itrs factory jul010 final
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8/6/2019 ITRS Factory Jul010 Final
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ITRS Conference July 2010 , San Francisco, CA 1
ITRS Factory Integration (FI) Update
Gopal Rao
July 2010
San Francisco, CA
July 2010 Meeting Attendees:
Michio Honma, Shige Kobayashi, Gopal Rao, Andreas Neuber, Terry
Francis, James Moyne,Patrick Fernandez, Chris Keith, Daniel Stevens, Les Marshall, Peter
Csatary,
Richard Oechsner, Bruce Klafter, Jim Jewett, Parris Hawkins, Mark Denome,
Michael Mocella, Masazumi Fukushima
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ITRS Conference July 2010 , San Francisco, CA 2
Agenda
1. Factory Integration Scope and Drivers
2. Key Technologies and Mapping of FI
agenda
3. Energy Conservation
4. FI Agenda for next 6-9 months
5. Summary
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Factory Integration Scope and Drivers
Wafer
Mfg
Chip
MfgProduct
Mfg D i s t r i b
u t i o
n
• FEOL• BEOL
• Probe/Test• Singulation
• Packaging• Test
Si Substrate
Mfg
Reticle
Mfg
Increasing cost &
Cycle time implications
Factory is driven by Cost, Quality, Productivity, and SpeedReduce factory capital and operating costs per functionFaster delivery of new and volume products to the end customer Efficient/Effective volume/mix production, high reliability, & high equipment reuseEnable rapid process technology shrinks and wafer size changes
FactoryOperations
ProductionEquipment AMHS
Factory Information& Control Systems Facilities
UI
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ITRS Conference July 2010 , San Francisco, CA 4
Key Technologies that will Impact Factory Design 2010 and future years were targeted to meet productivity and capture technology requirements
Key process & device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho(EUVL), New Device Structures, new materials, wafer size conversion & huge productivity improvements, naturalresource conservation
Economic and business challenges are equal to our manufacturing and process technology challenges in scopeand breadth to attain efficiency and effectiveness
20142014
FI ScopeFI Scope
MappingMapping
––
ForFor
illustratioillustrationn
purposepurpose
onlyonly
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ITRS Conference July 2010 , San Francisco, CA 5
Energy FocusRegulation Research
Operations (Fac/FO) Production Equipment
een Buildings/ Sub Fabergy Conservation/Waste Reduction
eterstegration with Smart Gridta Visualization
tegration with Renewable Energy Generationetricsctory Operational Policies
• Semi Standard S23 Next Gen Standard• Smart Sensors• Data Integration & Networking
• Data Visualization•Fab/Sub fab sync•Idle mode• Metrics
Carbon TaxRegional RegulationsRenewable Energy Generation IncentivesUtility CostsMetrics
• Modeling & Simulation of energy consumption• Sensor Development• Energy Recovery from processes• Energy Mapping – Factory, Tool and with in To• Energy Storage
Dot size indicatesamount of work
needed
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ITRS Conference July 2010 , San Francisco, CA 6
FI Agenda – Next 6-9months
Energy Workshop Continue discussions on energy, regulation etc and bring to IRC/TWGs key
recommendations for integration into roadmap Use workshops to dig deeper into tough issues
AEC/APC
450mm Comprehend FI issues and challenges for 450mm wafer size conversion
Development of baseline process for generating metrics Define a generic process flow Benchmarking/data quality Development of 300mm/450 mm fab model for energy and related
modeling/simulation
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FI Agenda – Next 6-9months
Formal process being developed for communicating researchopportunities that evolve from FI new topic discussions toAcademia, Suppliers, IRC, TWGs
Cost is one of the key parameters for staying on Moore’s Law FI will develop a proposal
Waste reduction in other TWGs Productivity improvements/metrics
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Factory Integration Summary
All FI technology requirements tables and potential solutionstables updated
Operations, Equipment, AMHS, FICS and Facilities Identified key focus areas for FI Technology requirement and potential solutions for 300/450mm Energy Conservation Waste reduction due to intrinsic equipment & factory system losses and better
visibility of data
AMC solutions for equipment and FOUP Working with other TWG on cross-cut issues With FEP, Litho, Metrology, Yield Enhancement and ESH EUVL, energy conservation, etc.
Business strategies, market demands, and process technologychanges continue to make factories difficult to integrate
Work with other forums/WG to ensure synergy ISMI 450mm WG, SEMI, etc.