limits of fr-4 in high-speed designs -...

21
Successful Design of OC-48/2.5Gbps Interconnects Slide 1 High Performance Engineering & Design http://www.nesa.com Limits of FR-4 in Limits of FR-4 in High-Speed Designs High-Speed Designs Dr. Edward Sayre, Mr. Michael Baxter, Dr. Jinhua Chen NESA Tel: 978 897-8787 v Fax: 978 897-5359 www.nesa.com v [email protected]

Upload: others

Post on 20-May-2020

5 views

Category:

Documents


0 download

TRANSCRIPT

Successful Design of OC-48/2.5Gbps InterconnectsSlide 1

High Performance Engineering & Design

http://www.nesa.com

Limits of FR-4 inLimits of FR-4 inHigh-Speed DesignsHigh-Speed Designs

Dr. Edward Sayre, Mr. Michael Baxter, Dr. Jinhua ChenNESA

Tel: 978 897-8787 v Fax: 978 897-5359www.nesa.com v [email protected]

Successful Design of OC-48/2.5Gbps InterconnectsSlide 2

High Performance Engineering & Design

http://www.nesa.com

The FR-4 Problem in Gigabit Design

• FR-4 is the most common PCB Fabrication materialand the most cost effective.

• Fabricators know how to laminate and etch a widevariety of conductor patterns and conditions

• A well known material with UL and other approvals• Question of the Hour!!!!

How far can Gigabit signals be run on 100 Ωimpedance differential etch and at what speeds?

Successful Design of OC-48/2.5Gbps InterconnectsSlide 3

High Performance Engineering & Design

http://www.nesa.com

Total RF Transmission Line Loss

++=0

0**35.4)(Z

fRRZfGdB

LengthUnitPernAttenuatio sdc

d

Where: Gd = shunt dielectric conductance [Ω Hz]-1 Rs = skin effect series loss [Ω (Hz)-1/2]

Successful Design of OC-48/2.5Gbps InterconnectsSlide 4

High Performance Engineering & Design

http://www.nesa.com

Frequency Where Skin Effect LossesEqual Dielectric Losses

2

20

1

•≡

ZGRf

d

se

Where: Rs = Skin Effect Resistance [Ω(Hz)-1/2]Gd = Dielectric Shunt Conductance [Ω Hz]-1Zo = Transmission Line Impedance [Ω ]

Successful Design of OC-48/2.5Gbps InterconnectsSlide 5

High Performance Engineering & Design

http://www.nesa.com

• Line Width - 8 mil• Line thickness - 1 oz Cu (1.4 mils)• Differential Impedance Zo = 100 Ω• FR-4 Dielectric Constant = 4.5• FR-4 Loss Tangent = 0.021 (assumed constant)

• Skin Loss = Dielectric Loss at fe = 205 MHz

Typical Values for FR-4 & Common LineParameters

Successful Design of OC-48/2.5Gbps InterconnectsSlide 6

High Performance Engineering & Design

http://www.nesa.com

RF Total Loss vs. Normalized FrequencyTotal Loss (% )

0.0%

10.0%20.0%

30.0%

40.0%

50.0%60.0%

70.0%

80.0%

0 1 2 3 4 5 6 7 8 9 10

Normalized Frequency (f /f e)

Perc

enta

ge L

oss

Successful Design of OC-48/2.5Gbps InterconnectsSlide 7

High Performance Engineering & Design

http://www.nesa.com

100 Ω Differential PCB percentage peak to peak loss as the function of

data rate, PCB lengths from 10” to 50” with 8 mil line width

0.00

10.00

20.00

30.00

40.00

50.00

60.00

70.00

80.00

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

Data Rate (Gbps)

PCB

Pea

k to

Pea

k Lo

ss (%

)

10"

20"

30"

40"50"

Successful Design of OC-48/2.5Gbps InterconnectsSlide 8

High Performance Engineering & Design

http://www.nesa.com

0.00

10.00

20.00

30.00

40.00

50.00

60.00

70.00

80.00

0.0 10.0 20.0 30.0 40.0 50.0 60.0

PCB Length (inch)

PCB

Pea

k to

Pea

k Lo

ss (%

)

622 Mbps

1.25 Gbps1.6 Gbps

2.5 Gbps

5 Gbps

100 Ω Differential PCB percentage peak to peak loss as the function of

PCB length with 8 mil line width

Successful Design of OC-48/2.5Gbps InterconnectsSlide 9

High Performance Engineering & Design

http://www.nesa.com

0.00

10.00

20.00

30.00

40.00

50.00

60.00

70.00

80.00

0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 5.50

Data Rate (Gbps)

PCB

Pea

k to

Pea

k Lo

ss (%

)

10"

20"

30"

40"

50"

100 Ω Differential PCB percentage peak to peak loss as the function of

data rate, PCB lengths from 10” to 50” with 6 mil line width

Successful Design of OC-48/2.5Gbps InterconnectsSlide 10

High Performance Engineering & Design

http://www.nesa.com

0.00

10.00

20.00

30.00

40.00

50.00

60.00

70.00

80.00

0.0 10.0 20.0 30.0 40.0 50.0 60.0

PCB Length (inch)

PCB

Pea

k to

Pea

k Lo

ss (%

)

622 Mbps

1.25 Gbps

1.6 Gbps

2.5 Gbps

5 Gbps

100 Ω Differential PCB percentage peak to peak loss as the function of

PCB length with 6 mil line width

Successful Design of OC-48/2.5Gbps InterconnectsSlide 11

High Performance Engineering & Design

http://www.nesa.com

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 5.50

Data Rate (Gbps)

PCB

Peak

to P

eak

Loss

(%)

10"

20"

30"

40"

50"

100 Ω Differential PCB percentage peak to peak loss as the function of

data rate, PCB lengths from 10” to 50” with 4 mil line width

Successful Design of OC-48/2.5Gbps InterconnectsSlide 12

High Performance Engineering & Design

http://www.nesa.com

100 Ω Differential PCB percentage peak to peak loss as the function of

PCB length with 4 mil line width

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

0.00 10.00 20.00 30.00 40.00 50.00 60.00

PCB Length (inch)

PCB

Pea

k to

Pea

k Lo

ss (%

)

622 Mbps

1.25 Gbps1.6 Gbps

2.5 Gbps

5 Gbps

Successful Design of OC-48/2.5Gbps InterconnectsSlide 13

High Performance Engineering & Design

http://www.nesa.com

0.00

10.00

20.00

30.00

40.00

50.00

60.00

0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 5.50

Data Rate (Gbps)

PCB

Pea

k to

Pea

k Lo

ss (%

)

8 mils

6 mils4 mils

100 Ω Differential PCBpercentage peak to peak loss as the function of data rate

30" traces with 4, 6 and 8 mil line width

Successful Design of OC-48/2.5Gbps InterconnectsSlide 14

High Performance Engineering & Design

http://www.nesa.com

-0.8

-0.6

-0.4

-0.2

0

0.2

0.4

0.6

0.8

0 0.1 0.2 0.3 0.4

Time (ns)

Vo

ltag

e (

V)

Simulated 2.5 Gbps Eye Patternskin effect + dielectric loss (FR-4 loss tangent 0.021) for 40” trace

Successful Design of OC-48/2.5Gbps InterconnectsSlide 15

High Performance Engineering & Design

http://www.nesa.com

-0.8

-0.6

-0.4

-0.2

0

0.2

0.4

0.6

0.8

0 0.1 0.2 0.3 0.4

Time (ns)

Vo

ltag

e (

V)

Simulated 2.5 Gbps Eye Pattern skin effect + dielectric loss for 40” trace with two backplane connectors

Successful Design of OC-48/2.5Gbps InterconnectsSlide 16

High Performance Engineering & Design

http://www.nesa.com

LONG CONTROL PAIR EYE DIAGRAM, 2.5GBPS

Measured 2.5 Gbps Eye Pattern skin effect + dielectric loss for 40” trace with two backplane connectors

Successful Design of OC-48/2.5Gbps InterconnectsSlide 17

High Performance Engineering & Design

http://www.nesa.com

Differential 1.25 Gbps Eye Pattern23” trace including two backplane connectors

Successful Design of OC-48/2.5Gbps InterconnectsSlide 18

High Performance Engineering & Design

http://www.nesa.com

SMA Connector

Skin Effect Region

Highly ResistiveLossy Etch

Poor Fabrication ResultsDifferential TDR vs. Risetime

Successful Design of OC-48/2.5Gbps InterconnectsSlide 19

High Performance Engineering & Design

http://www.nesa.com

1.25 Gbps Eye Patternproperly etched differential pair

Successful Design of OC-48/2.5Gbps InterconnectsSlide 20

High Performance Engineering & Design

http://www.nesa.com

1.25 Gbps Eye Patternover-etched differential pair

Successful Design of OC-48/2.5Gbps InterconnectsSlide 21

High Performance Engineering & Design

http://www.nesa.com

FR-4 PCB Limits - Summary• Eye Diagram Response

– Deterministic Jitter and Risetime Losses are well known and due to dielectricand conductor skin effect losses.

– Eye diagram mask violations in amplitude or bit time jitter lead to unacceptableBit Error Rates

• Fabrication Quality of PCB traces strongly affects eye response.– 100 Ω impedance line losses not strongly affected by line size.

• Semiconductor pulse fidelity and receiver determining factors– Receiver threshold region < (15 - 20%) of swing OK– Risetimes <(15 - 20)% of bit width reduces mask violations

• FR-4 max. line length depends on devices, bit rate, reflections and losses– As a practical matter, jitter more forcefully impacted by bandwidth limits due to

losses– Connector reflections shorten maximum length.

• Maximum usable clock rate Fclk ~ (7 - 10) * fe at reasonable PCB lengths of0.5 meter to 1.25 meter.