1:45 pm



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Session D2 (Mechanics):

Applied Reliability

Condessa 5

Session Organizers:Myung Sung, Ford; Meriem Akin, Leibniz University of Hanover

1. Development and Demonstration of Equivalent Material Characteristics for Microbump Arrays Utilized in Failure Estimation of Chip-on-Chip Packaging Chang-Chun Lee, Pei-Chen Huang, Bow-Tsin Chain, Chung Yuan, Christian University

2. Effect of Column Properties and CGA Assembly Reliability by Testing and Analysis Reza Ghaffarian, JPL

3. Reliability of a CBGA Microprocessor Package Incorporating a Decoupling Capacitor Array Jordan Roberts, Chandan Bhat, Jeffrey Suhling, Richard Jaeger, Pradeep Lall, Auburn University

4. PBGA Package Finite Element Analysis Based on the Physical Geometry Modeling using X-ray Micro CT Digital Volume Reconstruction Pradeeep Lall, Junchao Wei, Auburn University

5. Reliability Assessment of Hydrofoil-Shaped Micro-Pin Fins David Casey Woodrum, Xuchen Zhang, Peter Kottke, Yogendra Joshi, Andrei Fedorov, Muhannad Bakir, Suresh Sitaraman, Georgia Tech

Session D3 (Emerging Technologies):

Microchannels/Immersion Cooling

Condessa 6

Session Organizers:Hadi Ghasemi, University of Houston; Damena Agonafer, Stanford; Amy Betz, Kansas State

1. Mixing Enhancement Due to Viscoelastic Instability in Serpentine Microchannels at Very Large Weissenberg Numbers Kevin Nolan, Akshat Agarwal, Shenghui Lei, Bell Labs; Eric Dalton, University of Limerick

2. Evaporative Intrachip Hotspot Cooling with a Hierarchical Manifold Microchannel Heat Sink Array Kevin P Drummond, Justin A Weibel, Suresh V Garimella, Doosan Back, David B Janes, Michael Sinanis, Dimitrios Peroulis, Purdue University

3. Effects of Mineral Oil Immersion Cooling on IT Equipment Reliability and Reliability Enhancements to Data Center Operations Jimil Shah, Richard Eiland, Ashwin Siddharth, Dereje Agonafer, UT-Arlington

4. Embedded Two Phase Liquid Cooling for Increasing Computational Efciency Pritish Parida, Augusto Vega, Alper Buyuktosunoglu, Pradip Bose, Timothy Chainer, IBM

5. Study of Two-phase Pressure Drop and Heat Transfer in a Micro-scale Pin Fin Cavity: Part A Arvind Sridhar, Ozgur Ozsun, Thomas Brunschwiler, Bruno Michel, Pritish Parida, Thomas Brunschwiler, Timothy Chainer, IBM

6. Study of Two-phase Pressure Drop and Heat Transfer in a Micro-scale Pin Fin Cavity: Part B Pritish Parida, Arvind Sridhar, Thomas Brunschwiler, Timothy Chainer, IBM

Session D4 (Panel 2): X-ray Characterization of Diamond and Other Highly Conductive Materials - Condessa 9

Moderators: Ali Khounsary, IIT; Avi Bar-Cohen, UMD; Matin Kaiser, ECS-Federal

Panelists: Piero Pianetta, Stanford; Samuel Graham, Georgia Tech; Sunil Sinha, UC San Diego; Phil Eisenlohr, Michigan State; Daniel Twitchen, Element 6

Wednesday, June 1, 1:50 pm – 3:20 pm (Cont.)


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Session E1 (Thermal):

Pool Boiling

Condessa 2

Session Organizers:Poh-Seng Lee, National University of Singapore;Arun Muley, Boeing

1. Study of Secondary Pool Poiling Effects with Functionalized Surfaces Created via Femtosecond Laser Surface Processing Corey Kruse, A. Tsubaki, C. Zuhlke, T. Anderson, D. Alexander, G. Gogos, S. Ndao, University of Nebraska - Lincoln

2. Experimental Study of Bubble Dynamics in Highly Wetting Dielectric Liquid Pool Boiling through High-speed Video Wei Tong, Chenlong Wu, Kok Chuan Toh, Fei Duan, Nanyang Technological University

3. Hotspot Thermal Management via Thin-Film Evaporation Solomon Adera, Dion Antao, Evelyn Wang, MIT; Rishi Raj, IIT

4. Model Optimization of Dry-out Heat Flux from Micropillar Wick Structures Yangying Zhu, Zhengmao Lu, Dion Antao, Evelyn Wang, MIT; Hongxia Li, Tiejun Zhang, Masdar Institute of Science and Technology

5. 2 Phase Microprocessor Cooling System with Controlled Pool Boiling of Dielectrics Over Micro-and-nano-Structured Integrated Heat Spreaders Miguel Moura, Emanuele Teodori, Ana Moita, Antonio Moreira, University of Lisbon

6. Pool Boiling Enhancement through Hierarchical Texturing of Surfaces Minseok Ha, Samuel Graham, Georgia Tech

Session E2 (Thermal):

Characterization/ Instrumentation

Condessa 6

Session Organizers:Nishi Ahuja, Intel; James Petroski, Design By Analysis

1. Investigation of Internal Package Structure Based on the Analysis of Dynamic Temperature Response Marcin Janicki, Tomasz Torzewicz, Andrzej Napieralski, TU-Lodz

2. Heat Transfer Coefcient Measurements in the Thermal Boundary Layer of Microchannel Heat Sinks Mehrdad Mehrvand, Shawn Putnam, University of Central Florida

3. Thermal Imaging of Nanometer Features Kazuaki Yazawa, Dustin Kendig, Alex Shakouri, Microsanj; Amirkoushyar Ziabari, Ali Shakouri, Purdue University

Session E3 (Mechanics):

Finite Element Analysis Techniques

Condessa 5

Session Organizers: Pramod Malatkar: Sruti Chigullapalli, Intel

1. The Anand Parameters for SAC Solders after Extreme Aging Munshi Basit, Sudan Ahmed, Mohammad Motalab, Jordan Roberts, Jeffrey Suhling, Pradeep Lall, Auburn University

2. Improved Meshing Strategy for Finite Element Modeling of PBGA Thermal Cycling Chien-Chih Chen, Jeffrey Suhling, Pradeep Lall, Auburn University

3. A Novel Micro-CT Data Based Finite Element Modeling Technique to Study Reliability of Densely Packed Fuze Assemblies Pradeep Lall, Nakul Kothari, Auburn University; Jason Foley, John Deep, AF Research Lab; Ryan Lowe, ARA Association


Coffee Break: 3:25 pm – 3:55 pm


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Session E3 (Mechanics):

Finite Element Analysis Techniques

Condessa 5

Session Organizers: Pramod Malatkar: Sruti Chigullapalli, Intel

4. A Computational Study of PCB Layer Orientation of WCSP Assembly under Temperature Dependent Drop Impact Loading Anik Mahmood, Trina Barua, Sayalee Sabne, A R Nazmus Sakib, Dereje Agonafer, UT-Arlington

5. Improved Predictions of Cyclic Stress-Strain Curves for Lead Free Solders using the Anand Viscoplastic Constitutive Model Mohammad Motalab, Muhannad Mustafa, Jeffrey Suhling, Pradeep Lall, Auburn University

Session E4 (Technology Talk 2): High Thermal Conductivity Diamond Films and Substrates for Power Electronics Thermal Management - Condessa 4Chairs: Ali Khounsary, Illinois Institute of Technology; Mehdi Ashengi, Stanford University

1. The Diamond Renaissance for Power Electronics - Ken Goodson, Stanford University 2. Investigating CVD Diamond Films for Electronics Thermal Management - Sam Graham, Georgia Institute of Technology

Session F1 (Thermal):

Data Center-Efciency I

Condessa 6

Session Organizers: Ridvan Sahan, Intel; Rajat Mittal, Qualcomm

1. Evaluation of a New Data Center Air-cooling Architecture: The Down- ow Plenum Daniel Hackenberg, TU-Dresden; Michael K Patterson, Intel

2. The Design and Construction of a Bench-Top Organic Rankine Cycle for Data Center Applications Sebastian Araya, Gerard Jones, Amy Fleischer, Villanova University

3. Energy Efciency and Reliability Transformation at the IBM India Software Lab Data Center Dustin Demetriou, Pushpendra Pandey, Shankar KM, Vidhya Shankar, Veerendra Para, Aiswarya Mohanasundaram, IBM

4. Combining Cooling Technology and Facility Design to Improve HPC Data Center Energy Efciency Lynn Parnell, NASA; Dustin Demetriou, Eric Zhang, IBM

5. Parametric Investigation for Performance of the Active Tile in Data Centers Zhihang Song, Northeastern University in China

6. Energy Assessment of CRAH Bypass for Enclosed Aisle Data Centers Hamza Salih Erden, Istanbul Tech University; Mehmet Turgay Yildirim, Mustafa Koz, H. Ezzat Khalifa, Syracuse University



ITherm Sponsors & Exhibits2:00 pm - 5:30 pm


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Session F2 (Mechanics):

Solder Reliability

Condessa 5

Session Organizers: Krishna Tunga; IBM; Banafsheh Barabadi, MIT

1. Drop Impact Reliability Testing of Isothermally Aged, Doped Low Creep Lead-free Solder Paste Alloys Sharath Sridhar, Anto Raj, Seth Gordon, Sivasubramanian Thirugnanasambandam, John Evans, Auburn University; Wayne Johnson, Tennessee Tech University

2. Survivability Assessment of Electronics Subjected to Mechanical Shocks Up to 25,000g Pradeep Lall, Kalyan Dornala, Auburn University; Ryan Lowe, ARA Association; Jason Foley, AF Research Lab

3. A Study on the Effect of Aging on Thermal Cycling Reliability of Sn-Ag-Cu Interconnects Using Digital Image Correlation Pradeep Lall, Kazi Mirza, Jeff Suhling, Auburn University

Session F3 (Emerging Technologies):

Jets/Mobile

Condessa 6

Session Organizers: John Peeples, Citadel; Justin Weibe, Purdue University

1. Correlation for Single Phase Liquid Jet Impingement with an Angled Conning Wall for Power Electronics Cooling John Maddox, University of Kentucky; Roy Knight, Sushil Bhavnani, James Pool, Auburn University

2. Wireless Device Performance Management Based on the Thermal Resistance Matrix Kenan Kocagoez, Intel

3. Two-Dimensional Numerical Analysis of a Low-Re Turbulent Impinging Synthetic Jet Luis Silva-Llanca, Jean Paul Dalencon, Universidad De La Serena

4. Replicating Impinging Synthetic Jets as a Train of Consecutive Viscous Lamb-Ossen Vortex Pairs Luis Silva-Llanca, Universidad De La Serena

5. Thermal Management and Safety Regulation of Smart Watches Angel Qian Han, Huawei Device

ASME K-16/EPPD Committee Meeting - Condessa 6



ITHERM 2016


31

Session G1 (Thermal):

Thermosyphon/Vapor Chamber

Condessa 2

Session Organizers:Shailesh Malla, Zodiac Aerospace; Xiaojin Wei, IBM

1. Vapor Chamber Forced Convection Cooling Using Flow Boiling in Open Microchannels and Tapered Manifolds Philipp K. Buchling, Satish G. Kandlikar, Rochester Institute of Technology

2. Experiments on the Ultrathin Silicon Vapor Chamber for Enhanced Heat Transfer Performance Bin He, SMART; Mengyao Wei, SMART AND Nanyang Technical University; Sivanand Somasundaram, SMART; Chuan Seng Tan, SMART AND Nanyang Technical University; Evelyn Wang, SMART and MIT

3. Two-Phase Mini-Thermosyphon Electronics Cooling, Part 1: Experimental Investigation Chin Lee Ong, Nicolas Lamaison, Jackson Braz Marcinichen, John Richard Thome, LTCM-EPF

4. Two-Phase Mini-Thermosyphon Electronics Cooling, Part 2: Model and Steady-State Validations Jackson Braz Marcinichen, Nicolas Lamaison, Chin Lee Ong, John Richard Thome, LTCM-EPFL

5. Two-Phase Mini-Thermosyphon Electronics Cooling, Part 3: Transient Modeling and Experimental Validation Nicolas Lamaison, Jackson Braz Marcinichen, Chin Lee Ong, John Richard Thome, LTCM-EPFL

6. Two-Phase Mini-Thermosyphon Electronics Cooling, Part 4: Application to 2U Servers Nicolas Lamaison, Jackson Braz Marcinichen, Chin Lee Ong, John Richard Thome, LTCM-EPFL

Session G2 (Thermal):

Single-Phase Convection & Cold Plates

Condessa 5

Session Organizers:Ralph Schacht, TU-Brandenburg; Mohamad Abo Ras, Nanotest

1. Experimental and Numerical Study of a Water-stirring Radiator Cheng Chen, Run Hu, Xiaobing Luo, Huazhong University

2. Hybrid Warm Water Cooled Supercomputing System David Moore, Matt Slaby, Tahir Cader, Hewlett Packard Enterprise; Kevin Regimbal, NREL

3. Test Results from the Comparison of Three Liquid Cooling Methods for High-Power Processors Guy Wagner, Joseph Schaadt, Justin Dixon, Gary Chan, William Maltz, Electronic Cooling Solutions; Kamal Mostafavi, CoolIt Systems; David Copeland, Oracle

4. Numerical Investigation of the Thermal-Hydraulic Performance of Finned Oblique-shaped Tube Heat Exchanger Kent Loong Khoo, Chuan Sun, Nuttawut Lewpiriyawong, Poh Seng Lee, Siaw Kiang Chou, NUS

5. Enhanced Air-Side Performance of Finned Tube Heat Exchanger with Stamped Oval Obstacles for Residential Air-Conditioning Systems: Numerical Approach Nuttawut Lewpiriyawong, Chuan Sun, Kent Loong Khoo, Poh Seng Lee, Siaw Kiang Chou, NUS

Session G3 (Emerging Technologies):

Nanotechnology I

Condessa 6

Session Organizers: Ross Wilcoxon, Rockwell Collins; Craig Green, Georgia Tech

1. Thermal Property Investigation of Multi Walled Carbon Nanotubes (MWCNTs) Embedded Phase Change Materials (PCMs) Murat Parlak, ASELSAN; Umit Nazil Temel, Sengul Kurtulus, Kerim Yapici, Cumhuriyet University

2. Experimental Investigation of Transient Thermal Response of Phase Change Material Embedded by Graphene Nanoparticles in Energy Storage Module Murat Parlak, ASELSAN; Umit Nazlii Temel, Kutlu Somek, Kerim Yapici, Cumhuriyet University

Thursday, June 2, 8:00 am – 9:30 am


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Session G3 (Emerging Technologies):

Nanotechnology I

Condessa 6


3. Nanostructure-enabled Signicant Thermal Transport Enhancement across Solid Interfaces Tao Jiang, Eungkyu Lee, Michael Young, Tengfei Luo, University of Notre Dame

4. Design and Evaluation of Polymer-Carbon Nanotube Composites for Reliable, Low Resistance, Static and Dynamic Thermal Interface Materials Craig Green, Baratunde Cola, Carbice Nanotechnologies; Leonardo Prinzi, Georgia Tech

5. Performance Life Testing of a Nanoscale Coating for Erosion and Corrosion Protection in Copper Microchannel Coolers Nathan Van Velson, Matthew Flannery, Advanced Cooling Technologies

6. Analytical Model of Graphene-Enabled Ultra-Low Power Phase Change Memory Aaron Alpert, Rachel Luo, Mehdi Asheghi, Eric Pop, Kenneth Goodson, Stanford

Session G4 (Technology Talk 3): Microuidics - Condessa 9Chair: Karl Geisler, 3M

Efciency and Performance of Emerging Meso Scale Microuidic Devices for Electronics Cooling

– Recent Computational and Experimental Studies - Mehmet Arik, Ozyegin University;

M. Baris Dogruoz, Cisco Systems

Session H1 (Keynote) - Condessa 3

The Development of the Die Stacked AMD Radeon™ R9 Fury

- Bryan Black, AMD

Session I1 (Thermal):

Data Center-Efciency II

Condessa 2

Session Organizers: Salih Erden, Istanbul Technical University; Reza Khiabani, Google

1. A Dynamic Stochastic Optimization Control Model for Data Centers Based on Numerical Modeling Hidetomo Sakaino, NTT

2. On Energy Efciency of Liquid Cooled HPC Datacenters Michael Patterson, Intel; Shankar Krishnan, IIT-Mumbai; John Walters, Walters Engineering

3. Is Energy Efciency Enough? Filling the Engineering Gap in Data Center Design and Operation Mark Seymour, Future Facilities

Thursday, June 2, 8:00 am – 9:30 am (Cont.)

Thursday, June 2, 9:35 am – 10:35 am

Thursday, June 2, 10:40 am – 12:10 pm



33


Data Center-Efciency II

Condessa 2

Session Organizers: Salih Erden, Istanbul Technical University; Reza Khiabani, Google

4. Experimental Characterization of a Rear Door Heat Exchanger with Localized Containment Kourosh Nemati, Husam Alissa, Udaya Puvvadi, Bruce Murray, Bahgat Sammakia, Kanad Ghose, Binghamton University

5. Addressing Low and Part Load (In)Efciencies in Data Centers - Real World Examples from Operating Data Centers Dan Comperchio, Willdan Energy Solutions

6. Transient Modeling and Validation of Chilled Water Based Cross Flow Heat Exchangers for Local On-demand Cooling in Data Centers Marcelo Del Valle, Carol Caceres, Alfonso Ortega, Villanova University

Session I2 (Mechanics):

Interconnect Technology

Condessa 5

Session Organizers: Kaushik Mysore, AMD; Raphael Okereke, Microsoft

1. De-bonding Simulation of Cu-Al Wire Bond Intermetallic Compound Layers Pradeep Lall, Yihua Luo, Auburn University; Luu Nguyen, TI

2. Negative Impact of Certain Adhesive Congurations on Solder Joint Reliability of Package on Package Architecture: A Comprehensive Experimental and Numerical Study Shantanu Tripathi, Ru Han, Milena Vujosevic, Intel

3. Board Level Interconnect Risk Assessment in Spherical Bend Guruprasad Arakere, Milena Vujosevic, Todd Embree, Intel

4. Prognostication of Cu-Al WB System Subjected to High Temperature- Humidity Condition Pradeep Lall, Shantanu Deshpande, Auburn University; Luu Nguyen, TI

5. Reliability of Compliant Electrically Conductive Adhesives for Flexible PV Modules Kaustubh Nagarkar, GE

6. Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Thermal Shock Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Sharath Sridhar, Seth Gordon, John Evans, Fadel Megahed, Michael Bozack, Wayne Johnson, Mark Carpenter, Auburn University


Two-Phase Conv. II/ Condensation

Condessa 6

Session Organizers: TieJun Zhang, Masdar Institute of Science and Technology; Ryan Enright, Bell Labs

1. CFD Study of Flow Boiling in Silicon Microgaps with Staggered Pin Fins for the 3D-Stacking of ICs Daniel Lorenzini, Yogendra Joshi, Georgia Tech

2. Condensate Mobility Actuated by Microsurface Topography and Wettability Modications Christopher Duron, Sushil Bhavnani, Jacob Morris, Auburn University; Vinod Narayanan, UC-Davis

3. Flow Regimes and Heat Transfer Coefcients for Flow Boiling in Smooth and Internally-Grooved Tubes Darin Sharar, General Technical Services; Avram Bar-Cohen, University of Maryland

Thursday, June 2, 10:40 am – 12:10 pm (Cont.)


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Two-Phase Conv. II/ Condensation

Condessa 6

Session Organizers: TieJun Zhang, Masdar Institute of Science and Technology; Ryan Enright, Bell Labs

4. Environmental Acclimation of Computing Systems Milnes David, Joseph Prisco, Sharon Spaulding, William Green, Robert Sanders, Brian Rawson, IBM

5. Flow Boiling of Water at Sub-AtmosphericPressure in Staggered Micro Pin-Fin Heat Sink Xuefei Han, Yogendra Joshi, Andrei Fedorov, Georgia Tech

6. Enthalpy-based System-Model for Pumped Two-phase Cooling Systems Leitao Chen, Fanghao Yang, Pritish Parida, Mark Schultz, Timothy Chainer, IBM

Session I4 (Panel 3): LED packaging: Thermal and Mechanical Challenges and Future Direction - Condessa 9

Moderators: Xiaobing Luo, Huazhong University of Science and Tehchnology; Mehmet Arik,Ozyegin University

Panelists: Mehmet Arik, Ozyegin University; Sheng Liu, Wuhan University; Samuel Graham, GIT; Thomas Dreeben, Orsam; Frank Shi, University of CA- Irvine

Lunch on your own

Session J1 (Thermal):

Power Electronics/ Photovoltaics/ Refrigeration

Condessa 5

Session Organizers: Yoonjin Won, UC-Irvine; James Palko, Stanford

1. Boosting Electrical Generation of a Photovoltaic Array by Thermal Harvest from p-Si Cells: An Experimental and Theoretical Study Joshua Kelley, Veena Rao, Serguei Dessiatoun, Michael Ohadi, University of Maryland; Kyosung Choo, Youngstown State University

2. Thermal Analysis of Ethernet Connector in Power Applications with an Engineering Mechanics Approach James Petroski, Design By Analysis Technical Consulting

3. Design, Simulation and Fabrication of Liquid Cooled LTCC Devices Utilizing Integrated Channels Tilo Welker, Jens Mueller, TU-Ilmenau

4. Design of a Compact, Lightweight Screw-type Compressor for Refrigeration Systems Jerry Wagner, David Markham, Mainstream Engineering

Thursday, June 2, 12:15 pm – 1:15 pm


Thursday, June 2, 10:40 am – 12:10 pm (Cont.)



35

Session J2 (Thermal):

LEDs/Thermoelectric

Condessa 2

Session Organizers: Sung Ki Kim, Samsung;Chandra Mohan Jha, Intel; Leila Choobineh, SUNY Polytechnic; Kazuaki Yazawa, Purdue University

1. Effect Study of Silicone Amount on the Lumen Maintenance of High Power LED under Accelerated Stress Test Qi Chen, Run Hu, Bin Xie, Xingjian Yu, Jingjing Cheng, Xiaobing Luo, Huazhong University

2. Observations on the Implementation of LEDs for General Lighting James Pryde, Tamlite; James Pryde, David Whalley, Weeratunge Malalasekera, Loughborough University

3. Thermoelectric-based Sustainable Self-Cooling for Fine-Grained Processor Hot Spots Soochan Lee, LG Electronics; Dhinakaran Pandiyan, Intel; Jae-Sun Seo, Patrick Phelan, Carole-Jean Wu, Arizona State University

4. Thermoelectric Package Design for High Ambient Temperature Electronics Cooling Ram Ranjan, Matthew Pearson, Shashank Krishnamurthy, United Technologies Research Center

Session J3 (Mechanics):

Solder Characterization & Modeling I

Condessa 5

Session Organizers: Tuhin Sinha, IBM; Huiyang Fei, Intel

1. Aging Induced Evolution of the Cyclic Stress-Strain Behavior of Lead Free Solders Nianjun Fu, Jeffrey Suhling, Muhannad Mustafa, Pradeep Lall, Auburn University

2. Effects of Aging on SAC-Bi Solder Materials Sudan Ahmed, Munshi Basit, Jeffrey Suhling, Pradeep Lall, Auburn University

3. Mechanical Characterization of SAC305 Lead Free Solder at High Temperatures Mohammad Alam, Munshi Basit, Jeffrey Suhling, Pradeep Lall, Auburn University

4. Effect of Isothermal Aging on Harmonic Vibration Durability of SAC305 Solders Elaine Lin, Qian Jiang, Abhijit Dasgupta, University of Maryland

Session J4 (Emerging Technologies):

MEMS

Condessa 2

Session Organizers: Jaeho Lee, UC-Irvine; Hyoungsoon Lee, Stanford

1. Analysis of Squeeze Film Air Damping in MEMS with Lattice Boltzmann Method Weilin Yang, Hongxia Li, Ibrahim Elfadel, TieJun Zhang, Masdar Institute of Science and Technology; Aveek Chatterjee, GLOBALFOUNDRIES

2. A Method to Compensate Packaging Effects on Three-axis MEMS Accelerometer Chia-Cheng Chang, Hung-Te Yang, Yen-Fu Su, Yu-Ting Hong, Kuo-Ning Chiang, National Tsing Hua University

3. Die Stress in Stealth Dicing For MEMS Shuai Shao, Dapeng Liu, Yuling Niu, Seungbae Park, Binghamton University

4. A Study on Damage Progression in MEMS Based Silicon Oscillators Subjected to High-G Harsh Environments Pradeep Lall, Amrit Abrol, Auburn University; Lee Simpson, Jessica Glover, US AMRDEC

Thursday, June 2, 1:20 pm – 2:20 pm (Cont.)


36

Session K1 (Thermal):

Heat Spreaders

Condessa 2

Session Organizers:Stephanie Allard, IBM; Jason Nadler, Georgia Tech Research Institute

1. Steady-State Temperature Solution for Early Design of Annealed Pyrolytic Graphite Heat Spreader: Full Results Eric Monier-Vinard, Thales Corporate Engineering; Minh-Nhat Nguyen, Najib Laraqi, University of Paris Ouest Nanterre la Defense; Valentin Bissuel, Olivier Daniel, Thales Corporate Engineering

2. Temperature Distribution in a Circular Flux Tube with Arbitrary Specied Contact Temperatures Masood Razavi, Yuri Muzychka, Serpil Kocabiyik, Memorial University of Newfoundland

3. Generation and Analysis of 3D Anisotropic Meso-Structured Materials Ninad Trifale, Eric Nauman, Kazuaki Yazawa, Purdue University

4. Modeling and Design of Composite Materials for Thermal Management Michael Beckert, Georgia Tech Research Institute; Christopher Dupre, Woodward Academy; Jason Nadler, Georgia Tech Research Institute

5. Properties and Reliability of Molybdenum-Copper-Composites for Thermal Management Applications Martin Seiss, Plansee SE; Tobias Mrotzek, Plansee SE; Wolfram Knabl, Plansee SE; Thomas Hutsch, Fraunhofer Institute For Manufacturing Technology And Advanced Materials Branch Lab Dresden

Session K2 (Thermal):

Two-Phase Conv. I

Condessa 9

Session Organizers:Nicolas Lamaison, LTCM EPFL; Pritish Parida, IBM

1. Two-Phase Jet Impingement Heat Sink Integrated with a Compact Vapor Compression Systemfor Electronics Cooling Pablo De Oliveira, Jader Barbosa, Federal University of Santa Catarina

2. Heat Transfer to Wetting and Non-Wetting Liquid Droplets Deposited onto a Heated Microgroove Surface Tailian Chen, Gonzaga University

3. Enhanced Boiling Heat Transfer on Micromachined Surfaces Using Acoustic Actuation Thomas Boziuk, Marc Smith, Ari Glezer, Georgia Tech

4. Two Phase Closed Loop Cooling System with a Pump Masahiro Matsuda, Masataka Mochizuki, Yuji Saito, Koichi Mashiko, Thang Nguyen, Fujikura Ltd

5. Flow Boiling of R245fa in a Microgap with Integrated Staggered Pin Fins Pouya Asrar, Xuchen Zhang, David Casey Woodrum, Craig Green, Peter Kottke, Thomas Sarvey, Suresh Sitaraman, Andrei Fedorov, Muhanned Bakir, Yogendra Joshi, Georgia Tech

6. Extreme-Microgap (x-μgap) Based Hotspot Thermal Management with Refrigerant Flow Boiling Mohamed Nasr, Craig Green, Peter Kottke, Xuchen Zhang, Thomas Sarvey, Yogendra Joshi, Muhannad Bakir, Andrei Fedorov, Georgia Tech



37

Session K3 (Emerging Technologies):

Heat Spreaders/Heat Pipe/Heat Exchangers/ Pumps

Condessa 6

Session Organizers:Yoonjin Won, UC-Irvine; Bradley Urban, Amazon; Yongjie Hu, UCLA

1. Performance Comparison of Electrowetting Heat Pipe for Extended Distance Heat Transport Renee Hale, Vaibhav Bahadur, UT-Austin

2. Optimization and Thermal Characterization of Uniform Micropillar Based Silicon Evaporator in Advanced Vapor Chambers Mengyao Wei, SMART and Nanyang Technological University; Bin He, Sivanand Somasundaram, SMART; Chuan Seng Tan, SMART and Nanyang Technological University; Evelyn Wang, SMART and MIT

3. ALN Thin-lms as Heat Spreaders in III-V Photonics Devices Part 2: Simulations Shenghui Lei, Ian Mathews, Ryan Enright, Bell Labs; Julien Camus, S Bensalem, Abdou Djouadi, CNRS; Alexandre Shen, Guang-Hua Duan, III-V Lab

4. Apparent Slip Enhanced Magnetohydrodynamic Pump Ryan Enright, Bell Labs Ireland; Aritra Ghos, Bell Labs Irelandand University of Illinois- Chicago; Anne Gallagher, Bell Labs Irelandand Trinity College Dublin; Shenghui Lei,Bell Labs Ireland; Tim Persoons, Trinity College Dublin

5. Characterization of the Capillary Performance of Copper Inverse Opals Chi Zhang, Srilakshmi Lingamneni, Michael T. Barako, James W. Palko, Mehdi Asheghi, Kenneth Goodson, Stanford

Session K4 (Panel 4): Advances in Thermal, Thermomechanical and Packaging Issues for Mobile Device - Condessa 9

Moderator: Victor Chiriac, Qualcomm

Panelists: John Thome, EPFL Switzerland; Je-Young Chang, Intel Corp; Ken Goodson, Stanford University; Yogendra Joshi, Georgia Tech; Rick Beyerle, Graftech Inc.

Session L1 (Thermal):

Thermal Interface Material & Characterization

Condessa 2

Session Organizers:Ali Khounsary, IIT; Tuhin Sinha, IBM

1. Improved Methodology for Calculating Interfacial Thermal Resistance and Uncertainty for Steady-State TIM Testers with Embedded Probes Ronald Warzoha, Andrew Smith, Maurice Harris, US Naval Academy

2. Direct Contact Method for Gap Pad In-Situ Thickness Measurement, Control, and Optimization in VR Heatsink Application Jun Lu, Michelle C Lin, Bernie Short, Intel

3. Reduction of Die-bonding Interface Thermal Resistance for High-power LEDs through Embedding Packaging Structure Xiang Lei, Xing Guo, Huazhong University; Huai Zheng, Sheng Liu, Wuhan University

4. Processing-Structure-Property Correlations of Sintered Silver Mohamad Abo Ras, Berliner Nanotest and Design and Fraunhofer Institute; Daniel May, Berliner Nanotest and Designand TU-Chemnitz; Jens Heilmann, TU-Chemnitz; Sven Rzepka, Bernd Michel, Frauhofer Institute; Bernhard Wunderle, Fraunhofer Institute and TU-Chemnitz





38


Thermal Interface Material & Characterization

Condessa 2

Session Organizers:Ali Khounsary, IIT; Tuhin Sinha, IBM

5. Direct Bonding of a Titanium Header to an Embedded Two-phase FEEDS Cooling Device for High-Flux Electronics David Deisenroth, Raphael Mandel, Hannes Greve, Serguei Dessiatoun, Patrick McCluskey, Michael Ohadi, University of Maryland

6. Fundamental Study of Surface Roughness Dependence of Thermal and Electrical Contact Resistance Tomoyuki Hatakeyama, Risako Kibushi, Masaru Ishizuka, Toyama Prefectural University; Toshio Tomimura, Kumamoto University


Modeling/Optimization

Condessa 5

Session Organizers: Satish Kumar, Georgia Tech; Amir Shooshtari, University of Maryland

1. Transient Thermal Behavior of SOIC Packages -- An Optimization Study Baris Dogruoz, Cisco; Mehdi Abarham; Gokul Shankaran, Ansys

2. DPL-based Electro-thermal Modeling of Fin-FET Transistors Mariusz Zubert, Piotr Zajac, Tomasz Raszkowski, Piotr Stanislaw Nowak, Marcin Janicki, Agnieszka Samson, Melvin Galicia, Andrzej Napieralski, TU-Lodz

3. Numerical Modeling and Thermal Enhancement of Finned Tube Heat Exchanger with Guiding Channel and Fusiform Congurations Chuan Sun, Nuttawut Lewpiriyawong, Kent Loong Khoo, Poh Seng Lee, Siaw Kang Chou, NUS

4. A Numerical Study of the Effect of Thermal Radiation on the Forced Air Cooling of Low Heat Flux Electronic Chips Mounted on One Side of a Vertical Channel Rajat Dhingra, Partha Ghoshdastidar, IIT-Kanpur

5. Thermal-mechanical Co-design of Cold Plate, Second Level Thermal Interface Material (TIM2) and Heat Spreaders for Optimal Thermal Performance for High-end Processor Cooling Xiaojin Wei, Allan Vande Venter, Shawn Caneld, Ying Yu, John Torok, Peter Kelly, Donald Porter, William Kostenko, Jeffrey Zitz, Kamal Sikka, IBM

Session L3 (Emerging Technologies):

Thermal Transport

Condessa 6

Session Organizers: Ankur Jain, UT-Arlington; Rajat Mittal, Qualcomm

1. Carpet Thermal Cloak Realization with Layered Thermal Metamaterials: Theory and Experiment Run Hu, Bin Xie, Qi Chen, Jingjing Cheng, Xiaobing Luo, Huazhong University

2. NanoThermoMechanical Memory: Near-Field Heat Transfer Enabled Negative Differential Thermal Resistance and Thermal Latching Mahmoud Elzouka, Sidy Ndao, University of Nebraska-Lincoln

3. Disturbed and Scattered: The Path of Thermal Conduction through Diamond Lattice Firooz Faili, William Huang, Daniel Twitchen, Element Six; Julian Calvo, Martin Kuball, University of Bristol

4. Velocity and Thermal Slip at the Moving Contact Line Joseph J. Thalakkottor, Kamran Mohseni, University of Florida



39

Session L4 (Technology Talk 4): Aerospace Thermal Management - Condessa 9Chair: Peter de Bock, GE Global Research

1. Advanced Cooling Techniques and Thermal Design Procedures for Airborne Electronic

Equipment - Ross Wilcoxon, Rockwell Collins

2. Development of Advanced Spacecraft Thermal Management Subsystems

- Jeff Didion, NASA Goddard Space Flight Center

3. Next Generation Heat Transfer Devices Using Innovative Materials and Manufacturing

Processes - Michael Stoia, Arun Muley, Boeing Research and Technology

Session M1: - Condessa 3 and 4 Student Poster and Networking Session

ASME JEP General Committee Meeting - Condessa 5

ITherm Executive Committee Meeting - Condessa 6

ITherm 2017 Planning Meeting - Condessa 4




ITHERM 2016




40

Session N1 (Thermal):

3D Embedded Cooling / Mobile

Condessa 2

Session Organizers:Chin Lee Ong, LTCM-EPFL; Reza Khiabani, Google

1. Physical Co-Design for Micro-Fluidically Cooled 3D ICs Zhiyuan Yang, Ankur Srivastava, University of Maryland

2. Photoetched Clad with Embedded Heatpipes for Mobile Electronics William Hamburgen, James Cooper, Google

3. Combined Finned Microgap with Dedicated Extreme-Microgap Hotspot Flow for High Performance Thermal Management Reza Abbaspour, David Casey Woodrum, Peter Kottke, Thomas Sarvey, Craig Green, Yogendra Joshi, Andrei Fedorov, Suresh Sitaraman, Muhannad Bakir, Georgia Tech

4. A Figure of Merit for Smart Phone Thermal Management Victor Chiriac, Stephen Molloy, Jon Anderson, Qualcomm; Kenneth Goodson, Stanford

5. Eulerian Multiphase Conjugate Model Development and Validation for Flow Boiling in Micro-Pin Field Pritish Parida, Timothy Chainer, IBM

6. Boiling Sensitivity Analysis of Asymmetrically Heated Micro-scale Devices Fanghao Yang, Mark Schultz, Pritish Parida, Evan Colgan, Bing Dang, Gerard Mcvicker, Timothy Chainer, IBM

Session N2 (Mechanics):

Solder Characterization & Modeling II

Condessa 5

Session Organizers:Kaustubh Nagarkar, GE; Morten Jensen, Intel

1. Mechanical Characterization of Doped SAC Solder Materials at High Temperature Md Chowdhury, Sudan Ahmed, Abdullah Fahim, Jeffrey Suhling, Pradeep Lall, Auburn University

2. Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Vibration Sivasubramanian Thirugnanasambandam, Anto Raj, Thomas Sanders, Sharath Sridhar, Seth Gordon, John Evans, Fadel Megahed, George Flowers, Michael Bozack, Wayne Johnson, Mark Carpenter, Auburn University

3. High Temperature Creep Response of Lead Free Solders Abdullah Fahim, Sudan Ahmed, Md Chowdhury, Jeffrey Suhling, Pradeep Lall, Auburn University

4. High Strain Rate Stress-Strain Measurement of SAC105 Leadfree at Temperatures up to 200°C Pradeep Lall, Vikas Yadav, Jeff Suhling, Auburn University; David Locker, US Army AMRDEC

5. Mechanical Constitutive Properties of a Bi-rich High Temperature Solder Alloy Qian Jiang, Subhasis Mukherjee, Abhijit Dasgupta, University of Maryland; David Shaddock, Liang Yin, GE

Friday, June 3, 8:00 am – 9:30 am



41

Session N3 (Emerging Technologies):

Advanced Experimental and Numerical Methods

Condessa 6

Session Organizers: Angel Qian Han, Huawei; Luu Nguyen, TI; Yongjie Hu, UCLA

1. Thermal Characterization of the Inter-Die Thermal Resistance of Hybrid Cu/Dielectric Wafer-to-Wafer Bonding Herman Oprins, Vladimir Cherman, Tomas Webers, Abdellah Salahouelhadj, Soon-Wook Kim, Lan Peng, Geert Van Der Plas, Eric Beyne, IMEC

2. The Role of Condensation from Humid Air on Melting of Ice Aditya Chandramohan, Justin A Weibel, Suresh V Garimella, Purdue University

3. CTSIM: Convolution-Based Thermal Simulation using Iterative Methods Rajat Mittal, Ryan Coutts, Mehdi Saeidi, Qualcomm

4. Thermal Conductivity of Melt-Processed Nanobers Thomas Bougher, Matthew Smith, Kyriaki Kalaitzidou, Baratunde Cola, Georgia Tech

5. Simultaneous Thermal/Flow Characterization of Thermal Interface Materials Yuvraj Singh, Nikhil Bajaj, Ganesh Subbarayan, Purdue University

6. Particle Image Velocimetry Study on Dual Cooling Jet Flows Peter De Bock, Karthik Bodla, GE; Tim Persoons, University of Dublin

Session N4 (Panel 5): Data Centers and Emerging Technologies: Next Wave of Innovations for Energy-Efciency - Condessa 9

Moderators: Niru Kumari, Hewlett Packard Labs, Banafsheh Barabadi, MIT

Panelists: Ashish Gupta, Intel; Avram Bar-Cohen, University of Maryland; Eric Pop, Stanford University; Yogendra Joshi, Georgia Tech; YC Lee, University of Colorado at Boulder

Friday, June 3, 9:35 am – 10:35 am

Session O1 (Keynote) - Condessa 3

Innovations in Heterogeneous Integration and SiP

- William (Bill) T. Chen, ASE Group

Friday, June 3, 10:40 am – 12:10 pm

Session P1 (Thermal):

Data Center - Control/Thermal Storage

Condessa 2

Session Organizers: Mehmet Arik, Ozyegin University; Emil Rahim, Amazon

1. Analysis of a Water Tank Energy Storage System for use in a Warm Water Cooled Data Center Isaac Rose, Amy Fleischer, Villanova University

2. Phase Change Cooling with Evaporative Condenser at Data Centers Mizuki Wada, Arihiro Matsunaga, Masanori Sato, Minoru Yoshikawa, NEC

3. Costs and Benets of Thermal Energy Storage for Augmenting Indirect/Direct Evaporative Cooling Systems Jeff Luttrell, Abhishek Guhe, Dereje Agonafer, UT-Arlington

Friday, June 3, 8:00 am – 9:30 am (Cont.)



42

Friday, June 3, 10:40 am – 12:10 pm (Cont.)

Session P1 (Thermal):

Data Center - Control/Thermal Storage

Condessa 2

Session Organizers: Mehmet Arik, Ozyegin University; Emil Rahim, Amazon

4. Experimental Investigation of CRAH Bypass for Enclosed Aisle Data Centers Hamza Salih Erden, Istanbul Technical University; Mehmet Turgay Yildirim, Mustafa Koz, H. Ezzat Khalifa, Syracuse University

5. Charge Management for Large Transient Loads in a Multi-Evaporator Vapor Compression System with Recuperator Daniel Pollock, Zehao Yang, John Wen, Rensselaer Polytechnic Institute

6. Condensation Risk in a Partially Air Side Economized Data Center Levente Klein, Fernando Marianno, Hendrik Hamann, Alan Claassen, IBM

Session P2 (Mechanics):

RF Electronics/Extreme Hot Spots

Condessa 5

Session Organizers: Jeff Darabi, Southern Illinois University; Soheil Farshchian, Google

1. Impact of Microuidic Cooling on High Power Amplier RF Performance John Ditri, Roland Cadotte, David Fetterolf, Michael McNulty, Lockheed Martin

2. Thermal Raman and IR Measurement of Heterogeneous Integration Stacks T Robert Harris, Marshal Newberry, Paul Franzon, W Rhett Davis, North Carolina State University; Georges Pavlidis, Samuel Graham, Georgia Tech; Eric Wyers, Tarleton State University

3. High Heat Flux Two-Phase Cooling of Electronics with Integrated Diamond/Porous Copper Heat Sinks and Microuidic Coolant Supply James Palko, Hyoungsoon Lee, Damena Agonafer, Chi Zhang, Ki Wook Jung, Jess Moss, Joshua D. Wilbur, Tom J. Dusseault, Michael Barako, Farzad Houshmand, Guoguang Rong, Tanmoy Maitra, Catherine Gorle, Yoonjin Won, Mehdi Asheghi, Juan Santiago, Kenneth Goodson, Stanford; Yoonjin Won, UC- Irvine; Derrick Rockosi, Ihor Mykyta, Dan Resler, David Altman, Raytheon

4. Impingement Cooled Embedded Diamond Multiphysics Co-Design Vincent Gambin, Benjamin Poust, Dino Ferizovic, Monte Watanabe, Northrop Grumman; Gary Mandrusiak,David Lin, Thomas Dusseault, GE

Session P3 (Emerging Technologies):

Nanotechnology II

Condessa 6


1. Prediction of Thin Liquid Film Evaporation Characteristics with a Thermal Lattice Boltzmann Method Weilin Yang, Hongxia Li, Mohamed Alhosani, TieJun Zhang, Masdar Institute Of Science And Technology

2. Low-grade Heat Collection from a Latent Heat Thermal Energy Storage Unit Zhen Qin, Swapnil Dubey, Fook Hoong Choo,Fei Duan,Nanyang Technological University; Hongwu Deng, Beihang University

3. The Thermal Effects of Substrate Removal on GaN HEMTs Using Raman Thermometry Georges Pavlidis, David Mele, Ting Cheng, Samuel Graham, Georgia Institute Of Technology; Farid Medjdoub, Institute of Electronic Microelectronic and Nanotechnology



43

Friday, June 3, 10:40 am – 12:10 pm (Cont.)

Session P3 (Emerging Technologies):

Nanotechnology II

Condessa 6


4. Vertically Aligned Carbon Nanotube Based Thermal Interface Materials for Low Contact Pressure and Low Ambient Pressure Applications Andrea Haight, Composite Technology Development Inc; Craig Green, Baratunde Cola, Carbice Nanotechnologies Inc

5. Nanoporous Membrane Production via Block Copolymer Lithography for High Heat Dissipation Systems Ross Lundy, Ryan Enright, Bell Labs; Shauna Flynn, Susan Kelleher, Stephen Daniels, Dublin City University; Cian Cummins, Michael Morris, Trinity College Dublin; Maurice Collins, Eric Dalton, University Of Limerick

Session P4 (Technology Talk 5): - Embedded Inter/Intra-chip Cooling I Condessa 9Chair: Justin A Weibel, Purdue University

1. Recent Advances in Simulation of DARPA ICECool Fundamental's Embedded Two-Phase

Cooling - Kaiser Matin, ECS-Federal

2. Near Junction Intra-Chip Thermal Management Technology for High Power GaN

- David H. Altman, Raytheon

3. Assessing Reliability of Integrated Microuidics for Power Electronics Cooling

- Patrick McCluskey, University of Maryland

Friday, June 3, 12:20 pm – 1:50 pm

Luncheon, Organizational Committee Recognition, Best Paper Awards- Condessa 3 and 4


Session Q1 (Thermal):

Integrated Structures and Materials I

Condessa 2

Session Organizers: Prashant Gupta; Prasanna Raghavan, Intel

1. Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation Qiming Zhang, Jeffery C C Lo, S W Ricky Lee, HKUST; Wei Xu, Weihua Yang, Huawei

2. An Advanced Rack Server System Design for Rotational Vibration (RV) Performance Xianguang Tan, Guofeng Chen, Jiajun Zhang, Chao Liu, Baidu; Nishi Ahuja, Jun Zhang, Intel

3. Estimation of Passivated Metal Stack Modulus through Simulations of Micro-indentation Tao Song, Ganesh Subbarayan, Purdue University; Hung- Yun Lin, Siva Gurrum, TI



44

Friday, June 3, 1:55 pm – 3:25 pm (Cont.)

Session Q2 (Thermal):

Data Center – Containment

Condessa 5

Session Organizers: David Copeland, Oracle; Ashish Sinha, Georgia Tech

1. On Reliability and Up-time of IT in Contained Solution Husam Alissa, Kourosh Nemati, Bahgat Sammakia, Binghamton University; Mark Seymour, Tom Wu, Future Facilities; Russell Tipton, Emerson Nework Power; Ken Schneebeli, IBM

2. Empirical Analysis of Blower Cooling Failure in Containment: Effects on IT Performance Husam Alissa, Kourosh Nemati, Udaya Puvvadi, Bahgat Sammakia, Kanad Ghose, Binghamton University; Mark Seymour, Future Facilities; Russell Tipton, Emerson Network Power; Ken Schneebeli, IBM

3. Steady-state and Transient Comparison of Cold and Hot Aisle Containment and Chimney Kourosh Nemati, Husam Alissa, Bruce Murray, Bahgat Sammakia, Binghamton University

4. Rapid Modeling Tools for Energy Analysis of Modular Data Centers Rehan Khalid, Yogendra Joshi, Georgia Tech; Aaron Wemhoff, Villanova University

5. Study of Air Flow Energy within Data Center Room and Sizing of Hot Aisle Containment for an Active vs Passive Cooling Design Manasa Sahini, UT-Arlington; Eric Kumar, Tianyi Gao, Charles Ingalz, Ali Heydari, Sun Xiaogang, Baidu

Session Q3 (Emerging Technologies):

Refrigeration/ Thermoelectric

Condessa 6

Session Organizers: Tannaz Harirchian, Intel; Emil Rahim, Amazon

1. Design of High-Performance Refrigerant Ejector for Sub-Ambient Cooling Saleh Mohamed, Ali Almasabai, Youssef Shatilla, TieJun Zhang, Masdar Insttitute of Science and Technology

2. Highly Integrated Thermoelectric Coolers Philip Barletta, Erik Vick, Nick Baldasaro, Dorota Temple, RTI International

3. Heat Transfer Modeling for Bio-Heat Recovery Kazuaki Yazawa, Ali Shakouri, Purdue University

4. Thermal Optimization of Embedded Thermoelectric Generators in Refractory Furnaces Kazuaki Yazawa, Ali Shakouri, Purdue University

Session Q4 (Panel 6): Thermal and Mechanical Design Challenges in Internet of Things – IoT - Condessa 9

Moderator: Baris Dogruoz, Cisco

Panelists: Mehmet Arik, Ozyegin University; Don Le, Qualcomm; Dereje Agonafer, University of Texas at Arlington; Terry O'Shea, Hewlett Packard; Angel Han, Huawei Technologies; Bradley Urban, Lab126


45


Session R1 (Thermal):

Data Center - Air Cooling

Condessa 2

Session Organizers: Yongjie Hu, UCLA; Edvin Cetegen, Intel

1. Flexible Polymeric Hollow Fiber Heat Exchangers for Electronic Systems Miroslav Raudensky, Ilya Astrouski, Tereza Brozova, Eric Bartuli, Brno University of Technology

2. Compact Modeling of Data Center Raised-Floor-Plenum Stanchions: Pressure Drop Through Sparse Tube Bundles James VanGilder, Zachary Pardey, Schneider Electric; Paul Bemis, Applied Math Modeling; David Plamondon, University Of Massachusetts Medical School

3. Design and Testing of Prototype Data Center Yogesh Fulpagare, Pratik Shirbhate, Atul Bhargav, Energy Systems Research Laboratory Indian Institute of Technology Gandhinagar

4. Impact of Active Tiles on Data Center Flow and Temperature Distributions Jayati Athavale, Yogendra Joshi, Minami Yoda, Georgia Institute Of Technology; Wally Phelps, Degree Controls

5. Innovative Server Rack Design with Bottom Located Cooling Unit Tianyi Gao, Eric Kumar, Manasa Sahini, Charles Ingalz, Ali Heydari, Wendy Lu, Xiaogang Sun,Baidu

6. Impact of a Rotary Regenerative Heat Exchanger on Energy Efciency of an Air Cooled Data Center Seungho Mok, Satish Kumar, Yogendra Joshi, Georgia Institute Of Technology; Ronald Hutchins, University Of Virginia

Session R2 (Mechanics):

Integrated Structures & Materials II

Condessa 5

Session Organizers: Jeffrey Suhling, Auburn University; Jin Yang, Intel; Wei Koh, Pacrim

1. Parametric Study of the QFN Mounted PCB-Cu Layer Thickness Effect on the Stress Induced During Drop Testing Sayalee Sabne, Anik Mahmood, Trina Barua, Dereje Agonafer, Nachiket Kansara, UT-Arlington

2. Measurement and Simulation of Moisture Induced Die Stresses in Quad Flat Packages Quang Nguyen, Jordan Roberts, Jeffrey Suhling, Richard Jaeger, Auburn University

3. Multi Design Variable Optimization of QFN Package on Thick Boards for Enhanced Board Level Reliability Sumanth Krishnamurthy, Abhishek Deshpande, Md Malekkul Islam, Dereje Agonafer, UT-Arlington

ITHERM 2016


46

Friday, June 3, 3:30 pm – 5:00 pm (Cont.)

Session R3 (Emerging Technologies):

Transistor Technology

Condessa 6

Session Organizers: Chandra Mohan Jha, Intel; Guy Wagner, Electronic Cooling Solutions; Patrick McCluskey, University of Maryland

1. Transient Thermal Dynamics of GaN HEMTs Kevin R Bagnall, Evelyn N Wang, MIT

2. Thermal Management of GaN-on-Diamond High Electron Mobility Transistors: Effect of the Nanostructure in the Diamond near Nucleation Region Julian Anaya, Huarui Sun, James Pomeroy, Martin Kuball, University of Bristol

3. Thermal Performance of Nano-scale SOI and Bulk FinFETs U Sajesh Kumar, V Ramgopal Rao, IIT-Bombay

4. Temperature Change Induced Degradation of SiC MOSFET Devices Zoltan Sarkany, Weikun He, Mentor Graphics; Marta Rencz, Budapest University of Technology and Economics

Session R4 (Technology Talk 6): Embedded Inter/Intra-chip Cooling II - Condessa 9

Session Organizers: Michael M. Ohadi, University of Maryland; Darin Sharar, General Technical Services

1. Impingement Cooled Embedded Diamond GaN HEMTs

- Vincent Gambin, Northrop Grumman Aerospace Systems

2. Chip Embedded Two Phase Cooling for High Performance Computing

- Timothy Chainer, IBM T J Watson Research Center

3. Liquid Cooling of Microsystems Using Pin Fin Enhanced Microgaps - Yogendra Joshi, Georgia Institute of Technology

ITHERM 2016


48

ITHERM 2016: Student Poster & Networking Event

Session M1- Thursday, June 2, 5:30 pm – 7:00 pm, Condessa 3 and 4

Chair: Dr. Milnes P. David, IBMCo-Chairs: Professor Amir Shooshtari, University of Maryland;

Professor Jaeho Lee, University of California at Irvine

A Study on Damage Progression in MEMS Based Silicon Oscillators Subjected to High-G Harsh Environments- p404 Amrit Abrol, Auburn University

Hotspot Thermal Management via Thin-Film Evaporation- p221 Solomon Adera, Massachusetts Institute of Technology

On Reliability and Uptime of IT in Contained Solution- p150 Husam Alissa, State University of New York Binghamton

An Analytical Model of Graphene-Enabled Ultra-Low Power Phase Change Memory- p284 Aaron Alpert, Stanford University

The Design and Construction of a Bench-top Organic Rankine Cycle for Data Center Applications- p1167 Sebastian Araya,Villanova University

Flow Boiling of R245fa in a Microgap with Integrated Staggered Pin Fins- p253Pouya Asrar, Georgia Institute of Technology

Impact of Active Tiles on Data Center Flow and Temperature Distribution- p246 Jayati Athavale, Georgia Institute of Technology

Transient Thermal Dynamics of GaN HEMTs- p226Kevin Bagnall, Massachusetts Institute of Technology

Effect of Removal of Layers on Thermal Reliability of WCSP Boards: An Experimental and Computational Study- p466 Trina Barua, University of Texas - Arlington

The Role of Condensation from Humid Air on Melting of Ice- p282 Aditya Chandramohan, Purdue University

Enthalpy-based System-Model for Pumped Two-phase Cooling Systems- p443 Leitao Chen, University of Pittsburgh

Effect Study of Silicone Amount on the Lumen Maintenance of High Power LED under Accelerated Stress Test- p132Qi Chen, Huazhong University of Science and Technology

Topology Optimization for Efcient Heat Removal in 3D Packages- p379 Chun-Pei Chen, Purdue University

Direct Bonding of a Titanium Header to an Embedded Two-Phase FEEDS Cooling Device for High-Flux Electronics- p340 David Deisenroth, University of Maryland

Prognostication of Cu-Al WB System Subjected to High Temperature-Humidity Condition- p477 Shantanu Deshpande, Auburn University

A Numerical Study of the Effect of Thermal Radiation on the Forced Air Cooling of Low Heat Flux Electronic Chips Mounted on One Side of a Vertical Channel- p445 Rajat Dhingra, Indian Institute of Technology - Kanpur

Survivability Assessment of Electronics Subjected to Mechanical Shocks up to 25,000G- p458 Kalyan Dornala, Auburn University

Effects of Flow Length and Channel Size in a Two-Phase Hierarchical Manifold Microchannel Heat Sink Array- p293 Kevin Drummond, Purdue University

Condensate Mobility Actuated by Microsurface Topography and Wettability Modications- p366 Christopher Duron, Auburn University

49

Design and Testing of Prototype Data Center- p230 Yogesh Fulpagare, Indian Institute of Technology - Gandhinagar

Pool Boiling Enhancement through Hierarchical Texturing of Surfaces- p467 Minseok Ha, Georgia Institute of Technology Encapsulant Thickness Options as a Factor to Impact Thermal Performance of Chip-on-Board (COB) Light Emitting Diodes / All-Numerical Opto-thermal Coupled Analysis of Monochromatic LED Package under Different Die Attach Adhesive (DAA) Materials- p325, p487 Linjuan Huang, University of California - Irvine

A Novel Micro-CT Data Based Finite Element Modeling Technique to Study Reliability of Densely Packed Fuze Assemblies- p468Nakul Kothari, Auburn University

Reduction of Die-bonding Interface Thermal Resistance for High-power LEDs- p163 Xiang Lei, Huazhong University of Science and Technology

Optimization of Hybrid Wick Structures for Extreme Spreading in High Performance Vapor Chambers- p397 Tanya Liu, Stanford University

CFD Study of Flow Boiling in Silicon Microgaps with Staggered Pin Fins for the 3D-Integration of ICs- p181 Daniel Lorenzini, Georgia Institute of Technology

De-bonding Simulation of Cu-Al Wire Bond Intermetallic Compound Layers- p401 Yihua Luo, Auburn University

Costs and Benets of Thermal Energy Storage for Augmenting Indirect/Direct Evaporative Cooling Systems- p260 Jeff Luttrell, University of Texas - Arlington

FEA Simulation of Temperature Dependent Drop Impact on CSP Package Assembly- p470 Anik Mahmood, University of Texas - Arlington

Embedded Two-Phase Cooling of High Flux Electronics Using a Directly Bonded FEEDS Manifold- p265 Raphael Mandel, University of Maryland

A Review on Thermal Performance of CuO-H2O Nanouids applied to Heat Pipes- p161 Eliel Marcelino, INPE - National Institute for Space Research

Heat Transfer Coefcient Measurements in the Thermal Boundary Layer of Microchannel Heat Sinks- p413 Mehrdad Mehrvand, University of Central Florida

Impact of a Rotary Regenerative Heat Exchanger on Energy Efciency of an Air Cooled Data Center- p416 Seungho Mok, Georgia Institute of Technology

Extreme-Microgap (x-�gap) Based Hotspot Thermal Management with Refrigerant Flow Boiling- p240 Mohamed Nasr, Georgia Institute of Technology

The Thermal Effects of Substrate Removal on GaN HEMTs using Raman Thermometry- p231 Georges Pavlidis, Georgia Institute of Technology

Design and Evaluation of Polymer-Carbon Nanotube Composites for Reliable, Low Resistance, Static and Dynamic Thermal Interface Materials- p266 Leonardo Prinzi, Georgia Institute of Technology

Observations on the Implementation of LED's for General Lighting- p453 James Pryde, Loughborough University

DPL Based Electro-Thermal Modelling of Fin-FET Transistors- p303 Tomasz Raszkowski, Lodz University of Technology

Temperature Distribution in a Circular Flux Tube with Arbitrary Specied Contact Temperatures- p286 Masood Razavi, Memorial University of Newfoundland


50


Carpet Thermal Cloak Realization with Layered Thermal Metamaterials: Theory and Experiment- p123 Hu Run, Huazhong University of Science and Technology

Optimization of Layer Thickness of QFN Mounted PCB to Minimize Structural Damage Due to Drop Impact- p213 Sayalee Sabne, University of Texas - Arlington

Improve Data Center Efciency through the Study of Air Flow Energy within Data Center Room and Sizing of Hot Aisle Containment for an Active vs Passive Cooling Design- p335 Manasa Sahini, University of Texas - Arlington

Effects of Mineral Oil Immersion Cooling on IT Equipment Reliability and Reliability- p326 Jimil Shah, University of Texas - Arlington

Simultaneous Thermal/Flow Characterization of Thermal Interface Materials, p369Yuvraj Singh, Purdue University

Determination of Passivated Metal Stack Modulus through Micro-indentation- p488 Tao Song, Purdue University

Generation and Characterization of 3D Anisotropic Meso-structured Material- p437 Ninad Trifale, Purdue University

PBGA Package Finite Element Analysis Based on the Physical Geometry ModelingUsing X-ray Micro CT Digital Volume Reconstruction - p434 Junchao Wei, Auburn University

Optimization and Thermal Characterization of Uniform Micropillar Based Silicon Evaporator in Advanced Vapor Chambers- p249 Mengyao Wei, Nanyang Technological University

Reliability Assessment of Hydrofoil-Shaped Micro-Pin Fins- p447 David Woodrum, Georgia Institute of Technology

High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at Very High Operating Temperatures- p471Vikas Yadav, Auburn University

Physical Co-Design for Micro-Fluidically Cooled 3D-IC- p155Zhiyuan Yang,University of Maryland

Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation- p164Qiming Zhang, The Hong Kong University of Science and Technology

A Comparison of Temperature and Humidity Effects on Phosphor Converted LED Package and the Prediction of Remaining Useful Life with State Estimation- p415Hao Zhang, Auburn University

Characterization of the Capillary Performance of Copper Inverse Opals- p360Chi Zhang, Stanford University

Model Optimization of Dry-out Heat Flux from Micropillar Wick Structures- p235Yangying Zhu, Massachusetts Institute of Technology

ITHERM 2016

52

ITHERM 2016: Paper Reviewers

Dr. Mehdi Abarham Dr. Nazmiye AcikgozMr. Solomon AderaDr. Damena AgonaferDr. Arman AhnoodMrs. Nishi AhujaMr. Sandeep AhujaMrs. Meriem AkinDr. Sami AlkharabshehMs. Stephanie AllardMr. Dave AltmanMr. Luca AmalfiDr. Miguel AmayaDr. Ravi AnnapragadaDr. Vaibhav ArghodeDr. Mehmet ArikDr. Mehdi AsheghiDr. David Alonso AtienzaDr. Avram Bar-CohenDr. Fred BarezDr. Munshi BasitMr. John BeattyDr. Michael BeckertMr. Albert BeiselMr. Kevin BennionMr. Christian BergeronDr. Dhruv BhateDr. Dhruv BhateDr. Sushil BhavnaniDr. Avijit BhuniaDr. Shreyas BindiganavaleDr. Karthik BodlaDr. Karthik BodlaDr. Peter BorgesenProf. Huseyin BostanciMr. Levi CampbellMr. Filippo CataldoMr. Hasan CELIKDr. Edvin CetegenMr. Sergio Chan ArguedasMr. Chia-Cheng ChangDr. Je-Young ChangDr. Tony ChaoMr. Peng ChenMr. Chun-Pei ChenDr. Chung ChenDr. Sihai ChenDr. Sihai ChenMr. Leitao ChenDr. Wei ChenMrs. Feifei ChengMr. Sri Harsha ChodayProf. Kyosung ChooDr. Arnab ChoudhuryMr. Sunil ChougaleMr. Justin ChowDr. Evan ColganDr. David CopelandMs. Emily CousineauDr. Steffen CzichonProf. Abhijidt DasguptaDr. Susmita DashDr. Milnes David

Ms. Taryn DavisDr. Lynn DavisDr. Peter De BockDr. Hemanth DhavaleswarapuMr. Satish DholeDr. John DitriDr. Baris DogruozDr. Yajie DongDr. Fei DuanMr. Pranav DubeyDr. George DulikravichMr. Tom DusseaultMs. Alexandra EfimovskayaDr. Ryan EnrightDr. Salih ErdenMs. Chiara FalsettiDr. Aiwu FANMr. Haisheng FangDr. Rayhaan FarrellyMr. Andrei FederovDr. Xuhui FengDr. Amy FleischerDr. Scott FlueckigerMr. Benoit FoisyDr. Amit GabaleDr. Yu GanMr. Deepak GanapathyMr. Shuang GaoMr. Tianyi GaoMr. Edward GaoDr. Tianyi GaoMr. Damion GastelumMr. Tim GatesDr. Michael GaynesDr. Vadim GektinDr. Joshua GessProf. Hadi GhasemiMr. Satish GhongeMr. Aritra GhoshDr. Rajat GhoshProf. Partha GhoshdastidarMr. Ari GlezerMr. Anatoly GlukhowskoyProf. Samuel GrahamDr. Craig GreenDr. Craig GreenMr. Sam GuDr. Prashant GuptaDr. Jay Prakash GuptaMr. Man Prakash GuptaDr. Ajay GurungMr. Minseok HaDr. Mathieu HabertDr. Nicholas HaehnMs. Renee HaleDr. Harish Harish GanapathyDr. T Robert HarrisProf. Tomoyuki HatakeyamaDr. Chris HealeyDr. Philipp HempelDr. Domhnaill HernonMr. David HillmanMrs. Heidi Ho

Dr. Marc HodesDr. Mark HoffmeyerMr. Jonathan HolmesMr. Dhruv HoysallMr. Han HuMr. Xin HuangDr. Safina HussainMs. Thu HuynhDr. Sushumna IruvantiMr. Masaru IshizukaDr. Nitin JadhavMr. Nicholas JankowskiDr. Nick JeffersMr. Morten JensenDr. Vibhash JhaMr. Ilya JosefsonDr. Shailesh JoshiMr. Ki Wook JungDr. Hussameddine KabbaniDr. Satish KandlikarMr. Joon Sang KangMr. Christopher KapustaMr. Paul KarayacoubianMrs. Ming KeDr. Taravat KhadiviMr. Yasser KhanDr. Chirag KharangateProf. Ali KhounsaryMs. Risako KibushiMr. Wei KohDr. Ali KosarMr. Shrenik KothariDr. Peter KottkeDr. Gopi KrishnanMr. Corey KruseDr. Satish KumarDr. Niru KumariMr. Richard LangloisMr. Don LeProf. S W Ricky LeeDr. Bong Jae LeeDr. Hyoungsoon LeeProf. Poh-Seng LeeDr. Shenghui LeiDr. Guangyin LeiDr. Eric LewandowskiMr. David LewisonDr. Xiaobo LiMr. Man LiDr. Chenzhou LianMr. Yu-Wei LinMs. Adrienne LittleDr. Pilin LiuDr. Xi LiuMr. Kelly LofgreenDr. Daniel LorenziniDr. Nathan LowerProf. Xiaobing LuoProf. Constantine M Megaridis Dr. Mirco MagniniDr. Raghav MahalingamDr. Nayandeep MahantaMs. Allison Mahvi

Dr. Pramod MalatkarDr. Shailesh MallaMs. Neha MaluMr. Raphael MandelDr. Mike MannoProf. Amy MarconnetMr. Kenneth C MarstonMs. Genevieve MartinDr. Ian MathewsDr. Daniel MayDr. Andrew McNamaraDr. Rudi Meehan OReillyDr. Ali Akbar MerrikhMr. Enrico MertenMr. George MeyerProf. Nenad Miljkovic

Mr. Fahad Mirza

Mr. Rajat MittalProf. Hideo MiuraDr. Ana MoitaDr. Sung-Won MoonDr. Gilberto MorenoDr. Mohammad MotalabMr. Miguel Moura Dr. Radha MudduMr. Sibasish MukherjeeDr. Veerendra MulayDr. Kaushik MysoreDr. Aydin NabovatiDr. Kaustubh NagarkarDr. Fehmi NajarMr. Shinji NakagawaDr. Sreekant NarumanchiMr. Nader NikfarDr. Tobjorn NilssonMr. Hanju OhProf. Michael OhadiDr. Herman OprinsMr. Sylvain OuimetDr. James PalkoDr. James PalkoDr. Yi PanDr. Arunima PanigrahyDr. Pritish ParidaDr. John ParryDr. John PeeplesDr. Min PeiDr. Gustavo Peixoto De OliveiraDr. Bharat PenmechaDr. Tim PersoonsMr. James PetroskiDr. Patrick PhelanMr. Mani PrakashDr. Sathyanarayanan RaghavanDr. Emil RahimDr. Rishi RajDr. Akhilesh RallabandiMr. Bladimir Ramos Alvarado

Mr. Thanunathan Rangarajan

Dr. Ram RanjanDr. Anthony RobinsonDr. Anthony Robinson

53

Mr. Frank RobinsonDr. Melika RoshandellMr. Salvatore RuggeroDr. Subramanya SadasivaDr. Mehdi SaeidiDr. Tom SaenenDr. Sanjoy SahaDr. Ying-Feng SahanMs. Manasa SahiniMr. Manish SainiDr. Arnoldo Salazar SotoDr. Jaime SanchezDr. Sunand SanthanagopalanMs. Suchismita SarangiDr. Mark SchultzDr. Arkaparabha SenguptaMr. David ShaddockMr. Binoy ShahMr. Shuai ShaoMr. Darin ShararMs. Monika SharmaMrs. Carolyn ShelineDr. Ilai SherMr. Frank ShiDr. Amir ShooshtariDr. Ting Si

Dr. Luis Silva-LlancaMr. Yuvraj SinghDr. Ashish SinhaDr. Tuhin SinhaMs. Susan SmithMr. Tao SongProf. Zhihang SongDr. Papa Momar SouareDr. Arvind SridharDr. Vinod SrinivasanDr. Jason StaffordMr. Laisuo SuDr. Prabhakar SubrahmanyamDr. Vijay SubramanianDr. Vijay SubramanianProf. Jeffrey SuhlingMr. Yong SunProf. Liyong SunMr. Myung SungMr. Shrikant SwaminathanMr. Ahmer SyedDr. Abhishek TambatDr. Weihua TangDr. Paragkumar ThadesarDr. Naveenan ThiagarajanDr. Ratnesh Tiwari

Mr. Sandeep TonapiDr. Wei TongDr. Krishna TungaMr. Berkin UluutkuDr. Kritika UpretiMr. Pierre ValiorgueMr. Eugene Van RooyenMr. Allan VandeVenter Mr. James VanGilderMr. Guthikonda Venkata Suresh ReddyDr. SP VenkateshanMr. Tobias Von EssenDr. Milena VujosevicMr. Guy WagnerMs. Rebecca WagnerDr. Daijiao WangDr. Evelyn WangDr. Xiaojin WeiProf. Justin WeibelMr. Tilo WelkerDr. Aaron WemhoffDr. Ross WilcoxonProf. Yoonjin Won Dr. Amy XiaDr. Hongyan XiaDr. Kewei Xiao

Dr. Weidong XieMr. Guoping XuMr. Bing XueMr. Hongfei YanDr. Weilin YangMr. Zhou YangDr. Fanghao YangMr. Jin YangDr. Michelle YangMr. Yuan YaoDr. Matthew YaoDr. Kazuaki YazawaDr. Liang YinDr. Yonghua YOUProf. TieJun ZhangMs. Chi ZhangDr. Hongwen ZhangDr. Hongwen ZhangDr. Hongqing ZhangDr. Jie-Hua ZhaoDr. Jiantao ZhengDr. Feng ZhouMs. Yangying ZhuMr. Jeffrey ZitzMs. Yihui Zuo

ITHERM 2016: Paper Reviewers

ITHERM 2016

54

ITHERM 2016: Gold, Silver Sponsors and Exhibitors

ITHERM organizing commi�ee and community greatly appreciate generous contribu�ons from our Gold, Silver sponsors and Exhibitors

55

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may 31- june 3, 2016 cosmopolitan hotel, las …...i t h e r m 2 0 1 6 the intersociety conference...

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