malzeme tanımı: (r-07) - gucumuzbir.comt02 0.30 5218 plated default filled and capped by ipc-4761...

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Malzeme Tanımı: Boş Baskı devre kartı (R-07) Açıklamalar: Aşağıdaki özellikleri sağlayacaktır. Teknik Özellikler: BOARD TYPE : 6-Layers Rigid END PRODUCT SPECIFICATION : IPC-6012 Class II S.M.C.'s : Both Sides ASSEMBLY PANEL SIZE : 157.1 x 109 mm. SINGLE BOARD SIZE : 137 x 89 mm. NUMBER OF PCBs IN PANEL : 1 MATERIAL LAYUP (Component side at top) : MATERIAL LAYER# THICKNESS & TOL SPECIFICATION ---------------- -------- ------------------ -------------------- Solder Mask <<AUTO>> Copper Plating 25 mic. Copper Layer-1 35 mic. RO4003 203 mic. IPC-4103/10 Copper Layer-2 35 mic FR4 <<AUTO>> IPC-4101/26 Copper Layer-3 35 mic FR4 <<AUTO>> IPC-4101/26 Copper Layer-4 35 mic. FR4 <<AUTO>> IPC-4101/26 Copper Layer-5 35 mic. RO4003 203 mic IPC-4103/10 Copper Layer-6 35 mic. Copper Plating 25 mic. Solder Mask PCB PROCESS REQUIREMENTS : TOTAL BOARD THICKNESS : 1.60 mm. MIN. INSULATOR THICKNESS : 100 um. MATERIAL TG MINIMUM : 170'C FINAL FINISH : ENIG/ENEPIG (Suitable for Lead-Free Reflow-Soldering) (ENEPIG preferred) GALVANIC GOLD PLATING : None SOLDER RESIST : Liquid Photo Imageable (SMOBC-LPI), Side: Both, Color: Red LEGEND PRINT : None MIN. LINE WIDTH : 5 mils. MIN. SPACING : 4 mils. BARE BOARD TEST VOLTAGE : 25 VDC. BLIND-VIA : NO BURIED-VIA : NO CONTROLLED IMPEDANCE : NO

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Page 1: Malzeme Tanımı: (R-07) - gucumuzbir.comT02 0.30 5218 Plated default Filled And Capped by IPC-4761 Type VII T01 0.70 20 Plated default T04 0.90 8 Plated default T05 1.20 18 Plated

Malzeme Tanımı: Boş Baskı devre kartı (R-07)

Açıklamalar:

Aşağıdaki özellikleri sağlayacaktır. Teknik Özellikler: BOARD TYPE : 6-Layers Rigid END PRODUCT SPECIFICATION : IPC-6012 Class II S.M.C.'s : Both Sides ASSEMBLY PANEL SIZE : 157.1 x 109 mm. SINGLE BOARD SIZE : 137 x 89 mm. NUMBER OF PCBs IN PANEL : 1 MATERIAL LAYUP (Component side at top) : MATERIAL LAYER# THICKNESS & TOL SPECIFICATION ---------------- -------- ------------------ -------------------- Solder Mask <<AUTO>> Copper Plating 25 mic. Copper Layer-1 35 mic. RO4003 203 mic. IPC-4103/10 Copper Layer-2 35 mic FR4 <<AUTO>> IPC-4101/26 Copper Layer-3 35 mic FR4 <<AUTO>> IPC-4101/26 Copper Layer-4 35 mic. FR4 <<AUTO>> IPC-4101/26 Copper Layer-5 35 mic. RO4003 203 mic IPC-4103/10 Copper Layer-6 35 mic. Copper Plating 25 mic. Solder Mask PCB PROCESS REQUIREMENTS : TOTAL BOARD THICKNESS : 1.60 mm. MIN. INSULATOR THICKNESS : 100 um. MATERIAL TG MINIMUM : 170'C FINAL FINISH : ENIG/ENEPIG (Suitable for Lead-Free Reflow-Soldering) (ENEPIG preferred) GALVANIC GOLD PLATING : None SOLDER RESIST : Liquid Photo Imageable (SMOBC-LPI), Side: Both, Color: Red LEGEND PRINT : None MIN. LINE WIDTH : 5 mils. MIN. SPACING : 4 mils. BARE BOARD TEST VOLTAGE : 25 VDC. BLIND-VIA : NO BURIED-VIA : NO CONTROLLED IMPEDANCE : NO

Page 2: Malzeme Tanımı: (R-07) - gucumuzbir.comT02 0.30 5218 Plated default Filled And Capped by IPC-4761 Type VII T01 0.70 20 Plated default T04 0.90 8 Plated default T05 1.20 18 Plated

DEFAULT TOLERANCES (BASED ON IPC-6012 Class II) : PTH Hole : +/- 0.100 mm. None-PTH Hole : +/- 0.050 mm. Routing : +/- 0.200 mm. Board Thickness : +/- 10% FINISHED DRILL SIZES & COUNTS : Tool Size Count Plating Tolerance Notes ---- ------ ----- ------- ---------- ----------------------------------- T02 0.30 5218 Plated default Filled And Capped by IPC-4761 Type VII T01 0.70 20 Plated default T04 0.90 8 Plated default T05 1.20 18 Plated default T03 2.30 15 Plated default Tool Size Count Plating Tolerance Notes ---- ------ ----- ------- ---------- ----------------------------------- T06 3.05 4 None default RULES AND NOTICES: 1.Dielectric materials should be Lead-Free compatible. 2.The given dielectric thicknesses between layers are expected values on finished PCBs.