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PRIVILEGED AND CONFIDENTIAL MATERIALS

A Platform Specialty Products Company.

MACDERMID ENTHONE ELECTRONICS SOLUTIONSFILM INTRODUCTION



First Photec dry film Hitachi-Chemical products released in Japan (1974)

Enthone and Hitachi-Chemical Technology Partnership (1985)

First Sales Photec products in (1986)

First slitting operation Enthone Europe (1987)

Increased slitting capacity (1989)

New Slitting operations Build in NL (2014)

MDE selling Photec (PCB) and Kolon (select applications) (2015)

Re-allocation of Slitting to Wantage UK (Ready 2017 End)

Established Market Leadership with Photec dry film materials WW #1

HISTORY



• Hitachi Chemical Co. responsible for

• Resin manufacturing

• Resin coating

• Slitting for Asia (several facilities)

• Kolon : supplying slit roll resists to MDE

• MDE responsible for

• Slitting (facility in NL- Future UK)

• Storage of jumbo rolls and slit rolls

• Sales, Distribution & technical support in Europe

RESIST



SLITTING – NEW CLEANROOM IN UK



MACDERMID ENTHONE IS RE-INVESTING IN UK

Ready by End of 2017



COMMITMENT TO QUALITY

EUROPE:

• ISO-Certified in 12 countries

• 14001 Certified in 4 countries

• 6-Sigma Program

• OSHAS 18001

Quality is an ongoing process



• Any Width possible according to customer requirement: 144 - 650 mm

• Cores & length:

• Length 150 m => 3” core standard

• Length 150 m => 5” core (limited availability)

• Length 300 m => 3” core (limited availability)

• Length 300 m => 5” core Standard

• Length 590 m => 3” core (Special)

• Free of Charge sampling:

Width: 300, 350, 400, 450, 500, 550, 600, 650 mm

Length: 30 mtr => 3” or 5” Core

• Possibility for re-usable side covers

•

RESIST FORMATS

Highest flexibility in materials supply



ELECTRONICS TRENDS – DRY FILM NEEDS

• Higher density

• Higher layer

count,

• Thinner

materials

• Low cost

• Supply Chain

� Better

Adhesion,Resolution,

Conformability

� Higher Yield

� Good Technical

service

� Fast Delivery –

slitting

� Direct Imaging

• Lighter

• Thinner

• Smaller

• More

functions

• Lower cost

PCBElectronics Dry film



Laser Direct Imaging

Artwork:◆Change in dimension◆Static electricity◆Cost & time loss due to

artwork preparation

◆ Thinner ◆ Higher density ◆ More & smaller PTHs ◆ Lower Cost

◆ High layer counts ◆ Faster production ◆ Blind Microvias ◆ Mixed Finishes

DEMANDS FOR DRY FILM

Photosensitive

Dry Film Type

Subtractive process:Width of line : ◆ Top < Bottom,

◆Uneven

Distribution

Manufacturing :◆ Dimension & alignment accuracy (Adhesion and Dry film

formulation)

◆ PTH protection, cost & space of coating equipment,uniformity of thickness, etc. (Photosensitive liquid Type)

PWB Trends

Current Technology & Limitation Solutions

Thinner

Resists



Photec KEY PRODUCTS

• Photec H-6200 series General purpose – High Density

• Photec PH-2000 series Multifunctional PCB

• Photec H-N650 Electrolytic gold plating

• Photec H-8250 Secondary Imaging Technology

• Photec H-6600 series Multifunctional conventional high speed

• Photec SL-1300 series Laser Direct Imaging

• Photec DL-3200 series Imaging 405nm

Dry films for all Applications



Photec SPECIAL PRODUCTS

• Photec RY-3319/3315 Packaging, 19 µm und 15 µm

• Photec HM-4035/4056/4075 Packaging, 35, 56, 75 µm

• HM-40100, HM-40120, HM-3015 Packaging; 100, 120, 15 µm

• Photec H7025 Smartcards

• Photec RD-1225/1215 High performance plating Packaging

Dry films for all Applications


A Platform Specialty Products Company.12

KOLON Dry film for Plating Process

Item Unit KM-1140 KM-1150

Thickness um 40 50

Exposure Energy mJ/㎠ 35 40

Resolution um 26 29

Adhesion um 26 27

1) KM-1100 Series(Selective Gold Plating)

< KM-1140, Dot=40um >

(SST=19/41)

Item Unit PK-1640 PK-1650

Thickness um 38 48

Exposure Energy mJ/㎠ 20 22

Resolution um 34 37

Adhesion um 27 35

1) PK-1600 Series(Cu & Tin Plating)

< PK-1640, L/S=40/40um >

(SST=22/41)

Characteristics

Characteristics



Photec PH- 2000 AND H-6200 series : Value Creation

Improved adhesion

Faster exposure

Better Tenting

Finer Lines

Faster stripping

Yield improve

Productivity



LASER IMAGING PRODUCTLINE

Product name application Exposuremachine

Exposure Energy

(mJ/cm 2)

SL-1300Series

29 micron Inner MLBUV-LDI *1（355nm）

14～2338 micron47 micron

Outer MLB(TT, Plating) 20～35

DL-3100Series

29 micron Inner MLB

UV-LDI *1(355nm）

DLP *2(405nm)

10~20*1

17~35*238 micron Outer MLB(TT)

RD-1200Series

10 micron15 micron20 micron

PKG-Et 15~29*1

23~49*2

RD-1100Series 25 micron SAP 35~70*1

50~100*2

*1 Orbotech Paragon-8000m*2 Hitachi Via. DE-1AH



LDI FOR 405 NM - PHOTEC DL-3200 SERIES

Features

☆ Highest sensitivity � High through-put performance.

☆ Excellent adhesion & resolution � High Density, ultra fine line and space

pattern formation.

☆ Very good stripping properties � Improving first pass yield.

Tested on various machines � Flexibility in operation☆



Specifications

*1. Recommended ST, Minimum developing time× 2, DI Machine: DE-1AH by Hitachi Via Mechanics Corporation*2. 30℃, 1%Na2CO3 developer*2. 50℃，3%NaOH Stripper (Beaker test)

DL-3229 DL-3238 Competitor

Thickness μm 29 38 30

Exposure energy *1 mJ/cm2 15 16 18

Minimum developing time *2 sec 18 27 16

Adhesion *1 (L/S=n/400) μm 25 32 27

Resolution *1 (L/S=n/n) μm 25 30 27

Minimum stripping time *3 sec 30 50 39

Size of striped flake *3 mm 30 30 40DL-3238

L/S=50/50μmResist profile of DL-3200

after developing(Recommended ST，

Minimum developing time ×2)

DL-3229

LDI FOR 405 NM - PHOTEC DL-3200 SERIES



MACDERMID ENTHONE ELECTRONICS SOLUTIONSTOTALIMAGE



What is Totalimage™?

Totalimage is a system of processes that deliver superior results for photo-

imaging. Designed to improve yields, increase productivity and reduce

total cost of ownership, Totalimage is specially engineered to support

PHOTEC* dry film

*The PHOTEC® trademark is under license from Hitachi Chemical Co.



Today’s quality and high-density capability in PCB manufacturing depends on a

combination of both chemistry, dry film and equipment. Primary imaging and

periferic products enable line densities, layout capabilities and first pass yields.

A system of compatible and proven products—bundled with a primary imaging resist

such as PHOTEC—enables this to happen.

Why Introduce Totalimage™



Process Sequence

Surface preparation

Different ENPREP™ Ti pretreatment

products are available depending on

equipment available and needs

Lamination

Exposure Development

Plating/Etching Resist stripping

Various PHOTEC dry film types

available

for inner and outerlayer processing .

PHOTEC dry films are available for

conventional Exposure techniques as well

as LDI (365 and 405nm)

Also LED types.

Stripping with

ENPREP Ti-1400 RS

Development of PHOTEC

dry film

Using ENPREP Ti -1300 DS

For plating refer to CUPROSTAR™ and

STANNOSTAR™ products manuals.



Totalimage™ - Processes

Surface Preparation:

– ENPREP® Ti-1000 CL

– ENPREP Ti-1100 ME

– ENPREP Ti-1200 CLEANER

Imaging:

– PHOTEC

Development:

– ENPREP Ti-1300 DS

Stripping:

– ENPREP Ti-1400 RS

Equipment Maintenance /Cleaning:

– ENPREP Ti-1500 EC



Totalimage™ Creates Value

• Increases FPY in Primary Imaging

• Reduces maintenance and down-time

• Increased capability

• Reduced cost-of-ownership



Thank You

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