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SDC-92-395

SDC SOLENOIDAL DETECTOR NOTES

Prototype Tower Workshop

December 12-13, 1992

Edited by H. Lubatti

sse Laboratory

This document contains the transparencies of presentations made at the Prototype Tower Workshop. The purpose of this workshop was to bring together the groups responsible for the various aspects of the prototype tower in order to identify the interfaces between the groups. There was considerable discussion during each presentation which unfortunately was not recorded, but contributed greatly to the success of the workshop.

The following is a list of action items identified during the Tower Workshop and the person(s) responsible.

Drift Tubes

1. Develop quality assurance specification for the tube extrusions. - H. Lubatti

2. Establish gas purity specification (e.g. percentage of N2 and 02) - T. Zhao

3. Specify the use of x-ray verification for alignment. - H. Wellenstein

Ali~nment

1. Complete fmal SLM design. - J. Govignon, J. Oliver

2. A number of alignment/measurement devices are necessary so that the module can be monitored during assembly. These include SLM monitors, strain gauges, and thermal sensors. These must be available early for monitoring during assembly. The mounting and placement of the SLM's must be established as soon as possible, but no later than February I, in order to identify any special machining required on the end plates. - C. Daly and Alignment group

3. Establish shapes of modules mounted on 3-point kinematic supports and communicate to J. Govignon. - C. Daly

4. The laser tracker has not been ordered. D. Veal was consulted following the meeting and he claims that it will be possible to rent a laser tracker. This should be tracked closely. - J. Govignon

Front-end Electronics

J. Oliver has been appointed the Grounding and Shielding control person. All electronics and connectors in the modules and tubes must be reviewed by J. Oliver.

1. Can RPC's be integrated into the standard front-end electronics? - L. Introzzi and Electronics group

1

2. A system for verifying cabling connections for an entire module must be developed. - J. Oliver, W. Song

3. C. Daly should contact R. Davisson to verify that he has the latest placement of Bulkhead connectors worked out by R. Davisson. - C. Daly

3. Japanese group will develop a cabling scheme soon. - Y. Asano, S. Terada

Slow Controls

1. Requirements for tube test station at the Muon lab must be established and communicated to A. Fry as soon as possible.

2. A complete list of read out and calibration information required for the electronics must be developed. - J. Oliver

3 One or more individuals responsible for the software must be identified. This person(s) will also be responsible for documentation and for being present at the SSC during hardware installation and interconnection to the readout system. - A. Fry

Scintillators

1. Testing for the scintillators will be established at the SSCL. - R. Thun

2. An analysis system for the scintillator test must be developed - K. Heller, V. Kubarovsky

3. Requirements for storage of scintillators before and after testing will be specified - R. Thun.

TABLE OF CONTENTS

REVIEW OF SCOPE AND OBJECTIVES STATUS OF MUON LAB REMODELING

STATUS OF BW (213,4) DESIGN Overview of Fabrication Procedures and Mechanical Issues To Be Studied

FABRICATION ISSUES TO BE STUDIED

TEST PROCEDURES FOR TUBES

ALIGNMENT SYSTEM Review of Design, Prototype Instrumentation and Test Program

STATUS OFTMC's

GAS AND HV SYSTEM

FRONT-END ELECTRONICS AND TRIGGER

U.T. ARLINGTON ASSEMBLY SITE

SCINTILLATOR SYSTEM

RPC STATUS REPORT

SLOW CONTROLS

DATA ACQUISmON SYSTEM

3

H. Lubatti

C. Daly

W. Song

T. Zhao

J. Govignon J. Oliver

Y. Arai

P. Schuler

S. Terada Y. Asano J. Chapman J. Oliver

A. White

R. Thun

G. Introzzi

B.Roe

A. Fry

REVIEW OF SCOPE AND OBJECTIVES

STATUS OF MUON LAB REMODELING

H. Lubatti

Prototype Tower Workshop December 12, 1992

5

MUON TOWER PROTOTYPE

Presented to the SDC Collaboration Meeting

December 12,1992

Henry Lubatti

7

SDC PROTOTYPE TOWER WBS 3.2.1.5.8

Build BW(2,2)/BW(3,2) Tower in sse Muon Lab at Stoneridge

Build BW(2,1) at UT Arlington

Test

• Assembly procedures

• Alignment schemes

• Electronics • Trigger??

H. Lubatti Tower Workshop

8 December 12. 1992

PROTOTYPE TOWER - OCTANT 1. MODULE 2(4)

I ~ 9029.7 :: ~I r 8834.9 _. -1

I BW3

~ 2426.0 I.. 9161.9 .1 I" 7371.2 -I

-L-__ ~ 1/ BW2

I.. 7020.0 ~

Theta Tubes

Stereo Tubes

Phi Tubes

PROTOTYPE TOWER - OCTANT 1, MODULE 2(4)

I; :::: 11 II 1----IJo5 2'128 aW3 ,-1-

L, ~'1t BW2 f

Theta Tubes - 273 (BW3) • 262 (BW21 Stereo Tubes - l~~ eo.

Phi Tubes - 340 ea.

PROTOTYPE MODULE TASKS

TASK RESPONSIBILITY CONTACT

Enlarge and modify SSCL Muon Group J. Thunborg existing Muon Lab G. Pennycuff

Final module design Seattle/SSCL C. Daly

Assembly Seattle/SS CL H. Lubatti procedures

Jigging for module Seattle/SSCL R. Davisson assembly

Issuing POs for SSCL J. Thunborg module~ jigging & H. Lubatti end caps

Front-end KEKlHarvard/Michigan S. Terada electronics (ASD) J. Oliver

J. Chapman

Scintillators, bases Michigan/Protvin0 R. Thun and PMs V. Kubarovsky

HV distribution SSCL P. Schuler system

Gas distribution SSCL P. Schuler system

Drift tubes Boston/Seattle G. Feldman T. Zhao


11 December 12, 1992

TOP RAIL Slant Side

OUTER RAIL Slant Side

END PLATE Slant Side

. BOTTOM RAIL "" ... -. r;:':d.o ~':"::!i:. '_.L _

<$>" " . " . . . . . . . . . . . . . . .

GUSSET

\. GUSSfT

TOP RAIL Vertical Side

'- OUTER PLA TE Vertical Side

END PLATE Vertical Side

BOTTOM· RAIL Vertical Sio'e

ASSEMBLY PROCEDURE • Installation of jigging

Jigging establishes angles and positions

• Installation of module peripheral structure (side plates and bottom rails)

Side plates shipped from machine shop with bottom rails attached.

Then install on assembly jigging.

• Installation of bottom surface of module

1.5 x 3m, 6mm thick aluminum plates (epoxy bound)

For BW2, load-spreading plates are attached to bottom plates prior to installation

• Installation of tubes

Step 1: Install fiducial tubes

Step 2: Install remaining tubes

• Installation of tube spacers and stiffeners

Tubes with L1 < 2mm - epoxy directly

Tubes with 2mm < L1 < 4mm spacers at intermittent spaces

13


December 12. 1992

Tubes when sparse have 10-90mm separation, so use 1.6mln thick aluminum plates along common tangents.

• Installation of shear transferring membrane

1.6mm aluminum sheets

• Install remaining layers

Repeat above steps

• Install top plates and rails

• Install gas and electrical connections

• Install outer plates

BWI - attach 19mm outer plate

BW213 scintillators, walkways, access ladders

Attach BW2 to BW3 .

• Attach Lee bearing spreader plates

• Move module to storage or alignment station.

14


December 12, 1992

MUON LAB REMODELING

• Enlarge Laboratory

- Provide assembly pad (finished)

- Enlarge loading door so module can be removed

• Occupancy Adjacent Offices

- Space for SDC muon personnel

Offices for visiting university groups

15

16 SR3 OPTION C

C3' X 6 STEEL CHANNEL

3/8' X 6' NELSON STUD

GROUND EXPANSION INSERTS

1/4' STEEL PLATE

UUON DETECTOR ASSEt.lBl Y

PIER SUPPORT

JIG TABLE FOUt-l>A nON 26' X 36'

JIG TABLE FLUSH WITH EXISTING flOOR

EXISTING FLOOR

TOOL/JIGGING MUON DETECTOR MODULES BW2 AND BW3 DEC. 8, 1992

lho"e/novcVprdlkellyl thunborQI IIQ2

1,1380 3AU31Fl:J9U8 9U

'"BW 3 ,

l\j o

( I coc=ID

PERIMETER TOOLING JIG VERT ICAI "tATE

( I@ OJD

PERIMETER TOOLING JIG SLOPING SIDE

-- CORNER PLA TE

SLANTED END PLATE

~-- GUSSET

FIGURE t. PRE-ASSEMBLY OF SLANTED END PLATE

/ VERTICAL END PLATE

FIGURE 2. PRE-ASSEMBLY OF VERTICAL END PLATE

SLANTED END PLA TE-\ /--- CORNER PLA TE

_~ [-- VERTICAL END PLATE

~~ ..... ......~

FIGURE 4. INSTALLATION OF BOTTOM PLATE

DRIFT TUBE ~ BOTTOM PLATE

FIGURE 6. INSTALLATION OF FIRST TUBE LAYER

--- CORNER PLA TE SLANTED END PLATE .. , - VERTICAL END PLATE

-FIGURE 3. TYPICAL CORNER OF MODULE PERIPHERY FIRST STAGE OF ASSEMBLY ON PAD

SLANTED END PLA TE .. ",

'"" "

DRIFT TUBE -_/ /

II CORNER PLA TE

- VERTICAL END PLATE

- DIAGONAL STIFFNERS BOTTOM PLATE

FIGURE 7. SPARSE TUBES WITH DIAGONAL STIFFENERS

N 00

/_.. TOP RAIL -....~ ...

~ TOP COVER PLA TE

rTGURE 11. INSTALLATION OF rnp COVER PLATE AND RAILS

~CHl=nIlLl: II1V .. ~ ... ~

Ml.g'4LA_B It..n :~ .. .. .'w1AGHINEANR Ut-~I{jNSURF.I\CE PLATES IN~TALl.SU~ACE. f'LATES ~LI§~~IIJ:Ar.1= PLATES .... , fytA\lIlIrtc vlUUlrtU INSTALL AND AUGN .1Ir..nINn

I LJ"'~IUN TOP AND tjUI I\.IM RAILS ~AAl".~t.ls: TOPANDavlluMRAILS I

I DESIGN""" ..... I PlATES

I PlATES

I PRor.llRF END CAP PARTS I 1=, END CAPS

TUBE A~~I=URI_Y AT UNIV. TUBES l:Inll"'l"'cU TO sse

COMPLETE BWJ AQQClIDI.y

BW2 MOnI. II 1= Y

MAlE BW3TOBW2

PROTOi :mER SCHEDULE

~,"'~~~R~ 'I!E~A~Y IM~R~J! IAPRIL IMAY IJUNE 'JULY AllnUST

-+-r-I--I-~-+;-~-~~-~~+-'~-4-4--I-t~I-+~-r~--r-tl-+-;-;I-

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'-t--~-1-+--t-+-I--r-t-+-l--t-II- 1--'1 -I-I-I--t--t-t---f-I-~--t-f-I

r+-r;-+-~-I-~-+--t-f-~~-f'--I--I-I·-I-~-+-~-I·-r~-~-I

r+~;-~-f-t-+~;-+-,r-t-II-I-'I-~--I--'I-+--t-+-f-+--t-r-I

I I

1.

I

J

Page 1

PROTOTYPE MODULE TUBE PRODUCTION PERSONNEL

PHYSICIST

J. Bensinger G. Brandenburg R. Davisson G. Feldman (QAQC Officer) P. Hurst H. Lubatti A. Mann (QAQC Officer) R. Milburn A. Napier H. Wellenstein J. Wilkes T. Zhao (QAQC Officer)

ENGINEER

B. Dennis E. Sadowski

30

UNIVERSITY

Brandeis Harvard

U of Washington Harvard Harvard

U of Washington Tufts Tufts Tufts

Brandeis U of Washington U of Washington

UNIVERSITY

U of Washington Harvard


December 12, 1992

TECHNICAL SERVICES SUPERVISION

H. Guldenmann

SHOPFOREMAN~EAD~

F. Dalrymple L. McMaster D. Skow

MACHINIST/TECHNICIAN

Y. Chen D. Dupuis R. Haggerty P. Long E. Lucia R. Musgrave J. O'Kane M. Renteman J. Roze S. Sansone L. Stark

31

UNIVERSITY

U of Washington

UNIVERSITY

Harvard Tufts

,U of Washington

UNIVERSITY

U of Washington Tufts

Harvard Brandeis Harvard

U of Washington Harvard

U of Washington U of Washington

Harvard U of Washington

H. Lubalti Tower Workshop

December 12, 1992

PROTOTYPE TOWER DRIFT TUBE PRODUCTION

- ORGANIZATION

Institution

Brandeis

Harvard

Tufts

U of Washington

- TASK RESPONSIBILITIES Items

Aluminum extrusion

Noryl/aluminum extrusion

End caps

32

Contact

H. Wellenstein

G. Feldman

A. Mann

T. Zhao

E. Sadowski H. Guldenmann

H. Guldenmann

J. Thunborg


December 12. 1992

TUBE ASSEMBLY EQUIPMENT AND FACILITY

Clean room and tube storage

Tube end finishing machine

Tube cleaning machinery

Tube assembly station and jigging

End cap interference fit apparatus

Electrode cutting and trimming

Electrode zipper

Wire tensioning and crimping

Wire dispensing and stringing

E. Sadowski A. Mann H. Guldenmann T. Zhao

A. Mann H. Guldenmann

E. Sadowski A. Mann W. Song

E. Sadowski A. Mann H. Guldenmann T. Zhao

H. Wellenstein

H. Guldenmann

H. Guldenmann

H. Wellen stein

E. Sadowski R. Davisson


December 12. 1992

- TUBE TESTING PROCEDURE AND EQUIPMENT

G. Feldman, P. Hurst, T. Zhao

• ITEMS TO BE TESTED

•

Dark current Gas leak rate Wire tension Observe signal

WIRE POSITION - X-RAY H. Wellenstein

• INFORMATION TO BE STORED ON PC OR MAC

Tube number Manufactured location and date

Module number and layer number (l/J, 8 and stereo) High voltage and dark current Gas leak rate Wire tensio n Signal response to source and cosmic ray

• UNIVERSAL BAR CODING FOR TUBE ID

31

W. Song


December 12, 1992

Rigging of Modules

• Two companies capable of moving modules in the Muon lab have been identified

• Portable gantries will be used to lift the modules and move them laterally

• The modules can be rotated within the laboratory by placing them on caster dollies.

35


December 12. 1992

UNRESOLVED ISSUES

• Mounting of front-end electronics

How distribute the two options Impacts: Design and Fabrication of end plates

Routing of signal cables

• Mounting of Alignment Paraphernalia

Impacts: Plate/Rail Design

• Mounting of Gas Manifold

Impacts: Plate/Rail Design

• Mounting of Strain Gauges, Thermal Sensors, and Wiring

Impacts: End Plates

• Lay-out and Number of Tubes Per Layer

Impacts: End Plates

3{i


December 12. 1992

STATUS OF BW (2/3,4) DESIGN

Overview of Fabrication Procedures

and Mechanical Issues To Be Studied

C. Daly


37

41

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PROTOTYPE TOWER - OCTANT I, MODULE 2(4)

Il4-tl4-~-=--=--=--_-_-------::: ===--=--=--=-------..--..;1

2426

BW2

,..'1"1 (f\WJI • 262 (BW21

Phi Tubes - 340 ea.

PROTOTYPE TOWER - OCTANT I, MODULE 2(4)

I~ ::::~ ~I I BW3

~ 2426.0 ,.. 8167.9 .. I c..J I" 7377.2 "I

_______ ~ II BW2

I.. . 7020.0 ·1

It .. -'{' i.... .'\ 1.-:

Phi Tubes

./ ,,' .'

/

·_----.... _----- '" ,...,

~-, -------

{,

• j' ,. !. , ;. l. 1 !

1\'

I I

·.~ (

/.:. // . .... / ::'1

(

Access

BW2/3 Tower - Octant 3 Showing 2m x O.8m access way from IW2/3

46

" ,

,',

LOAD DISTRIBUTION SPACERS AT BEARING MOUNT POINTS

+ 89 V

Active Gouges

Standard Strain Gouge Setup

Balance

_____________________________ ~---------------J 10-500 microvolts

Dummy Gauge

High gain, low drirt DC amp I i r i er

3-5 V

To ADC

Common

FABRICATION ISSUES TO BE STUDIED

W. Song


51

Prototype December 8, 1992 Page 1

Process Analvsis •

1 Definition of Process Steps

· Need · Simplicity · Sequence · Work Instruction

Development

2 Setup Process and Time Reduction

· Jigs and Fixtures . Maximize Assembly Station

Utilization

53


3 Design of Tools

· Need for Tools · Reduce the Number of Tools · Reduce the Number of

Operations

4 Tolerances and Specifications

5 Adhesive Material (Epoxy)

· Less Expensive Material · Easy to Process · Standardize Materials · Using Material More

Economically · Using Salvage Materials

54

Prototype December 8,1992 Page 3

6 Tube Handling Process

· Shipping / Assembly Box · Handling System · ·Storage · Tube Failure Rate

7 Information Flow

· Bar Code System · Documentation

55

Prototype December 8. 1992 Page 4

8 Labor force determination

•

· Work Crew Size · Number of Work Crews · Skill Mix

Special Services

9 Layout of Assembly Work Area

· Layout Improvement . Tooling/Equipment Location · Location of Material

56

Prototype December 8, 1992 P:lge 5

10 Work Conditions

· Lighting · Ventilation · Sound · Power Supply · Orderliness and Cleanliness · Personal Protective

Equipment and Supply I 0 $((1l1 d ~. ~,L.-~-If

11 Co~crmnp6isoU)?c 7~_k es

12 Project Control

. Time Study · PERT/CPM analysis · Schedule Justification

57

Prototype December 8. 1992 P:J.ge 6

Time Study Objectives

Establishing Time Standard for Tasks

Minimize the Time Required to Perform Tasks

Maximize the Safety, Health, and Well-Being of All ElDployees

58

TABLE I-REACH-R

Dlsu"" Tim. TMU H .. nd In CASE AND DESCRIPTION Moved Motion Inch .. Cor A Reach to ob.ject in fixed toea-A B D E A B tion, or· to object in other ~.o'I ... 2.0 2.0 2.0 2.0 1.6 1.6 hand or on which other hand

1 2.5 2.6 3.6 2.4 2.3 2.3 rests. 2 4.0 4.0 6.9 3.8 3.5 2.7 ;J 6.3 6.3 7.3 5.3 4.5 3.6 B Reach to single object • .. 6.1 6.4 B.' 6.8 '.9 '.3 In 5 6.5 7.8 9A ·7.4 6.3 6.0 location which may vary 6 7.0 8.6 10.1 8.0 . 6.7 6.7 slightly from cycle to cycle • T 7.4 9.3 10.8 8.7 6.1 6.5

C Reach to object jumbled with 8 7.9 10.1 11.5 9.3 6.6 7.2 9 8.3 10.8 12~2 9.9 6.9 7.9 other objects in a group so

10 8.7 11.5 12.9 10.5 7.3 8.6 that search and select -occur. 12 9.6 12.9 1'.2 11.8 8.1 10.1 1. 10.6 14.4 15.6 13.0 8.9 11.6 o Reach to a very small object 16 11.4 16.8 11.0 1".2 9.7 12.9 or where .accurate grasp is 18 12.3 17.2 18." 15.5 10.5 1 ..... required. 20 13.1 18.6 19.8 16.7 11.3 15.8 22 14.0 20.1 21.2 18.0 12.1 17.3 E Reach to indefinite location 24 14.9 21.5 22.5 19.2 12.9 18.8 to get hand in position for 26 16.8 22.9 23.9 20.' 13.7 20.2 28 16.7 24.4 25.3 21.7 1'.5 21.7 body balance or next motion 30 17.5 26.8 2&.7 22.9 1&.3 23.2 or out of way_

IABLE II-MOVE-M Time TMU Wt. AIiDwance

Distance Moved H.i1d Wt;, Faa- Con-

CASE AND Inch .. In DESCRIPTION Motion (lb.) tor aunt

A B C B Up to TMU

~ol'l ... 2.0 2.0 2.0 1.7 2.5 0 0 1 2.6 2.9 3.4 2.3 2 3.6 •• 6 6.2 2.9 7.5 1.06

A Move object to 3 4.9 6.7 6.7 3.6 2.2 other hand or against • 6.1 6.9 8.0 • .3 6 7.3 8.0 9.2 6.0 12.5 1.11 3.9 stop. 6 8.1 8.9 10.3 6.7 7 8.9 9.7 11.1 6.5 17.5 1.17 6.6 8 9.7 10.6 11.8 7.2 9 10.5 11.5 12.7 7.9 22.5 1.22 1.4 B Move object to 10 11.3 12.2 13.5 8.6'

approximate or • 12 12.9 13.4 15.2 10.0 27.5 1.28 9.1 In· 14 14 .. 14.6 16.9 11 •• definite location. 16 16.0 15.8 18.7 12.8 18 11.6 17.0 20.4 14.2 32.5 1.33 10.8

20 19.2 18.2 22.1 15.6 22 20.8 '19.4 23.8 17.0 37.5 1.39 12.5 2A 22.4 20.6 25.5 18.4 C Move object to ex-26 24.0 21.8 27.3 19.8 42.5 1." 1 •• 3 28 25.5 23.1 29.0 ' 21.2 . act location. 30 27.1 24.3 30.7 22.7 47.5 1.&0 18.0

Prototype December 8. 1992 Page 7

Components of Time Study

1. Choosing the Operator

2. Approach to the Operator

3. Analysis of Material and Methods

4. Recording the significant Information

5. The Observer's Position

6. Dividing the Operation into Elements

7. Taking the Study

62


8. Recording the Time Consumed by Each Element

9. Difficulties Encountered·

10. The Number of Cycles to Study

11. Rating the Operator's Performance

12. Apply Allowances

13. Calculate the Study

63


Shipping Box Requirement

1. One Box Contains Only One Layer of Tubes For A Module

· Just In Time Operation · Minimizing The Inventory

Cost · Minimizing The Storage

Required . · Minimizing Material

Handling · Better Installation Quality

Control

61


2. Three Or Four Types Of Boxes Based On Tube Length

. Tubes Can Be Grouped By Length

3. Same Type of Tubes For A Module Uses The Same Box

4. Shipping Box is Also The Assembly Box

. Minimizing Tube Handling

. Tube Installation Quality Control

65

Tube Group

From 4926.8

6463 6882.8 8535.4

To 5164.6 6854.3 7120.7 8773.2


# of tubes 6280

16170 8384

17844

Total 48678

66

Prototype Decem her 8. 1992 Page 11

5. Both Ends Can Be Opened

· Easier Receiving Checking · Easier Receiving Testing · Less Material Handling

6. No Projecting Handles

. Less Space For Transportation

· Better Assembly Work Area . Handling Connections Built

In

67


7. Strong Box

. Boxes Can Be Stored On Top Of Each Other

. Not Broken By An Accidental Drop

8. Foldable

· Easy To Be Shipped Back To Reuse

68

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t ~I 'I ~.L_ I ~r- I I f lie ell ' I I I i H I BWl Block I 1 ~ j ~ 8.3 m ~l i

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I 'I' I 1.1 i I! I , t ~~- II ~~~ II ,

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1m

13m _ .. 13m 13m 13m .. 1-4.66m

Muon Module SlOfa,e

Figure 1 Layout of Drift Cell Storage and Assembly Pads (Scenario 1)

Universities

SSCL

Ordering Materials

Tube Assembly Manufacturing

Testing

Boxing: One Muon layer per Box Plus Max Predicted Failures

Transporting

Receiving Storage (can locate off site)

Temporary Storing

Moving to the Assembly Area

70

-----. I I I I I I I I I I I

Increasing/Decreasing Order Quantity for Next Box of the Same Length

Minimum Spares Inventory

TEST PROCEDURES FOR TUBES

T. Zhao Prototype Tower Workshop

December 12, 1992

71

TUBE TESTING AND

QUALITY CONTROL

A Proposal

(PRELIMIN ARY)

Tianchi Zhao

University of Washington

December 2, 1992

• We perform all possible tests for prototype tubes.

- During tube assembly (for quality control);

- After tubes are assembled and before shipping;

- After receiving at the SSC lab .

• What are the tests 'we really need?

- Cost of the tests?

- Time it takes to perform these tests?

These questions can only be ans\vered by analysing the results of prototype tube production.

73

Shigeki Mori

AT THE MANUFACTURING SITES

1) After evacuating air, fill Ar-C02 gas, measure dark current as a function of high voltage, and (observe) noise signal by a osclloscope.

2) Measure anode wire tension.

Defective anode wire is replaced.

3) Perform gas leak test by immersing endcaps in water after presurizing a tube slightly higher (50/0 - 100/0) than the atmosphere pressure.

AT sse LAB ... at least

1) Visual inspection 2) Tension mesaurements 3) Hihg voltage tests.

74

ELECTRODE HIGH VOLTAGE TEST

Purpose Testing N oryl insulation

vVhen? Before \vire stringing

Testing conditions +9kV to +10 kV in air

Acceptance requirements Dark current < 10 nA No sparks

Required Equipment (1) A test stand (2) High voltage power supplies (3) High voltage distribution panel ( 4) High voltage end plugs

WIRE TENSION TEST

Purpose Checking and recording "vire tension Testing conditions (1) Before crimping

(2) Immediately after crimping (3) ?? minutes after crimping ( 4) After receiving at SSCL

Acceptance requirements ~T < 2.5% x T (or ±25 grams) Required Equipment Tension measurement device

WIRE LOCATION VERIFICATIO"N

Purpose Checking the ,vire position in tube Test conditions Ho\v many exposures for each tube?

Acceptance requirements Deviation < ??? /-Lm Required Equipment being developed by H. Wellenstein

75

GAS LEAK RATE MEASUREMENT

Purpose Checking and recording gas leak rate When? (1) After the tube is assembled

(2) After receiving at SSCL Acceptance requirements Leak rate < ??? Required Equipment Being developed by H. Wellenstein

Two Main Issues

1. O2 ~ Gas Gain~ Efficiency and Resolution

• Upper limit: 500 ppm (from Bensinger)

• Lower limit: 20 ppm (form an unnamed "expert")

Require more study in order to clarify this.

2. N2 ~ Drift velocity ~ Resolution

• 0.1 % of N 2 ~ ""' 1 % change in drift velocity

• 1% change in drift velocity is too large.

• N2 content in our recycled gas system must be stable to a level such that it does not change the drift velocity by more than 0.5%.

• N2 should be stable to at least 'within 500 ppm.

76

09/10/92 13.46

. . . . ·················T···················T················ ····r···················l····················~·······

.CD .......... ~ .... @ ..

· . ;Q) · . · . ~ : 14' · . \31

u 5 o ••.••••••.•.•.•••.•••••••••••••• ~~::.c: . ···i····················~····$··· · .

(1)

> · . · .

· . . . ... ... ............................................................................... .- .................................. . · . . . . · . . . . · . . . . · . . . . · ., . · ., . · .. . · .. . · ., . · .. . · .. . · .. . · . · . · . · . · . · . 3

.. . ................ . ···················t···················r····················~····················j·····················i···· ...... . · . . . . · . . . . · . . . . · . . . . · . . . . . . . . Ar : C02 : N2 ~ .. '"

... ) .................... ~ .................... t ........... Q) .... ~ 5_ 0 ... .: ... .t.q.Q ... : ... :4.. ~ ... ~ .......... . l l [@ ~8.D : l~.D : 2.0 ~ : l Q) ~9.0 : 1 q.O : 1.0 1

1 1 @ ~9.5 : 1 q.O : 0.5 1 .... . ......... ··f········· ···········f ........ ············f·········· .@ ... ·~9·:9····:· ··1·q: 0·'·:' ··t)": , ... r····· .... . : 1 @ ~o.o : 10.0 : 0.0 1

. . ..

°0 400 UWVTL

800

· . · . · . · .

1200 1600 2000 2400 Electric Field (Volts/ cm)

Effect of Nitrogen Contamination

77

TUBE PERFORMANCE TEST

Purpose To ensure that every tube ,vorks When? (1) A.fter the tube is completed

(2) After receiving at the SSC Lab Test Conditions Tube purged by Ar-C02

Acceptance Ianode <??nA and Ielectrode < ??nA .. f 5i.,~fe'5 R£ requirements at Vanode = 6.5 kV, Velectrode = 7 kV

Resolution < ??? J-Lm Pulse height variation < ??%

Required (1) TVlo precision end plates for 32(??) tubes Equipment (2) Gas purging and fio'wing equipment

(3) High voltage system ( 4) 32 channels of front end electronics (5) Special plugs for analog + digital signals (6) Scintillating trigger counters (7) Nlj\tI discriminator and logic modules (8) TDC and A.DC modules (9) Portable DAQ systenl (10) Data analysis code

• The distance between the two end plates must be adjustable.

• The total area of trigger counters must be la.rge enough to give us reasonable rate.

• Iron or lead blocks are required in order to remove lo,v momentum muons.

• The ADC spectrum ,vill help us to understand the gas gain.

• CAMAC or VNIE for the DA.Q systenl?

78

ALIGNMENT SYSTEM

Review of Design, Prototype Instrumentation

and Test Program

1. Govignon 1. Oliver


79

• ALIGNMENT MEETING @ BOSTON

Monday January 11, 9 am • 5:30 pm

Tuesday 12, 9 am - 3 :30 pm

Agenda:

Prototype Activity: Design, Schedule, Responsability

• Need for Better Interaction

* Teleconferencing on Mondays @ 11 am Eastern time. See Debbie for Scheduling.

* Increase Use of Intergraph. Module Drawings and Drawing list (Assembly Drawings and Part Lists) needed.

• SOC Muon Measurement System, Conceptual Design Report of the Alignment System

available at SOC Doc.as SDC-92-381

~[Q)© rnaJUJJ@[N] ~W~IJ~1Mtl £[!J@[N][M]~[N]IJ

PURPOSE & APPROACH

• THERE IS NO ADJUSTMENT (Except for Jacks on Support System) ( fi~J~ c( Z~~~~~C:'-.r~ ~J

• PLACEMENT OF COMPONENTS (MODULES) DURING CONSTRUCTION

- 1-3 mm w/r/t design and expected Beam Line and IP

• MEASUREMENT OF ACTUAL POSITION WHILE THE MAGNET IS "ON"

Precise Knowledge of Wire Position - 150 ~m w/r/t actual Beam and IP

GLOBAL MEASUREMENT

LOCAL MEASUREMENT (Inside a module)

---- J.GOVIGNON (617) 258·3866 ------------ DALLAS 10/28/92

SUMMARY OF OVERALL ALIGNMENT SYSTEM

• Alignment During Module Construction - Establish Interpolation Model (Calibration of

Relationship between Wires and Fiducials at corners) • Alignment During Detector Assembly

- Placement of the Modules (Survey by AG) • Alignment After Detector Assembly

- Position Knowledge and Monitoring Changes with Precision - Local Alignment

- Excerclsing the Interpolation Model (On-Module SlM) - Global Alignment (Baseline)

- Rela1ing Module to Module through Aduclals' Position Knowledge (1) limited Network of Straight-Line Monitors (SLMs) and

Fenceposts (FPs) Inside the Detector and Extended out (2) Range-Only-Measurement (ROM) Network (3) Anclillary Subsystems: LIquid-Level, Temperature Sensors (4) Computer Integration of Data

FIDUCIAL MARK

I I

, , , , , , ,

" , , I ' , I ' ' , , '

, I , I

, I I

_._._._ • ...!.. wi ~.~.~.-.~.~.~.-.

~[Q)© [MllU]©[N] ~W~l~[}¥u &[lJ@IN][Ml~[N]1 ALIGNMENT & MEASUREMENT STEPS

STEP 1

• MEASURE PRECISELY THE LOCATION OF SENSOR END-WIRES W/R/T FIDUCIALS AT MODULE CORNERS DURING MODULE FABRICATION

STEP 3

• MEASURE CONTINUOUSLY WHILE THE DETECTOR IS OPERATING:

A) THE DEFORMATION OF THE MODULES W/RIT FIDUCIALS (LOCAL)

B) A SET OF RELATIVE DISTANCES BETWEEN FIDUCIALS AND ALSO W/RIT BEAM LINE (100 /lm) (GLOBAL)

C) TEMPERATURE DISTRIBUTION

---- J. GOVIGNON (617) 258-3866

STEP 2

• PLACE MODULES TO WITHIN PLACEMENT TOLERANCES (1-3 MM)

STEP 4

• FEED DISTANCE MEASUREMENTS AND TEMPERATURE READINGS INTO A COMPUTER MODEL TO RECONSTRUCT THE PRECISE ACTUAL WIRE LOCATION

DALLAS 10 /2R 192

~ ~ 1Mll1JJ@[N] ~W~tr~1Ml ~[LO@[N]IMl~[N]tr TYPICAL ERROR BUDGET (rev. 1)

WIRE POSITION KNOWLEDGE UNCERTAINTY

15 I

TEMPERATURE UNCERTAINTY

84

LOCAL

I 38.4

LOCAL WIRE SAG

~ TENSION

I

I 50

TIMING CALIBRATION

r- MEASUREMENT

- INTERPOLATION r- ELECTROSTATIC

- ALPHA 53.4 r- POSITION ALONG WIRE

20

WIRE-ENDS POSITION

(INTERPOLATED) I 49.5

SLM MEASUREMENT UNCERTAINTY

CALIBRATION OF INTERPOLATION

FUNCTION

35 I 35

(All numbers are in Jlm)

150

124.2

GLOBAL

I ERROR

PROPAGATION FACTOR: 1.75 *

I 71 WEIGHTED AVERAGE

MEASUREMENT UNCERTAINTY

t- SlMs

f- FPs

- INCLINOMETER

- PROXIMITY SENSOR

- LIQUID lEVEL

r- ROMs

f- STRUCTURAL INFORMATION INITIAL POSITION OFSLM NODES VS FIDUCIALS

INITIAL POSITION OF WIRE-ENDS VS FIDUCIALS * HIGHER REDUNDANCY LOWERS THIS FACTOR

----- J. GOVIGNON (617) 258-3866 DALLAS 10/28/92

GLOBAL ALIGNMENT SYSTEM

Device Device or number of Total Measrmt. Measurement Temperature Transfer to Quantity Measurement measurements Uncertainty Uncertainty Effect Fiducials

Type (micrometer) (micrometer) (micrometer) (micrometer) 48 SLM 96 43.0 20 15 35 32 Indpndt. FP Measrmnt. (extension) 64 68.2 55 20 35 20 Inclinometer 20 60.4 45 20 35

160 Independant Proximity Sensors 160 43.0 20 15 35 768 FP's Prox. Sensor (lateral) 768 80.6 384 FP's Prox. Sensor (length) 384 49.7 25

2 Beam Position Sensor (BPS) 2 66.0 50 25 35 20 liquid Level 20 58.7 40 25 35 26 Range-Emitter-Receiver (RER)· 0 83.8 80 25 0

220 ROM Target· 0 38.1 0 1 5 35 0 Range-OnlY-Measurement (ROM)· 2288 92.1 0 Structural Knowledge·· 1200 38.1 35 15

Total Total 1680 5002

Measurement Uncertainty (Weighted Average): 71.0

• 40% of the number of RERs times the number of targets •• 6 length per Module (the distances between the fiducials) 200 modules, 7 DOF. 1400 unknown. Redundancy factor=5002/1400

O .. qe 1

1+

I \ \

\

\

..... .....

\

\

.....

..... ..... ..... .....

.....

\ \

.....

\ \

.....

\ \ \

..... "-

\ \

..... ...

\ \

I , I I I I , , ,

I , , I ,

\ \ \ \

87

\ \ \ \ \ \ \ \ \ \ \ \ \

"- ..... "- .....

" " .....

" " " ..... .... ....

• Resolve Conflicts in Design for "Real Module" : Cabling, Space etc ..

• Test Bed for Truth Test (Local and Global Alignment)

cc cc • Test Article for FEA

• Test Bed for Options under R&D

• Real Size Model to Apprehend Alignment Installation & Global Issues

"LOCAL ALIGNMENT" to Monllor Module Deformations

• Through local alignment, the wire ends positions are related to the fiducial marks at module's corners (tied to global alignment)

• Straight line monitors measure low order structural mode shape

• Low order mode shape ascertained by analysis & prototype

• Mode shape is determined by: - Fabrication errors - Thermal & gravity loadings - Mounting conditions (# of support points & location)

• Length determined by Fabrication tolerance & temperatute sensing

----r FIDUCIAL

TYPICAL ofJTlcAL STRAIGHT LINE

L~~_ -::::-:~·~~~-31 ... -.. -~ ---.. - ' -----. --._.- .. ----- POSiTION LENS SENsOR

c.o o

r-----------------------------------__ . ____ _

MON'70~ o "l + ~

--------------'----------~~------~

12/1/<12-

vw p:

k~~ GMG 11-17-92

087_se

PHOTOTYPE ALIGNMENT DEVICES & MEASUREMENTS (see Spreadsheet)

- Strain Gages - Temperature Sensors

v - On-Module SLMs - Liquid Levels

'" - Proximity Sensors - (Fencepost)

f-\o _ Fenceposts

- Inclinometers - Measurement of Structural Information • Survey Interface (Detector Construction and Global Alignment) : Targets

ON - MODULE SLM

CONCEPTUAL DESIGN - 3 Node SLM, 1-Dim., Synchr. Detection LOCATION ON MODULE - BARREL

- SIDES: Bottom of BW3 Top of BW2

- DIAGONALS: BoHom of BW3 Bottom of BW2 (Prototype only)

- INTERMEDIATE (see Dwg) DETAIL DESIGN & INTERACTION WITH MODULE DESIGN TEAM (Barrel & Intermediate)

- Optoelectronic Component Selection, Specification (Parts & Vendor), Procurement - Electronic Read - Out and Cabling - DAQ and Analysis Software - Calibration Procedures and Documentation - Fixtures for Zeroing, Calibration

R&D - Alternate Design (1-D vs 2-D, range, 3/4/5 nodes) - Alternate Location - Performances: Aging, Environmental Effects

On - Module Activities: - Proof of Concept - Measurement Acuracy <==> Truth Test: Auxiliary Measurement, Calibr. - Finite Element Model Checking - R&D Feedback and Interface with Final Design

QUAD·CELL on MICROMETER STAGE (X,Y)

(for ALIGNMENT and CAUBPA T10N

OfCENTER~

QUAD-CELL on MICROMETER STAGE (X,V)

(for ALIGNMENT and CALERA TION of CENTERING)

MICROMETER STAGE (X,V)

(FOR AUGNMENT AND CAUBRATION

OF CENTERING)

D\IM DVM

LENS

AUXILIARY LENS

E6

LENS

AUXILIARY LENS

HOLDER"S ROTATION

(FOR CENTERING VERIFICATION)

HOLDER"S REFERENCE DIAMETER

DRIVE ~

LED ADJUSTMENTS IN HOLDER

r-...:;...--'"1---.., HOLDER"S ROTATION

(FOR Ce.lTER1NG VERIFICATION)

HOLDER"S

REFERENCE DIAMETER

1//.'/.· J". "///,,-.,'/" I r . .,. ~ / 1'" , ". ,;:,

~ /

~:

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JRa;.) I1AGtJET

J ;(

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Alignment Devices For Supertower Prototype \Z.-,o-~

D. Goodwin, 1. Govignon Draper Lab. Camb. Mass.

K. Hashemi, J. Oliver, E. Sadowski Harvard Univ. High Energy Physics Lab. Camb. Mass.

Program consists of

(1) Optics design

(2) Mechanical Design

(3) Electronic Readout

(4) Testing and evaluation

(5) Alignment and slow controls issues - temp sensors

Alignment Devices

(1) Straight Line Monitors

(2) Optical Proximity Sensors for Fencepost

(3) Prototype Fencepost

95

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~. s~~

(a~ ~{ l'~c~d,~d-e - (Me....w.r~ ~1 d:f?er?~

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lIt Ca\~~c~~ ~~ ~~ s~~p~ dep~~f J I

~> - •

<l~deJ ~ Q4Er~'1 d;S~b~ ;'" ~po/-. (b) L:.~r~\ ?~~l~ ~E#-c.c;~+~c:. ~~~~r (tsD)

?~-~\~~ 96

C_l~b( .. .J...~ ~~(~) ~!:1 (0.\5%) '~edr

ChI ~~;c{ (not s6pE") depeuJ.eu~ . . -

?rJ.c.~ pe 'SLM ~~I'efI4_.f ,: z.8 ( ~~.l ~ 'a \.Jc i.e.& ~

P4'Ch~,&A t40"N"r

~ ~eT ---------~ 97

Program to analyse data from SLM experiment 14

Data := READPRN(DATAFlLE)

i := 0 •• rows(Data) - 1

<1> SUM := Data

<2> LRDIFF := Data

LRDIFF - LRDIFF_O • • 1 1

Ratio . - Time .-.- .-i SUM - SUM_O i 144

i Ratio - 2.7001

b . - 2.700 m . - -0.547845 X_SLM . -.- .- .--0.547845

6.010

i

5.990 o

Lense position according to SLM (mm) vs.

Time (days)

Time i

98

7

i

3

Lense position according to SLM (mm) vs.

Lense position according to micrometer (mm)

3 x i

7

.ense position according to SLM - Lense position according to micrometer (mm) vs.

0.010

-0.010

Lense position according to micrometer (mm)

I

} \ , ~ 1\

3

1 1 i) r~ ~ w

U V I,

X i

~

1\ ~tH ~ , ~ , , V

7

Standard deviation of above graph for lense positions 3.Smm to 6.Smm:

pm := .001 stdev(error) = 2.3S-pm

9~

2 x single axis

I -I""" 2x Leds

,. Muon Module

2x Leds ~

2 x single axis

100

VME" Gr-o--h::.. -\..

Jl -e v -t: A

0 « u V>

x1

V M{; CrO-+~ •

Po.....-I-ch 'Bo)C

'Fb~ ~---' Module.. ~_-I fa.-t-ch

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STATUS OF TMC's

Y. Arai


111

Preliminary Report on Toshiba TMC Test Chip Dec. 1 0-12 ~-~ SSCL Y. Arai (KEI<)

1. Introduction 2. Preliminary Test Results 3. Summary & Future Plan

• p)-~ f~"\ Res!, i.o).- (SOCu·c{

• ~ t-l o~ Cc. h )<.

• 6·q.,~ TM(-VME

• ::;;c~!ol"l<_

1. Introduction (TMCSSC1)

II • TMC1 004 -> Gate Array Version -> Rad-Hard Version. • Test Chip for Gate Array Version.

Technology Change

• 0.8 11m CMOS Full Custom (NIT)

~ -> 1 11m CMOS Sea-af-Gate (Toshiba).

~ • Vdd = 3.0 V -> 3.3 V.

Circuit Change

• 'Analog' Feedback -> 'Digital' Phase Lack Loop (PLL).

• Combined Time measuring & Buffering (1 J1s) -> Separated Time measuring & Buffering (4 I.lS).

• Delay Cell: Falling edge control -> Rising/Falling edge control.

• Least Count = 1 ns/bit -> 32ns / 28 bit = 1.14 nSJbit.

• 32 ns Encode -> 16 ns Encode.

• Encode data at readout -> Encode data at buffering.

Others

• Differential Input Buffer ( il. V - + 50 mV ).

• Fast (-62 MHz) FIFO circuit.

~ • 144 pins (0.5 mm pitch) CeramicjPlastic QFP pacl~age. ~

CJ1 • 54 k gate master, 22.6 k gate used (41.33 0/0).

• Die size = 9 mm x 9 mm.

Ot: .. t t~ Oto.1 ,r- ... "

~ ~Ih~ I ----r---+--r----r----~

"w:-: -: ::R :'p': • .1·0' ··T·I . 'E' .•

WSTART -~:::-::~: -:-:-:E: • ClK ···.·.R·

-~ ..... 31.25MHz ... ..

RESEr* ..

DOUTO*

:::::CHO·::::: · ........... .. -:-: . 32' :-:-: :-:- X -:.:-:::: 32 ::::: -: -: TMC :-:- : · ........... .. . .. .. .. . .. . . . · ........... ..

: .. FeedbaCk :. . . . . . . . . .

TINO

DOUT1*

.: Encoder .:

.............. :- : -: CH 1 : -: -:

.. .......... .. .......... ............. : -:. 32 .:-: -:-: X :-:. :-:. 32 -:-: . ·TMC·· · . . . .. .. . ..

......... ...

· : Feedback' . · ...... . .

DOUT2*

· ........ .. .. ........... . :.:.:CH2:.:.:. . :-:-: 32 :-: :-:-:. X -:. -:-:-: 32 :-: ······TMC ... · . . . .. . . . .

.. .......... . . · :, Feedback : · ....... . .

DOUT3*

.: Encoder'·: . .

TIN1 TIN2 TIN3

TMC1004 Block Diagram

CIO*<7>

,:-:-:-:.:-~ WE* ...... ...... CSR's· :1-4- RADR ..... . . . . .

L :- :- : -: . :-..- CS*

DVALID

DS*

~ Voltage Controlled f Oscillator

ference .J1Il Re CI ock

.. Phase Loop Filter

Charge Frequency .. Pump Detector .. I Cvg

Block Diagram of TMC PLL Circuit

.. Control Voltage (to TMC)

I. No Encode II. With Encode

.............................. .. .. .. .. .. .... .. ........... .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. ............................ .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .... . ........... .. .. .. .. .. .. .. .. .. .. .. . . .. . .. .. .. .. .. .. .. .... .. ............ . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .... .. ............ . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. ........................... .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .............................................................. 2 x4bx 128 : .~~~I ~.0!1. fy1~~~ry . :

.. .. .. .. .. .... .. ............ .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .... .. ............ . .. .. .. .. .. .. .. .. . . . . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. . ... . .......... . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. . .. .. .. .. . . .. .. .. . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .... . ........ . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. . .. .. . . . . .. .. .. . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .... . ......... . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. . .. .. .. . . . . . . . .. . .. .. .. .. .. ... . ......... . .. .. .. . .. .. .. .. .. .. .. .. .. .. . .. .. .. .. .. . .. .. .. .. .. .. .. .. .. .. . . .. .. .. .. .. . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. . . .. .. .. .. .. .. .. .. .. . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. 4

• • • Encode

• • • TMC Cell Encode

• • •

TMC Cell

-·---1.14nsx28=32 ns--- TMC Cell

---- 1.14 ns x 28 = 32 ns---

TMCSSC1 Memory Config!Jration

VG ~

~WIN :-C .-----. JL Lr

Memory rI Write --.J L.

.--- WOUT

Previous Delay Element

~~ LIe VG -----#--------~

Memory -. r Write 1--1

WOUT

New Delay Element

Delay Cell

W1N--L.-~

I I I

VDD

TIN

VDD

-------------------------------------

Memory Cell SITS

VDD

W·

Name(WOUT,BITB)=WSTMC1Z(WIN,TIN,VGN,WORD,WORDB)

WSTMC1Z I 9/18/92 One Bit TMC Circuit Y. Ami I KEK

2J-1

>

Waveform Simulation of the Delay Cell 3.5

OCELL7.1

....' :... I----~-!~-----~~.--....... " .. "" .. ~., ......... - ... -...... " ..... - .

J .......... l~1·~~ ..... J. ...................... L ........ L ............. \ ............... J......... .. ................. I~~r.. ................................ l.. ........ .. r[1~~---r! \;1 32 \ I \ I ! I I -ltI- I:-::.··········.; ..... :;· .. · .. · ...... · ...... · .. ,.=:.:: .. · .... · .. ·:.:~ .. :· ... · .. · .... · .... · ...... \:············; ..... :i.····· ··················.·.t· .. · .. I .. ::::········

V

······

1

·····0····2 .............. :.: .. :::.············

............. .l.~.:: .... :~.!-- ...... ....J.: .. : .... ,.:1 ···························t························ !·········-t-························~········- to .. . · .. ~· ... ~ .. ,·~ ... ·:~·.:.~.·.·~· ........ ·r,·::·.· .... I.· ... " .. '. :·~ .. ,·.· .. · ... ~·.l .............. , .. ~ ... . ···"·ir .. ··V12·1iT ······~···j· .. · .. ···· .. I····t······· .. ··\·r ----: -[- - -J . -

i § ~~ ; '. &, .................................. t:::::::............... . ............. + ......... .. ··············ri···························· ····r:····· ................ -!.-_ ........ :.:: .......................... !.:.:' ......... '.:! ............................ \: ..... -r.; .'

11_[ v 131 : i! : :

11 1 fj 3 :i r. i :~ .............. ! .................................. :.~ .......... . : .: = • : : . :

3.0

2.5

2.0

1.5 ............... V100 ........ V121

V102 - V131 --_. V132

.. ..

1.0

0.5 i \ I ~ o . 0 '-'-'""'-.... • ......... ~'-'-I..L..JLo.L.JI...J,..JI...J,..JIWo.IIoooIoooI ..... -.-. ...... IoooIoooI ... I ... 5"""-1~-...-. ... , • .Jl.I ... I • ..\t .. r.!~" .. "' .. .& .. I..G.J_l~.L_LI.J..J • .al.u.J..J

46 48 50 52 Time[ns)

54 56 58

2.0

,......,

~ CI) c 1.5

~ ........

~ >-as Q)

0

1.0

0.5

k i. i.

Delay vs Control Voltage

! '. --.- V131 -> V132 Falling Edge ! • -- V131 -> V132 Rising Edge

\\ .... ····r····\.~ •••. ························· ··I·'---__ ~_:_o:_7_:.~_~_~_~_~':""""+d-5~-~""-~~-;-~=-:-;-~-e~=g~.;.....~_~_;~':""""~_~~-~-~-~-:u-:-~~) • , i

··· .... · .. · .......... · .... ·\:~:~ .... I·.. . .............. · .... '<·~·~·~·· .. · .. ··I·· .... · ........ · .... · .... ···· ............ ··· ............ , .................................................. . .l .... '.: ,i " ~ T--___ i 1 \ i - - - - - _ _ i t = 1 .14n5

,~ .. ~ ".( .~("(}\C ~'t """ "(H~'U '" h"U~'C "C'~'t , .. ",e,,,. ~,' ", -, .U ~\C 'H'"'''' "c ~ .. .i: ,,' ~.\C ~'('U,~C,'C "~ ,'.( ,H ~'! ,.(j" ""U''''''( :.:-:-,.~.cl!'!'; ~~.ftc_ '_~WfCW 'Ui "~'('UHC~"C'U"C'{.:-, ,- '~'", -, e, .. c,."C,U ,,,c,\C'U"ChC ,u, .. c

~ "'." 1 l - - ... - - t .... - - - __ _ ....................... ·······I>'·'«.~.. ' ...................... ··········+1···· ............................... . I ·······t·············· .•.......•.. ! ~.~ : : .............•.....•.• :

~ ~ j ·······r····· .. ·······•·· ! : : : : : : : ~ ? ~ ~ ................................ ········r············································· ........... ~ .......................................... ···············i······································ .................. 1' .................................... '"

1.5 2.0 2.5 3.0

VGN [V]

14 bit to 4 bit Encode Scheme

Row Data Bit adjacent bit Encoded

0 1 2 3 4 5 6 7 8 9 10 11 12 13 (14) Data

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 X X X X X X X X X X X X X 1 0 0 1 X X X X X X X X X X X X 2 0 0 0 1 X X X X X X X X X X X 3 0 0 0 0 1 X X X X X X X X X X 4

• . • .

0 0 0 0 0 0 0 0 0 0 0 0 1 X X 12 0 0 0 0 0 0 0 0 0 0 0 0 0 1 X 13 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 14

l Error. S14i,~ '. ) 15

~ -..... .-.-•• -•• -..... -.t. •• -............ -•••••• ~_~ ~. =1~'I~W~~i1. '~'~;:!~II~Im' fl!JilllfjIlli"n_';;~.!1 ~ ~~m--,."J.r., --"'.~\~<~ - - . ;"-·,,11 --~~..." ,- "'"",,,,"~4""~~ •

,--~-.... --. . -.

125

-. • • ~.tai£.s:

• • •

2. Preliminary Test Results

• PLL Circuit * Stability of the veo frequency (af / f - 10-4 : Cvg = 400 pF).

* Stable Vdd > 3.1 V.

~ • TMC Circuit N 00 * Fail to write at the end of row: little time margin between write and read.

( 2 rows -> 3-4 rows )

* Different delay per stage between VCO and TMC delay: difference between wire length between cells. ( -> adjust the length )

* Fitting of bit 0 - 21 (O - 24 ns) shows (1 = 0.4 ns.

{ lool{s better than previous TMC, (1 = 0.5 ns)

ieq A llk only running

.038 x

, ......... · ............ · ...... · .. · .... · .. · ........ ·1 ...... · .............. · ............ ·· .......... · ............... " .............................................................................................................. j

1 • 171JJX

3B;Z5BBM'l

" I., 31.BBBB8BM sa~ples

1 '. ~ Sld Dev 5B4.B3215k~ ~ Mean 31.Z6Z77B31M~

~

U~J Freq A running

.B6 x

31.1BBBBM'l

tlk only

Sld Dev 5.56916Bk~ Mean 31.Z5251BZ61M~

Pk-Pk 1.31B8M~

I.BBBBBBM sa~ples

Pk-Pk 3B.73k~

3Z.Z5B8M'l

31.4BBBBM~

~p) Freq A Uk only C _ I acquiring dala V~ - () P F , ........... ~ .............................................. -........... " ................................................ _ ........................................... - ................................. _ ........ __ .. ,

F' 576 X Pk - p~ = 90% Id-h I ~ , I ! I i i···· .... ····· .... ····· .. ······ .. ·-············· .. ······· .... ·· ........................................................... -.... _ ............................................................... · .. ········ .. ········· .. ····1 i' ! I ! i i i i I i i ~ I,i .. ······ ........ ·····-.... · .. ·-.. ··········-·· .. -···· .. -··-·--.... - .......... --.... - .. _ .. -. .. ..... _ ....... -_ ............ - ............. - .............................. ,

! t. .......... -....................................... -.......................... '" ..I....... ... . ................. -.... -......................................... · .... ······ .. ·1

liB.zn, : I, 'IJ!~liil I L.................................................................. i .. ) u . . ~ ~ U: ;;,' __ ................... _ ......................... ! 3B.Z5BBM~

98.800088M sa~ples

Sf.d Dev 1!>1. 937Z4k~ Pk-Pk 9B8.7k~

Mean 31.Z538957ZM'1

(hp) Freq A running

llk on ly

3Z.Z5BBM'l

cv~ = 3'to pF ~9":"i4"";''''''''''-'''''''''''''-''''-''''''''''''''-'''''''''''''''''''''' ......................................................... -.. -...................... ; .... ; ................... , i Pk-Pk:. 2 D. ~ kH?; I ! I

1

1·-...... _ .......... ·-.......... ··· .. ·· .. · .. -· .. · .. ·-·-··_ .. · .... · .... ···................... .. .... ·· .... _ .. · .. · .. __ ··· .. ·-· .... ·· ...... · .. · ...... · ...... ·· .... ··· ...... -.. ·1

i I

i i ! .............. -.-.. -.-.... - .. -.. ---.. -....... -..... --.... ~ ................ ........ : ....... _ .. - ......... -..... _ .... _.-.. _ .... _ ............... __ ................. _ .. ·_···1 I .. ! i ! i i i " I i i ~ ......... - .......... - .... - .......... --..... - .. -.-......... -............. ......... . .... _ .•• _.-.................. __ .......... _ .. __ ................ _ ... _ .. _ .. .1 I i I ' f I f i SB. BB'JX l \._ ........ _ .... - ..... - .. --.... - ... _ ..... -.-.. - .. -.............. .... . ...... _ .. _ ....... _ .. __ . __ ... _-_ .. _ .................................. .1 31.1BBBBM~ 31.4BBBBM~

l.ooonnBM sa~ples

Sld Dev Z.403686k~ Pk-Pk ZB.71k'1 Mean 31.Z5Z107B5BMH

~·'::-!r:":.:JII'I':·T .. -'" ''!-''-"!r.~~ •. , i.

PLL Frequency Stability

Ci~pin! f = 31.25 Mhz 1 0-1 ............... ~I~ ........................................ ...1 ....................................................................... Vdd = 3.3 V

I C=Cin+Cpin+Cext

10000

I (Cin=40pF. Cpin=5pF)

1 0-2 ............................................................... [......................................................................... -0- Peak-Peak .......................... .

1000

I ~Sigma 100

............................................................................................... { .............. .

, \' 10

............................................................................... ; ................................ .

1

Capacitance [pF]

TMCSSC1 Time-ta-Digital Conversion

42

....... -.c ...... ~ -:::::I c,.., C. - 28 ~ :::::I

0 () :E I-

14

56~~~~--~~~~~~~~~--~~~~~~~~~~~~-... / .~ ... , . ,/.-I Preliminary I ,-f.:.~ ..... .

".-r; .. : .r;.-

............ _ ..... _._ ......... _ ..................... 1. ........................................................... .l. .................................................. ; .. ...,..;~.:=~ ............................... _ .............. . j ~~.!

....;;,. : ~.' ; .,.;;,'" ~ "!I'fit. ;

1.066ns/bit .. .,;-t6. I ............. _ .................................................................... "\. /~ ........................................ _ ..... I ...................................................... ..

~ '" .... ~ .•.. ! I . ........ 1 : ". #1 : : .... .".-....: . I f"I-r;:..... I 1.143 n sIb It R. ; ",,:. ; 0 e- I. ... z..- i '.

------/~l'·------r----··-·-····-·· ·-1-·---··-_·-..,;--I--!i' I ! !

~~. I I I ,r 1 1 1

O~-L~~-L~~~~~~~~~~~~~~~~~~~~~~~

o 16 32 48 64 Input Time [ns]

Change Time line Info zoom

Signal Full Name : 1~/TINl Z (eLKIN) [WOO] I

RI)"'" ~) .. ~~c. * -I(XXl321W1N1 R~2. UJ .. ~l(. e 0 1<XXl321W1N2

[WOO]

[WOO] h

Signal Edit

32~$-~

I 1

search Fi Ie

.-:} lL.Ll t " T I I I I

~ :-:. ~.; 'i 1

r ()Jit ] [ select Cancel]

I ''--_"__.....J' . L

~----------~------~~ ~---------------~r ''--~ _______ ~I

'1

R'I'~" Kf.' .. f. f - 100032/Wl

~ ... ,!.. t. Hcc...f 8 - IOOOO2/W2

Do. ~,.. - ~f -0 1000321B08

[W01] W 1 '--__________________ ~J~ I 1

"-Ad.,foss -~: RC2_0

llt.~. \.Vlo;'.( . ~t 0 ~JEB ~ ... :

~ i ------------

Signalset Nare Sim, last Time

[WOO]

[WlO]

[WOO]

[W01]

Z Z

1 1

II 1'40 150 160

I ...---------.1 /.... "'------1-------11 lAo. i' 1 '7 ~I "I

1

Z L __ .. __ ... _~ t'* r L-. __ :f.. ___ ~ IJ

1

L-______ ~-,----~ ~I"---------~I

L..-__ .....J,r--------., IIL-__ .....J'

I 1 . r

170 180 ., 190 200 220 230 IT 2~() 260 29

24735.4 [nsec] 10 Ti 100 lire T i 100 l!.!;. MSG;;;IM;;;;riX)9~8~~;;;;;alR~1~~ ~~:g;;;~;;;;~~T~AI~lfIff-~, L,,;;~;;-r~;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;~~;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;~1

265.0 [nsec] .. MSG IMAOO37 :J:-b~ft~0)~2J:a~t~:.EL"T<r':~It\ Change Time .. MSG 1MriX)96 L,,~11? < ~ ~ '5 "F~ It\

0.0 [nsec] f,-====----===-="""""" .............. -=======--==-=====---====,,-.--==-=--............. =-= (liCOW)

........ ::J ..J '--'

~ Q) 0

CIJ C to CtJ :t:: 0 to 0-to () Q) I.-

~

4

3

.. • • 2 • •

• .. , , ~ . 1

Wire Capacitance Distribution for Ring Oscillator and TMC Cell

I I I

<RingOsc>=1.558 <ROW1 >=0.948 <ROW2>=0.780 <ROW1 &2>=0.864

--e- RinaOsc •••• , ROW1

""'."''' ROVV2

~

~ I' I • I I

I • • I I I

• • I • I • -\ .'!.t , , I', ,

1\ ' , I I, _;.i •••• ,~ '. " ...... • I I', ,$, \. " • "

• ,.j '~', I( I , , ~, ~ '$ A \. '.1 ,.. ~ •• , _ , , .... ~.: ~ "'.........~ ".

ill.. ... • _ 'Il:o:... ":o.~ #""" •• #' .... '

"...... ... ". !'.A.\ .. .A \./ ' .. ' '\ / ••• ~ •• , . ~,

OL-~~~~~-L-L-L-L-L~~~~~~~~L-~~~~ __ l~~~

o 5 10 15 Cell Number

20 25

Difference of time-to-digital conversion factor:

~ u..')

•

AT = T(Ring Oscillator Cell) - T(TMC Cell) = 1.14 ns - 1.06 ns =80 ps

IfI/"'.;F .. ,-t~ .-; .....

Tpropagation = Tcell + K x (Fan Out + Wire Length) II

1.2

~ <W. L.(R.O.» - <W.L.(TMC» = 1.558 - 0.864 = 0.694 [LU]

... AT = 1.2 x 0.694 = 80 ps

rn ... c: ::l o t)

150 TMCSSC1 Timing Measurement Error (Bit a - 21)

, , , I' , , , I' , , , I' , , , I' I

IPreliminaryl

100 Ideal Response :

(rr -=O.~~5)~:

50

O~~~~~~~~~ ~~~~~~~w.~ __ ~~~~~

-3 -2 -1 a 1 2 3 Timing Error[ns]

135

UJ -C :::J o U

TMC1004 Time Measurement Error

150

(J = 0.52 ns

/ 100

50

O~ULULU.~~~~LU~LULULULU~~~~~ULU

-3 -2 -1 o 1 2 3

Timing Error [ns]

136

• Differential Input Buffer (not yet tested)

Preliminary Spec.

~V > SO mV, Common mode range: 1.9 + O.S V

Td : 1.7 + 0.5 ns

Power Consumption = 1.12 mW

~

~ • Fast FIFO

Operates up to 62.5 MHz.

Tested up to 20MHz successfully.

1

A

~ IN- >-~ X1

B

VID

ENB·

35

20

L 45 ,--<IN+

c

All Transistor L=1um, W=32.6um

TMC Differential Amp 9/10/92 I Y.Arai

D

1

E

,......., > ......... CD C> a:s -o >

TMC Diff. Buffer (DC Transfer Curve) 3.5

3.0

2.5

2.0

'_I_'_'_'.'-'-'.'-~-'-'-'-'-'-'-'.'-'-•• '-'-'.'-'-'.'-1-'~'-\Pf~I~ •••• '-'-'-'~'.'.'-'-'-'-'-'.'_'~'_I_'_'_'-'.-._._ •• ; •••.••••• ····································f·······································L:;;;:;;;;;;;, ...... ·!·~~~~:::::J~:·~ii ....... ]-.~ .. ~ .. ~ .. :::.-l-................. ~ .. ::: .. ~ .. ~ .. ~··l·:::·:::··~··~··~····· ... ::: .. ~-L.:::.:::.::: ... . . -------:.:l~".: .. :··:··: .. :: .. :ft·~·~ .. ~I- ------ l:~ I I I" I

•••• , ••• , .... 1""" ! l i :ff' 1 l V35 ~

~--rl!f/JI/DDI-I-: : ..1# ~ .- - - - - .. ,. .. - - - - - - - -:- - - - .......... -: ........ 1 __ ----l--------- i I -~.~. l ~ l

···-·-··-·-·-···-·~·····IIl-~·······--····-····-·····t·······································t·····~·········· ·········" ... ,..·i_~·.·.·;-~-;;~·;;;·;:.;·;:::···············~ ............... -........................ ~ .................. . ~ ~ i ~ 1 l ,···· .. ·,············,······t········· i : ••••••••••••••••••• ~ •• ; .................. ~ ••••••••••• ~········~···················r······· ··················r·················1 1 ,; i V!30 i

o . 0 .'".'., .. L!.,.,L,.LL.LL,L.L.L.LLLL .. Lot.!,,~!,j>YLJ .. J .... J ..•. LJ ... ".L!,.,lj .• "" , i , , , .

1.5

1.0

0.5

1.0 1.2 1 .4 1 .6 1 .8 2.0 2.2

V45[V]

2.0

1.5

1.0

0.5

0.0

< o o ~

3 » .........

Differential Input Buffer Common mode Range (simulation)

Vin=Vcenter±200mV . . . . . -------------- ---------------------------------------------------r---------------------------------------------------T---------------------------------------------------r---~---~~~-------------

I ! i -.- Tdn

5

.... ----... -.. _ ... -........ ~ .- .. -----.- .-_ ........ - ..... ............. ._-- ~ .... ' .. -. -.. ~

! I i 4 : : :

,...... ~ ~ ~ en ;;; c: 3 ; ; ; i§'-··r--- ·················-i;,············-i.1·:·:··l··I ·----:T·······r-··········

2 -------- .. ---:-+--·---::-:--:A--:----:-:--~:-:-----·--------~-~: -. -----------·---:·-:--:--:---::------:-~-:---~-:-F---h-:-----:--:-:-----:--~-:--~- .. -h:-:---~-:m-F-:---~-~--:-~-----:-m .. --~---:-:---------: ~ I., ( , ,: : •

1

~.::l ... i',· ,.- ':. ~:~. -. _-j ____ .tI l : B_._ ! .. .. - •. :,. • - •• - •.• _ •• ·1· - •..• _0 - .... -. -r .- .. _0 •• -..... _~ ___ .-...... .

-llf-r-1.0 1.5 2.0

Vcenter[V] 2.5 3.0

o >

TMC Differential Input Buffer (Transition Simulation) 3.5

: ...."" .. """ : damp3,1 : ~.;.:. ..... .-v."""'~~~~\'o\o!:"""~'~:"""""'-»-'~'~;;.Mo;~#""".v...,.. : ~ V32 : l : ; . ;

....................... 1" 1 50 1 \. / \ :

1·" .. ~·~·~·':~~:::::::::·· .. ·················t···:~~~~~·.:~~~~~~~~+~~~::~~~~ ... ~.~~~~~:::::::.~:~~~~.~.~.~~.~~::~::::~~:~~~.·~.'~~ .. ;; .. l ......... \ .............. ···~i ..... • .. ~~~·::.·:~~~·~.:~~~:~~:t~~~~~.~.~~~~~.: .. ~~.~~.~~~~~~~~ .... ~.~ .. ~ .... : 3.0. 1 "it ........ " ... , .................. ·, .,,* ~ :

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142

Change Info

Timelioo Zoom

Signal Edi t

search Fi Ie

Signal Full Name : J< factor': /. 5/5 c c/e /6· nsec /tA// (vdel ) (RES) [WD1]

.....

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(OEB)

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(SOB)

(010)

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( FULL)

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(000)

RQl.IJO

R()I..J1

ROW2

ROl~3

RO\IJ4

ROW5

RON6

ROW?

Signalset NafOO Sim. last Time

[WOO]

[WOO]

[WD1]

[BCtl ]

[WOO]

[~JD1 ]

[WD1]

[BCti]

[~Joo ]

[loJoo ]

[l~oo ]

[WOO]

[~JOO]

[WOO]

[WOO]

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3. Summary & Future Plan

rr est Results]

• TMC circuit was moved to Toshiba Sea-of-Gate. This is a first step to the rad-hard TMC.

• PLL circuit is very stable ( ""'1 0-4 ) at external capacitor of 400pF.

• Although the delay / bit is increased ( 1 ns/bit -> 1.14ns/bit ), timing resolution looks 1-* better ( IT ..... 0.4 ns) than previous TMC1 004 chip. ~

~ • Data recording at the end of TMC row does not work properly, since 2 rows is not enough to read/write within two cycles. Next version will use 3 or 4 rows of TMC.

, I , , • Slope of time-to-digital conversion differs from expected one because of difference of

wire length between cells. Careful adjustment of the length is needed.

[Plan]

• Finish design of (4 ch x 4 IlS) TMC chip.by the end of March.

• Finish design of L2B chip by the end of March.

• RUN • 64 channels in 9U x 400 mm, Single-width VME module

@STRl

@STOP

@Trig o Out

• 1 ns I bit least count, sigma = 0.52 ns time resolution • 129 usee Full Scale • Common stop or Common start operation • Fast DSP56002 (31.25 MHz) for Data Formatting

• Seriall/F to DSP

IU! • Rising/Falling edge detection and 6 bit encoded data output for-each 32 ns data. or raw data dump for full data

.......-• • • Stable operation for temperature, voltage variation • • • • • VME Slave module (Dual Port Memory & Host I/F)

IN 15 I

• ECL differential input for signal • NIM level start I stop signal input

0 ... • NIM level trigger output • • ~ • TIL level output from P3 connector for trigger card .----• • • OnCE Debugger Port • • • •

IN 31 I

16 • • • • '--

,...-• • • • • •

IN 47 I

32 • • • • '--

.---• •

. . . • •

IN 63 I

48 • • • • -640i Th'C

I<E<

(This front-panel drawing is not scaled.)

145

RS232C

CH63

(ECLDi

" '.\ \ !

• • •

CH1 CHO

Com. Start Com. Stop Sync.Out

(NIM)

ft.)

.. ...

~

I Serial IIF;~ • , ~ ~

~

~ ~

~ ~ 6bx4 ~ F-BUS ,

/ .. ~ r- R 2kW TMC J .. , ~ FIFO x #16 , ~ ~ ,

~ , 24 , , • • • ,;'

~ • • /' , • ~ • • , • , , , . ' ... R TMC ~ , .. - FIFO #2 , . x ~ , , , , -, , . , ... R .I TMC - FIFO ~

#1 , .. x , ~ '. r. CIO .-M , , - P , C-BUS 8 / ... , r..:. ,

/ -, , , Start/Stop ,

~ Control , ... , ~

64~ /

... ~ ~-

04- D ~ E

c 04- - ... ...... 0 - -~ D ~ E

... A-BUS -D-BUS --

3V<->5V -"'"

~ .v ---. ..

~

OnCE IIF

" " H-BUS DSP ......

56002 ....

DSP RAM 8

V 24bx8kW ,/

8bx64kW nOM

'1CSR ~

~,

V 8kW M

~ -DPMEM E

I MCSR F

Counter

\ Tr \ igger

Out P3 ' \ \-,-, \ \ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , I , , , , , , ,

-' ... "",-, , , , , , , , , ,

V M E

B U S

~"""""""""""""""""""""""""'" """""""""",,\

TMC-VME Module Block Diagram 92.11.16 Y.Arai

Address Map (nSp Space)

Program Space 23 Boorstrao(MODE=I) a

0000

OOIF

COOO

C5FF

FFFF

Data Space

0000

OOFF

0100

7FF

800

FFF 1000

200F

FFBF FFCO

FFFF

'3 -

i Bootstrap ROM

J. -

- I i - I Ext. ROM

- I J. - I J.

~

XD S am ipace a i

Internal X RAM (256 \V) J. i

External RAM (2kW) J.

(not used)

Chip 1 FIFO Chip 2 FIFO

Chip 16 FIFO

i On-Chip P:!fiphe::t1

J,

147

--> 0000

i i OlFF

i 0200 -> . ..

OFFF

1000

FFFF

0000

OOFF

0100

7FF

FFF 1000

3FFF

FFCO

FFFF

23

MODE=2 a i

Internal RAM (512W) I .....

i Ext. RAy! (3.5kW)

J. - I Ext. ROM

- I (60kB)

- I J.

Y DaraSpace a i

Internal Y RAM (256 W) J. i

Exterr.:li RAM (2kW) J.

(not used)

I DualPonRAM I (l6b x 8 kw) I · I · · I · · I J.

i Exte:n~l Pe:ipher~l

J,

P3 : Tri~ ger Output Pin ROW A ROWB ROWC

1 CH 0 Out GND CH 1 Out 2 CH 2 Out GND CH 3 Out 3 CH 4 Out (not used) CH 5 Out 4 CH 6 Out (not used) CH 7 Out 5 CH 8 Out GND CH 9 Out 6 CH 10 Out GND CH 11 Out 7 CH 12 Out (not usedl CH 13 Out 8 CH 14 Out (not used) CH 15 Out 9 CH 16 Out GND CH 17 Out

10 CH 18 Out GND CH 19 Out 11 CH20 Out (not used) CH 21 Out 12 CH22 Out (not used) CH 23 Out 13 CH 24 Out GND CH 25 Out 14 CH26 Out GND CH 27 Out 15 CH28 Out (not used) CH 29 Out 16 CH30 Out (not used) CH 31 Out 17 CH32 Out GND CH 33 Out 18 CH34 Out GND CH 35 Out 19 CH 36 Out (not used) CH 37 Out 20 CH 38 Out (not used) CH 39 Out 21 CH 40 Out GND CH 41 Out 22 CH 42 Out GND CH 43 Out 23 CH 44 Out (not used) CH 45 Out 24 CH 46 Out (not used) CH 47 Out 25 CH 48 Out GND CH 49 Out 26 CH 50 Out GND CH 51 Out 27 CH 52 Out (not used) CH 53 Out 28 CH 54 Out (not used) CH 55 Out 29 CH 56 Out GND CH 57 Out 30 CH 58 Out GND CH 59 Out 31 CH 60 Out (not used) CH 61 Out 32 CH 62 Out (not used) CH 63 Out

148

Backplane Connector Pin Assianment

Pi: VMEBus Pin ROW A ROWB ROWC

1 DOO BBSY· D08 2 DOl BCLR· D09 3 D02 ACFAIL· D10 4 D03 BGOIN· Dll 5 D04 BGOOUT'" D12 6 DOS BGlIN· D13 7 D06 BG10UT'" D14 8 D07 BG21N* D1S 9 GND BG20UT'" GND

10 SYSCLK BG3IN· SYSFAIL· 11 GND BG30UT'" BERR· 12 DS1· BRO· SYSRESET· 13 DSO· BR1· LWORD· 14 WRITE· BR2· AMS 15 GND BR3· A23 16 DTACK· AMO A22 17 GND AM1 A21 18 AS· AM2 A20 19 GND AM3 A19 20 lACK· GND A18 21 lACKIN· SERCLK A17 22 lACKOUT· SERDAT* A16 23 AM4 GND A1S 24 A07 IRQ7· A14 25 A06 IRQ6· A13 26 AOS IRQS· A12 27 A04 IRQ4· All 28 A03 IRQ3· A10 29 A02 IRQ2· A09 30 A01 IRQ1· A08 31 -12V H-SV STDBY +12 V 32 +SV +SV +5 V

+5 V = 4 pins, -12 V = 1 pin, +12 V = lpin, GND=8 pins

149

P2 : VME Bus + Power/GND (92.12.4 revised) Pin ROW A ROWB ROWC

1 -2 V +5V (reserved~

2 -2 V· GJ\1) (reserved) 3 -2 V (reserved) GND· 4 GND· A24 -5.2 V· 5 dsi21+ A2S -5.2 V 6 dsi21- A26 -5.2 V 7 -5.2 V· A27 GND· 8 GND A28 (reserved) 9 Si21 A29 (reserved)

10 GND· A30 GND· 11 sig2 A31 -2 V 12 sig3 GND -2V 13 -5.2 V· +SV -2 V· 14 GND D16 -2 V 15 sig4 D17 -2 V 16 GND· D18 GND· 17 shtS D19 (reservedl 18 sh!6 D20 GND 19 -5.2 V* D21 -5.2 V· 20 dsi~+ D22 -5.2 V 21 dsi~- D23 -5.2 V 22 GND* GND GND· 23 sig7 D24 +3.3 V ::!4 +SV D2S +3.3 V 25 +5 V· D26 GND· 26 +SV D27 +3.3 V 27 +5 V D28 +3.3 V 28 GND· D29 GND· 29 sig8 D30 +3.3 V 30 GND D31 GND· 31 GND· mom +3.3 V 32 +3.3 V +SV +3.3 V

+5 V"", 8 pins, -2 V = 8 pins, -5.2 V = 9 pins, +3.3 V"'" 8 pins, GND= 22 pins, 2 diff signal pairs, 8 single-end signals. • : VXI standard power pins.

[Common Stop Mode]

START

t WSTART --.J SEL --.J STOP

COM

....... CLOCK c.n ODS· -I ~~----------------------------~

WP ~ J X N X N+ 1 X N +2 X'-----IX'-----IX,-----,X N+6 X'-----I X ~

XN+6 X X

DATA

START

t

~ X X X M ~M+1 (!'

X X X X X t .f

I-"

[Common Start Mode)

CPU

• WSTART --1 SEL

START

COM

CLOCK

~ CNTENB

DS·

CNTEND

WP J.---.J N

RP J.---.J DATA

x X XN-t-6X

X X

STOP

•

X X X X X~ X X '{

XN+6 X X X X X X X '(

4- (~[\)( (I t.~ T t-\ (., l2" L 2:- \3 )

" I., , !

~\:c: .. eo ~~;!\ ~o!./ C t·, ... ~. Co

.•.. --.. " ~

( &*iE2-")

t, 8e«~ It-.tf

, ,

GAS AND HV SYSTEM

P. Schuler

Prototype Tower Workshop December 13. 1992

153

GAS AND HV SYSTEM

1. Barrel Prototype Gas System

• Argon/C02 (90/10)

• Gas Volume -- 50m3 (1,000 Tubes x 50 Liters/Tube)

• Flow Rate 70 Liters/min

(assumed 1 volume change / 12 hrs. actual flow rate may be more or less, will depend on leak rate and outgassing of system)

155

~::1q, ~14 QI~. L TUbe.. . VoL .. f!n) {L;hu-~)

nt-t, a.1'1 " " s,s: 8 ru-3 I.()tj '8 55:1 ~ '8.S- rt1 3

11t - 2. 8.,. '9 ~ 33' 5,.8 ...

TH-' B.S" 641 St,. 3 ~ 3'1.0 m 3

TlI-sr 8.55 '3_~ __ 5".~ .. 1>,,-$T '.85 81 ~3.'

-.,

PH- 11 6.Qo 85 ~ 421 ~3. q ~ 18.& t11

3 PH-3 6.~o IlS "3. t; ... Pit .. 2. 6.-.0 as 43. t; PH-. 6 .• 0 8s .- "3.1 ...

Tq .. t, 1. ,z., 's '1 '15.1 til,,' Jn3 "'(H-3 '1.0" '5 ~ 2'0 t,t,~8

• ., .. 2. , Ii' '5 "'1.3 1'"14 -I '88 '.5' ~ "3.8 J . -- .- --~ .. - ..

• Liquid Argon -- 87K @ 1 atm

1 Liter Liquid = 850 Liters Gas @ 20°C / 1 atm

»Liquid is more more economical gas*

convenient and than compressed

@ 1 Vol. Change / 12 hrs. » 5 dewars/wk. (160Ltr per dewar)

• C02 -- 57 atm / 20°C

Liquefied Gas = Liquid + Gas @ Vapor Pressure

@ 1 Vol. Change / 12 hrs. » 5 bottles/wk. (27kg./bottle)

• Note: We do not circulate/purify the gas in the prototype test!

(*) Should, however, also consider large tube trailers of premixed compressed gas (as used at Fermilab) or large in-situ Argon dewar as kindly suggested by Suzanne Willis.

157

loers; (~~~f.~)

= ...

'"

-.....

::

.... ::

~ooo I 4000

I 3000

2000

1000

sao

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I / I I I

600 ~oo

400

300

;

i ! i I 1/: , ; ! i

zeo

100

so

60 50 40

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, : ! : - , I I i I

I

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i , j I , ,

;

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I ',I I _, _!~ ~_;l~IA_ t-, - -I - T -;- - i - i

I I I ,"! I lo,~----~~~~!--_I----! ~~ ____ ~ ________ ~ ________ ~

I ,

8 i / 6/ [.

i I

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V I I ,

I I I I : I I , I I , ! I

;

I I I

, I I I : I I I I I I i i I i ! I I I i i ,

I .160 .::'0 -120 .100 .SO .60 -40 -20 0 2C 40 so ec 100 120 I~O

T E ... P E =! AT U III E IN·;:

Fig. 1. Equilibrium curve for carbon dioxide.

158

Arflon

aWl BW3 TlI

ox~. of"e~ ttOIit. r10t1. f

,.., 70 l.'#-er-s / ..... :.,

(ISo SCFH)

r<PS ;P¢C. q:z..

1J 0 'Bu bl,(w J' I •

• Argon/C02 Proportion:

Possible Measurement Methods

»Optical Transmission (VV or IR) employed by L3

»Speed of Sound (VI trasound/Resonance) employed by FNAL-E665

»many other schemes possible

»Should aim for -- 0.1% precision

»Should build something!!

• Oxygen Monitor

Will probably buy one (SSC/PRD)

• Pressure Transducers

trivial

• Chromatograph / Mass Spectrometer

-- maybe

160

• Gas Manifolds

Two Technologies are being explored

(A) Noryl (plastic) Manifolds with Brass Thermo Sert Gas Fitting

(B) Stainless Steel Manifold with Stainless Fittings welded or epoxyed)

Tube

Nylon Hose 6 ~ GasFitting

Manifold Tube

(Dia 1.0" or 1.S")

Tube (either

Status: Build short demonstration pieces Waiting for delivery of fittings

161

4

f 0_ l31 e.Q qor

2. TOlERANCE OF OECIMALS .XX :I: 0.10

1600P STRAIGHT KNURL (2'1 4.35 MIN AFTER KNURLING ANSII A SME B94.6-1984

VIEW A &

NOTES: UNLESS OTHERWISE SPECIFIEO.

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THIS IS A CAO GEUERATEO ORAWING. 00 NOT MAKE MANUAL REvISIONS OR AL TERATIONS

FITTING. GAS. C360 BRASS DESCRIPTION

LIST OF MUERIALS I PARTS lIST

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II 7 A 2

REVISIONS

.' -- . . .. l.QU!i. IREV OESCRIPTIOH

c;-' 45' X 0.30 , 'F~5 .0.05 r'~ S~ ... t.all J~;O I DATE I APPROVED

I I

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51-METRIC

SDD000901

(Qf.j of J2S~ooo) THIS IS A CAD GENERATED DRAWING. DO NOT ((f\\ .. O· ... MAKE MANUAL REVISIONS OR AL lERA TIONS "'-'V

I FITTING. GAS. 304 S T AINLE S SST ::::EE=-=-l-----L--1r----rI-'Ir----i OTY on on PART NUIABm I OESCRIPTION I CAGECO IZOIIE Inw

LIST OF .... ATERIALS I PARTS LIST

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GAS FITTINGI' STAINLESS MANIFOLD

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U/ I DASH NO. NEXT ASSY USED ON " CONTRAC r NO.

APPLICA TlON OE-AC35-89ER40486 SCALE 4:1 .lWEIGIIT ISIIEET I Of

2. Barrel Prototype HV System

We ordered and received:

• CAEN SY 127 Mainframe (holds up to 40 channels)

• CAEN 431 P Plug-Ins (5) +8V/200JlA 4 Channels / Plug-In

• CAEN A200 VME Interface

164

~n-tube parts (ASD card etc,)

1) Readout Side I , (GND) - -300pF

t ~ WN--;~ Drift Tube

1000 pF

10 n

1000 pF 10 n U

Q' 1""1 I v .< :..: .. ~ lkn~ I

, I

Connector

+8V - 8 V

) ( ~u~o ,"VI

Threshold

GND

5pF ~_

~ Test pulse 1kn

2) HVSide Drift Tube

+6kV

( -+6kV

1000 pF

\ +6kV

1000 pF 360 n GND

165 Drawing H. Iwasaki &m. 26.1992

»

»

• HV In-Line Resistors

Initially envisaged to be only IMn or 10Mn

Propose to choose a much higher value: 100 Mn

v = 7kV » Imax = 70J..lA

Broken group

• wires will not disable entire

Voltage drop: L\ V = 100Mn x I with I = IJ..lA » L\ V = 100V

a wire which draws more than will see significantly lower voltage which is very desirable!

166

IJ..l A high

Gas Lines and HV Cables -- WHERE?

BW3 module

Outer plate connecting BW2 and BW3

167

BW2 modLJle

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DETAIL A

BW2 - SLOPING PLATES

44.6

955.4

Sc1tow5 (flF -sl,;aLd ) / 1-"1· ~;..slr. -aO)(

\.

29.7

36.3

I~V- CbU!.

~LDIf G ttS Hose..

BW3 - SLOPING PLATES

DETAIL A

36.3l --- I

__ . ____ I _

955.4

DETAIL A---.. L--I--52.0 DETAIL A

47.5--'

BW3 - VERTICAL PLATES

FRONT-END ELECTRONICS

AND TRIGGER

S. Terada Y. Asano

J. Chapman J. Oliver


173

December 12, 1992 S. Terada;KEK

Japanese Contribution to the Front-end Electronics for

Supertower Prototype

1. Amp., Shaper, Discri. (ASD) cards i) ASD card with Hybrid IC: - 200ch ii) ASD card with Monolithic IC: -800ch

2. Interconnection box for signals i) Connection for interfacing signals ii) Threshold generator iii) Test pulse distributor iv) Low voltage distributor/regulator

3. Local crate and Lo\v Voltage PS's i) VME 9-U/6-U Crate: 1 crate ii) Low voltage PS for the local crate iii) Low voltage PS for the ASD cards

4. Local electronics modules (VME) i) TMC card (64ch Icard): -10 cards ii) Wire trigger cards (64ch/card): -10 cards iii) Crate sum trigger modules: 1 module

5. Cables i) Cables between ASD cards and Interconnection box ii) Cables between interconnection box and local crate

175

Patch Box

+8V - 8V GND

Signal(+) -----... ·tl Signal(-) Threshold ...... 1------iJ

+8V - 8V GND -.~ ..... - ..... --~ .•

Signal(+) ------I~ .. Signal(-) Threshold ....... f---..... ---...(

+8V - 8V

• • •

GND ...... ~-------l; Signal(+) -----..... t Signal(-) Threshold _.I------.tl

Testpwse-__ -4-+--~: GND

176

Threshold Generator

Test pulse Generator

Regulator

Signal cable Assembly

Power for ASD

Drawing H. Iwasaki Sep.21,1992

Location of Patch Boxes

1). r<t> view r-I 1 1 1 -------------'----J- _1- _I

2). • rz VIew r-'" I 1

BW2

•• •

• for e modeles

• for <p modeles

.......... <I

••

Box size: - 20 em x 50 em x 30 em (for =< 96 channels)

r.., 1 1 1 1 L..J

Local Crate (1/ two supermodules) 177

Drawing H. Iwasaki Cl ........ .." '00..,

i

SDC Muon Readollt & Trigger System

I .

i : ,

Cable Interconnection

---, Box

Supenv! odule '

Scintillator

Tube

L..-_____ ~ ______________________________________ _

-------------------------------------------------------I Muon TMC Card lv!uon

\

TMC+L2B

L 1/L2 Trigger Subboard

Muon Scintillator Card

Muon Trigger Crate Sum Card

Regional node

DAQ Processor Card

1 ______ --------

Muon L 1 Trigger Sum

Global L 1 Trigger System

Underground

Surface

Muon L2 Trigger Processor

Global L2 Trigger System

17R

Event Builder

Muon Electronics Development Plan

Milestones

Minitower Beam Test

Supertower Prototype

Muon

ASD

Hybrid IC Prototype

Monolithic IC Prototype

Monolithic IC Production

'9 Supertower 1...------'

Assembly

179

TMC

CAMAC 32ch

VME9U 64ch

1...-------1

SDCstd Master Board. 96ch

Trigger

VME9U 64ch 30MHz

VME9U 64ch 60MHz

SDCstd Sub board 96ch

Regional Node Installation

ASD DEVELOPMENT PLAN IN JAPAN

Dec. 1992 Y. Asano

Univ. of Tsukuba

1. Hybrid ASD cards

Hybrid amp. + Commercial comparator (AD96685)

Purposes

# To get the best parameters. Amp. gain, rise time/fall time, band width, pole zero, the value of the decoupling capacitor, noise, hysteresis, test pulse, etc.

* Printed boards for the hybrid amp. completed.

* 5 different combinations of transistors will be mounted on the

boards and the evaluations with a pulser will start in 1 week .

. Noise

.Rise time/Fall time

.Hysteresis properties

* Art work for the mother boards (ASD side and HV side) will

s tart soon, expected to be ready by the middle of January.

* Tests with a real tube will start by the end of January.

* KEK beam test in the last week of February.

2. Monolithic ASD

Development tool "QuickTile library" and "QuickTile Startup package A" have been ordered (Tektronix Japan). They are expected to be delivered in c.. the end of December or in early January. A SPARl( station is being made ready for the purpose. (Men have yet to be trained including me).

A shared run at Tektronix with Penn. is expected in April. We

make one-channel version of Penn. ASD with optimized parameters.

180

]) m () o

~

r---r--------ffiC) <lk

~ 2k 23P

w

~ <7-2.1!lk

U!5 20P i

c:-I'- ~

cT ~

:F ~ 0

"'C -...J g <\ :J;> .... 1 e-

2k 101"

UUI .. eo 0IC5: <lk

l04P

1! 1I , -

::J f g ..... ~ :::l ~ =: = -f

~

~ C'l :::h 4""'1

~-t

I\J~

;'1 ~ 110

I' ~

~ + ~ -F-<\ ~l ::'C> <}

I\J

:-, ;;lI; ~ :::!l.

r.e------~----r---------------------~llr.--------~ ...

]) () o

,:.

182

SD 'd Vee Circuit of A S1 e 6.81l =c

~------------------tJ __ Test pulse

~ son - 4k

10k -

=c O.lll

5.2V

10k 1·81l

J.-...J--+----4I~ ~-I + OUT

O.IIl

=top O.IIl

275Q

VEE

6.81l =c

Compo AD96685TE

I°.l ll

6.8~

,--------~--e.::== Threshold

lOOk O.IIl lOll

4k

II

OUT

ASD side

®

CD 0

e z 0

~ 00 ~

"8 .. ~17 ~ ... 18 ~ ...

~

• • • •

• •

47 (hybrid amp size)

120

Thickness: 1.5mm <1.7mm with pattern

Material:Glass-epoxide

Electrolytic capasitor

~

1 °1 "'!

V)

C"'I '" 9 N N I

~ .. 4

~

H.Y. side

lOOOp I 6kV 1M

1M

6kV IOOOp

IOOOp

6kV 1M 1M

II000P

1000p

T

-I

I

I ®

t~ - Ir, tr,

~ -0 N N

® I I I I

I l 1

i ~

~ ~

'"C) .0-4 (/) .... ~

.... ~ . 12 CoO

> Socket 4 CO ,...; . ::r: .... 56 ~

i 1000pF If)

7.5kV . If) .....

~ .... 15 ~ .... ~

6.5

SDC Muon Triggers Michigan Plans for Mini- Tower Tests

J. Chapman University of Michigan

11 Dec 92

for the December 1992 SDC Meeting

187

---r -z:: 7 r \.

r \.

Simplified Muon Trigger

,--------------------------~ I I I I

I I , I ,

Wire Trigger Card .. ~ -.. ..

cut

" Stretch , N crx I

I I , I I I - I - I

r-- ~ I - I ------------------_. - ______ 1

,--------i-------~

I I

Delay N crx ,

Set/Hold forcrx _. Mean timer

Scintillator Trigger Card

, I

._---------------188

~ eJ tJ

Wire pair • Scintillator (Delayed)

(movable) ... ..

Beam ~

Beam Counters ....... .,..

I

Muon Counter (- 2 m)

Beam Counter --1-. I

o tube for trigger

-0 tube for tracking only

Fig.1 A schematic top view of the setup.

189

- 6 -

:;re airs ASD

E C l

a n

" d • • T • T • l

F a n 0 u t

Mini-tower Test Interconnects

NIM ASD

NIM to ECl conversion

VME ~ -

2 Eel

31 Michigan t:igger

ECl 2 30

TTL TIL 31

Washington trigger TTL

4 VME ECl

32 KEK wire trigger

ECl

31

ECl

Figure 1

190

32 Trigger TMC card

ECl ·

CAMAC

Wire TMC card

Michigan Trigger Card

VMEIO

• ClK

® 81 ® 82 ®

T u b e s 1

T u b e s 2

D~ T M C 1

T M C 2

0+5 0-5 0-2

191

Michigan Trigger Card

~

NIM ASD

~ Scintillator Chip

,-. ~

2 60MHz to Clock 4-Wire .............. -~

Pairs \7 S ASD

( I

{ Wire AND Chip Gates

( T

( Wire AND Chip Gates

( I


• 20 Tubes • •

• (

I { Wire AND

Chip Gates (

1"


{ -. ( ~ Wire AND

Chip Gates

Figure f92

~

NIM ASD

CMOS to

ECl

-CMOS f--i....- DVR ~

."2

~

CMOS Gated

39 Wire , Pairs

to 2 of 4 Logic

-oJ 0 w

39 0 -7 en 0 ~ 0

,

" J 2

.~

EC L ed re rs

Gat WI Pai

t T

o MC

rd Ca

Muon Chip Functions

Scintillator Chip

Input 2 phototubes

Mean-time inputs

Segment into 4 outputs

Stage awaiting drift tubes

Drive external pins

*Maskable channels

*Download setup

Wire Chip

Input 2 projective wires

Select 3 P t ranges

Stretch for coincidence.

Tag with scintillator

*Maskable channels

*Download setup

* Features not yet included in design.

, 193

Scint V2

Scintillator Trigger Chip

General De.cription

The Scintillator trigger chip carries out mean timing of signals from the opposite ends of scintillator slats. Figure 1 shows how the mean timing is carried out by sending each signal down a 7 stage chain of voltage controlled delay buffers. Output at each stage of the delay chain is fed in to AND gates and the output of adjascent AND gates is fed in to OR gates to give four mean time signals corresponding to each quarter of the scintillator slat. Each mean time signal is then fed i.nto a programmable length shift register to delay each output up to 63 clock cycles.

SCINTILLATOR CHIP FUNCTION

Scintillator Slat

P ~. I I I I I I I ~

POSLL I

7 STAGE DELAY

POSLH POSRH POSRL I

TO PROGRAMMABLE 64 STAGE SIm'T REGISTER

Figure 1 Mean Timing Circuit

PR

The delay per stage is controlled by an analog voltage generated by a phase locked loop circuit called the clock lock circuit. The clock lock circuit

Physics Electronics Shop 11/2/92 Page·

194

Wire V2

Wire Trigger Chip

General Description

The wire trigger chip performs mean timing of the signals from projective wire pairs. The mean timing selects the 3 Pt regions of time difference between the projective pairs. The time difference covered by - the chip is 512ns. Mean timing over this long time is done using shift register that clock at the crossing frequency (62 MHz). Figure 1 shows how the mean timing carried out using counter running 31 stage shift register chains.

INL-PHIl":" '" .. SHIFT31A PHIZ- ....

; ••••• c •• ;:;;;!!;;!iiiiiili51Ii - UTL - W -

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... ... -1:1 " ~

.. ~

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r. -1;1 !S:II

A ~. - I.

U Da::I -1:,

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'i=. aa:!

"' •• .. II • l. ,}! r. 1:,

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l'~

11 !S::! -I:'

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ll~ 1 - PT....BIN-.A iliiiiiliiii£iiiiiiiiill:II •• a: DUTil .... ""-" 11011 U"lv .... l til

SHIFT31A - HI2 • I .......... ".NI Dt _. HI1 I I "lchlOI" .. IN" ........... hUllol DIP

Figure 1 Mean timing Circuit

The input to the shift register is widened to two clock pulses to guarentee. overlap of oppositely shifting signals. The string of ANDs from the mean timer are directed to one of 3 different OR groups depending on the settings of the Pt

Physics Electronics Shop Page 1

19~)

Earliest Hit

~ --.ll

Earliest Timer out

~

Timing Ranges

Wire Signals:

Latest Hit

Latest Timer out

__________ ~____________________ ~ __ ~n~ ______ __ ________ ~n~ ______________________________ _

--------------------------~~

_________________ ~S~c~illnt~il~lallt~or~S~i~g~na~l~s: :---------------------Scintillator

Hit Latest Staging

~ ~ - Earliest Staging ~

~n~ __________________________________ __ ____ ~n _______________________________________ __ __________________________________ ~n~ __ __

Ons

Figure 3

196

1400ns

SDC MUON Chip Development

Scintillator Trigger Chip:

Version 1: . Mean timer and pulse staging parts of the chip work. Input pulse shaper did not work right.

Version 2: Back from fabrication. Start testing 101'1/92.

12

,,10

..s.

Mean-timer Test

:. • •••••• 0000 ••• 00 000

• ;0.000 ••••• 000000 ••••••

Long Programmable Staging •

Figure 3. 2

• Scintillator Chip Tests

Wire Triuer Chip:

°O~--~'~---+'IO~---I~'--~ t2 (ns)

Version 1: All the functional blocks work. The chip was tested with a lSns clocking and except for the low Pt'pulse stretcher everything else worked.

,. Running: Waitt" for Trtgger

t- : : : Applk'c . " Menu

~. . ... ~ .... ~ .... ~ .• , -~ . , , ~ , , , , ~ , , , , ~ , , , , ~ , , . 4 INl

1 ":;:·:T:(::::C:- ::T:::L::!::::C:_ IN . T· . '1': :::: r

z .,.._ . .. ; .... ; .... ; .... ~ ... 'f ' , , ~ , . , , ~ , , , , ~ . , . , ~ .. ,- mpt . . '. ... .

:J.o . _ft.: ... : ... :, ... :.... . .. : .... : .... : .... : ....

~r 1::~··· ·~··i :f'" !%OO~ 'Oii >, '~:'riV M:E!>Pt I!I: . . . . :+ : : : : LtARDCC,,! I I I I I r- .. , IMedium Pt Selection

Wire Chip Tests Figure 4.

197

,. Running: WIltIng for 1ltgger

· , , · , , ................. · . , , , , · . , 1 ........ : .... : ........

, , , . . , ...... . ...........

. , . .......... .

, , , ......................

App.'e Menu

Trigger

: : i----.. . . . , ,

Stretche . .................. . · . . . · . . . .. .. . .

Z.~~ __ *"~ __ ~~~~·~~· __ ~· ~.~~

Clock , . ....................... · . . .. · . . . · . . . · . . .

.,. 'loora 'Oii :'\,'" i:.o . · . . . Retriggerable Stretcher

Beam Counters

I Concidence

"-t r '" I"

""" start * stop ~ ~ MIDIS Wire TMC "-r ..

~ \.. ~ . !=;top ~tart, t I" "" I"

""'" * stop MIDIS Trig TMC ----.

" ~ " ~

~

/ "" M-trigger

\. ~

VME ~

,IP

*MIDIS #1 is programmed with sequence that generates a STOP output that forms the Wire TMC stop and also starts MIDIS #2. The STOP of MIDIS #2 forms the Trig TMC stop. These TMC stops are nominally at 1 J.lS and 1.25Jls respectively. MIDIS #2 STOP also sets the VME interrupt that initiates readout.

198

C A M A C

Front End Electronics for Supertower Prototype

1. Oliver :: 1 I'D2 IZ/,o{g2

600 channels of muon front end ASDs will be constructed with external electronics configuration. i.e. ASD mini-boxes 6x16= 96 channelslbox

(A) 300 channels using single channel Penn preamps, hybrid tail cancellation shapers, commercial discriminator chips.

Features

(1) Adjustable gain and risetime over 7ns to 30ns and 10:1 gain range. (One pole in preamp circuit and one pole in shaper)

(B) 300 channels using ~ Penn ASD chips

Features

(1) No adjustable risetime - must be specified at fabrication.

(2) Dedicated run for muon ASD - Choose risetime and gain reduction from cosmic ray (mini-tower test) Parameters chosen by consensus of muon front end electronics people(penn., KEK, Tsukuba, Harvard, SSCL) Submit -Apr. 93

(3) Low power

(4) High packing density - easily upgraded to 32 channels per board

199

(C) Common features

(1) Input pulse transformer coupling for

(a) impedance matching (b) common mode rejection (c) input protection

(2) 16 channels per board x 6 boards per box = 96 channels per box .

To be upgraded to 6x32=192 channels per box for production.

(3) Electronic test pulse injection via Octal CMOS charge injection circuits

(a) Charge injected through selectable on-chip capacitors of 10, 20, .... 80 femptofarads

(b) Precisely controlled timing to +/- < 1/4ns (adjustable prop delay)

(c) Injection of -Ifc to 400fc charge in arbitrary timing to test trigger in-situ (all channels inject same charge).

(d) Measured crosstalk < 10-20 mv compared with preamp output of up to 500mv . Measured charge injection accuracy -10% on test chips.

(e) Performance not achievable via discrete logic/fet/cap injection - Crosstalk & feedthrough swamps signal.

Note: CMOS charge injection circuits will be included on a small number of channels for test/demonstration purposes only.

200

till· H1GCC

! ,...,Qt1 ~ 4:~ 'I.00Qt1 ~VIH

[;(_____ ~ _____ 400_ GH1 ___ .J\..-"I][[:~:~C~:~:::;::~[==~::~C~:= ~ ~ CTXJ •

c;.ocu:~

till • I"C.D

:x.:

201

30-ns

T ,T ,T (i,O) (i,l) (i,2)

o o

Peaking times and Nonnalized Gain using two poles of risetime control

(Preamp and Shaper)

x "

X ~[] In -x ~ 0 [] n X 0 0

"

v ,v ,v (i,O) (i,l) (i,2)

GAiN

202

1

CMOS Receive.

3/13/92 J. O.

1

----- ---------::-------_._-_._-------------~

~-~ 0':

• i I -

3er: hill File: a~g92.cif L'~ ifplot* Window: -24~20 1957Sq

-+---

204

• !

'~.l .2 .:.~

1 micron is

• ~j ~~ ~: .. 7 ,~,

-- -~---.- ..

circuit 'CEIVER Date/Time run: 03/30/92 13:41:49 Temperature: 27.0

6.0V~-~-------:-----------------------------------------------------------I • ! I : ! · : · : · : · : · : · : · : · : · : · : : :

4. OV ~

I N 2. OV I o Cl1

OV-r-~--~~

, ,

I 1 I

-2.0V·+-~-------L---r-------------r-------------r-------------r-------------I Os 10ns 20ns 30ns 40ns 50ns , ...... ..

o V(108) + x Y A x V(109) 0 <> ~Al v 0 V(112) ...... : 0: <> v

Time C 1 . = 7 . 216 On, 2 . 6465 C2 = 1.3885n, 2.7475 dif= 5. 8274n, -101.010m

Pulseheight vs Vref

a ,b ,e ,d iii i

L~ ~--~--~----~~----~------~------~

LO ... v i

Capacitor settings: + = 000 x= 001 box = 011 diamond = 111

206

VME:

CALI~O~ ~~t>

~, ue) 1:loW a.) L.Q'\ I) ~l>

-=&11 ~, 1 E2IJS t}. SI~L~

(, ¥~2. c..h8t\ .. e\ ~~l> ~ ~ (~2.

c ~~ Pf2O~ ~~

c.~.

O'Pnoto.lPcL - ~l=\N ~L.SO C!.o~1 U ,.

~"tlAMM~~ 'beLA'fS Ft>e. L\ ,es-r" 'T~~OO",fi Mbs

207

...

1----- ~Teo~E ...=:s:::::=-

!.... out <.:5 MUX <.:5 cS

VC+

In ----c Vc-

ProgroMMoble Deloy

208

VIOl U ~ a.ddr " IIIIII

Da.ta. I I I

U L, >. d -OJ

<:S

I

I

I

I

I

I

Inltla.l tiMing a.dj

dela.y tiMing a.dj

32 eLeMent delo.y

209

I

I

I

Muon Module Shielding

Primary rf shielding (Faraday Cage) is muon module skin, whose integrity is maintained by shielding or bypassing signals entering or leaving.

I.e. (a) Tube signals are shielded using 16 twisted pair shielded cable to connect module to ASD box.

(b) Within the module, signal connection probably do not require shield. .

(c) Slow sensor signals and hv supplies are bypassed with series RC (at least 50 n , 0.01110

(d) No large uncovered holes, slots, or seams

210

Simple Rules For Effective rf Enclosure

DO

(a) Enclose tubes and electronics in a box (or boxes) with continuous seams.

(b) Make signal connections using shielded conductors with the shield tied to ground at enclosure. .

(c) Use bypass resistors and capacitors for all unshielded wires entering box i.e. power supplies, temperature sensors, strain gages, etc.

DON'T

(a) have large holes or long seams - they leak rf

(b) pass bare wire through holes in box. They transmit rf to interior

(c) pass shielded cable through holes in box unless shield is tied to ground. Unless tied to ground at box, the shield is transmits rf to box interior as does a bare wire.

Note: Shielding procedures can be quickly checked using portable fm radio (which has high gain at .... lOOMhz.) An rf leak generally results in a response from the radio.

211

Shielded wIre through bu~khe.o.d

Bulkheo.d connector

I "DoN'T

212

Bo.re wire through bulkheo.d

Bypo.ssed bo.re wire through bulkheo.d

Slgno.l Co.ble 16 Twisted po.lr shlelded

To shielded electronic box

r

Power SupplieS TeMperature sense o.nd o.U other non-slgno.l connectj.

U.T. ARLINGTON ASSEMBLY SITE

A. White


215

Equipment and Procedure Development for Manufacturing SDC's Muon System Modules

by

Dr. Andrew White, David Vanecek & Mike Diver

The University of Texas at Arlington Automation & Robotics Research Institute

Funding by Texas National Research Laboratory Commission

ARRI ~----------------------------------~ UTA SOC Collaboration Meeting 12109/92

Outline of Talk

- UTA I ARRI Personnel Support

- Module Assembly Modeling

- Renovation Plans at Swift Center

- Automod 3D Factory Simulation

- Future Work

ARRI ~----------------------------~ UTA SOC Collaboratir"'\ Meeting 12109/92

UTA I ARRI Personnel Support

UTA

David Steele - Mechanical Engineering at SSCL (2 days)

ARRI

ARRI

Mike Diver -Industrial Engineering at SSCL (2 days) Dave Vanecek - Industrial Engineering John King - Mechanical Engineering

SOC Collaboration Meeting 12/09/92 UTA

Module Assembly Modeling

- Module assembly process flow chart based on building BW1 modules

- MPX modeling software used to determine facility capacity and resource requirements for building modules

- Key Issue;

ARRI

1) Low labor utilization low due to large # of assembly operations at one station and adhesive cure cycles


Drift Tube Test

Tube Assemblies

(10)Continuity Test

To Burn-In

(20)Burn-In

To Module Assembly Build Station

Module Assembly

(2) Incline End Plates, (4) Rail Extrusions, (?) Drift Tubes, (2) Upright End Plates, (3) Top Panels, (3) Bottom Panels, (1) Spacer Sheets, (1) Gas Connections, Alignment Jigs

(10)Assemble Rail Extrusions to End Plates (offassy. pad)

(11)Setup Alignment Jig on Assy. Pad (align)

(12)Place Spacer Pads on Assy. Pad

(13)Place End Plate Assy.'s on Assy. Pad (Bolt assy.'s together & install gussets)

(14)Epoxy Bottom Plates together with Doubler Strips

D (15)Adhesive Cure

(16)Dispense Epoxy on Fiducial Tube

(17)Place Drift Tubes on Module using Stiff-Back

(18)Install Dowel Pins (2) each drift tube

D (19)Adhesive Cure

Repeat steps (16) - (19) to complete Fiducial Tube Assy.

(20)Dispense Epoxy on Module between Fiducial Tubes

(21)Place Tube with Stiff-Back

(Continued Step (22»

D

D

(22)Install Dowel Pins (2) each drift tube

(23)Place Alignment Rack over Tubes

Repeat Steps (20) - (23) to complete layer assy.

(24)Dispense Epoxy, place Epoxy coaled Spacers, or place Epoxy coaled Plates between Tubes

(25)Dispense Epoxy on top of Tubes

(26)Place Inter-Layer Spacer Sheets on Top of Tubes

(27)Adhesive Cure

Repeat Steps (16) - (27) to complete up to Top Layer

Repeat Steps (16) - (25) for Top Layer

(28)Epoxy Top Plates together wI Doubler Strips

(29)Adhesive Cure

(30)Connect Gas Manifolds, Signal Bulkhead Connectors, & High Voltage Bus Boards to Modules

(31)Connect Gas Tubes & Install Electrical Plugs

(32)Connect voltage to Signal & High Voltage end of Module

(33)Inspection/fest

(Continued Step (34»

SDC Muon Detector Module Assembly Process Flow at UTA Swift Center Revision 11/19/92

V Storage

o Operation

D Delay

[] Inspection!fest

~ Transportation

(34)Install Outer Plates

(35)Install Lee Bearings & Outer Plates

(40)Pack

Ship 10 Site

Assembly Modeling of BWI Muon Detector Module at University of Texas at Arlington

prepared by

The Automation & Robotics Research Institute

12/09/92

223

Modeling Software

MPx, Rapid Modeling Technology by Network Dynamics Inc.

Standard Time Units

Operation Time Flow Time Demand Period

MinuteslDay DaysIYear

Minutes Days Years

420.0 250.0

Maximum Resource Utilization 95%

Labor Group List

Assembler Test Technicians

Equipment Group List

Tube Tester Bum-In Tester Module Jig Leveling Table Epoxy Dispenser Module Tester Inspector

Labor Group Assigned

Test Technician Test Technician Assembler Assembler Assembler Test Technician Assembler

224 2

BWI Module Build Base Numbers

Module Specification Size S.S x 7.5m, (440) Tubes, (8) Layers - (4) Phi, (4) Theta (4S) Tubes/Layer & (6S) Tubes/Layer

Two assembly operations; Drift Tube Test and Module Assembly (lot size (1». Purchased components go through receiving inspection station.

Drift Tube Test Flow Sequence & Cycle Times(min.) Operation I Description I Equipment Equipment Labor Labor Flow Model Flow Chart Set-UDlLot Run TimeIPC Set-UDlLot Run TimeIPC

TEST Step 10 5.0 5.0 5.0 5.0

REWORKTS 2% Rework 0.0 30.0 0.0 30.0 BURN IN Step 20 5.0 120.0 5.0 15.0

REWORKBI 2% Rework 0.0 60.0 0.0 60.0

Module Assembly Flow Sequence & Cycle Times(min.) Operation I Description I Equipment Equipment Labor Labor Flow Model FlowChart Set-UDlLot Run TimeIPC Set-UoILot Run TimeIPC RAn.. ASY SteD 10 15.0 30.0 15.0 30.0 nG STUP SteD 11 &12 60.0 120.0 60.0 120.0

ENDPL AS Step 13 30.0 30.0 30.0 30.0 BTMPL AS Step 14 & 15 200.0 480.0 200.0 0.0 FIDU ASI SteD 16-19 30.0 300.0 30.0 180.0 TUB ASYI Step 20 - 23 30.0 445.0 30.0 445.0 SPACERS 1 Step 24 0.0 210.0 0.0 210.0 PX DISPI Step 25 30.0 30.0 30.0 30.0

LAYR SHI Step 26-27 150.0 480.0 150.0 0.0 FIDU AS5 Step 16-19 30.0 250.0 30.0 150.0 TUB ASY5 Step 20 - 23 30.0 340.0 30.0 340.0 SPACERS5 Step 24 0.0 255.0 0.0 255.0 PX DISP5 Step 25 30.0 30.0 30.0 30.0 LAYR SH5 Step 26-27 150.0 480.0 150.0 0.0 TOPL ASY Step 28 & 29 200.0 480.0 200.0 0.0 GAS ELEC Step 30 0.0 30.0 0.0 30.0 GAS TUBE Step 31 0.0 219.0 0.0 219.0 VOLTAGE Step 32 0.0 15.0 0.0 15.0 FINAL TS Step 33 60.0 120.0 60.0 120.0 REWORK 1% Rework 0.0 120.0 0.0 120.0

OUT PLAT Step 34 30.0 60.0 30.0 60.0 BEARINGS Step 35 15.0 30.0 15.0 30.0

OperatIon FIDU_ASI - LAYR_SHI & FIDU_ASS - PX_DISPS repeated (4) times Operation LA YR _ SHS repeated (3) times

225 3

Model Results BWI

Labor Group List # Assembler (2) Test Technicians (1)

Equipment Group List Tube Tester Bum-In Tester Module Jig Leveling Table Epoxy Dispenser Module Tester Inspector

Tube Test Flow Timeffube (days)

Module Assembly

# (1) (3) (1) (1) (1) (1) (1)

Number of Modules ShippedN ear Flow TimeIModule (days)

Labor Utilization Assembler Test Technicians

Equipment Utilization Tube Tester Bum-In Tester Leveling Table Epoxy Dispenser Module Tester

Labor Group Assigned Test Technician Test Technician Assembler Assembler Assembler Test Technician Assembler

(.39)

(4) (70.74)

% (60.4) (54.0)

0/. (22.7) (74.3) (59.7) (02.1) (00.9)

226

What-If Scenario Scenario above includes an (8) hour epoxy cure time between the completion of each layer. The scenario below assumes proper scheduling of work time allows cure times to occur overnight.

Labor Group List # Assembler (3) Test Technicians (1)

Equipment Group List Tube Tester Bum-In Tester Module Jig Leveling Table Epoxy Dispenser Module Tester Inspector

Tube Test Flow TimelTube (days)

Module Assembly

# Labor Group Assigned (1) Test Technician (4) Test Technician (1) Assembler (1) Assembler (1) Assembler (1) Test Technician (2) Assembler

(.60)

Number of Modules Shipped/Year Flow TimeIModule ( days)

(6) (54.17)

Labor Utilization Assembler Test Technicians

Equipment Utilization Tube Tester Bum-In Tester Leveling Table Epoxy Dispenser Module Tester

% (60.4) (81.0)

% (56.1) (94.6) (63.3) (03.2) (02.2)

227 5

~----I Renovation Plans at Swift Center 1----__.

- Renovation documentation includes;

1) Specifications for module work surface, maximum module size can build 11.0 x 8.5 m /

2) Facility design & layout requirements

3) Material handling requirements for modules, tubes, and end plates

- Architects (Albert Halff) status;

1) Analyzing soils report for module pad design

2) Bid completion due erid of January

3) Renovation target start date March 1, (6) month renovation

ARRI r-----------------------------------~ SOC Collabof::ltif\n Meeting 12/09/92

UTA

Proposed Renovation Plans at Swift Center University of Texas at Arlington

prepared by The Automation & Robotics Research Institute

12/09/92

229

Introduction This document describes the renovation specifications to facilitate muon detector production at the University of Texas at Arlington's Swift Center and is directed at the architects of Albert H. Halff Associates, Inc. who are responsible for the determination of feasibility and the implementation of these plans. The areas concerning facility renovation are~ 1) Module work surface, 2) Facility layout, 3) Facility Flow, 4) Monorail tube transportation and 5) Bridge Crane.

1.0 Specifications for the Module Work Surface In general, the objective is to create a surface (the jig plate) that is stiff and flat but not necessarily level. The deflection across the span of the jig plate must be less than 0.13 mm over the time it takes to build a module (about one month). The long term deflection (5 years) must be less than 0.50 mm. The work surface or pad will be independent of the remaining foundation (i.e. it is free floating). The location of the work surface can be seen in figure 1.

Specifications for the BWI Module Pad These specifications are given with reference to figure 2. Note that the pad size shall be a manximum of36' x 28' (1l.0 x 8.5 meter). Sizing of the assembly pad was designed for a 30' x 22' (9.1 x 6.7 meter) maximum module structure, weighing approximately (7-10) tons, with a 3' (.91 meter) addition for each side to accommodate jig fixturing and alignment tooling. Not shown is that the concrete in the pad shall be rated at 75 psi There are C3 x 6 channel beams spaced 2' apart on center as shown in the figure.

Important to understand is the elevation of the pad, the detached floor, and the aluminum jig plate. The C3 x 6 channel beams embedded into the foundation such that the tops of each beam are even with the pad's surface. The pad's surface is 2.5" below the surface of the surrounding (detached) foundation. The jig plate is mounted to the pad by adjustment bolts embedded in the channel beams. The jig plate is then adjusted into a flat surface with the bolts. When flattened, the jig plate will be near even with the surrounding foundation. Once the jig plate is flat, grout will be pumped into the space between the jig plate and the pad. The grout will help stiffen the jig plate.

Specifications for Transporting the Module In addition to having a surface to construct the modules, the foundation must also support the vehicle that will carry the module from the work surface to the transportation truck. Two gantries will be used to pick up the module and carry it out the door along rails. The rails will be able to straddle the work surface and the transportation trucklloading dock outside the building. Each strip runs from the farthest end of the module out the door to straddle the loading dock. The only dimension constrained for the strips is the length (see figure 1). The other dimensions shall be driven by the load specifications. The distance between the rails should be as wide as possible but less than the 34' door width and greater than 25' (the width of the work surface). The width between rails will not be specified so that the architects may have more flexibility in design.

230 2

Each gantry will roll on four caster wheels. Two wheels on each side of the module. Hence the entire load of the module will be distributed over eight cast iron "V" grooved wheels for use on an iron track. There will be a load of 4000-5500 pounds per caster. A drawing of the proposed gantry is included to help determine any other load specifications (see figure 3).

Other constraints It should also be noted that the ceiling clearance is II '8". The exit door will be 34' wide and 10' high.

2.0 Facility Layout The modified Swift Center facility is designed to manufacture BWI modules. The manufacturing design has five primary areas for manufacturing activity. Those areas are:

Receiving and Shipping dock Tube & Plate Storage Tube Cleaning and Test Muon Detector Assembly Pad Miscellaneous Storage

The Receiving and Shipping dock located on the West wall of the building at the main overhead door (34 door) and is used for the receipt and shipment of all large assemblies and 40 trailer and containerized stock. A secondary receiving and shipping area is available through the existing 8 roll-up door at the East comer of the manufacturing area. Only smaller shipments can be received through this entrance due to access problems.

The Tube & Plate storage area is located in the work volume of the existing bridge crane. This area will be used as storage space for boxes of assembled Muon tubes and for the plates of aluminum which separate layers in the muon assembly. The storage area is capable of holding an adequate supply of tubes to construct an entire BWI Superlayer.

The Tube Cleaning and Test area is located in the East comer of the manufacturing area as designated in figure 4 by the three Testing and Cleaning tables. This area will serve as a staging area for Muon detector tubes prior to the assemblage into the superlayer. Tests and cleaning procedures which will occur at these stations are to be determined.

The Muon Detector Assembly Pad is located on the projected centerline of the main access door and is sized to accommodate BWI modules. Running parallel to the muon pad are imbedded steel rails which will serve as guide ways for the gantry cranes which will move the module upon completion. Miscellaneous Storage is available in either the North or South ends of the Swift Center facility. Storage requirements and racking requirements are to be determined based upon the final assembly requirements of the Muon detector.

231 3

3.0 Facility Flow A walk through approach will be used to describe the flow of materials through the facility. Terms describing the areas in the facility are standard and defined in section 2.0 Facility Layout.

Receipt of Muon Tubes 1. Tubes arrive in containers or tube carriers at the main shipping door. Due to

restrictions in the height of the Swift Center Facility, a maximum of two tube carriers can be received from any truck. The conceptualized tube carrier will hold approximately one sixth of the tubes required to manufacture a single BWI module. .

2. Tube carriers are lifted from the truck with a single gantry crane and rolled to the Shipping and Receiving dock.

3. The tube carrier is placed on a cart. 4. Receiving information is scanned from the tube carrier 5. The cart is the moved to the Tube & Plate Storage area 6. The Bridge Crane is used to move the tube carrier into the storage area

Steps 1-6 are repeated until all tubes are received

Receipt of Plates 1. Plates sufficient to manufacture a BWI module arrive on a flat-bed trailer at

the main shipping door. 2. Plates are removed from the trailer with a single gantry crane fitted with an

appropriate end effector and rolled to the Shipping and Receiving dock. 3. The plate is placed on a cart. 4. Receiving information is scanned from the plate. 5. The cart is then moved to the Tube & Plate Storage area. 6. The Bridge Crane is used to move the plate into the storage area.

Steps 1-6 are repeated until all plates are received.

Assembly Process (plates) 1. A plate is taken from the Tube & Storage assembly area and placed on a cart. 2. The cart is moved to the Shipping and Receiving area. 3. The Plate is removed from the cart by the Gantry crane. 4. The gantry crane is used to maneuver the plate to the appropriate location on

the muon detector assembly pad. S. The plate is positioned and affixed to the super layer structure.

Steps I-S are repeated throughout the assembly process as required.

Assembly Process (Tubes) 1. Five tubes are removed from the tube carriers onto the monorail tube holder

fixture.

232 4

2. Tubes are moved via the monorail to the Tube Cleaning and Test area. 3. Tubes are prepared for installation 4. A single tube is moved from the Tube Cleaning and Testing area and

maneuvered to position over the assembly pad. The tube is supported during this activity by the stiff-back device.

5. The tube is affixed to the super-layer.

Steps 1-5 are repeated as required for the manufacturing process.

Super Layer Shipping 1. Gantry cranes are positioned over pickup points on module. 2. Module is raised from assembly pad by gantry cranes. 3. Gantry cranes transfer the module to the truck-bed. 4. Gantry cranes lower the module onto the truck-bed. 5. Module is secured. 6. Gantry cranes are moved from area. 7. Shipment to SSC Site commences.

4.0 Monorail Tube Transportation The ceiling in the vicinity of the module assembly must support a monorail suspension system that will be used to transport drift tubes (see figure 5). The average load carried by the rail will be 500 lb. The rail will be attached to the roof joists already present in the building.

5.0 Bridge Crane

The bridge crane present in the building will remain to be used in material handling. A trolley will be added to the bridge to move materials in an x-y manner.

23a 5

UI

MODULE 22' X 30' MAX. SIZE

LEVELING PLATFORM 28' X 38' lUX. S'Z. ~

-.1 -

NOTE: THESE TREES MUST BE REMOVED TO PACIUTATE RUNWAY CONSTRUC110N.

CONCRETE RUNWAYS WITH RAILS FOR mE TRAILER WHEELS. DEPTH TO BE DETERMINED.

III 1 I

N.T.S •

• • ' MIN.

12' MIN.

If 1" N.t,B.

~DRlVEWAY'RUNWAYS' AND ASSEMBLY PAD CENTERED ON DOOR

ARRI/SSC MODULE ASSEMBLY LAYOUT

SCALE: I" =30' 1-... JOHN KING I.... 11/08/92

FIGURE 1 1_ 12/09/92

C3 X fi CHANNELS CED 2' O.C. SPA

18

CONCRETE RUNWAY (TYP) WIDTH TO BE DETERNINED

MAX.

IIG

SPACE __

~

NOTE: THE PLATFORN WILL SIT ON THE SOIL SEPARATELY FRON THE SURROUNDING rouNDAnoN AND THE CONCRETE RUNWAYS

,

CHANNEL WELDED TO 1/"" X ,," PLATE

FACE OF THE CHANNEL IS LEVEL mH THE CONCRETE PAD

V . .. . .

SI~EW' DEPTH TO BE DBTERKINED

l--/" MAX. (N'T'S.~

. . . , . SIDE VIEW

..... D

\ .. " " -

36'

ARRI/SSC

. . 3/tI' DlA. ]I ". BOLTS o 2' SPAC ING ALONG BEANS

MAX. (N.T.S.)

BWl LEVELING PLATFORM SCALE: I" = 12' DRAWN BY: JOHN KING

FIGURE 2

_~[12.19"

8'

~-------h'6"--------~

NOTE: MAX. LENGTH DETERMINED BY WIDTH OF RAILS

~-----MIN. 28',------~

/ I

ARRI sse BWl GANTRY

SCALE: ... =3' DRAWN BY: JOHN KING DATE: 09/25/92

FIGURE 3

TUBE TABLE

TEST AND CLEAN

MISC, STORAGE TUBE AND PLATE STORAGE

BRIDGE CRAN

MODULE ASSEMBLY

MONORAIL TRACK

MISC. STORAGE

SHIPPING AND RECEIVING

ARRI/SSC FLOOR LAYOUT

SCALE: 1"=30' _ ... n, JOHN KING DAm 11/06/92

FIGURE 4

STEEL ROOF JOISTS AT 7' AND 9' CENTERS

500 Ib TRAY NYLON STRAPS RAIL

~1·-------------------------------30'------------------------------~ 11'-6"

7'-6"

NOTE: THIS IS THE MAXIMUM OPERATING HEIGHT OF THE SYSTEM.

ARRI/SSC PROFILE OF MONORAIL

SCALE: 1" = 4' DU,," n: JOHN KING IIAft 09/25/92 FIGURE 5

3D Factory Simulation

- 30 Simulation (Automod & Cimstation) generated to visualize material and assembly procedures

- Automod visualization of material handling complete

- Cimstation simulation of tube assembly and adhesive dispensing in progress

Key Issues;

ARRI

1) Space requirements for movement of large materials more difficult than initially realized with 20 layout drawings

2) Safety concerns should have priority when methods for moving large objects are designed


Future Work

- Continue updating and refining simulation model

- Provide architect with final layout drawings l'V ~

o - Continue 3D simulation modeling

- Support prototype BW3 module assembly build

ARRI r-------------------------------~ UTA SOC Collaboration Meeting 12/09/92

SCINTILLA TOR SYSTEM

R. Thun


241

PROPOSED SDC MUON COUNTER CONFIGURATION

1) Overview

E. Dodd, E. Gero, S. Hong, R. Thun, C. Wea .... erdyck University of Michigan

2 Dec 92

We propose, as in the TDR, to identify the bunch crossing of muons traversing the barrel and intermediate regions of SDC with a single layer of scintillation counters. In this note we present a particularly attractive configuration and layout for these counters. This proposal is based on recent measurements of prototype counters and on a detailed evaluation of access requirements. We also present preliminary results from a study of neutroninduced backgrounds based on SDC Note SDC-92-361. We discuss a minor modification of the Intermediate and Forward counter configuration that will reduce backgrounds by an order of magnitude.

A muon counter task force charged with finding the optimal location of the single layer of counters has made a preliminary recommendation that this layer be located in the 1.0 m gap between the BW2/fW2 and BW3/IW3 chamber modules. This highly constrained space demands the implementation of compact counters with easily accessible photomultiplier tubes (PMTs) and bases. The only configuration which appears to satisfy these constraints is shown in figures 1 and 2.

As indicated in fig. 1, the light guides are folded back across the top of the counters so that all PMTs and bases are accessible without moving any counter. The total length of approximately 185 cm allows any counter to be removed from the detector should this be required sometime during the lifetime of SDC. (Counters with straight light guides would be about 300 cm long and would be difficult or impossible to move around the BvV-IVV corner.)

The task of reversing the path of photons is accomplished in two steps. The first consists of internal reflection at the counter ends whose edges are cut at 45 degrees. A quarter section of plastic cylinder then guides the photons adiabatically into a twistedstrip light guide. This configuration has been proposed by N. Christensen and K. Heller who determined experimentally that approximately 60-70% of photons transmitted by the scintillator are reflected by this geometry.

2. Performance of Prototype Counter We have constructed and tested a counter at Michigan with the configuration and

overall dimensions shown in fig. 1. The average number of detected photoelectrons (p.e.) from perpendicularly incident cosmic-rays is shown in fig. 3 as a function of distance from each end of the counter. The yields are essentially identical and more than adequate (>25) for SDC. This test was performed with Kuraray SCSN-81 scintillator. Based on previous experience, we would expect Bicron BC-408 to have a substantially (>50%) higher photon

243 1

yield. NE110 would show similar or slightly better and 1HEP scintillator similar to slightly worse performance. We intend to construct counters with all these scintillators.

The signals from the two counter ends were processed with a mean timer whose output time relative to the signal from a small trigger counters is shown in fig. 4. The observed time resolution of about 1.4 nsec is dominated by the time jitter of the trigger counters which is measured to be of a similar magnitude. Even without unfolding this extraneous jitter, it is clear that the time resolution ofthe prototype counter is adequate for identifying the correct bunch crossing with very high probability. The small tails in the distributions towards early times are not understood but are consistent with multiple hits which can shift the mean-timer output by up to one half of the maximum light transit time (12/2=6 nsec) but only to earlier times. The tails <\I"e well contained within the 16 nsec time window. [Note: as shown in fig. 5, mean-timer mismeasurements at BS2 due to prompt multiple hits will be limited to less than 3.7 nsec.] The threshold for signals displayed in fig. 4 was approximately equal to 1.5 p.e. Raising the threshold to about 4.0 p.e. did not change the character of the time distributions.

We note that the mean timer also provides spatial information along the scintillator. For SDC, the mean timer output segments counters into four logical elements corresponding to 50 x 50 cm pixels in BS2 and 1S2. This matches the hadronic calorimeter granularity of 0.1 x 0.1 in TJ - <I> space.

9. Access Figs. 6 and 7 show the platforms and ladders required for servicing the barrel counters

described above. This design work is still in progress. As shown in fig. 8, full-scale models have been constructed to study the adequacy of the proposed 1.0 m gap between BW2 and BW3. Our initial impression is that this 1.0 m spacing is sufficient.

4. Neutron Backgrounds L. S. Waters et al. (SDC Note SDC-92-361) have made a detailed study of neutron

currents in SDC. Results pertinent to the muon trigger counters are summarized in fig. 9. The indicated number of neutrons correspond to an integrated luminosity of 10,000 pb- l .

It is clear that the region near the final-focus quadrupoles is a very intense source of neutrons. Rates in FW5 are an order of magnitude higher than in FvV4. Surprisingly, the same is true for BW3 vs BW2. Rates increase dramatically with decreasing polar angle. It should be noted that this study is based on the TDR version of the forward SDC detector configuration (see fig. 10) with only minimal shielding near the quadrupoles. The actual SDC detector will be constructed with much more elaborate shielding schemes so that the rates calculated by Waters et al. will (hopefully) represent an upper limit on what will be experienced by SDC. A goal should be to reduce the Waters et al. rates by one order of magnitude.

The response of scintillator to fast neutrons is well documented. Some useful references (which all give very consistent results) include:

244 2

J. E. Hardy, Rev. Sci. Inst. 29 (1958) 705

S. T. Thornton and J. R. Smith, N1M 96 (1971) 551

M. Drosg, N1M 105 (1972) 573

R. A. Cecil et al., N1M 161 (1979) 439

Data from two of these references are shown in figs. 11 and 12. To summarize: 1.0 em thick scintillator and a threshold of 0.1 minimum ionizing (0.2 MeV) yield a neutron detection efficiency which is zero below neutron energies of 1.0 Me V, rises to a maximum of 0.06 at 2 MeV, and falls linearly to 0.04 at 10 MeV. We have calculated the neutroninduced rates under the following simple assumption: the number of neutrons above 1 MeV is equal to half the number indicated in fig. 9 (which displays neutrons with 0.1 < E < 20 Me V) and that the average scintillator detection efficiency is 0.050. The singles rates per counter from neutrons obtained in this manner are shown in fig. 13 for the standard SSC luminosity of 1033 cm-2 sec-I.

Suppose a real muon trigger occurs and is correctly tagged by the muon counters. What is the probability of obtaining additional random taggings during the 1.0 usec drift chamber time window? This is shown in fig. 14 for the TDR muon counter configuration. The calculation for this figure ORs together all counters across an octant under the assumption that only the theta tubes are used in level 1. In BS2/1S2 this consists of the OR of 4 counters. In the forward region, 2 or 3 counters are ORed depending on theta. Except for the single layer of intermediate counters, the extra random tagging rate is reasonably low everywhere (typically 2% in the barrel and 10% in the forward system.) The random rate in the intermediate region equals the real rate and would increase the overall level-1 muon trigger rate by about 12%. ( The random taggings would not survive level-2 and level-3 requirements). This increase presents no major problem.

It turns out that the random trigger rates from neutrons can be dramatically reduced in the intermediate and forward regions by a very simple change in configuration, one that adds essentially no extra cost. Basically, the 1S2 and FS4 counters would be replaced with the design shown in fig. 15, and the FS5 layer would be eliminated entirely. Two close, optically isolated counters would yield a very low random coincidence rate because of the very short range of protons recoiling off the neutrons. Externally, the design in fig. 15 would be indistinguishable from the barrel counters. Using a high-yield scintillator such as Bicron B C-408 in 1S2 would allow the use of 0.6 cm thick counters so that the total amount of scintillator material would be essentially the same as for the counter shown in fig. 1. The cost would be somewhat higher because the scintillator piece count is doubled. However, the cost increase would be compensated by the effective shift of FS5 to the FS4 location with its much smaller area. Recall that FS5 rates are nearly an order of magnitude higher than those in FS4. Shifting the layer to FS4 reduces the random tagging rate by twice this ratio of neutron rates since the FS4 *FS5 trigger required the coincidence of one FS4 counter with the OR of two contiguous, overlapping FS5 counters. The double FS4 layer would be more vulnerable to electromagnetic debris than the FS4*FS5 combination but such debris is likely to be less severe than the neutron background. This should be studied

245 3

in greater detail. Figure 16 shows the expected random tagging rate from neutrons with this new, proposed IS2/FS4layout at the SSC design luminosity. It is below 2% everywhere in IS2 and FS4.

5. The Next Step We intend to produce and test several more counters according to the designs described

in this note using various scintillator materials available to us. IT the results continue to be encouraging, we would propose to have the Collaboration accept this design and then begin the detailed engineering required to implement it in the supertower prototype and in the SDC detector itself.

6. Summary We propose to tag muons in SDC with a set of scintillators that provide excellent time

resolution (better than 1.0 nsec), very good positional resolution (50 x 50 cm or better corresponding to 0.1 x 0.1 in 7]-4> space), and low neutron-induced random rates (typically less than 2% of the muon trigger rate at the SDC design luminosity). Scintillation counters represent a well-proven, low-risk technology which can be implemented by many groups working within the collaboration. The hazard associated with such counters is very low since no gas is required and the Cockcroft-Walton photomultiplier bases are powered by supplies operating at low voltage. The configuration of counters outlined in this note allows ready access to all photomultipliers and bases. Replacement of these active components in case of failure is a straight-forward matter.

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SDC Note SDC-92-361

November 12. 1992

Neutron Currents in the SDC

L. S. Waters, A. P. T. Palounek, H. G. Hughes, H. Lichtenstein, R. E. Praei, and H. J. Zioek

Los Alamos National Laboratory

100keV<EIW\<20MeV

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J

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Figure 2: A close-up of the region around z=19m. This shows the end of the

quadrupole magnet, the magnet collimators. pan of the forward calorimeter.

and edges of several muon chambers.

FIG /0 25fl

II/CLEAR INSTRUMENTS AND METHODS 96 (1971) 551-555; (0 NORTH-HOLLAND PUBLISHING CO.

MEASUREMENTS AND CALCULATIONS OF NEUTRON DETECTOR EFFlCIENCIES*

S. T. THORNTON and J. R. SMITH

Department 0/ Physics, UniueTsity 0/ Yirrinia, ChDTlottesflille, Yirrinia, U.S.A.

Rcc:cived 19 May 1971

".,cron detector absolute efficiencies measured in our laboratory t several orcanic scintilla tors are reported. A substantially .. ued version or Kurz's neutron detector effiCiency computer

program has been used to calculate efficiencies ror new and previous measurements. Good alreement has been obtained ror various scintillators •

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III 16 18 20 6 8 10 12 1'1

t£UTAON ENEAOT (!'lEV)

=is. I. Comparison or experimentally measured neutron detector efficiencies and calculations by DETEFF (solid line). The calculions were made ror an equivalent electron energy bias as indicated in the parenthesis. The measurements were by (a) Halelli) and

Thornton et al.12). (b) Thornton et al.l2) and Murphy13), (c) Thornton et al.l2). and (d) Wood et al.11) .

. Work supported in part by the National Science Foundation through the University or Virlinia Center ror Advanced Studies.

S.D C ;

SSl

/10 em sci" h//4,tid Ff6 II 257

"CLEAR INSTRUMENTS AND METHODS 105 (1972) 573-584; C NORTH-HOLLAND PUBLISHING CO.

ACCURATE MEASUREMENT OF THE COUNTING EFFICIENCY OF A NE-213 NEUTRON DETECTOR BETWEEN 2 AND 26 MeV·

M.DRosot

Los A/QmOS Sci~nlific lAbortltory, Unicn'sily 0/ CQli/o,niQ, Los AIQmos, N~III Mexico 875#, U.S.A.

R.eceived -4 July 1972

I" neutron detection efficiency of a liquid scintillator (NE·213, aCID diam. x 5.7 cm) was measured with various bias scttinl$ ~ponding to proton energies from 1 MeV to 6 MeV. Fo"r .Jllluon energies below about 12 MeV a simplified calculation . iII the data very well and the uncertainty in the shape is less than

2 %. The importance of contributions from the reaction 12(:(n,n')3« above that enerl)' is shown. An extensive survey of publications dealing with the efficiency of orpnic scintiJlators is also presented •

•

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NEUTRON ENERGY (MeV)

(II- 4. Measured efficiency points for biases at 0.4, 1.0,2.0, 3.0, ,,0 and 5.0 times Cs and calculated fits (solid lines). The dashed

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259

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260

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1 I SDC-92-361 I I

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AND LJ/TII r~2/Fslt- ACCORD/NG To ~/6./:J 262

RPC STATUS REPORT

G. Introzzi


263

RPC's STATUS

G. Introzzi & G. Liguori

SSCLab, 11/13 Dec. '92

265

Resistive Plate Counters for the SDC Muon System

V. Arena, G. Boca, ?vI. Cambiaghi, G. Gianini, G. Introzzi G. Liguori, S. Ratti, C. Riccardi, P. Torre, P. Vitulo

University and INFN of Pavia, Italy

November 3, 1992

Abstract

The Resistive Plate Counter (RPC) detectors are described together with some oftheir applications to High Energy Physics. A possible use or RPe's in the Muon System of the Solenoidal Detector Collaboration (SDC) is outlined. They could be employed as part of the system devoted to the identification or muons and for trigger purposes.

SDC note 92-380

267

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~71

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MODEL VX299 48 CHANNEL DISCRIMINATOR AND MULTI -HITTDC

.The MOd. VX 299 isan 8 TE width 9U high VXI mechani-'cally compatible unit

j It houses 48 multi-hit TOC channels which can accept differential analog signals.

I The signals are discriminated by 48 comparators ar-ranged in 12 groups of 4 with common thresnolO aejust-able in the range from 0 to 2.5V.

The channel resolu-Jon is twice the period of an external clock (std. NIM 50Q signal) and the maximum time resolution is 4 ns (125 MHz of external cleck frequency).

RPG's

:~ .~ .:= ;"\'1 \S,-:o : _ ~ = ;..=;: :: L: ~' ::

There is a circular buffer fer eacn channel to store the oisc::mlnator status: the out'er !engm can be programmed vIa dip switches up to 2Q.:8 samples.

W~en the external c!ock s:=:s. :!"Ie cata contained in the buffer are transferred In a multi-event buffer (up to 16 events): the event length is settable via dip switches. WIth a maximum of 256 samples.

The unit houses a TMS 320C25 (40 MHz) esp. that con:rols the various unit functicns. in particular sets the disaiminators thresholds. ensures the commU'1ication with the external world by a serial port located on the trontpanel. and by an interfa:::e with a private Backplane bus: furthermore it can be used for data reduction and fermatting; two FIFO memcries for the formatted data are accessible trom the private bus.

Some Front Panel LEOs show the unit status.

Following its usual fashion CAEN has collabOrated with the grcups developing the read-out electronics dedicated to the APC detec!ors. The enormous interest shown at the moment concerning this lUnd ef oetector has motivated us to develop a ne'N engineering of the read-out system which allows a more general use of the electronics.

Different kinds of frent-end electronics are available at the moment:

• The well known module developed by the INFN-AOMA " (R. Cardarelli. R. Santonico). The unit is a small piggy-back hybrid board in SMO technology bearing 8 independent acquisition channels.

The tront-end electronics characteristics are:

8 independent channels per board: APC's input signal polarity: negative: minimum input pulse width: 8115 ns: discrimina10r threshold level: -40 mV; common TEST input; output acIive TTL level: low: fast OR TTl; output pulse shapero width on request.

I This rlcdt;ie can :e :::luC;l:jed en a mct!"!er ceare ~ear:r.g tt:e ::nn~crs linking the system to the detector and can I be custcmizad to tM user's needs.

The read-out of this mother board can be performed either serially or in parallel: serially via CAMAC ( Mod. C 267 and SY 480) already available. or via VME in design phase. in parallel via VME through a dedicated 48 bit 1/0 register (developed by INFN-AOMA) •

• At the moment CAEN is also collaborating with the T& T program. NAPOU, PAVIA and PALEAMO INFN sections. to design a fast parallel VME read-out system with a memory buffer to be used in accelerator applications •

• CAEN developed. in collaboration with the University of LA SAPlENZA- ROMA (M. Bonori. U. Contino. F. Massa) a unit housing a fast TOC with a resolution of 1 ns to be used in acosmic ray and accelerator apolications. The main features of this module are: 16 differential channels. double pulse resolution of 2 ns. completely programmable via a OSP 56001. software presettable common threshold. fast OR output for triggering purposes.

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276 "I ;'i .",

RPC READOUT SYSTEM

There are two kinds of boards

- a small board on the RPC frame with the amplifiers.

- a VME module with the main part of the electronics (Fast TTL).

Each VME board (V533) handles 32 channels.

277 II

Small Board

- comparator

- threshold and width remote preset

- TTL differential line driver

- twisted flat cable to the VME crate

278

V533 Module

4 functions:

1) frontend 2) logic functions 3) memory 4) VME interface

1) frontend

Connector on the front panel

differential TTL line receive~

logic functions memory

279 /3

2) logic functions

The signals go to a PAL in order to generate the trigger signal.

The PAL is programmed with logic function among the 32 input data.

FAST OR (of 32) on the front panel at NIM level.

Less than 60 ns

280 10

3) memory

The RPC signals are piled on a FIFO

The half full is programmed in a way to have the trigger word near the ou tpu t of the FIFO.

When the trigger occurs a group of words is tranferred on a second FIFO. The acquisition of new data is forbidden.

The acquisition of new data is allowed and the words are read by the crate controller .. The read out of the 3 2 channels is made in parallel.

281

Main Features

- Standard VME interface on the V533 module

- Remote preset of the threshold and the width

- Remote test of the electronics

- New frontend electronics

- High frequency clock (up to 66 MHz)

- Some logic functions for triggering purposes.

282 I(

ffOrOTYPE

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SLOW CONTROLS

B. Roe


285

B. KOE

Slow Control for Supertower Test a.) SADC. The Harvard SADC VME module seems

satisfactory. It is a 62 channel scanning ADC (64, but 2 used for calibration and ground.) It can be built for about $800, about 50% cheaper than a commercial unit.

i.) Linearity. It is linear to about 1 % over the full scale.

ii.) Channel to channel variation. It is constant to about 1 least count. (of 4096).

iii.) Integration time is a 60th of a second. This is fine for slow control and turns out to average over most noise. Signal conditioning may not be necessary and is certainly easier.

b.) Noise tests. With a scope, a fast noise of about 50 m V can be seen in the lab in which we test, a reasonably noisy place. A simple capacitor of about 0.1 J..Lf reduces this to about 20 mV when a 100 n resistor is in series with the line. Any conditioning can be put in the ADC after the scan switch so we use only one circuit per module, not 62.

287 1

c.) Cabling. The strain gauge people recommend twisted pair cabling and this probably would be useful for temperature sensing and alignment sensing also.

d.) After a discussion with John Oliver it appears that for temperature sensing, a sensor delivering a constant current for a given temperature is slightly preferable to one delivering a constant voltage as it is immune to differences in cabling resistance. The AD592 seems reasonable, but we still need to decide what quality level is required.

e.) We will use a circuit with an offset, so 20° C is about o. We do not need to trim for each channel. The computer can easily store the necessary constants (2 per channel).

288 2

f.) Strain gauges. We need to discuss the circuitry needed with the engineers here. Some groups use two gauges, one a dummy in a Wheatstone bridge circuit. It is not clear if this is needed or not. The gauges can be obtained with temperature coefficients of expansion matched to the material being measured. We have samples of 125UW, CEA series of different quality ratings. Will the gauges be being used at the extreme limits of their sensitivity?

g.) Alignment gauges. We need to discuss this with the alignment people. It appears that the SADC's and the same cabling as for the above will probably be ok.

289 3

Official calibration (gain 1) ,..,....

:j: + + > + ++ E -12 ++ ++1-+ +

'-"

u-16 + +

0 ~-20 > J..-24 Ul + 0 + (]) -28 + E + + >-32 + + + +

+ + +

-36 + + + +

-40 +

-44 2250 2500 2750 3000 3250 3500 3750 4000

ADC-value

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-44 I I I I I +

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290

Our calibration (gain 1) .-:-.. + + > E 6 + '-" + --- 4 +I- + u + + 0 + + + + u 2 + + '-" + + >

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-8 +

-10

-12 2250 2500 2750 3000 3250 3500 3750 4000

ADC-value

+ + c:: 6 +

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-8

-10 +

-12 + 0 2 3 4

V(meas) V

291

Official calibration (gain 10) .......... -1 + > E

'-"-1 2 .......... . (J

0-1 4 (J •

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~-1.8 + + (]) + + + E -2 +

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+ + -2.6

2250 2500 2750 .3000 .3250 .3500 .3750 4000 ADC-value

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-2.6

100 150 200 250 300 .350 400 450 V(meas) (mV)

292

Our calibration (gain 10) """"' + > E 0.8

'-"

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-0.4 + +

-0.6 + +

-0.8

2250 2500 2750 3000 3250 3500 3750 4000 ADC-value

+ c:: 0.8

'-"

U 0.6 0 ~ 0.4 + + > I 0.2 + + + +

""""' ++ + + + Ul + + 0 0 + (!) + E + +

>-0.2 + + + +

-0.4 + +

-0.6 + + -0.8

50 100 150 200 250 300 350 400 450 V(meas) (mV)

293

Our calibration (gain 100) ;--.. + > E +

'--'0.04 ;--.. + u + 0 + + u + >0.02 + I + + + ;--.. + + + + U)

0 0 Q) + E .......... ++ > + -0.02

+ + + ++ +

-0.04

2250 2500 2750 3000 3250 3500 3750 4000 ADC-value

+

0.04 + ;--.. + u + 0 + + u

>0.02 + + I + + + ;--..

U) + + + + 0 0 Q) + E .......... ++ > + -0.02

+ + + + + +

-0.04

10 15 20 25 30 35 40 45 V(meas) (mV)

295

Portable DAQ Features

1. Runs on Unix systems.

(a) SUN-SPARC with Solfiower VME interface

(b) DEC-ULTRIX with DEC VME interface

(c) HP-UX with Bit3 VME interface

(d) Access to CAMAC from all 3 via Kinetics Systems board set.

(i) Sun and DEC use KEK CAMAC driver.

(ii) HP currently has no transparent interface from user programs to CAMAC.

(e) Access to VME is not yet user-transparent.

2. Distribution via tar file

3. Recompilation of entire package via top-level Makefile

(a) 2.5 minute elapsed time on HP 9000-710

4. Start entire canned package of processes via single command

5. Current version runs on single processor

( a) Planned next version for multiple processors

29fl

Software Requirements

1. C++ compiler is needed.

( a) Built using HP C++ compiler.

(b) Built using SUN C++ compiler.

(c) Built using GNU g++ v2.2 on DECstation.

2. CERN libraries needed by distributed analyzer.

( d ) Must be at least v92a.

297

L INTRODUCTION

This documentation provides an overview of the SOC Portable Data Acquisition System, 3PO VeISion 1.0. The overall system software consists of a generic template sttucture, a buffer manager, and a set of processes such as collector, analyzer, recorder, and runcontrol, which were developed using the template and the buffer manager. The processes running in 3PO interact with each other by means of two entities: command messages and event data. The inteIpIOCeSS message passing is handled by the template, and the circulation of event data is controlled by the buffer manager. The interaction of the processes is illustrated in Figure 1.

Event Source

---.

log file 4- - -

Commmd·

larenc:tiaas to the NOVA

Flow of the Eveat Buffer

---~ --- --

Figme 1. Interac:tion of the processes.

I I I I.

~

Other Processes

Two of the criteria consideIed in the design of the SOC Portable Data Acquisition System are extendability and scalability. The template is extendable by providing a generic under!yii:.,~ sttucture on which the processes are built. The processes built on top of the template inherit all the character-1stics provided by this generic struChU'e, and if required, the additional process-specific features can be added to that particular process without having to modify the kemel template. This facilitates the addition of new processes to the system. Similarly, both the template and the buffer manager are scable up to distributed environments and higher event rates, and allow on-the-fly addition and deletion of processes.

298

Event Flow

1. "Collector" process reads hardware.

( a) More than one such process allowed, merging events into a single stream.

2. "Recorder" process saves event buffers to media.

(a) Disk file

(b) Tape device

3. "Analyzer" process( es) look at event buffers and perform user analysis.

( a) PAW distributed as part of standard analyzer.

4. Buffer Manager is NOVA, written at KEK, and will be used in next CDF run as their event buffer manager.

299

Control Flow

1. XPC process (and XPC_checker) ensures all processes remain alive

2. RunControl process sends commands to all appropriate processes corresponding to the likes of "Begin Run"

\

( a) Commands corresponding to the likes of "Begin Run" are read from an editable file.

3. Operator process (not started automagically) presents input windows to the "operator" with "buttons" for Begin Run, etc.

4. Logbook receives and logs messages from all other processes, including keyboard messages.

5. murmur (see FNAL PN457) can be used to display the logbook messages via X/Motif, separating messages according to severity (S,I,W,F).

(a) murmur server runs only on SUN-Spare, but is not required by the rest of the software. Logbook is the only murmur client, and can be compiled to not use murmur.

300

Adding Individualized Processes

1. Modify "collector" process to correspond to daq hardware.

2. Use multiple collectors for multiple types of data buffers.

3. Currently, collector code is hard-wired, i. e., changes in what is read out are made in program followed by recompilation.

( a) This will be changed in the next version.

4. "Template" skeletons are provided to make new processes.

( a) Collector

(b) Analyzer

5. Modification of a single shell script to add new processes to automatic startup.

301

DATA ACQUISITION SYSTEM

A. Fry


303

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