Lighting the way inLED Applications

The global market for packaged LED

is expected to reach US$18.54 billion

by 2021

Source: Yole Développement

The future of lightingRapid growth of the LED market

In recent years, the industry is witnessing rapid growth in Light-Emitting Diode (LED) products for many lighting applications. From retail spaces to residential homes, from automobiles to industrial warehouses and roadways — for all lighting needs, there are intelligent LED solutions.

Recognized as one of the most promising technologies in the lighting industry, LED offers a range of benefits in many environments due to its exceptional controllability, advanced dimming and scheduling capabilities, and unparalleled lifespan.

Manufacturers in the LED lighting industry are constantly seeking innovative ways to engineer reliable LED products with enhanced performance to cater to the increasingly competitive market. At Heraeus Electronics, we recognize the need to help manufacturers stay ahead of the game. For more than 160 years, we have been a key global player in the ever-evolving technology landscape. Moving ahead, we endeavor to partner our customers in achieving their business objectives and bringing out the best of LED technology.

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“The major growth drivers for the LED lighting market are the increasing demand of LED TVs, growing automobile industry, increasing phasing out of incandescent bulbs in many countries, and supportive government policies that focus on energy effi ciency.”

Source: Research & Markets

Heraeus ElectronicsThe leading LED materials solutions provider

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We offer high-quality products for LED applications that includes bonding wires, assembly materials, thick fi lm pastes and substrates. We combine our technical know-how to integrate materials perfectly into high-functioning systems. Our products are a result of extensive market knowledge, cutting-edge research, and manufacturing precision by our team of experts.

In addition, our state-of-the-art application and innovation center in Hanau offers comprehensive engineering services for the development of LEDs and LED modules. The center’s optimal test environment makes it possible for manufacturers to simulate their prototypes in a wide variety of scenarios and then analyze the results.

Analyses competence Testing and qu

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Application Knowledge

Simulation Competence

Diagram illustrates the range of engineering services offered by Heraeus Electronics

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Coated Phosphor

Chip

Ceramic/Metal Substrate

Molding Silicone

CLOSE-UP OF AN LED

LED ASSEMBLY SYSTEM

Our range of products for LED applications include bonding wires, solder and sinter pastes, adhesives, substrates, celcion system and thick fi lm materials. By combining technological know-how and our expert knowledge in LED assembly materials, we create high-quality solutions for our customers.

Unique LED materials portfolioHigh-quality solutions for our customers

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LEVEL 1Top die connection and the die attach

LEVEL 2SMT joining

Bonding Wires Conductive

Adhesives Sinter Pastes

Fine Pitch Solder Pastes

Solder Pastes

LEVEL 1LED die carrier substrates

LEVEL 2Circuit boards for HP-LEDs

Lead Frames

Thick Print Copper PastesCOB

Substrates

Polymer Thick Film

Pastes

CelcionPastes Thick Print

Copper Pastes

BONDING AND

JOINING

SUBSTRATES

SMT Adhesives

BONDING AND JOINING

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Conductive Adhesives

Excellent conductivity at high reliability and cost efficiency.

Properties PC300X PC3201 PC3601 PC400X

Silver content > 80% > 80% > 80% ~40%

Application Printing/dispensing

Dispensing Dispensing Printing/dispensing

Curing conditions 10 min/150°C20 min/120°C

1 min/180°C3 min/130°C

3 min/90°C5 min/80°C

10 min/150°C20 min/120°C

Thermal conductivity < 5 W/(mK) < 5 W/(mK) < 3 W/(mK) < 3.9 W/(mK)

Key features Standardcuring

Highly fl exible, fast curing

Low temperaturecuring

Low silver

Bonding Wires

Broad range of wire types for different applications and requirements.

Properties Au Au Alloy Ag Cu CuPd

Wire hardness 70-73 HV 80-90 HV 70-80 HV 85-95 HV 97-107 HV

Gas fi xtures No No Yes Yes Yes

Floor life ≥ 365 days ≥ 365 days ≥ 10 days ≥ 7 days 30 days

Key features Best workability and reliability

Compromise between cost and reliability

Alternative low cost

Lowest cost

Alternative low cost

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Solder Pastes

Fine Pitch Solder Pastes

Exceptional electrical and thermal performance, suitable for high-power density modules.

Available in IPC compliance ultra fine, lead-free Welco™ powder.

Properties F64X SOP91123 FC720 Low Temperature

Alloy SAC, InnoRel Innolot, HT1

SAC, InnoRel Innolot

SAC SnBi, SnBiAg

Standard powder type

Type 3 Type 4 Type 4 & 5 Type 3 & 4

Application Printing/ dispensing

Printing Printing/ dispensing

Printing

Key features Superior wetting on a wide range of surfaces

Halogen zero, anti-capillary

Low silver versions, low voiding

Low temperature refl ow, high reliability

Properties WS5112 (Water soluble)

SOP9213/SOP92132(No clean)

Alloy SAC305 SAC305

Standard powder type Type 6 & 7 Type 6

Application Printing Printing/dispensing

Key features Higher yield, no splashing Long stencil life

Sinter Pastes

Improve thermal, electrical and reliability performance with mAgic non-pressure sinter paste for longer lifetime.

Properties mAgic non-pressure sinter paste

Application Stamping, pin transfer

Metallization Au, Ag

Thermal conductivity > 100 W/(mK)

Electrical resistivity < 0.008 mΩ.cm

Processing temperature > 200°C

Key features Superior thermal conductivity, high adhesion force for small die size

SUBSTRATES

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CHIP-ON-BOARD (COB) Substrates*

High-performance COB substrate at lowest cost due to reel to reel process and optimized material selection.

Properties COB substrates

Thermal conductivity 210-235 W/(mK)

Refl ectivity ~98%

Key features Improved resistance against corrosion, superior refl ectivity at lowest cost

Celcion PastesEnables assembly of LEDs directly on heat sink.

Properties Dielectric layer Conductive layer

Product name IP6080A C9929D C7847

Material Glass Silver Copper

Thickness 50-75 µm 12-16 µm 15-20 µm

Thermal conductivity 1-2 W/(mK) > 100 W/(mK) > 100 W/(mK)

Key features Celcion® is compatible with lead-free solders and fi ne Au wire bonding, lower thermal resistance, longer lifetime or higher 1m/$

* Product under development

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Polymer Thick Film Pastes

Thick Print Copper Pastes

Lead Frames

Lead-free material system developed for applying thick layers of copper onto AIN, Al2O3 or ZTA substrates, suitable for use when high thermal and electrical properties are required.

Multilayer substrates are highly innovative substrates solutions for LED applications. They permit the structuring and lamination of metal-plastic combinations in a highly efficient mass production system. The manufacturing process is able to treat all layers on separate reels and structure the miscellaneous materials according to specific requirements.

A comprehensive range of conductive, resistive & dielectric polymer thick film inks for LED circuits applications.

Properties LTR46xx CL21-11130

Sheet resistance 10 Ω/sq-1 kΩ/sq 50 mΩ/sq

Substrates Polyimide, Glass, Al2O3

Polyimide, Glass, Al2O3

Key features Fast curing, integrated resistor into circuit

Fast curing, solderable

Properties C7403A(Bonding layer)

C7403C(Bonding layer)

C7404C(Build-up layer)

Sheet resistance ≤ 0.7 mΩ/sq(FFT: 50 µm)

≤ 0.7 mΩ/sq(FFT: 50 µm)

≤ 0.7 mΩ/sq(FFT: 50 µm)

Substrates AIN Al2O3 , ZTA AIN, Al2O3 , ZTA

Key features Excellent reliability in shock/thermal cycling, design fl exibility, low warpage

Optimal test environment For prototype testing and analysis

Comprehensive testing and analysis is important in the production of high-quality LEDs and LED modules. Our state-of-the-art application center in Hanau, Germany, makes it possible for LED manufacturers to test their prototypes using extensive and advanced engineering services.

We provide an optimal test environment that allows manufacturers to better understand material behaviors, combinations, and the reliability of their products in different scenarios.

Our variety of processes include thermal analyses, metallography and surface analyses for the identifi cation of possible design fl aws; optimized simulation to determine the reliability of soldering compounds; and other time-consuming tests such as temperature cycle and temperature shock tests.

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Our state-of-the-art application center in Hanau, Germany, makes it possible for LED manufacturers to test their prototypes using extensive and advanced engineering services.

We are Heraeus Electronics

We are one of the leading manufacturers of materials for the assembly and packaging of devices in the electronics industry.

We develop sophisticated materials solutions for consumer electronics and computing, automotive, LED, power electronics and communications.

Our core competencies include bonding wires, assembly materials, thick fi lm pastes as well as roll clad strips and substrates, and their integration into perfectly matched systems.

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Headquartered in Hanau, Germany

of experience in providing materials for electronics industry

More than 50 years

Product distribution toover 50 countries

10 production sitesacross 7 countries

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Production sites and service labs Proximity to our clients around the world

PRODUCTION SITES

Hanau, Germany

Chisoda, Romania

West Conshohocken, USA

Kulaijaya, Malaysia

Changshu, China

Shanghai, China

Zhaoyuan, China

Incheon, Korea

Singapore

SERVICE LABS

Hanau, Germany

West Conshohocken, USA

Changshu, China

Shanghai, China

Singapore

West Conshohocken

Hanau Chisoda Zhaoyuan

Incheon

Shanghai

Kulaijaya

Singapore

Changshu

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The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.

Heraeus Electronics is a business unit of the Heraeus Group. The technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in 1851. With expertise, a focus on innovations, operational excellence and an entrepreneurial leadership, we strive to continuously improve our business performance.

We create high-quality solutions for our clients and strengthen their competitiveness in the long term by combining material expertise with technological know-how. Our ideas are focused on themes such as the environment, energy, health, mobility and industrial applications.

Our portfolio ranges from components to coordinated material systems which are used in a wide variety of industries, including the steel, electronics, chemical, automotive and telecommunications industries.

In the 2016 fi nancial year, Heraeus generated revenues without precious metals of €2.0 bn and a total revenue of €21.5 bn. With approximately 12,400 employees worldwide in more than 100 subsidiaries in 40 countries, Heraeus holds a leading position in its global markets.

Heraeus Group The Global Technology Company

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