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SECTION 1. SUMMARY

SERVICING PRECAUTIONS .......................................................................................................... 1-2

ESD PRECAUTIONS ....................................................................................................................... 1-3

SPECIFICATIONS ........................................................................................................................... 1-4

SECTION 2. ELECTRICAL

ELECTRICAL TROUBLESHOOTING GUIDE ................................................................................. 2-1

WAVEFORMS OF MAJOR CHECK POINT .................................................................................... 2-6

INTERNAL BLOCK DIAGRAM of ICs .............................................................................................. 2-7

BLOCK DIAGRAM ......................................................................................................................... 2-19

SCHEMATIC DIAGRAM ................................................................................................................ 2-21

PRINTED CIRCUIT DIAGRAM ...................................................................................................... 2-27

SECTION 3. CABINET MAIN CHASSIS & MECHANISM

EXPLODED VIEW ........................................................................................................................... 3-1

[CONTENTS]

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SERVICING PRECAUTIONSAlways disconnect the power source before:

1) Removing or reinstalling any component, circuit board, module or any other instrument assembly.

2) Disconnecting or reconnecting any instrument electrical plug or other electrical connection.

3) Connecting a test substitute in parallel with an electrolytic capacitor in the instrument.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result inan explosion hazard.

Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this servicemanual might be equipped.

Do not apply power to this instrument and or any of its electrical assemblies unless all solid-statedevice heat sinks are correctly installed.

Always connect a test instruments ground lead to the instrument chassis ground beforeconnecting the test instrument positive lead. Always remove the test instrument ground lead last.

1) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing,follow the printed or indicated service precautions and service materials.

2) The Components used in the unit have a specified conflammability and dielectric strength. Whenreplacing any components, use components which have the same ratings. Components marked in

SECTION 1. SUMMARY

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ESD PRECAUTIONS[Electrostatically Sensitive Devices (ESD)]

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such omponentscommonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices areintegrated circuits and some field-effect transistors and semiconductor chip components. The followingtechniques should be used to help reduce the incidence of component damage caused by static electricity.

1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drainoff any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain andwear a commercially available discharging wrist strap device, which should be removed for potentialshock reasons prior to applying power to the unit under test.

2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductivesurface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4) Use only an anti-static solder removal device. Some solder removal devices not classified as anti-staticcan generate electrical charges sufficient to damage ESD devices.

5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESDdevices.

6) Do not remove a replacement ESD device from its protective package until immediately before you areready to install it. (Most replacement ESD devices are packaged with leads electrically shorted togetherby conductive foam, aluminum foil or comparable conductive material).

7) Immediately before removing the protective material from the leads of a replacement ESD device touch

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1. GENERAL

Power requirements ..................................................................................................................... DC12V~15VGround system ................................................................................................................................... NegativeDimensions(W x H x D) ...................................................................................................... 188 x 58 x 166mm

Weight .............................................................................................................................................. Net: 1.3kg

2. RADIO SECTION

FM AM(MW)Frequency range 65.0~74.0MHz(Optional), 522~1,620kHz

87.5~108MHz (Optional:530~1,710kHz/ 520~1,620kHz)Intermediate frequency 10.8MHz 450kHz

Usable sensitivity 10dBV 28dBVSignal to noise ratio 55dB 45dB

3. COMPACT DISC SECTION

Frequency response ..................................................................................................................... 40Hz~20kHzChannel separation ...................................................................................................................... 50dB(1kHz)Signal to noise ratio .................................................................................................................................. 60dB

SPECIFICATIONS

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ELECTRICAL TROUBLESHOOTING GUIDE

Any Key power on.

Is power turnd on?

DISC loading?

Does initial reading occur?

Check power supply circuitry.Q380, Q381, Q382,Q230IC201 Pin1, IC401 Pin3.

Check loading supply circuitry.

Q350,Q351,Q353,PN505, IC401 Pin1

Check laser circuitry.Q501, IC502

Check focusing circuitry

YES

YES

YES

NO

NO

NO

(1) No Power.

SECTION 2. ELECTRICAL

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YES

YES

YES

(2) LCD light abnornal.

Any Key power on.(without DISC)

Do display LCD then light?Check voltage in the power supply

circuitry.Power supply circuitry defective.

Q371,Q372,IC403

Reset circuit defective.IC201 Surrounding circuitdefective.

IC401 pin89 defective.

X401, X422, C412,C413, C415, C416.

Q260, PN401 frontPCB pattern defective.

Is u-com IC401 reset circuitnormal? Pin88

Is u-com IC401 keyin Pin9, 37, 51,52, 64 5volt input?

Is u-com IC401X1, X2 terminalPin38,39,41,42 input?

OSC : 12.5MHzOSC : 32.768kHz

NO NO

NO

NO

NO

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(3) Initial reading is not carried out.

NO

NO

NO

NO

NO

NO

NO

NO

NO

YES

YES

YES

YES

YES

YES

YES

YES (with disc)

Slide motor moves

(With disc)

Spindle motor turnsWAVEFORM #1

Does RF waveform appear?IC502 Pin8

WAVEFORM #2

Check the Data transmission fromCN503(18,20,21) to CD DSP

WAVEFORM #5

Check the Data transmission fromCN503 Pin19 to MICOM

WAVEFORM #5

Check the TRVPVoltage

IC501 Pin31

Check the change of SL+, SL - VoltageIC504 Pin13,14

Check the Voltage change ofCN503 Pin10(6.4~6.8V)

Check the Voltage IC501 Pin31(1.4V~1.8V)

Defective connectorCN503

Defective IC501


Defective MICOM


Defective IC504

Defective IC501

Defective IC504

1.4~1.8V

3~4V

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NO

NO

NO

NO

When laser does not light.

Is 2.4V~3.4V applied to pin2 of IC502?( 3.4V 2.4V)

Is data transferred fromMICOM IC ?

Does voltage appear atIC504 Pin 13, 14?

Defective MICOM or CN503.

Defective IC501,IC502

Defective slide motor and/orconnector.(CN501)

Did pickup return toinnermost circular?

YES

YES

YES

YES

A

OV

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When laser light.B

NO

NO

YES

YES

YES

Laser lights

Check the signal of IC504Pin 15, 16

WAVEFORM #3

Check the signal FOCUSSEARCH of IC501 Pin 37

WAVEFORM #3

Defective IC501

Defective IC501

Degraded laser diode

Defective PICK-UP

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WAVEFORMS OF MAJOR CHECK POINT

#1. SPINDLE DRIVE AND MOTOR WAVEFORM

IC501(29), IC544(12) when TOC reading

#2. RF WAVEFORM

IC502(8), IC502(3) during TOC Reading

#3. FOCUS DRIVE AND MOTOR WAVEFORM

IC501(37), IC504(15) When focus search failed or there is no disc on tray There is disc on tray and focus search success

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I IC401PD784214A1) PORT ASSIGNMENT

INTERNAL BLOCK DIAGRAM of ICs

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2) PORT DESCRIPTION

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I IC501 MN6627933CG

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I IC504 AM5810

1) BLOCK DIAGRAM

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PIN No Pin Name Description1 FWD Input for loading forward2 REV Input for loading reverse3 LDCONT Output control terminal for loading4 PS Control terminal for power saving mode5 IN1 Input 1 of CH16 IN2 Input 2 of CH27 PREVCC Pre and loading unit power supply input terminal8 POWVCC12 Power unit power supply input terminal (CH1, CH2)

9 VOL ( - ) Inverted output of loading10 VOL ( + ) Not inverted output of loading11 VO2 ( - ) Inverted output of CH212 VO2 ( + ) Not inverted output of CH213 VO1 ( - ) Inverted output of CH114 VO1 ( + ) Not inverted output of CH115 VO4 ( + ) Not inverted output of CH416 VO4 ( - ) Inverted output of CH417 VO3 ( + ) Not inverted output of CH318 VO3 ( - ) Inverted output of CH319 GND Substrate ground20 POWVCC34 Power unit power supply input terminal (CH3, CH4)21 MUTE Input for mute control22 OPOUT3 Output of CH3 OP-ANP23 OPIN3 ( - ) Inverting input of CH3 OP-ANP24 OPIN3 ( + ) Not inverting input of CH3 OP-ANP25 OPOUT4 Output of CH4 OP-ANP

3) PIN DESCRIPTIONS

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I IC505 AMC1117

1) BLOCK DIAGRAM

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I IC601TDA7348D

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I IC901 PT65241) BLOCK DIAGRAM

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2-19 2-20

BLOCK DIAGRAM

TU10111,12

CET85XX

20 4,1416,17,18,19

2(LR)

9.4V 14V

24

72, 73, 74,75, 76, 81

58, 60

29, 31, 35, 37

9,10,11,12,13,14 7,8,20

1,2

4

5,6,23,26 15,16,17,18

10,14

8,121617

2728

25,26

23,24

10,142

11,15

12,14

17,19

7,9

21,23

3,56,20

22

Q720,721,722,723

56~60

1~50

61~64

29

14,19

30,31,32,36

68,69,70,71

54 2 55 1011

2 4 3 9 0 6 9 1 443

56,57

66,6747,48

38

39715, 16, 17, 18

PICK-UP

CD MECHA(CD303-C004A)

MOTORDRIVE IC(AM5810)

DSP IC(MN6627933)

RF ICAN22004A

RADIO VCCQ310,ZD313

LINE SW/E.VOLUME

9.4V REGQ360,ZD361

POWER 5VQ282,Q283

7.5V REGQ350,351

3.3V REGIC505

U-COM

uPD784214A

KEY MATRIXRESISTOR

RADER

RESETIC201

5V CONVERTQ260,D233

REG 9VIC403

Q371LCD

CONTROL

LCD DRIVERIC901 PT6524

LCD DISPLAY

DIMMER CONTROLQ371

PHONE MUTEQ280,281

ACC DETECTORQ230,D231,D232

REMOTECONTROLQ320,321

ANT CONTROLQ390,391

POWER ONQ380,381

MUTECCNTROL

POWER AMPIC803

TDA8275HQ

L-SPEAKER

L-SPEAKER

FRONTR-SPEAKER

REARR-SPEAKER

LINE-OUT(OPTION)

CDC SIGNAL

PN801 #16BACK_UP

PN801 #10PWR_ANT

PN801 #6REMOTE

PN801 #14ACC

PN801 #5PHONE

PN801 #11DIMMER

2(FL,FR)

2(RL,FR)

2 ( R L

, R R )

4-CH(FL,FR,RL,RR)

IC601 TDA7438D

IC401

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2-21 2-22

SCHEMATIC DIAGRAM1. MAIN SCHEMATIC DIAGRAM

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2-23 2-24

2. FRONT SCHEMATIC DIAGRAM

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2-25 2-26

3. CDP SCHEMATIC DIAGRAM

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2-27 2-28

PRINTED CIRCUIT DIAGRAM

1. MAIN P.C. BOARD (COMPONENT SIDE)

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2-29 2-30

2. FRONT P.C. BOARD (TOP) 2. FRONT P.C. BOARD (BOTTOM)

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2-31 2-32

3. CDP P.C. BOARD (TOP) 3. CDP P.C. BOARD (BOTTOM)

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2-33 2-34

5. LED P.C.BOARD (BOTTOM)

5. LED P.C.BOARD (TOP)4. TRIM P.C. BOARD (BOTTOM)4. TRIM P.C. BOARD (TOP)

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2-35 2-36

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I EXPLODED VIEW

2 9 1

A 2 6

A 4 13 0 1

2 90

45 3

4 5 0

4 5 2

3 0 23 0 42 70

2 5 1

2 9 4

2 96

2 5 3

2 6 9

2 6 3

2 6 7

2 5 5

2 562 5 7

2 5 2

26 1

2 5 0

A 4 6

2 7 7

2 7 2

2 7 6

2 7 1

2 9 5

2 7 3

2 7 8

2 8 8

3 3 0

A 4 9

A 4 3

A 5 0

A 40

A 4 5

A 4 22 82

2 8 0

2 8 128 3

NOTE) Refer to SECTION 4 REPLACEMENTPARTS LIST in order to look for thepart number of each part.

SECTION 3. CABINET MAINCHASSIS & MECHANISM

lac-m5500

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